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Thursday, June 22, 2023
Synopsys: Blending AI Innovation With Robust IP For Semiconductor Dominance
aiMotive achieves an industry first milestone with ISO26262 ASIL B certification for aiWare4 NPU IP
Wednesday, June 21, 2023
Airbus and STMicroelectronics to develop silicon carbide power electronics for aircraft
Do Startups Have a Place in the Semiconductor Supply Chain?
Codasip partners with SmartDV to accelerate chip design projects
Intel Provides Update on Internal Foundry Model
DRAM Alternative Spawns U.K. Startup
Tuesday, June 20, 2023
SiC and GaN Drive Vehicle Electrification
OPENEDGES Achieves Tapeout of LPDDR5x/5/4x/4 PHY IP on 5nm SF5A Process Technology
Quadric Announces Vision Transformer Support for Chimera GPNPUs
Monday, June 19, 2023
MosChip appoints Dr. Naveed Ahmed Sherwani to the Board of Directors
Concentrated competence in battery management: Vitesco Technologies France cooperates with CEA
Jim Keller on AI, RISC-V, Tenstorrent's Move to Edge IP
RISC-V Europe Summit Debuts Among Signs of Significant Growth in Advanced IoT Applications
Global Top Ten IC Design Houses Break Even in Q1, Hope for Recovery in Q2 Bolstered by AI Demand, Says TrendForce
Can Any Novel Architecture Topple the Mighty GPU?
Sunday, June 18, 2023
Intel plans US$25 billion Israel wafer fab spend
Samsung to apply AI, big data tech to entire chipmaking process
Extending Moore's Law: CEA-Leti & Intel to Develop Atomically Thin 2D TMDs on 300mm Wafers Using Layer Transfer Technology for Future Transistor Scaling
SEGGER adds Stack Overflow Prevention (STOP) technology to Embedded Studio for ARM
Blueshift Memory and Crypta Labs to develop quantum-resilient cybersecurity memory module
MosChip Announces the appointment of Semiconductor Industry Veteran Dr. Naveed Ahmed Sherwani to the Board of Directors
Introducing T2M's Key IP Cores Empowering AI Chipsets and unleashing the true AI Potential
Chips Acts' Role in Reshaping a Global Industry
Thursday, June 15, 2023
Semiconductor Industry Sustainability Priorities - A Systems Engineering Opportunity
Creonic Releases Ultrafast BCH Decoder IP Core, Processing One Codeword per Clock Cycle
DFSPI IP Core from DCD supports all serial memories available on the market.
M31 Has Expanded MIPI IP Portfolio, Successfully Validated 7nm MIPI C/D PHY Combo IP
Thursday, June 15, 2023
Nanusens secures first IP license for its revolutionary MEMS-in-ASICsâ„¢ sensor technology
Wednesday, June 14, 2023
Arm approaches TSMC, Apple, Google, Microsoft and Samsung for anchor investments prior to IPO
SK Powertech Adopts Silvaco's Victory TCAD Solution for the Development of Next Generation SiC Power Devices
Cadence Announces $200 Million Accelerated Share Repurchase Agreement
Nanusens secures first IP license for its revolutionary MEMS-in-ASICs™ sensor technology
Samsung fab cobbling IP offerings for data-intensive SoCs
Global Semiconductor Materials Market Revenue Reaches Record $73 Billion in 2022, SEMI Reports
MosChip's strategic initiatives in India's rising semiconductor market: acquisitions, collaborations, and innovations
Droop response system IP made available for SoC designs
Simplifying the Analog and Mixed-Signal IC Design Process
Axiomose testimonial from AMD
Meeting the Major Challenges of Modern Memory Design
Capturing Innovation: Logic Fruit Technologies Triumphs with ARINC 818 Video Processing and Switching Module Copyright
Secure-IC & NSITEXE extend strategic partnership to provide security solutions for Cyber-Physical Systems (CPS)
Soitec reports full year results of fiscal year 2023
Leveraging IBIS-AMI Models to Optimize PCIe 6.0 Designs
Tuesday, June 13, 2023
Samsung broadens IP portfolio to narrow gap with TSMC
PCI-SIG® Announces New Research Projecting PCI Express® Technology TAM Expected to Reach $10 Billion by 2027
Intel in cooler chips project
Cadence and Samsung Foundry to expand 5nm automotive IP
Samsung Electronics to hoist foundry IP portfolio to narrow gap with TSMC
proteanTecs Achieves ASIL-B Automotive Functional Safety Certification
Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio
Signature IP chooses IPro for Sales Representation in Israel
Intel talking to Arm about becoming an anchor investor in Arm IPO
Alphawave Semi Expands Collaboration with Samsung, Adds 3nm Connectivity IP to Meet Accelerated AI and Data Center Demand
Exec tried to set up copy-cat Samsung fab in China
PCI-SIG® Announces New Research Projecting PCI Express® Technology TAM Expected to Reach $10 Billion by 2027
Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes
Chiplets advancing one design breakthrough at a time
Global 300mm Fab Equipment Spending Forecast to Reach Record $119 Billion in 2026, SEMI Reports
Tuesday, June 13, 2023
Cadence Enhances Unified Custom/Analog Flow to Boost Productivity at Nodes Down to 20nm
Tuesday, June 13, 2023
NetLogic Microsystems Announces Definitive Agreement to Merge with RMI Corporation
Tuesday, June 13, 2023
MIPS64 Architecture Powers New Superscalar XLP Processor from RMI Corporation
Tuesday, June 13, 2023
RMI Announces Next Generation Multi-Core Processor Architecture and Product Family Developed on 40nm Process with Frequencies Greater than 2.0 GHz
Tuesday, June 13, 2023
RMI and SPIRIT Form Strategic Partnership
Tuesday, June 13, 2023
RMI Corporation Launches Industry's First Quad-Core Multi-Threaded Processor With Integrated Serial RapidIO Interface and IEEE1588 Controller for Wireless Base-Station Markets
Tuesday, June 13, 2023
INSIDE Secure Introduces DRM Fusion Essential at the NAB Show 2015
Monday, June 12, 2023
Intel to anchor rival chip designer Arm's IPO?
TSMC's biggest chiplet backend fab opens for business
Chiplets advancing one design breakthrough at a time
Movellus Announces Industry-First Integrated Droop Response System for SoCs
Tachyum Among Recipients of 8.1 Billion Euro IPCEI Grant
First Generation SiMa.ai Edge AI Platform Enters Mass Production Amidst Surge in Company Momentum
Efabless Reveals Winners of AI-Generated Silicon Design Challenge
Achronix Pushes the Boundaries of Networking with 400 GbE and PCIe Gen 5.0 for SmartNICs
Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security
AONDevices Introduces Breakthrough Super Low-Power, Low-Latency, Customizable Edge AI Speech Enhancement
BittWare selects EdgeCortix's SAKURA-I AI Processors as its Edge Focused Artificial Intelligence Acceleration Solution
Sunday, June 11, 2023
The Semiconductor Industry's Most Important Tool Goes Green
Intel German fab in doubt
Apple completes its ARM lineup with 5nm, 134billion transistor M2 Ultra
SynSense releases the Speckâ„¢ Demo kit, enabling users to rapidly deploy and validate event-based neuromorphic vision applications
Securing Embedded Systems - Making it the Norm
Top 10 Foundries Report Nearly 20% QoQ Revenue Decline in 1Q23, Continued Slide Expected in Q2, Says TrendForce
Jim Keller on AI, RISC-V, Tenstorrent's Move to Edge IP
BrainChip Examines New Approach to Optimizing Time-series Data
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