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Monday, September 25, 2023
Infineon's Circular Economy Security Advancing Sustainability for All
Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs
QuickLogic Announces New eFPGA Contract Targeting GlobalFoundries 22FDX® Platform
Cadence AI-Powered Virtuoso Studio Supports RF and mmWave Design Reference Flows for TSMC N16RF, N6RF and N4PRF
Unlocking IoT Security: Crypto Quantique Introduces QuarkLink Ignite - A Free IoT Security SaaS Platform
Ashling's RiscFree™ SDK Now Supports RISC-V® Processor Cores from CAST
Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies
Codasip selects Verilock to provide secure hardware authentication technology
Synopsys Unveils Industry's Broadest Portfolio of Automotive-Grade IP on TSMC's N5A Process Technology
Introducing Tomi Jalonen - Xiphera's Sales Representative for Central European Markets
SambaNova Unveils New AI Chip, the SN40L, Powering its Full Stack AI Platform
Kneron Announces $49M in Additional Funding, Bringing Total Series B to $97M
GlobalFoundries Announces Opening of New Malaysia Office to Support Global Manufacturing Operations
Sunday, September 24, 2023
Efabless Launches 3rd AI-Generated Open-Source AI Contest to Extend the Caravel SoC Platform with AI-Generated Peripherals
Synopsys tools tape out 2nm chips at TSMC
Alphawave Semi: Interim results for the six months ended 30 June 2023
Arm shares return to offer price
Synopsys and TSMC Collaborate to Accelerate 2nm Innovation for Advanced SoC Design with Certified Digital and Analog Design Flows
Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes
proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem
Flex Logix Expands Upon Industry-leading Embedded FPGA Customer Base
Unlock the Power of DisplayPort v1.4 Tx/Rx PHY and Controller IP Cores: Maximize the Potential of Your Next-Generation Products
proteanTecs Joins TSMC 3DFabricâ„¢ Alliance, Expanding Its Support of the 3D IC Ecosystem
GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding
Thursday, September 21, 2023
MEEP: An HPC Systems Development Platform for RISC-V Based HW/SW Co-Design
Q2 Revenue for Top 10 Global IC Houses Surges by 12.5% as Q3 on Pace to Set New Record, Says TrendForce
Sustainable Innovation Month - Fostering Innovation Action
Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings
Rambus MACsec-IP-361 is Certified ASIL-B Ready
Wednesday, September 20, 2023
Report: TSMC Could Push 2nm Node Back to 2026
U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing
Kalray announces the availability of its new processor "Coolidgeâ„¢2", the first DPU optimized for AI and data intensive processing
Inuitive Adopts VeriSilicon's Advanced ISP IP for its Vision AI Processor
Alphacore Recognized for its TID Results of 22-nm FDSOI SRAM Published in IEEE Transactions on Nuclear Science journal
SMIC Well on Its Way to 5-nm Breakthrough, Observers Say
Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports
Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP
CEVA, Inc. Appoints Iri Trashanski as Chief Strategy Officer
BrainChip Engages VVDN to Deliver Industry's First Commercial Edge Box Based on Neuromorphic Technology
Nordic combines Arm and RISC-V for "remarkable" EEMBC benchmarks
Infineon heads European research project for advancing the circular economy and sustainability of the electronics industry
Tuesday, September 19, 2023
OpenHW Group Appoints Florian 'Flo' Wohlrab as New CEO to Spearhead Open-Source Ecosystem Advancement
SEMI Semiconductor Climate Consortium and BCG Issue First Insider Report of Semiconductor Value Chain's Carbon Emissions
AccelerComm, Radisys, RFDSP & TTP unveil LEO Regenerative 5G RAN solution
Intel launches compact RISC-V Nios processor core
Nordic combines Arm and RISC-V for 'remarkable' EEMBC benchmarks
UXL looks to standardise heterogeneous compute
AiM Future Introduces Next-Generation NeuroMosAIc Processors, Expands Partnerships
Cadence to Acquire Intrinsix Corporation from CEVA
Thalia expands footprint in China with appointment of Business Partner Fionn Liu
ADTechnology and BOS Semiconductor Collaborate to develop 5nm automotive semiconductors
Monday, September 18, 2023
New RISC-V Market Report Will Provide 5-year Growth Projections for Semiconductor Devices and Insights on the Enabling Ecosystem
Synopsys Aims to Advance IC Design Workforce in Vietnam
Intel Innovation 2023: Empowering Developers to Bring AI Everywhere
Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design
TSMC in talks about chiplet packaging in Arizona
QuickLogic and Xiphera Partner to Pioneer Post-Quantum Cryptography on eFPGAs
Creonic Expands Satellite IP Core Portfolio with DVB-S2X Multi-Carrier Demodulator
SandBox Semiconductor Adds Hybrid Metrology Capabilities to Industry's Leading Physics-based, AI-enabled Process Optimization Platform, Creating the First Software Solution to Holistically Address Process Development Challenges
OPENEDGES and VisioNexT Shapes the Future of Vision AI SoCs
Rambus Added to PHLX Semiconductor Sector Index (SOX)
Arm Announces Closing of Initial Public Offering and Full Exercise of Underwriters' Option to Purchase Additional American Depositary Shares
Sunday, September 17, 2023
HighTec, Synopsys team for AI on Infineon's AURIX TC4x
Arm Begins 2nd Term on Nasdaq, at $54.5 Billion Valuation
Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm
Synopsys Demonstrates Industry's First Interoperability of PCI Express 6.0 IP with Intel's PCIe 6.0 Test Chip
Driving Europe's Chip Renaissance: TSMC's Vision with ESMC
TCL Joins Via Licensing Alliance's ATSC 3.0 Broadcasting Patent Pool
Quadric Announces Llama2 LLM Support Immediately Available for Chimera GPNPUs
Flex Logix Announces Reconfigurable Block RAM with ECC Option
LIN Controller IP Core, equipped with a Safety package (Safe LIN, ISO 26262: Safety manual, FMEDA), tailored specifically for High-End Automotive and Consumer Applications is available for immediate licensing
Panmesia Raises $12.5 Million in Seed Funding with a Valuation Exceeding $81.4 Million in the CXL Semiconductor Arena
Thursday, September 14, 2023
TSMC Accelerates Renewable Energy Adoption and Moves RE100 Target Forward to 2040
Driving EuropeÂ’s Chip Renaissance: TSMCÂ’s Vision with ESMC
Wednesday, September 13, 2023
Lawo and intoPIX Partner to Deliver Edge-Compute JPEG XS Support at IBC 2023
Realtek and V-Nova Announce Support for MPEG-5 Part 2 LCEVC on Set-Top-Box SoCs
X-Fab adds new passive integration technology for RF
Arm Announces Pricing of Initial Public Offering
Fraunhofer IIS and IHSE announce their partnership for new JPEG XS implementations at IBC 2023
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