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Thursday, June 22, 2023

• Synopsys: Blending AI Innovation With Robust IP For Semiconductor Dominance
• aiMotive achieves an industry first milestone with ISO26262 ASIL B certification for aiWare4 NPU IP

Wednesday, June 21, 2023

• Airbus and STMicroelectronics to develop silicon carbide power electronics for aircraft
• Do Startups Have a Place in the Semiconductor Supply Chain?
• Codasip partners with SmartDV to accelerate chip design projects
• Intel Provides Update on Internal Foundry Model
• DRAM Alternative Spawns U.K. Startup

Tuesday, June 20, 2023

• SiC and GaN Drive Vehicle Electrification
• OPENEDGES Achieves Tapeout of LPDDR5x/5/4x/4 PHY IP on 5nm SF5A Process Technology
• Quadric Announces Vision Transformer Support for Chimera GPNPUs

Monday, June 19, 2023

• MosChip appoints Dr. Naveed Ahmed Sherwani to the Board of Directors
• Concentrated competence in battery management: Vitesco Technologies France cooperates with CEA
• Jim Keller on AI, RISC-V, Tenstorrent's Move to Edge IP
• RISC-V Europe Summit Debuts Among Signs of Significant Growth in Advanced IoT Applications
• Global Top Ten IC Design Houses Break Even in Q1, Hope for Recovery in Q2 Bolstered by AI Demand, Says TrendForce
• Can Any Novel Architecture Topple the Mighty GPU?

Sunday, June 18, 2023

• Intel plans US$25 billion Israel wafer fab spend
• Samsung to apply AI, big data tech to entire chipmaking process
• Extending Moore's Law: CEA-Leti & Intel to Develop Atomically Thin 2D TMDs on 300mm Wafers Using Layer Transfer Technology for Future Transistor Scaling
• SEGGER adds Stack Overflow Prevention (STOP) technology to Embedded Studio for ARM
• Blueshift Memory and Crypta Labs to develop quantum-resilient cybersecurity memory module
• MosChip Announces the appointment of Semiconductor Industry Veteran Dr. Naveed Ahmed Sherwani to the Board of Directors
• Introducing T2M's Key IP Cores Empowering AI Chipsets and unleashing the true AI Potential
• Chips Acts' Role in Reshaping a Global Industry

Thursday, June 15, 2023

• Semiconductor Industry Sustainability Priorities - A Systems Engineering Opportunity
• Creonic Releases Ultrafast BCH Decoder IP Core, Processing One Codeword per Clock Cycle
• DFSPI IP Core from DCD supports all serial memories available on the market.
• M31 Has Expanded MIPI IP Portfolio, Successfully Validated 7nm MIPI C/D PHY Combo IP

Thursday, June 15, 2023

• Nanusens secures first IP license for its revolutionary MEMS-in-ASICsâ„¢ sensor technology

Wednesday, June 14, 2023

• Arm approaches TSMC, Apple, Google, Microsoft and Samsung for anchor investments prior to IPO
• SK Powertech Adopts Silvaco's Victory TCAD Solution for the Development of Next Generation SiC Power Devices
• Cadence Announces $200 Million Accelerated Share Repurchase Agreement
• Nanusens secures first IP license for its revolutionary MEMS-in-ASICs™ sensor technology
• Samsung fab cobbling IP offerings for data-intensive SoCs
• Global Semiconductor Materials Market Revenue Reaches Record $73 Billion in 2022, SEMI Reports
• MosChip's strategic initiatives in India's rising semiconductor market: acquisitions, collaborations, and innovations
• Droop response system IP made available for SoC designs
• Simplifying the Analog and Mixed-Signal IC Design Process
• Axiomose testimonial from AMD
• Meeting the Major Challenges of Modern Memory Design
• Capturing Innovation: Logic Fruit Technologies Triumphs with ARINC 818 Video Processing and Switching Module Copyright
• Secure-IC & NSITEXE extend strategic partnership to provide security solutions for Cyber-Physical Systems (CPS)
• Soitec reports full year results of fiscal year 2023
• Leveraging IBIS-AMI Models to Optimize PCIe 6.0 Designs

