Search News

Monday, October 9, 2023

• New Synopsys Research Reveals Vast Majority of Organizations Report DevOps Delays Due to Critical Security Issues
• RISC-V group says export ban on open-source chip standard would slow innovation
• Siemens launches Tessent tool for Verilog and RTL design for test
• AMD to Acquire Open-Source AI Software Expert Nod.ai
• Accellera Releases Portable Test and Stimulus Standard 2.1
• Efabless Raises $6.3 Million in Series A-1 Extension, Featuring Investments from GlobalFoundries, Synopsys, and New North Ventures
• Update on Israel situation; Weebit's operations unaffected
• Omni Design to Present Next Generation LiDAR Solutions at CadenceLIVE Europe
• Leti Innovation Days Tokyo 2023

Sunday, October 8, 2023

• Siemens extends leadership in EDA design-for-test with the launch of Tessent RTL Pro
• TSMC looks to standardise chiplet protocols in "world changing" move
• TSMC September 2023 Revenue Report
• 1G Ethernet PHY IP Core is now available in 14nm LPP for Blackbox License and in 28FDSOI as Whitebox License for maximum flexibility

Thursday, October 5, 2023

• Samsung Electronics and TSMC Grapple with 3-Nano Yield Challenges
• GUC Monthly Sales Report - September 2023
• UMC Reports Sales for September 2023
• Marquee Semiconductor Expands Presence in India with New Location at Veer Surendra Sai University of Technology Campus in Odisha
• ADTechnology and Zaram Technology to develop the next-generation of telecommunications semiconductor chips
• Arteris Wins Autonomous Vehicle Technology of the Year Award
• EDGX Announces Collaboration with BrainChip to Develop Disruptive Data Processing Solutions for Space

Wednesday, October 4, 2023

• JUPITER Exascale Supercomputer, lead customer for SiPearl
• Global Semiconductor Sales Increase 1.9% Month-to-Month in August
• Using Open-Source Hardware to Speed Product Development
• Swiss-Based Enclustra Announces US Operations in San Diego to Realize the Full Potential of Embedded Chip Technologies
• SmartDV Rolls Out Multi-Phase Expansion Plan
• MachineWare announces new ARM processor simulation and SystemC profiling products, adds Windows support
• Renesas Extends Tender Offer and Receives CFIUS Clearance for Proposed Acquisition of Sequans
• Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet
• Cadence Completes Acquisition of Intrinsix
• ELES and proteanTecs Partner to Enhance Reliability Testing with Deep Data Analytics
• Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub

Tuesday, October 3, 2023

• imec looks to automotive chiplet programme
• Renesas partners with EdgeCortix to streamline AI/ML development
• TSMC's 3Dblox 2.0 and 3DFabric Alliance Achievements Set the Stage for the Future of 3D IC
• TSMC selects IC'Alps for its Design Center Alliance (DCA)
• EdgeCortix Closes $20 Million in Additional Funding Round
• Intel Announces Intent to Operate Programmable Solutions Group (PSG) as Standalone Business

Monday, October 2, 2023

• Soitec Opens New Plant, Positioning SmartSiC™ as a Future EV Standard
• Tachyum Books Purchase Order to Build System with 25,000x ChatGPT4 Capacity and 25x Faster than Current Supercomputers
• BrainChip Makes Second-Generation Akida Platform Available to Advance State of Edge AI Solutions
• CEA and Siemens collaborate on research to expand applications of Digital Twin for industry
• Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect

Monday, October 2, 2023

• Alphawave Semi Earns Great Place to Work® Certificationâ„¢ for 2023-24

Sunday, October 1, 2023

• Alphawave Semi Earns Great Place to Work® Certification™ for 2023-24

Wednesday, September 27, 2023

• Circular Economy, a Path to a Sustainable Ecosystem: Infineon's Security Solutions Support the Industry, the Consumer, and the Environment Alike
• Capgemini boosts its semiconductor capabilities in Europe with acquisition of HDL Design House
• Intrinsic ID Becomes World's First IP Vendor with PSA Certified Level 3 Root of Trust Component
• How the Worlds of Chiplets and Packaging Intertwine
• Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Advanced 4nm RF FinFET Process
• EU Turns Rivals into Allies
• M31 Announces Low-Power IP Solutions for TSMC's N12e Process
• Microchip FPGAs Speed Intelligent Edge Designs and Reduce Development Cost and Risk with Tailored PolarFire® FPGA and SoC Solution Stacks
• Nanusens technology is key to enabling AI to be smarter
• Percepio Enables Trace Observability for All RTOS, Middleware and Silicon Vendor APIs
• China Gears Up for Chip Dumping, Ex-DoC Official Says
• TSMC Announces Breakthrough Set to Redefine the Future of 3D IC

Wednesday, September 27, 2023

• GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit