Search News

Thursday, April 13, 2023

• The Future of LiDAR Lies in ADAS
• TSMC could partner with Bosch for 28nm fab in Germany
• Fraunhofer IIS partners with Avid to enable support of MPEG-H Audio in Pro Tools
• CryptOne IP Core is ready for post-quantum reality
• Experience the Future of Video Processing with intoPIX and Imagine Communications at the 2023 NAB Show
• MainConcept and Fraunhofer IIS collaborate on MPEG-H Audio and xHE-AAC encoding for video and audio streaming services
• Pine64 launches world's first RISC-V tablet device - PineTab-V for presale
• IAR Embedded Secure IP upgrades solutions portfolio with late-stage security
• Pragmatic Semiconductor Announces Appointment of Semiconductor Industry Veteran, David Moore, as CEO
• Cadence Introduces EMX Designer, Delivering More Than 10X Increased Performance for On-Chip Passive Component Synthesis
• Strict Restrictions Imposed by US CHIPS Act Will Lower Willingness of Multinational Suppliers to Invest; Chinese Semiconductor Development Will Be Limited for Next Decade, Says TrendForce

Thursday, April 13, 2023

• Hardware Root of Trust: The Key to IoT Security in Smart Homes

Wednesday, April 12, 2023

• Battery recycling takes the driver's seat
• JEDEC Expands CAMM Standardization to include Two Key Memory Technologies
• VeriSilicon Brings Super Resolution Technology to Smart Display
• Get Ready to be Amazed by the one-of-a-kind exhibit "JPEG XS in Action" by intoPIX at NAB2023
• Frontgrade Products Enable ESA's JUICE Mission
• Global Semiconductor Equipment Billings Reach Industry Record $107.6 Billion in 2022, SEMI Reports
• IC Manage Partners with Library Technologies to Accelerate Library Characterization by 100x in the Cloud
• Ateme and Fraunhofer Join Forces to Deliver Next Generation Audio
• On your Wrist and in Space; Intrinsic ID is Everywhere. Come Find us at Key Industry Tradeshows in April
• EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices
• Synopsys Introduces the Industry's First Emulation System with Unmatched Capacity to Enable Electronics Digital Twins of Advanced SoCs
• Softbank reduces Alibaba holding to 3.8%

Tuesday, April 11, 2023

• Infineon Renames IPC Division to Green Industrial Power
• Nordic Semi introduces fourth generation of multiprotocol SoCs
• Rambus Joins the Intel Foundry Services (IFS) Accelerator IP Alliance to Enable State-of-the-Art SoCs
• DENSO adopts VisualSim Architect to improve in-vehicle network design.
• APlabs Chooses CAST IP Cores for Next-Generation Automotive SoC
• Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design
• Xylon Reveals Industry's First L5 Autonomy Ready Data Logger and HIL System
• Arteris IP Selected By ASICLAND for Automotive, AI Enterprise and AI Edge SoCs
• Tiempo Secure and GreenWaves Technologies demonstrate Secure Element role as Master in an embedded system
• Cadence Strengthens Tensilica Vision and AI Software Partner Ecosystem for Advanced Automotive, Mobile, Consumer and IoT Applications
• Lawo and intoPIX Partner to Deliver End-to-End JPEG XS Support!

Monday, April 10, 2023

• UK wireless strategy aims to boost 5G/6G deployment
• Rapid Silicon Launches Revolutionary RapidGPT for FPGA Designers
• Renesas Samples Its First 22-nm Microcontroller
• TSMC March 2023 Revenue Report
• UMC Reports Sales for March 2023
• Village Island VICO-XI is Revolutionizing IP Video Conversion with Reduced Bandwidth and Microsecond Latency using intoPIX Technology

Sunday, April 9, 2023

• Peripheral IP Cores targeting Automotive applications are instantly licensable for extremely reliable performance

Saturday, April 8, 2023

• Semiconductor sustainability: Paving the way for a greener technology industry

Thursday, April 6, 2023

• ARM completes functional safety revamp of microcontrollers with Cortex-M23 update
• Global Semiconductor Sales Decrease 4% Month-to-Month in February

Wednesday, April 5, 2023

• CXL Testing Leverages PCIe Expertise
• ChatGPT leaking Samsung chip secrets is iceberg's tip
• SiPearl: Initial closing of Series A with €90m financing to launch Rhea, the energy-efficient HPC-dedicated microprocessor
• GUC Monthly Sales Report - March 2023
• Post-Quantum Cryptography: Are You Ready?
• Samsung Electronics and AMD Extend Strategic IP Licensing Agreement To Bring AMD Radeonâ„¢ Graphics to Future Mobile Platforms
• Synopsys Accelerates First-Pass Silicon Success for Banias Labs' Networking SoC
• AMD Launches First 5nm ASIC-based Media Accelerator Card to Power New Era of Interactive Media Services at Scale
• intoPIX Partners with Panasonic Connect to Enable new JPEG XS Cameras for Live Video Production
• GUC Taped Out 3nm 8.6Gbps HBM3 and 5Tbps/mm GLink-2.5D IP using TSMC Advanced Packaging Technology
• As Arm Eyes IPO and Higher Prices, RISC-V May Get a Boost

Tuesday, April 4, 2023

• Post-Quantum Cryptography: Are You Ready?
• Capgemini to coordinate next generation IoT project for european commission
• Rapidus, Japan's newly founded chip manufacturer, joins imec's Core Partner Program
• Tiempo Secure appoints IPro as its Sales Representative in Israel
• OPENEDGES' LPDDR5 Memory Subsystem IP Licensed by Aisin for Automotive Application
• Orthogone and Napatech collaborate to deliver state-of-the-art, ultra-low latency FPGA-based SmartNIC platform for high-frequency trading applications
• Rambus and SK hynix Extend Comprehensive License Agreement
• Google extends license agreement for AAC codec range with Fraunhofer IIS

Monday, April 3, 2023

• Synopsys to Showcase Next Gen Polaris Software Integrity Platform at RSA Conference
• Allegro DVT Announces the Industry's First MPEG-5 LCEVC Decoder Silicon IP
• SEMIFIVE Achieves Mass Production Milestone of its SoC Platform
• CEO interview: Paul Wells of SureCore on low power memory and China
• ULTRARAMâ„¢ universal computer memory to be commercialised
• Introducing STAGE RACER 2 with intoPIX JPEG XS: The Future of Fiber Transmission for Broadcast Events
• sureCore pushes the SRAM voltage envelope to below 0.5V for the first time
• Sondrel signs EDA license extension with Siemens for three more years

Sunday, April 2, 2023

• Making Formal Verification the New Normal in IoT with Ashish Darbari - Founder, Axiomise | The IoT Podcast
• SynSense closes strategic round to accelerate the development of their high-speed 3D neuromorphic processor DYNAPâ„¢-CNN2
• Vtool appoints Wonderep to be its sales-channel partner in Israel
• The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi
• TurboConcept and Lomicro Information Technology today celebrate two years of successful collaboration
• XMOS announces xcore®-voice: the next generation intelligent solution for smart voice applications
• Unleashing the Full Potential of Your Display: eDisplayPort v1.4 PHY and Controller IP Cores are available for licensing for your Robust products