Tuesday, June 13, 2023

• Samsung broadens IP portfolio to narrow gap with TSMC
• PCI-SIG® Announces New Research Projecting PCI Express® Technology TAM Expected to Reach $10 Billion by 2027
• Intel in cooler chips project
• Cadence and Samsung Foundry to expand 5nm automotive IP
• Samsung Electronics to hoist foundry IP portfolio to narrow gap with TSMC
• proteanTecs Achieves ASIL-B Automotive Functional Safety Certification
• Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio
• Signature IP chooses IPro for Sales Representation in Israel
• Intel talking to Arm about becoming an anchor investor in Arm IPO
• Alphawave Semi Expands Collaboration with Samsung, Adds 3nm Connectivity IP to Meet Accelerated AI and Data Center Demand
• Exec tried to set up copy-cat Samsung fab in China
• PCI-SIG® Announces New Research Projecting PCI Express® Technology TAM Expected to Reach $10 Billion by 2027
• Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes
• Chiplets advancing one design breakthrough at a time
• Global 300mm Fab Equipment Spending Forecast to Reach Record $119 Billion in 2026, SEMI Reports

Tuesday, June 13, 2023

• Cadence Enhances Unified Custom/Analog Flow to Boost Productivity at Nodes Down to 20nm

Tuesday, June 13, 2023

• NetLogic Microsystems Announces Definitive Agreement to Merge with RMI Corporation

Tuesday, June 13, 2023

• MIPS64 Architecture Powers New Superscalar XLP Processor from RMI Corporation

Tuesday, June 13, 2023

• RMI Announces Next Generation Multi-Core Processor Architecture and Product Family Developed on 40nm Process with Frequencies Greater than 2.0 GHz

Tuesday, June 13, 2023

• RMI and SPIRIT Form Strategic Partnership

Tuesday, June 13, 2023

• RMI Corporation Launches Industry's First Quad-Core Multi-Threaded Processor With Integrated Serial RapidIO Interface and IEEE1588 Controller for Wireless Base-Station Markets

Tuesday, June 13, 2023

• INSIDE Secure Introduces DRM Fusion Essential at the NAB Show 2015

Monday, June 12, 2023

• Intel to anchor rival chip designer Arm's IPO?
• TSMC's biggest chiplet backend fab opens for business
• Chiplets advancing one design breakthrough at a time
• Movellus Announces Industry-First Integrated Droop Response System for SoCs
• Tachyum Among Recipients of 8.1 Billion Euro IPCEI Grant
• First Generation SiMa.ai Edge AI Platform Enters Mass Production Amidst Surge in Company Momentum
• Efabless Reveals Winners of AI-Generated Silicon Design Challenge
• Achronix Pushes the Boundaries of Networking with 400 GbE and PCIe Gen 5.0 for SmartNICs
• Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security
• AONDevices Introduces Breakthrough Super Low-Power, Low-Latency, Customizable Edge AI Speech Enhancement
• BittWare selects EdgeCortix's SAKURA-I AI Processors as its Edge Focused Artificial Intelligence Acceleration Solution

Sunday, June 11, 2023

• The Semiconductor Industry's Most Important Tool Goes Green
• Intel German fab in doubt
• Apple completes its ARM lineup with 5nm, 134billion transistor M2 Ultra
• SynSense releases the Speckâ„¢ Demo kit, enabling users to rapidly deploy and validate event-based neuromorphic vision applications
• Securing Embedded Systems - Making it the Norm
• Top 10 Foundries Report Nearly 20% QoQ Revenue Decline in 1Q23, Continued Slide Expected in Q2, Says TrendForce
• Jim Keller on AI, RISC-V, Tenstorrent's Move to Edge IP
• BrainChip Examines New Approach to Optimizing Time-series Data