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Wednesday, March 29, 2023

• Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon's High-Performance Processors
• CXL Testing Leverages PCIe Expertise
• POLYN Introduces VibroSense, Industry-First Application-Specific Vibration Pre-Processing Chip Design
• Interview: Aart de Geus on AI-driven EDA
• Renesas Expands RISC-V Embedded Processing Portfolio with New Voice-Control ASSP Solution
• Computing Hardware Expert Georgios Konstadinidis Joins proteanTecs Advisory Board

Tuesday, March 28, 2023

• 3D-IC: An Opportunity to Augment India's Semiconductor Ecosystem
• Survey reveals software now central to automotive development
• I hear you NOCing, But Can You Close Timing?
• Veriest Solutions Promotes Dusica Glisic to Vice President of Frontend Engineering
• Synopsys.ai Unveiled as Industry's First Full-Stack, AI-Driven EDA Suite for Chipmakers
• Tachyum To Use UCIe Interconnect Standards In Prodigy 2
• Networking Chip Startup Enfabrica Emerges from Stealth Mode to Solve Scalability and Price-Performance Challenges for AI Growth in Cloud
• Report: Arm proposes change to IP royalty model

Monday, March 27, 2023

• Mobiveil's PSRAM Controller IP Lets SoC Designers Leverage AP Memory's Xccela x8/x16 250 MHz PSRAM Memory
• eMemory and UMC Expand Low-Power Memory Solutions for AIoT and Mobile Markets with 22nm RRAM Qualification

Monday, March 27, 2023

• Andes Custom Extensionâ„¢ (ACE) Supports AndesCoreâ„¢ 45-Series Processors to Provide Flexible Acceleration

Sunday, March 26, 2023

• Samsung Electronics Facing TSMC-Nvidia Alliance in Advanced Chip War
• Is RISC-V Poised to Benefit From Arm's Licensing Changes?
• MIPI A-PHY Specification Levels Up In-Vehicle Connectivity
• Chinese web giant Baidu backs RISC-V for the datacenter
• China forms its own chiplet standard amid isolation
• 2026 All-Time High in Store for Global 300mm Semiconductor Fab Capacity After 2023 Slowdown, SEMI Reports
• Designing MPUs/MCUs with Functional Safety
• Sensor Fusion Explores AI to Prep for ADAS, AV Designs
• MIPI A-PHY Specification Levels Up In-Vehicle Connectivity
• Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 22nm ULP is Available for Immediate Licensing for Smart Audio Chipsets

Thursday, March 23, 2023

• Alphawave Semi Opens Pune Office, Continues Expansion into India

Wednesday, March 22, 2023

• SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speckâ„¢" to mass production
• Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports
• CEO Interview: Ian Lankshear, EnSilica
• Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration
• OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip

Tuesday, March 21, 2023

• Hidden impact of semiconductor manufacturing on climate change
• IAR Delivers "Security Made Simple"
• Infineon and UMC Extend Automotive Partnership
• Renesas to Acquire Panthronics to Extend Connectivity Portfolio with Near-Field Communication Technology
• The Impact Of Blockchain On IoT Data Privacy
• BrainChip's Neuromorphic Technology Enables Intellisense Systems to Address Needs for Next-Generation Cognitive Radio Solutions
• SoftBank and EdgeCortix Partner to Jointly Realize Low-latency and Highly Energy-efficient 5G Wireless Accelerators

Monday, March 20, 2023

• CEO Interview: Ian Lankshear, EnSilica
• Electronics Tech Hub Seeks to Set Example for Green Semi Manufacturing
• NVIDIA, ASML, TSMC and Synopsys Set Foundation for Next-Generation Chip Manufacturing
• Omni Design Opens Design Center in Hyderabad, India
• Agile Analog joins Intel Foundry Services Accelerator IP Alliance Program to drive forward semiconductor design innovation
• SkyWater Establishes Cryogenic Lab, Utilizes FormFactor's Leading Tool for RTS Noise Detection in Read-Out Integrated Circuit Applications

Sunday, March 19, 2023

• Perforce Joins AWS ISV Accelerate Program and Launches Turnkey Cloud Solution for Helix Core in AWS Marketplace
• Sustainability In Semiconductors - Why Eco-Friendly Initiatives Are Important In The Tech Industry
• Securing Memory will Take More than Cryptography Alone
• TDK announces availability of automated ML Platform Integration for Arm® Keil® MDK
• 12bit 2Msps Silicon proven SAR ADC IP Core with Ultra-low power is available in different technology nodes for various applications that includes IoT, Medical, Consumer, etc
• Remote.It Simplifies Secure Access to Arm Virtual Devices
• TDK announces availability of automated ML Platform Integration for Arm® Keil® MDK