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Monday, March 20, 2023

• CEO Interview: Ian Lankshear, EnSilica
• Electronics Tech Hub Seeks to Set Example for Green Semi Manufacturing
• NVIDIA, ASML, TSMC and Synopsys Set Foundation for Next-Generation Chip Manufacturing
• Omni Design Opens Design Center in Hyderabad, India
• Agile Analog joins Intel Foundry Services Accelerator IP Alliance Program to drive forward semiconductor design innovation
• SkyWater Establishes Cryogenic Lab, Utilizes FormFactor's Leading Tool for RTS Noise Detection in Read-Out Integrated Circuit Applications

Sunday, March 19, 2023

• Perforce Joins AWS ISV Accelerate Program and Launches Turnkey Cloud Solution for Helix Core in AWS Marketplace
• Sustainability In Semiconductors - Why Eco-Friendly Initiatives Are Important In The Tech Industry
• Securing Memory will Take More than Cryptography Alone
• TDK announces availability of automated ML Platform Integration for Arm® Keil® MDK
• 12bit 2Msps Silicon proven SAR ADC IP Core with Ultra-low power is available in different technology nodes for various applications that includes IoT, Medical, Consumer, etc
• Remote.It Simplifies Secure Access to Arm Virtual Devices
• TDK announces availability of automated ML Platform Integration for Arm® Keil® MDK

Friday, March 17, 2023

• CoreHW secures €4M investment to accelerate growth in indoor positioning solutions

Thursday, March 16, 2023

• Samsung's Mega Investment Plan to Compete with TSMC
• CoreHW secures €4M investment to accelerate growth in indoor positioning solutions
• M31 hit a record high of revenue and profit in last year, and it expects to sustain a double digit growth throughout the year

Wednesday, March 15, 2023

• intoPIX revolutionizes the gaming experience at GDC 2023: Image quality BEYOND reality

Wednesday, March 15, 2023

• Ashling and Imagination announce Ashling's RiscFreeâ„¢ C/C++ SDK support for RISC-V-based Catapult family

Tuesday, March 14, 2023

• Samsung to invest $230bn in ICs
• Introducing Signature IP Corporation - Providing a Configurable And Flexible Platform for SoC Development
• proteanTecs Collaborates with BAE Systems to Enable a Zero Trust Supply Chain for Defense Applications
• Telechips showcases Arm-based Dolphin5 automotive SoC at embedded world 2023
• Ashling and Imagination announce Ashling's RiscFree™ C/C++ SDK support for RISC-V-based Catapult family
• VeriSilicon delivered multi-format hardware video decoder Hantro VC9000D supporting 8K@120FPS VVC/H.266 to customers

Monday, March 13, 2023

• The Key to IoT Security in Smart Homes
• Imagination and CoreAVI partner for safety-critical automotive graphics applications
• Creonic Today Revealed Its New CCSDS 131.2 Wideband Demodulator IP Core with Immediate Availability
• Imagination and Telechips drive automotive display diversity with hardware virtualization
• ASUS IoT Announces Tinker V
• SPARK Microsystems Announces CDN$48 Million Financing Led by Idealist Capital
• At Embedded World 2023, Dolphin Design showcases AI-based vision applications at sub-mW level that fit in less than 1MB RAM
• VeriSilicon collaborates with Microsoft to deliver Windows 10 to the Edge
• Codasip and IAR demonstrate dual-core lockstep for RISC-V

Sunday, March 12, 2023

• Best in Show Winners: Processing & IP
• ARM adds custom instructions to M85 controller in RISC-V AI fightback
• Imperas in RISC-V three way deal
• Create high-performance SoCs using network-on-chip IP
• CEVA Wi-Fi 6 IP Powers ESWIN ECR6600 Smart Connectivity IC
• Rambus Expands Industry-Leading Security IP Portfolio with Arm CryptoCell and CryptoIsland IP
• Intrinsic Semiconductor Technologies Secures £7m Investment to Solve the Memory Bottleneck for Data Hungry Applications
• Imperas Collaborates with MIPS and Ashling to Accelerate RISC-V Application Software Development from SoC Concept to Deployment
• Total Revenue of Top 10 Foundries Fell by 4.7% QoQ for 4Q22 and Will Slide Further for 1Q23, Says TrendForce
• Veriest Solutions and Neuronix AI Labs Collaborate for Neural Network Acceleration
• 1G Ethernet PHY IP Cores is now available with Blackbox licensing option in various technology nodes for advanced networking applications
• Mythic Raises $13 Million to Bring Its Next-generation Analog Computing Solution to Market
• TSMC February 2023 Revenue Report
• Intrinsic ID Launches Software to Protect Billions of Smart, Connected Devices Addressing Worldwide Cybersecurity Challenges
• BrainChip integrates Akida with Arm Cortex-M85 Processor, Unlocking AI Capabilities for Edge Devices

Thursday, March 9, 2023

• Arm and ecosystem leaders empower developers for a future built on Arm
• ASICFPGA releases new ISP core supporting AXI4-Lite, AXI4-Stream, new AE, and new AWB
• EU Chips Act: Key Intellectual Property Considerations
• AmberSemi Announces Successful Tapeout of Silicon Chip for Patented AC Direct DC Power Delivery Technology
• Cadence Verisium AI-Driven Verification Platform Accelerates Debug Productivity for Renesas

Thursday, March 9, 2023

• Defacto's SoC Compiler 10.0 is Released

Wednesday, March 8, 2023

• Renesas to Demonstrate First AI Implementations on the Arm Cortex-M85 Processor Featuring Helium Technology at Embedded World
• CEVA Introduces UWB Radar Platform for Automotive Child Presence Detection to Meet Emerging Safety Specifications
• Atlas Credit Partners Provides $85MM Investment in Coherent Logix
• CEVA to Showcase Latest Wireless Connectivity and Smart Sensing Solutions at embedded world 2023
• Think Silicon to Showcase its Latest Ultra-Low-Power Graphics and AI Solutions for Edge Computing at Embedded World 2023
• Blueshift Memory to use Codasip custom compute to develop new memory-efficient processor technology
• QuantWare lands €6 million to roll out groundbreaking quantum processors
• Imagination launches its first edge AI course
• IAR Enables Robust End-to-End Embedded Security Solution with the Launch of IAR Embedded Trust
• TSMC's 3-nm progress report: Better than expected
• ProvenRun and SiFive deliver RISC-V-based secure Trusted Execution Environment (TEE)
• GOMACTech 2023: Menta, a major player in semiconductors for the defense industry
• Defacto's SoC Compiler 10.0 is Released
• GF to commercialize AR glasses MicroLED solution with FD-SOI technology
• Renesas to Demonstrate First AI Implementations on the Arm Cortex-M85 Processor Featuring Helium Technology at Embedded World