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Thursday, May 11, 2023

• Samsung Electronics Accelerating Foundry Facility Expansion While TSMC Slows Down
• TSMC says new chips to be world's most advanced
• Nordic teams for IoT software SIM
• Perforce survey reveals software has become central to automotive development
• Japanese foundry Rapidus is making cutting edge 2 nm nodes with IBM, plans to compete with TSMC and Samsung by 2027

Wednesday, May 10, 2023

• Canonical enables Ubuntu on StarFive's VisionFive 2 RISC-V single board computer
• Arteris Selected by BOS Semiconductors for Next-Generation Automotive Chips
• Kalray, Arteris, Secure-IC, and Thales, Win the Call for Projects Related to the AI Acceleration Strategy of the "France Relance 2030 - Future Investments" Plan
• BrainChip Showcases Edge AI Technologies at 2023 Embedded Vision Summit
• SMIC Reports 2023 First Quarter Results
• Alphawave Semi Update on Audit Process
• CryoCMOS Consortium develops 4K & 77K transistor models to enable CryoIP development

Tuesday, May 9, 2023

• Launch of the New Horizon Europe Project SYCLOPS
• Interview with Jean-Louis CHAMPSEIX, ST Group VP, Head of Corporate Sustainability on STMicroelectronics is Enabling & Contributing towards Green & Low Carbon Economy
• Quantinuum's H2 quantum computer described as a significant step forward
• Cryo-IP for quantum computing
• TSMC adds two variants to 2nm node; will Intel catch up?
• TSMC April 2023 Revenue Report
• CEVA, Inc. Announces First Quarter 2023 Financial Results
• CEVA Acquires Spatial Audio Business from VisiSonics to Expand its Application Software Portfolio for Embedded Systems targeting Hearables and other Consumer IoT Markets
• Creonic Introduces 25 Gbit/s LDPC IP Core Solution for ITU G.9804.2 PON Standard
• StarIC appoints Redtree Solutions as Sales Representative in Pan-Europe
• OPENEDGES' 12nm LPDDR5/4x/4 PHY is Ready for Mass Production by Novachips' SSD
• Upgrade To Solid Sands' Latest SuperTest Version Supports Andes To Its Ambitions For Further Growth In The Automotive Sector

Monday, May 8, 2023

• Accelerating Sustainability Investments Will Fuel Double-Digit Growth in European Digital Spending in 2023, Says IDC
• Developing and verifying 5G designs: A unique challenge
• LC3plus audio codec optimized for ARM®, RISC-V, HI-FI & Kalimbaâ„¢ DSPs for Bluetooth® LE Audio are available for Immediate Licensing
• FuriosaAI Enhances Next-Generation AI Chips with proteanTecs' Deep Data Analytics
• Qualcomm to Acquire Autotalks

Sunday, May 7, 2023

• Samsung to Detail Second-Gen 3nm Node, But Admits It Is Behind TSMC
• IC designers leave Graphcore for Meta
• LC3plus audio codec optimized for ARM®, RISC-V, HI-FI & Kalimba™ DSPs for Bluetooth® LE Audio are available for Immediate Licensing
• Arteris Announces Financial Results for the First Quarter 2023 and Estimated Second Quarter and Full Year 2023 Guidance
• Flex Logix Cancels AI Chip, Markets IP for AI and DSP
• GUC Monthly Sales Report - April 2023
• BrainChip Joins Arm Tech Talk to Discuss Cutting-Edge AI Solutions that Deliver Exceptional Performance and Efficiency

Thursday, May 4, 2023

• Generative AI in factory automation and the edge
• UMC Reports Sales for April 2023

Wednesday, May 3, 2023

• NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry
• Alphawave IP Group Plc Announces CFO Transition
• The environmental footprint of semiconductor manufacturing

Tuesday, May 2, 2023

• TSMC Teams Up With EDA Companies to Speed Up Design Flows
• Via Licensing Alliance Appoints Three New Members to its Board of Directors
• Via Licensing and MPEG LA Unite to Form Via Licensing Alliance, the Largest Patent Pool Administrator in the Consumer Electronics Industry
• Crypto Quantique Announces Robert Clyde as Chairman of the Board of Directors
• UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications
• AccelerComm's LEOphy Shortlisted at SCF Industry Awards 2023

Monday, May 1, 2023

• Alphawave confirms further delay to audited results
• Menta, Codasip join RISC-V 3D neuromorphic AI project
• Alps Alpine uses Siemens Symphony to verify mixed-signal touch chip
• TSMC upends 3-nm roadmap with three new nodes
• PsiQuantum Expands Development Engagement and Plan for Production Ramp of Quantum Computing Technology at SkyWater's Minnesota Fab
• Worldwide Silicon Wafer Shipments Decline in Q1 2023, SEMI Reports
• Tenstorrent Selects Arteris IP for AI High-Performance Computing and Datacenter RISC-V Chiplets
• BrainChip Pushes the Edge in 2023 with Akida Innovations, Expanded Partner Ecosystem
• Global Semiconductor Sales Decrease 8.7% in First Quarter; March Sales Tick Up Month-to-Month for First Time Since May 2022
• Rambus Reports First Quarter 2023 Financial Results

Sunday, April 30, 2023

• £21.5m raised to supercharge 5G radio performance | AccelerComm
• Overcoming the Automotive-Grade IC Shortage
• Fraunhofer picks Achronix eFPGAs for chiplet demonstrator
• Soitec S.A.'s (EPA:SOI) latest 12% decline adds to one-year losses, institutional investors may consider drastic measures
• Electronic System Design Industry Logs $3.9 Billion in Revenue in Q4 2022, ESD Alliance Reports
• EC approves €7.4bn subsidy for ST-GloFo JV fab
• Processor Startup Innovates Memory Allocation Management
• EdgeCortix Expands Leadership Team by Appointing Jeffry A. Milrod as Vice President of Product Engineering
• GlobalFoundries Completes Purchase of 800 Acres Adjacent to New York Manufacturing Facility
• Softbank files to list Arm on the Nasdaq
• TSMC's 3-nm Push Faces Tool Struggles
• Cadence Reports First Quarter 2023 Financial Results
• Samsung makes $3.4bn Q1 chip loss
• EU-Funded NimbleAI to Deliver 3D Neuromorphic Chip
• Arm Announces Confidential Submission of Draft Registration Statement for Proposed Initial Public Offering
• LC3plus audio codec for various Audio Application Is Available for Immediate Licensing!!