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Monday, November 6, 2023

• Reducing industrial CO2 emissions
• How the chip industry is tackling CO2 and the global mission to go green
• Siemens digitalises the entire energy supply chain journey
• AI, memory safety are real threats to IoT security
• Infineon Extends Microcontroller Portfolio with New PSoC Edge Family of Products
• Imagination launches brand new line of high-performance GPU IP with DirectX 
• Synopsys Expands Its ARC Processor IP Portfolio with New RISC-V Family
• Arteris Awarded ISO 9001 Certification for Semiconductor System IP Quality Management System
• European Processor Initiative partner SiPearl will provide its general purpose processor for Europe's first EuroHPC exascale supercomputer JUPITER
• Andes and Vector Propel RISC-V AUTOSAR Software Innovations for the Automotive Industry
• Ubilite Licenses RISC-V Application Processor IP Core from CAST
• Imagination launches brand new line of high-performance GPU IP with DirectX?

Sunday, November 5, 2023

• Trio team up to drive RISC-V ASIL-compliant automotive silicon
• Semidynamics and Arteris to accelerate AI RISC-V SoC development
• Will 1.4-nm help Samsung catch up with TSMC, IFS?
• Weebit Nano receives first revenue
• Cadence Announces Voltus InsightAI, Industry's First Generative AI Technology that Automatically Identifies and Addresses EM-IR Violations
• OPENEDGES Proud to Announce the World's Only 7nm LPDDR5X PHY IP Operating at 8533 Mbps
• Renesas Extends Tender Offer and Receives UK NSIA Clearance for Proposed Acquisition of Sequans
• UMC Reports Sales for October 2023
• SkyWater Announces Availability of Cadence Open-Source PDK and Reference Design for SkyWater's 130 nm Process
• GUC Monthly Sales Report - October 2023
• TASKING, Andes, and MachineWare Team Up to Facilitate Rapid Development of RISC-V ASIL Compliant Automotive Silicon
• semify announces the upcoming launch of SmartWave: A tool providing instant connection to any device
• Hyperion Core Joins RISC-V International as a Strategic Member

Thursday, November 2, 2023

• Synopsys Receives Multiple Partner of the Year Awards at TSMC 2023 OIP Ecosystem Forum
• STMicroelectronics sees its forte in sustainability to maintain lead in supply chain
• First Generative AI tool for power integrity sign off
• Ansys medini Accelerates Andes' Development of Automotive-Grade IP
• VSORA to Receive $13.18 Million in Funding from the European Innovation Council Accelerator Program

Wednesday, November 1, 2023

• Are We Ready for the 2nm Process Node?
• Nvidia Trains LLM on Chip Design
• Global Semiconductor Sales Increase 1.9% Month-to-Month in September
• Raspberry Pi Receives Strategic Investment from Arm, Further Extending Long-Term Partnership
• Semidynamics and Arteris Partner To Accelerate AI RISC-V System-on-Chip Development
• Sophgo Licenses SiFive RISC-V Processor Cores to Drive High-Performance AI Computing Innovation
• proteanTecs Enhances Astera Labs' Connectivity Solutions with Performance and Reliability Monitoring
• Worldwide Silicon Wafer Shipments Fall in Q3 2023, SEMI Reports
• Zero ASIC Democratizing Chip Making
• Imperas RISC-V Solutions for Developers - Accelerating RISC-V

Tuesday, October 31, 2023

• New EU Rule Requires Proof of Sustainability
• Axiomise Heads to Silicon Valley Next Week for RISC-V Summit North America
• Andes Technology to Exhibit Groundbreaking RISC-V Solutions for AI and Automotive at RISC-V Summit North America 2023
• A consortium led by Semiwise wins an Innovate UK grant to develop Virtual Reality Semiconductor Training Fab.
• Arm Collaborates with Industry Leaders to Build AI Foundations of the Future
• Xiphera Enhances the Performance of Its Portfolio with New Cryptographic IP Cores
• sureCore and Intrinsic announce collaboration to accelerate time to market for innovative ReRAM technology

Monday, October 30, 2023

• Sustainability key to semiconductor roadmap for the chiplet era
• From Connectivity to Intelligence: How Edge AI is Revolutionizing IoT Innovation
• Realtek Deploys Cadence Tempus Timing Solution to Deliver Working Silicon on N12 Design
• Details about Samsung Foundry's 1.4nm process node surface
• Quantum tunneling avoids thermal noise in analog circuits
• Codasip delivers processor security to actively prevent the most common cyberattacks
• Synopsys Delivers Seamless Interoperability for Semiconductor Design Ecosystem with New Synopsys Cloud OpenLink Program
• lowRISC Announces New OpenTitan Project Partner, zeroRISC
• Rambus Reports Third Quarter 2023 Financial Results
• Renesas' New Ultra-High Performance MCUs are Industry's First Based on Arm Cortex-M85 Processor
• UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI
• Tenstorrent Teams with Imperas to Provide Model of the Tenstorrent Ascalon RISC-V Core

Sunday, October 29, 2023

• Cadence Bags Four TSMC OIP Partner of the Year Awards
• DSPs target sensor intelligence and edge AI inference needs
• Aniah simultaneously validates ISO9001 and ISO27001 certifications, reinforcing its commitment to Quality and Cybersecurity
• Flex Logix adoption expands into datacenters
• Stephane Cordova joins Thalia as Director of Sales Europe
• EnSilica to supply beamforming SatCom ICs to Germany's VITES to enable power- and cost-efficient flat panel terminals for NGSO-constellations
• Weebit Nano signs Tier-1 licensing agreement; on track to generate first IP revenues in 2023

Friday, October 27, 2023

• RISC-V Releases Abound Ahead of 2023 RISC-V Summit

Wednesday, October 25, 2023

• Multielement Ink is Promising for Sustainable Semiconductor Manufacturing
• Synopsys Honored at TSMC 2023 OIP Ecosystem Forum with Multiple Partner of the Year Awards
• Weebit Nano's ReRAM IP Awarded "Embedded Solution Product of the Year" in the Electronic Industry Awards
• Global Silicon Wafer Shipment Growth to Bounce Back in 2024 After 2023 Decline, SEMI Reports
• MosChip Technologies announces its new Managing Director & CEO