Search News

Monday, September 25, 2023

• Infineon's Circular Economy Security Advancing Sustainability for All
• Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs
• QuickLogic Announces New eFPGA Contract Targeting GlobalFoundries 22FDX® Platform
• Cadence AI-Powered Virtuoso Studio Supports RF and mmWave Design Reference Flows for TSMC N16RF, N6RF and N4PRF
• Unlocking IoT Security: Crypto Quantique Introduces QuarkLink Ignite - A Free IoT Security SaaS Platform
• Ashling's RiscFree™ SDK Now Supports RISC-V® Processor Cores from CAST
• Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies
• Codasip selects Verilock to provide secure hardware authentication technology
• Synopsys Unveils Industry's Broadest Portfolio of Automotive-Grade IP on TSMC's N5A Process Technology
• Introducing Tomi Jalonen - Xiphera's Sales Representative for Central European Markets
• SambaNova Unveils New AI Chip, the SN40L, Powering its Full Stack AI Platform
• Kneron Announces $49M in Additional Funding, Bringing Total Series B to $97M
• GlobalFoundries Announces Opening of New Malaysia Office to Support Global Manufacturing Operations

Sunday, September 24, 2023

• Efabless Launches 3rd AI-Generated Open-Source AI Contest to Extend the Caravel SoC Platform with AI-Generated Peripherals
• Synopsys tools tape out 2nm chips at TSMC
• Alphawave Semi: Interim results for the six months ended 30 June 2023
• Arm shares return to offer price
• Synopsys and TSMC Collaborate to Accelerate 2nm Innovation for Advanced SoC Design with Certified Digital and Analog Design Flows
• Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes
• proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem
• Flex Logix Expands Upon Industry-leading Embedded FPGA Customer Base
• Unlock the Power of DisplayPort v1.4 Tx/Rx PHY and Controller IP Cores: Maximize the Potential of Your Next-Generation Products
• proteanTecs Joins TSMC 3DFabricâ„¢ Alliance, Expanding Its Support of the 3D IC Ecosystem
• GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding

Thursday, September 21, 2023

• MEEP: An HPC Systems Development Platform for RISC-V Based HW/SW Co-Design
• Q2 Revenue for Top 10 Global IC Houses Surges by 12.5% as Q3 on Pace to Set New Record, Says TrendForce
• Sustainable Innovation Month - Fostering Innovation Action
• Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings
• Rambus MACsec-IP-361 is Certified ASIL-B Ready

Wednesday, September 20, 2023

• Report: TSMC Could Push 2nm Node Back to 2026
• U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing
• Kalray announces the availability of its new processor "Coolidgeâ„¢2", the first DPU optimized for AI and data intensive processing
• Inuitive Adopts VeriSilicon's Advanced ISP IP for its Vision AI Processor
• Alphacore Recognized for its TID Results of 22-nm FDSOI SRAM Published in IEEE Transactions on Nuclear Science journal
• SMIC Well on Its Way to 5-nm Breakthrough, Observers Say
• Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports
• Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP
• CEVA, Inc. Appoints Iri Trashanski as Chief Strategy Officer
• BrainChip Engages VVDN to Deliver Industry's First Commercial Edge Box Based on Neuromorphic Technology
• Nordic combines Arm and RISC-V for "remarkable" EEMBC benchmarks
• Infineon heads European research project for advancing the circular economy and sustainability of the electronics industry

Tuesday, September 19, 2023

• OpenHW Group Appoints Florian 'Flo' Wohlrab as New CEO to Spearhead Open-Source Ecosystem Advancement
• SEMI Semiconductor Climate Consortium and BCG Issue First Insider Report of Semiconductor Value Chain's Carbon Emissions
• AccelerComm, Radisys, RFDSP & TTP unveil LEO Regenerative 5G RAN solution
• Intel launches compact RISC-V Nios processor core
• Nordic combines Arm and RISC-V for 'remarkable' EEMBC benchmarks
• UXL looks to standardise heterogeneous compute
• AiM Future Introduces Next-Generation NeuroMosAIc Processors, Expands Partnerships
• Cadence to Acquire Intrinsix Corporation from CEVA
• Thalia expands footprint in China with appointment of Business Partner Fionn Liu
• ADTechnology and BOS Semiconductor Collaborate to develop 5nm automotive semiconductors

Monday, September 18, 2023

• New RISC-V Market Report Will Provide 5-year Growth Projections for Semiconductor Devices and Insights on the Enabling Ecosystem
• Synopsys Aims to Advance IC Design Workforce in Vietnam
• Intel Innovation 2023: Empowering Developers to Bring AI Everywhere
• Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design
• TSMC in talks about chiplet packaging in Arizona
• QuickLogic and Xiphera Partner to Pioneer Post-Quantum Cryptography on eFPGAs
• Creonic Expands Satellite IP Core Portfolio with DVB-S2X Multi-Carrier Demodulator
• SandBox Semiconductor Adds Hybrid Metrology Capabilities to Industry's Leading Physics-based, AI-enabled Process Optimization Platform, Creating the First Software Solution to Holistically Address Process Development Challenges
• OPENEDGES and VisioNexT Shapes the Future of Vision AI SoCs
• Rambus Added to PHLX Semiconductor Sector Index (SOX)
• Arm Announces Closing of Initial Public Offering and Full Exercise of Underwriters' Option to Purchase Additional American Depositary Shares

Sunday, September 17, 2023

• HighTec, Synopsys team for AI on Infineon's AURIX TC4x
• Arm Begins 2nd Term on Nasdaq, at $54.5 Billion Valuation
• Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm
• Synopsys Demonstrates Industry's First Interoperability of PCI Express 6.0 IP with Intel's PCIe 6.0 Test Chip
• Driving Europe's Chip Renaissance: TSMC's Vision with ESMC
• TCL Joins Via Licensing Alliance's ATSC 3.0 Broadcasting Patent Pool
• Quadric Announces Llama2 LLM Support Immediately Available for Chimera GPNPUs
• Flex Logix Announces Reconfigurable Block RAM with ECC Option
• LIN Controller IP Core, equipped with a Safety package (Safe LIN, ISO 26262: Safety manual, FMEDA), tailored specifically for High-End Automotive and Consumer Applications is available for immediate licensing
• Panmesia Raises $12.5 Million in Seed Funding with a Valuation Exceeding $81.4 Million in the CXL Semiconductor Arena

Thursday, September 14, 2023

• TSMC Accelerates Renewable Energy Adoption and Moves RE100 Target Forward to 2040
• Driving EuropeÂ’s Chip Renaissance: TSMCÂ’s Vision with ESMC

Wednesday, September 13, 2023

• Lawo and intoPIX Partner to Deliver Edge-Compute JPEG XS Support at IBC 2023
• Realtek and V-Nova Announce Support for MPEG-5 Part 2 LCEVC on Set-Top-Box SoCs
• X-Fab adds new passive integration technology for RF
• Arm Announces Pricing of Initial Public Offering
• Fraunhofer IIS and IHSE announce their partnership for new JPEG XS implementations at IBC 2023