Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Videos
Subscribe to D&R SoC News Alert
English
Mandarin
Login
Catalog of SIP Cores
Silicon on Chip design resources
Catalog of SIP Cores
Silicon on Chip design resources
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Videos
Subscribe to D&R SoC News Alert
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller & PHY
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Design Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Search News
Keyword
Category
Foundry
Chiplet / Multi-Die
Design IP
Design Platform and Service
Processor
RISC-V
Artificial Intelligence
Automotive
Internet of Things
Security
Networking
Audio / Video
eFPGA / FPGA
Business
Monday, October 9, 2023
New Synopsys Research Reveals Vast Majority of Organizations Report DevOps Delays Due to Critical Security Issues
RISC-V group says export ban on open-source chip standard would slow innovation
Siemens launches Tessent tool for Verilog and RTL design for test
AMD to Acquire Open-Source AI Software Expert Nod.ai
Accellera Releases Portable Test and Stimulus Standard 2.1
Efabless Raises $6.3 Million in Series A-1 Extension, Featuring Investments from GlobalFoundries, Synopsys, and New North Ventures
Update on Israel situation; Weebit's operations unaffected
Omni Design to Present Next Generation LiDAR Solutions at CadenceLIVE Europe
Leti Innovation Days Tokyo 2023
Sunday, October 8, 2023
Siemens extends leadership in EDA design-for-test with the launch of Tessent RTL Pro
TSMC looks to standardise chiplet protocols in "world changing" move
TSMC September 2023 Revenue Report
1G Ethernet PHY IP Core is now available in 14nm LPP for Blackbox License and in 28FDSOI as Whitebox License for maximum flexibility
Thursday, October 5, 2023
Samsung Electronics and TSMC Grapple with 3-Nano Yield Challenges
GUC Monthly Sales Report - September 2023
UMC Reports Sales for September 2023
Marquee Semiconductor Expands Presence in India with New Location at Veer Surendra Sai University of Technology Campus in Odisha
ADTechnology and Zaram Technology to develop the next-generation of telecommunications semiconductor chips
Arteris Wins Autonomous Vehicle Technology of the Year Award
EDGX Announces Collaboration with BrainChip to Develop Disruptive Data Processing Solutions for Space
Wednesday, October 4, 2023
JUPITER Exascale Supercomputer, lead customer for SiPearl
Global Semiconductor Sales Increase 1.9% Month-to-Month in August
Using Open-Source Hardware to Speed Product Development
Swiss-Based Enclustra Announces US Operations in San Diego to Realize the Full Potential of Embedded Chip Technologies
SmartDV Rolls Out Multi-Phase Expansion Plan
MachineWare announces new ARM processor simulation and SystemC profiling products, adds Windows support
Renesas Extends Tender Offer and Receives CFIUS Clearance for Proposed Acquisition of Sequans
Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet
Cadence Completes Acquisition of Intrinsix
ELES and proteanTecs Partner to Enhance Reliability Testing with Deep Data Analytics
Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub
Tuesday, October 3, 2023
imec looks to automotive chiplet programme
Renesas partners with EdgeCortix to streamline AI/ML development
TSMC's 3Dblox 2.0 and 3DFabric Alliance Achievements Set the Stage for the Future of 3D IC
TSMC selects IC'Alps for its Design Center Alliance (DCA)
EdgeCortix Closes $20 Million in Additional Funding Round
Intel Announces Intent to Operate Programmable Solutions Group (PSG) as Standalone Business
Monday, October 2, 2023
Soitec Opens New Plant, Positioning SmartSiC™ as a Future EV Standard
Tachyum Books Purchase Order to Build System with 25,000x ChatGPT4 Capacity and 25x Faster than Current Supercomputers
BrainChip Makes Second-Generation Akida Platform Available to Advance State of Edge AI Solutions
CEA and Siemens collaborate on research to expand applications of Digital Twin for industry
Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect
Monday, October 2, 2023
Alphawave Semi Earns Great Place to Work® Certification™ for 2023-24
Sunday, October 1, 2023
Alphawave Semi Earns Great Place to Work® Certification™ for 2023-24
Wednesday, September 27, 2023
Circular Economy, a Path to a Sustainable Ecosystem: Infineon's Security Solutions Support the Industry, the Consumer, and the Environment Alike
Capgemini boosts its semiconductor capabilities in Europe with acquisition of HDL Design House
Intrinsic ID Becomes World's First IP Vendor with PSA Certified Level 3 Root of Trust Component
How the Worlds of Chiplets and Packaging Intertwine
Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Advanced 4nm RF FinFET Process
EU Turns Rivals into Allies
M31 Announces Low-Power IP Solutions for TSMC's N12e Process
Microchip FPGAs Speed Intelligent Edge Designs and Reduce Development Cost and Risk with Tailored PolarFire® FPGA and SoC Solution Stacks
Nanusens technology is key to enabling AI to be smarter
Percepio Enables Trace Observability for All RTOS, Middleware and Silicon Vendor APIs
China Gears Up for Chip Dumping, Ex-DoC Official Says
TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
Wednesday, September 27, 2023
GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit
Previous
|
Next
Did you miss last D&R News Alerts ?