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Monday, February 20, 2023

• China dominates semiconductor patent activity
• Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller
• CEVA, Inc. Announces Inducement Award in Connection with Appointment of Amir Panush as Chief Executive Officer
• Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller
• Low power PLL for short-range mmwave industrial radar
• Qualinx Raises €8 Million to Bring Game-Changing Digital RF Technology to Market
• Non-Volatile Memory: What Will 2023 Bring?
• Faraday Reports Record-High Revenue and Net Income for Full-Year 2022
• Qualinx Raises €8 Million to Bring Game-Changing Digital RF Technology to Market

Sunday, February 19, 2023

• Arctic Semiconductor Ships Its First 5G RF Chipset, IceWings, for the 5G Market
• Weebit Nano to demonstrate new silicon at Embedded World 2023
• Cadence Delivers 13 New VIP and Expands System VIP Portfolio to Accelerate Automotive, Hyperscale Data Center and Mobile SoC Verification
• Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
• Arm China profit falls 90%
• 12bit 5Gsps Current Steering DAC IP Core for Highspeed Communication and Automotive SoCs is available for immediate licensing
• ESA and UK Space Agency back EnSilica to develop satellite broadband chip

Friday, February 17, 2023

• Verification IP for chiplet designs

Thursday, February 16, 2023

• Infineon begins construction of new plant in Dresden
• Accurate Positioning Systems and Proximity Solutions with CoreHW Bluetooth® AoA and AoD Antenna Modules

Wednesday, February 15, 2023

• Imec Digs Deeper Into ChipmakingÂ’s Sustainability Issue
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2023
• Oculi Forms strategic partnership with GlobalFoundries to advance edge sensing technology
• embedded world 2023: Codasip presents on custom compute and RISC-V design
• Tachyum Validates Prodigy Universal Processor with Kubernetes for High-Performance, High-Density Computing for Containers
• Cadence Reports Fourth Quarter and Fiscal Year 2022 Financial Results
• NIST Selects "Lightweight Cryptography" Algorithms to Protect Small Devices
• The Six Semiconductor of OPENEDGES Technology Collaborates with imec.IC-link US to Tape-out Two 7nm Testchip

Tuesday, February 14, 2023

• CEVA, Inc. Announces Fourth Quarter and Full Year 2022 Financial Results
• Intrinsic ID Protects 500,000,000 Devices Globally: Leading the Way in Secure and Authenticated Connected Devices
• Andes And IAR Systems Together Enable Leading Vendor ILITEK To Accelerate The Development Of Its ISO 26262 Ready TDDI SoC ILI6600A

Monday, February 13, 2023

• Industry First PCI Express® 6.0 and CXL Interposer Improves Data Captures for Speeds up to 64 GT/s
• Arm China lays off 14% of staff
• Xiphera and Muspark Technologies announce a partnership to enter the Indian technology market
• intoPIX showcases its new JPEG XS solutions to simplify IP video production workflow at HPA Tech Retreat 2023

Monday, February 13, 2023

• Würth Elektronik Partners with Crypto Quantique for IoT Security

Sunday, February 12, 2023

• AccelerComm to deliver cell service from space with 5G NTN LEO
• A closer look at security verification for RISC-V processors
• Bluetooth SIG Introduces Wireless Standard for Electronic Shelf Label Market
• Wi-Fi 6 (ax)/BLE/15.4 22nm Combo RF IP Core, for IoT Application Is Available for Immediate Licensing
• TSMC January 2023 Revenue Report
• Würth Elektronik Partners with Crypto Quantique for IoT Security

Saturday, February 11, 2023

• Secure Optical Data Communication Using Quantum Cryptography and Li-Fi

Thursday, February 9, 2023

• AI Must Be Secured at the Silicon Level
• Sharp, Motorola Mobility, and Kyocera Join Access Advance's HEVC Advance Patent Pool as Licensees
• Andes Technology: Stepping into the 18th Year with Perseverance and Proud Accomplishments
• indie to Acquire GEO Semiconductor
• GlobalFoundries and GM Announce Long-Term Direct Supply Agreement for U.S. Production of Semiconductor Chips

Wednesday, February 8, 2023

• The Value of Semiconductor Packaging Technology in the Era of Heterogeneous Integration
• Rambus Reports Fourth Quarter and Fiscal Year 2022 Financial Results
• SMIC Reports 2022 Fourth Quarter Results
• Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs
• GlobalFoundries Acquires Renesas' Non-Volatile Resistive RAM Technology to Proliferate IoT and 5G Applications