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Tuesday, February 7, 2023

• QuickLogic Drives eFPGA Innovation with New Auroraâ„¢ Development Tool Suite

Monday, February 6, 2023

• Arm results shine bright in SoftBank mire
• Rambus Spins 6.4 GT/s DDR5 Registering Clock Driver for Speedier Servers
• Worldwide Silicon Wafer Shipments and Revenue Set New Records in 2022, SEMI Reports
• AI-designed Chips Reach Scale with First 100 Commercial Tape-outs Using Synopsys Technology
• Arm Q3 FY22 financial results
• QuickLogic Drives eFPGA Innovation with New Aurora™ Development Tool Suite
• ZeroPoint Technologies raises EUR 3.2 million in seed funding to reduce energy consumption of data centers by more than 25%

Sunday, February 5, 2023

• Quantum-safe identities for a digital future
• What will TSMC do next?
• Aldec Releases Automated Static Linting and CDC Analysis for Microchip FPGA and SoC FPGA Designs
• Denying China IC Manufacturing Tools
• U.S. Ban on Huawei Seen Widening China Chip War
• Global Semiconductor Sales Increase 3.2% in 2022 Despite Second-Half Slowdown
• DVB-RCS2 Turbo Decoder and Encoder IP Core Available For Integration From Global IP Core
• GreenWaves Technologies announces a €20M financing
• UMC Reports Sales for January 2023
• Gartner Says Top 10 Semiconductor Buyers Decreased Chip Spending by 7.6% in 2022
• GUC Monthly Sales Report - January 2023
• Peripheral IPs with proven automotive compatibility are instantly licensable for extremely reliable performance.

Saturday, February 4, 2023

• TSMC opens up 7nm FINFET process to universities

Wednesday, February 1, 2023

• Single-Event Transient Study of 28 nm UTBB-FDSOI Technology Using Pulsed Laser Mapping
• Gartner Highlights Top Trends Impacting Technology Providers Through 2025
• Why embedded IoT benefits from software portability
• GreenWaves Technologies announces a €20M financing
• Xfuse, LLC Phoenix ISP Now Available as a Download for AMD Kria KV260 Vision AI Starter Kit
• Rambus Delivers 6400 MT/s DDR5 Registering Clock Driver to Advance Server Memory Performance

Tuesday, January 31, 2023

• Perfecto by Perforce Releases 2023 State of Test Automation Report
• 4 articles CIOs should read about open source in 2023
• Rambus ups DDR5 data rate and bandwidth by 33%
• UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

Tuesday, January 31, 2023

• Andes Technology Unveils The AndesCore® AX60 Series, An Out-Of-Order Superscalar Multicore RISC-V Processor Family

Monday, January 30, 2023

• Weebit looks forward to first revenue in 2023
• Intel Terminates RISC-V Development Project: What Happened?
• TSMC Joins Hands with Apple and Sony to Keep Samsung in Check
• QuickLogic Partners with Andes Technology for eFPGA Joint Promotion
• Siemens advances integrated circuit verification with new, data-driven Questa Verification IQ software
• Tachyum Successfully Runs UEFI on Prodigy FPGA
• Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution
• Hardware Root of Trust: The Key to IoT Security in Smart Homes
• Faraday Announces Multi-site Manufacturing Support in ASIC

Sunday, January 29, 2023

• NASA Recruits Microchip, SiFive, and RISC-V to Develop 12-Core Processor SoC for Autonomous Space Missions
• Achieving Unprecedented Power Savings with Analog ML
• U.S. and Japanese Chipmakers Join 2-nm War
• Gidel introduces groundbreaking edge computer with NVIDIA Jetson Orin NX system-on-module and high-bandwidth camera frame grabber for real-time image acquisition compute and AI processing
• Q4 loss at Intel
• EU Parliament Adopts Position on Chips Act
• Linaro to Acquire Arm Forge Software Tools Business
• BrainChip Tapes Out AKD1500 Chip in GlobalFoundries 22nm FD SOI Process
• Intel kills its RISC-V Pathfinder development kit programme
• 10-bit 3Msps Ultra low power SAR ADC IP core for Wireless Communication and Automotive SoCs is available for immediate licensing

Wednesday, January 25, 2023

• BoW Strengthens Pathway to Chiplet Standardization
• Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
• Axiomise Accelerates Formal Verification Adoption Across the Industry
• IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS
• intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
• Sevya joins TSMC Design Center Alliance
• Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies