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Thursday, December 28, 2023
Led by automakers, 12 companies in Japan form Advanced SoC Research for Automotive
Fraunhofer IIS joins Sonical's Headphone 3.0 platform
PCIe 6.0 moves closer to arriving in the market in 2024: Alphawave demonstrates interoperability
Samsung Seen Stumbling at Silicon's Leading Edge
BrainChip Awarded Latest Patent for Event-Based Pattern Detection
U.K. Conference Accelerates Post-Quantum Cryptography Standards Review Process
Wednesday, December 27, 2023
Samsung Press Conference at CES 2024: Connectivity in the Age of AI
Established "Advanced SoC Research for Automotive" with 12 companies, led by automotive manufacturers
Can There Be Any Doubt? In Our Industry, 2023 Was 'The Year of AI'
Rambus Advances Data Center Server Performance with Industry-First Gen4 DDR5 RCD
Tuesday, December 26, 2023
Can There Be Any Doubt? In Our Industry, 2023 Was 'The Year of AI'
Monday, December 25, 2023
Samsung Delays Mass Production at New Texas Fab to 2025
Synopsys plus Ansys: The making of an EDA giant?
The green revolution runs on chips - but there is no good way to make the fragile semiconductors ecosystem sustainable in the short term
Outlook 2024: 6 ways tech will play a role in sustainability
Europe Aims for Leadership Role in Quantum Computing
Samsung, Intel Gear Up for Intense Competition in 2-NM Semiconductor Process, Chasing TSMC
Thursday, December 21, 2023
Five Leading Semiconductor Industry Players Incorporate New Company, Quintauris, to Drive RISC-V Ecosystem Forward
Wednesday, December 20, 2023
Silvaco Successfully Concludes Its Global Users Event (SURGE) With Over 1000 End-Users and Prospects in Attendance
Next Up: Internet of Energy
Quantum predictions for 2024
Is Software and Hardware Ready for TinyML Tsunami?
Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development
Synopsys Acquires RISC-V Processor Simulation Tools Firm
XYALIS unveils Hartroid: A Strategic Initiative to Counter Hardware Trojans in Defense Systems
Tiempo Secure's Unique IP Expertise Required to Secure First Post Quantum Sovereignty Chip
Tuesday, December 19, 2023
2023 MRAM Forum Shows MRAM For Automotive And Other Applications
2023 in Review: AI Takes Center Stage in the Eternal Quest for Innovation
Intel Announces the Company's Largest Architectural Change in 40 Years
SensiML launches Data Studio - sensor data management for AI/ML
Samsung Seen Stumbling at Silicon's Leading Edge
Siemens collaborates with sureCore and Semiwise to pioneer quantum computing ready cryogenic semiconductor designs
Reed Solomon Encoder and Decoder FEC IP Core From Global IP Core
TSMC Announces Dr. Mark Liu Not to Participate in Next Board of Directors Election
GlobalLogic Announces Acquisition of Mobiveil
Top Ten IC Design Houses Ride Wave of Seasonal Consumer Demand and Continued AI Boom to See 17.8% Increase in Quarterly Revenue in 3Q23, Says TrendForce
Monday, December 18, 2023
Intrinsic ID to Showcase New Embedded Security Solutions at CES 2024
Takashi Yamada, Memory Industry Expert Joins OPENEDGES to Lead Japan Business
ST Engineering Acquires D'Crypt to Strengthen its Cyber Capabilities
VeriSilicon and Google Collaborate on the Open-Source Project Open Se Cura
Sunday, December 17, 2023
Siemens to tap EU chip cash with Cre8Ventures
Infineon commits to set a science-based target and expands its climate strategy towards the supply-chain
World's first UCIe heterogeneous chiplet test chip
Apple-TSMC-Amkor Pact Bolsters U.S. Chip Supply Chain
Igniting Innovation: Siemens EDA launches Cre8Ventures in support of the EU Chips Act
Infineon, POLYN to Collaborate on Advanced Tire Monitoring Products
BrainChip and Unigen Partner to Deliver Powerful, Energy-Efficient Edge AI Server
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