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Friday, February 23, 2024

• TSMC Celebrates the Opening of JASM in Kumamoto, Japan

Thursday, February 22, 2024

• Renesas Announces Termination of Memorandum of Understanding and Tender Offer for Proposed Acquisition of Sequans

Wednesday, February 21, 2024

• Intel Foundry Services Head Sees Advanced Packaging as "On Ramp" to Growth
• Faraday Reports Full-Year 2023 Results
• Arm Updates CSS Designs for Hyperscalers' Custom Chips
• Andes Technology and MetaSilicon Collaborate to Build the World's First Automotive-Grade CMOS Image Sensor Product Using RISC-V IP SoC
• M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2024
• Arm and Nuro Partner to Deliver AI-first Autonomous Technology for Commercial Scale
• Weebit Nano demonstrates performance of its ReRAM under extended automotive conditions

Tuesday, February 20, 2024

• Vervesemi launches Made-in-India semiconductor ASIC
• The Future of Sustainability: How Semiconductors Pave the Way for a Stable Economy
• How Semiconductor Companies Can Help Drive Net Zero by 2050
• CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems
• Intel Launches World's First Systems Foundry Designed for the AI Era
• Taiwan's 5-Bit Superconducting Quantum Computer Goes Online
• Tessolve's Ambitious Leap: Championing RISC-V's Global Surge from India
• BrainChip Begins Accepting Pre-Orders of the Akida Edge AI Box
• Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel's EMIB reference flow
• Siemens' breakthrough Veloce CS transforms emulation and prototyping with three novel products
• Siemens qualifies industry-leading IC design solutions for Intel Foundry processes
• Analog Bits Expands Engineering Presence by Opening a Design Center in Europe
• Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process
• Intrinsic ID Joins Intel Foundry Accelerator IP Alliance to Secure Leading-Edge Semiconductors
• Arteris Announces Financial Results for the Fourth Quarter and Full Year 2023 and Estimated First Quarter and Full Year 2024 Guidance

Monday, February 19, 2024

• US awards USD 1.5 bn to GlobalFoundries for semiconductor production
• Xiphera Releases High-Speed ECC Accelerator
• Imec pioneers unique, low-power UWB receiver chip: 10x more resilient against Wi-Fi and (beyond) 5G interference
• T2M-IP Unveils the 12-bit 4Gsps ADC Silicon-Proven IP Core with Cutting-Edge Features, Silicon Proven and Ready to License
• M31 Launches PCI-SIG Certified PCIe 5.0 PHY IP, Partnering with SSD Storage Chipmaker InnoGrit to Advance the Next-Generation PCIe 5.0
• Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry's Latest GAA Process Technology
• Intel and Cadence Expand Partnership to Enable Best-in-Class SoC Design on Intel's Advanced Processes
• IAR unveils Functional Safety version of IAR Embedded Workbench for Arm equipped with certified static analysis capabilities
• Rapid Silicon Leads the Way with First Complete Open-Source FPGA EDA Tool-Chain

Sunday, February 18, 2024

• Openedges sees revenue from TSMC foundry jump
• GlobalFoundries receives funding for essential chip manufacturing
• What does Renesas' acquisition of PCB toolmaker Altium mean?
• GlobalFoundries and Biden-Harris Administration Announce CHIPS and Science Act Funding for Essential Chip Manufacturing
• Imec launches the first design pathfinding process design kit for N2 node
• Logic Fruit's ARINC Innovation Journey: Delivering Diverse Products to DRDO Labs
• What does Renesas acquisition of PCB toolmaker Altium mean?

Thursday, February 15, 2024

• Samsung wins first 2 nm AI chip order from JapanÂ’s PFN; a snub to TSMC
• Quantum Experts discuss next Digital Revolution
• Arm CSA and AMBA release provide boost for chiplet ecosystem

Wednesday, February 14, 2024

• AccelerComm® Joins Open Compute Project Foundation Focusing on Evenstar Modular Open RAN Radio Unit Reference Design
• Renesas to Acquire PCB Design Software Leader Altium to Make Electronics Design Accessible to Broader Market and Accelerate Innovation
• Thalia releases AMALIA 24.1 with support for 12nm FinFET, porting simulation comparisons and streamlined technology analysis reporting
• AccelerComm® Joins Open Compute Project Foundation Focusing on Evenstar Modular Open RAN Radio Unit Reference Design
• New Report Suggests India Can Expand Role in Global Semiconductor Value Chains with the Right Policies
• Blumind Harnesses Analog for Ultra Low Power Intelligence
• IP block secures FPGAs with one external IC
• RISC-V Processors Addressing Edge AI Devices to Reach 129 Million Shipments by 2030
• Arm shares jump 50% on AI, China boosts to results

Wednesday, February 14, 2024

• zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform

Tuesday, February 13, 2024

• ARM bids for chiplet dominance
• Logic Fruit Welcomes Vishal Sinha as a People Management Consultant
• OpenTitan® Partnership Makes History as First Open-Source Silicon Project to Reach Commercial Availability
• zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform
• Ceva, Inc. Announces Fourth Quarter and Full Year 2023 Financial Results
• OpenTitan® Partnership Makes History as First Open-Source Silicon Project to Reach Commercial Availability
• Saankhya Labs receives approval under Semiconductor Design Linked Incentive (DLI) scheme for Development of a System-on-Chip (SoC) for 5G Telecom infrastructure equipment

Monday, February 12, 2024

• What Role Will Open-Source Development Play in Quantum Computing?
• EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure
• Join Secure-IC at Mobile World Congress 2024 to discover our cutting-edge solutions for mobile and connectivity
• Cadence Reports Fourth Quarter and Fiscal Year 2023 Financial Results

Sunday, February 11, 2024

• DesignEuropa Awards 2024: Celebrating Europe's Creativity, Innovation, and Sustainability
• Cadence and Dassault Systemes Unveil the First Cloud-Enabled, Collaborative Experience to Transform the Development of Electromechanical Systems
• The next frontier in semiconductor innovation: Chiplets and the rise of 3D-ICs
• Qualcomm asks Samsung Foundry and TSMC to each build 2nm Snapdragon 8 prototypes
• T2M is excited to announce the successful licensing of our partner's Silicon-Proven 1G Ethernet PHY IP Cores on a Tier-1 Foundry in Korea, using the advanced 14LPP process, in collaboration with a leading Tier-1 Korean customer
• Flex Logix Joins Intel Foundry Services Accelerator IP Alliance to Enable Fast, Low Power, Reconfigurable SoC's
• Alphawave Semi Announces Appointment of Charlie Roach as Chief Revenue Officer
• Biden-Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce