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Foundry
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Thursday, May 11, 2023
Samsung Electronics Accelerating Foundry Facility Expansion While TSMC Slows Down
TSMC says new chips to be world's most advanced
Nordic teams for IoT software SIM
Perforce survey reveals software has become central to automotive development
Japanese foundry Rapidus is making cutting edge 2 nm nodes with IBM, plans to compete with TSMC and Samsung by 2027
Wednesday, May 10, 2023
Canonical enables Ubuntu on StarFive's VisionFive 2 RISC-V single board computer
Arteris Selected by BOS Semiconductors for Next-Generation Automotive Chips
Kalray, Arteris, Secure-IC, and Thales, Win the Call for Projects Related to the AI Acceleration Strategy of the "France Relance 2030 - Future Investments" Plan
BrainChip Showcases Edge AI Technologies at 2023 Embedded Vision Summit
SMIC Reports 2023 First Quarter Results
Alphawave Semi Update on Audit Process
CryoCMOS Consortium develops 4K & 77K transistor models to enable CryoIP development
Tuesday, May 9, 2023
Launch of the New Horizon Europe Project SYCLOPS
Interview with Jean-Louis CHAMPSEIX, ST Group VP, Head of Corporate Sustainability on STMicroelectronics is Enabling & Contributing towards Green & Low Carbon Economy
Quantinuum's H2 quantum computer described as a significant step forward
Cryo-IP for quantum computing
TSMC adds two variants to 2nm node; will Intel catch up?
TSMC April 2023 Revenue Report
CEVA, Inc. Announces First Quarter 2023 Financial Results
CEVA Acquires Spatial Audio Business from VisiSonics to Expand its Application Software Portfolio for Embedded Systems targeting Hearables and other Consumer IoT Markets
Creonic Introduces 25 Gbit/s LDPC IP Core Solution for ITU G.9804.2 PON Standard
StarIC appoints Redtree Solutions as Sales Representative in Pan-Europe
OPENEDGES' 12nm LPDDR5/4x/4 PHY is Ready for Mass Production by Novachips' SSD
Upgrade To Solid Sands' Latest SuperTest Version Supports Andes To Its Ambitions For Further Growth In The Automotive Sector
Monday, May 8, 2023
Accelerating Sustainability Investments Will Fuel Double-Digit Growth in European Digital Spending in 2023, Says IDC
Developing and verifying 5G designs: A unique challenge
LC3plus audio codec optimized for ARM®, RISC-V, HI-FI & Kalimba™ DSPs for Bluetooth® LE Audio are available for Immediate Licensing
FuriosaAI Enhances Next-Generation AI Chips with proteanTecs' Deep Data Analytics
Qualcomm to Acquire Autotalks
Sunday, May 7, 2023
Samsung to Detail Second-Gen 3nm Node, But Admits It Is Behind TSMC
IC designers leave Graphcore for Meta
LC3plus audio codec optimized for ARM®, RISC-V, HI-FI & Kalimba™ DSPs for Bluetooth® LE Audio are available for Immediate Licensing
Arteris Announces Financial Results for the First Quarter 2023 and Estimated Second Quarter and Full Year 2023 Guidance
Flex Logix Cancels AI Chip, Markets IP for AI and DSP
GUC Monthly Sales Report - April 2023
BrainChip Joins Arm Tech Talk to Discuss Cutting-Edge AI Solutions that Deliver Exceptional Performance and Efficiency
Thursday, May 4, 2023
Generative AI in factory automation and the edge
UMC Reports Sales for April 2023
Wednesday, May 3, 2023
NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry
Alphawave IP Group Plc Announces CFO Transition
The environmental footprint of semiconductor manufacturing
Tuesday, May 2, 2023
TSMC Teams Up With EDA Companies to Speed Up Design Flows
Via Licensing Alliance Appoints Three New Members to its Board of Directors
Via Licensing and MPEG LA Unite to Form Via Licensing Alliance, the Largest Patent Pool Administrator in the Consumer Electronics Industry
Crypto Quantique Announces Robert Clyde as Chairman of the Board of Directors
UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications
AccelerComm's LEOphy Shortlisted at SCF Industry Awards 2023
Monday, May 1, 2023
Alphawave confirms further delay to audited results
Menta, Codasip join RISC-V 3D neuromorphic AI project
Alps Alpine uses Siemens Symphony to verify mixed-signal touch chip
TSMC upends 3-nm roadmap with three new nodes
PsiQuantum Expands Development Engagement and Plan for Production Ramp of Quantum Computing Technology at SkyWater's Minnesota Fab
Worldwide Silicon Wafer Shipments Decline in Q1 2023, SEMI Reports
Tenstorrent Selects Arteris IP for AI High-Performance Computing and Datacenter RISC-V Chiplets
BrainChip Pushes the Edge in 2023 with Akida Innovations, Expanded Partner Ecosystem
Global Semiconductor Sales Decrease 8.7% in First Quarter; March Sales Tick Up Month-to-Month for First Time Since May 2022
Rambus Reports First Quarter 2023 Financial Results
Sunday, April 30, 2023
£21.5m raised to supercharge 5G radio performance | AccelerComm
Overcoming the Automotive-Grade IC Shortage
Fraunhofer picks Achronix eFPGAs for chiplet demonstrator
Soitec S.A.'s (EPA:SOI) latest 12% decline adds to one-year losses, institutional investors may consider drastic measures
Electronic System Design Industry Logs $3.9 Billion in Revenue in Q4 2022, ESD Alliance Reports
EC approves €7.4bn subsidy for ST-GloFo JV fab
Processor Startup Innovates Memory Allocation Management
EdgeCortix Expands Leadership Team by Appointing Jeffry A. Milrod as Vice President of Product Engineering
GlobalFoundries Completes Purchase of 800 Acres Adjacent to New York Manufacturing Facility
Softbank files to list Arm on the Nasdaq
TSMC's 3-nm Push Faces Tool Struggles
Cadence Reports First Quarter 2023 Financial Results
Samsung makes $3.4bn Q1 chip loss
EU-Funded NimbleAI to Deliver 3D Neuromorphic Chip
Arm Announces Confidential Submission of Draft Registration Statement for Proposed Initial Public Offering
LC3plus audio codec for various Audio Application Is Available for Immediate Licensing!!
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