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Monday, November 20, 2023

• Synopsys GenAI Capability Helps Accelerate Chip Design
• Axelera AI Platform Accelerates Edge Application Deployment
• Samsung Foundry aims to improve production of AI, high performance computing chips
• Xiphera's Crypto Module Offers Customisable Offload and Acceleration Solutions
• Secure-IC strengthens its innovation leadership in embedded cybersecurity with the acquisition of eShard patents portfolio
• Weebit Nano receives wafers manufactured in GlobalFoundries' 22FDX® process
• New RISC-V processors address demand for open source and performance

Monday, November 20, 2023

• Renesas Extends Tender Offer for Proposed Acquisition of Sequans

Sunday, November 19, 2023

• Red Bull Ford Powertrains pursues the sustainable future of motorsport with Siemens Xcelerator
• Ventana Micro Systems Unveils Second Generation Veyron Family RISC-V Processor, Paving the Way for Data Center-Class Performance
• Insyde Software Becomes the First Independent BIOS Vendor to Achieve Arm SystemReady SR-SIE Certification for the NVIDIA GH200 Grace Hopper Superchip Platform
• Weebit Nano's ReRAM IP achieves high temperature qualification in SkyWater Technology's S130 process

Friday, November 17, 2023

• Lenovo commits to end-to-end product circular economy

Thursday, November 16, 2023

• Green Mountain Semiconductor Participates in Unveiling of Innovative AI processor
• Rapidus and Tenstorrent Partner to Accelerate Development of AI Edge Device Domain Based on 2nm Logic

Thursday, November 16, 2023

• AndeSentryâ„¢ Collaborative Framework Enables Comprehensive RISC-V Security Solutions

Wednesday, November 15, 2023

• SEMICON Europa: Building a Sustainable US$1 Trillion Semiconductor Industry
• Scale FD-SOI to 7nm? Yes, We Can
• Siemens acquires Insight EDA to expand Calibre integrated circuit reliability verification offering
• QuickLogic Announces New Auroraâ„¢ FPGA/eFPGA User Tools with Enhancements for Reconfigurable Computing
• Arm Collaborates with Microsoft on Custom Silicon to Unlock Sustainable, AI-Driven Infrastructure
• Bringing Arm TCS23 to Life on Next-gen Flagship Smartphones with MediaTek and vivo
• Mixel Celebrates 25 Years of Mixed-Signal Excellence
• Faraday Unveils Enhanced Gigabit Ethernet PHY on UMCÂ’s 28HPC+ Process
• Siemens buys Insight EDA
• Secure-IC announces the integration of Securyzr™ technology in MediaTek's new flagship smartphone chip, Dimensity 9300
• Thalia's AMALIA (23.4a) qualified on Siemens AFS for increased analog design migration flexibility

Tuesday, November 14, 2023

• Imec's Virtual Fab Goes Public to Speed IC Manufacturing Decarbonization
• M31 Q3 Profit Surged Over 50%, Accumulated EPS NT$9.34
• Synopsys Announces Synopsys.ai Copilot, Breakthrough GenAI Capability to Accelerate Chip Design
• QuickLogic Reports Third Quarter Fiscal 2023 Results Including Record Non-GAAP Net Income
• Xiphera Announces a New Batch of CAVP Validated IP Cores

Tuesday, November 14, 2023

• Movellus Introduces Aeonic Insightâ„¢ Product Line for On-die Telemetry

Monday, November 13, 2023

• Japanese chipmaker Rapidus plans US sales office
• Finnish consortium participating in Sustronics e-waste and materials project
• Siemens works with Arm and AWS to bring PAVE360 to the cloud and unlocks next generation automotive innovation
• Movellus Introduces Aeonic Insight™ Product Line for On-die Telemetry
• Arteris Ncore Cache Coherent Interconnect IP Certified for ISO 26262 Automotive Functional Safety Standard
• Imagination to lay off 20% of staff
• OEMs' Sourcing Strategies Need to Account for Node Sizes
• CXL Consortium Announces Compute Express Link 3.1 Specification Release
• Rambus Demonstrates CXL Platform Development Kit at SC23
• Arm Announces Appointment of Ami Badani as Chief Marketing Officer
• Andes Technology Partners with WITTENSTEIN high integrity systems (WHIS) to Build Safety-Critical Solutions with RISC-V Processors

Monday, November 13, 2023

• Synopsys Unveils Next-Generation Verification IP for Faster SoC Verification

Sunday, November 12, 2023

• Cadence and Autodesk Collaborate on Smart Product Design
• CEA-Leti unveils breakthroughs in 3D, RF, power, and quantum computing
• Global Semiconductor Manufacturing Industry Set for Q4 2023 Recovery, SEMI Reports
• T2M-IP Presents Silicon Proven 22nm 1.5GHz Fractional-N PLL IP Core, with Dynamic Configuration for Wireless and Automotive SoCs - Licensing Now Available.

Saturday, November 11, 2023

• Samsung to unveil 3D AI chip packaging tech SAINT to rival TSMC

Thursday, November 9, 2023

• TSMC October 2023 Revenue Report

Wednesday, November 8, 2023

• Extinguishing Lithium-Ion Battery Liability With Green Packaging
• Accellera Announces IEEE 1666â„¢-2023 Standard Available Through IEEE GET Program
• Cadence EMX 3D Planar Solver Certified for Samsung Foundry 8nm LPP Process Technology
• Alphawave Semi Named One of Canada's Enterprise-Industry Leaders Winners in Deloitte's Technology Fast 50â„¢ Program
• SMIC Reports 2023 Third Quarter Results
• Arm Holdings plc Reports Results for the Second Quarter of the Financial Year Ending 2024
• CEVA, Inc. Announces Expansion of Existing Share Repurchase Program
• Accellera Announces IEEE 1666™-2023 Standard Available Through IEEE GET Program
• Server Processors in the AI Era: Can They Go Greener?
• SPARK Microsystems Revolutionizes Wireless Headsets with Ultra-Wideband Audio Technology
• RISC-V Pioneer SiFive Takes Stock, Realigns, Moves Forward
• Alphawave Semi Named One of Canada's Enterprise-Industry Leaders Winners in Deloitte's Technology Fast 50™ Program
• Imagination launches brand new line of high-performance GPU IP with DirectX