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Thursday, November 30, 2023

• Energy Collaborative to Help Accelerate Installation of Greener Energy Sources in APAC
• Leadership Spotlight: Sanjeev Kumar Earns Global CEO Business Excellence Award
• Lockheed Martin Prepares First 5G.MIL® Payload for Orbit
• Faraday Receives ISO/IEC 27001:2022 Certification for Information Security Management System

Wednesday, November 29, 2023

• Cadence Signoff Solutions Empower Samsung Foundry's Breakthrough Success on 5G Networking SoC Design
• BrainChip Details Olfactory Capabilities of Identifying Bacteria in the Blood in New Research Report
• Agile Analog's New VP Sales to Expand Ties With Foundries
• Credo Technology Group Holding Ltd Reports Second Quarter of Fiscal Year 2024 Financial Results
• Agnisys Announces Wacom Selects IDesignSpecâ„¢ to Automate Its IP and Chip Development Flow from Executable Specifications
• Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2023
• QuickLogic Secures New eFPGA IP Contract on UMC's 22nm Process
• Renesas Unveils the First Generation of Own 32-bit RISC-V CPU Core Ahead of Competition

Tuesday, November 28, 2023

• Amidst export restrictions, RISC-V continues to advance
• European tech funding dropping but better than elsewhere
• AI Puts the "Ability" in Sustainability
• Crypto Quantique partners with Blaitek enabling quantum secure chip-to-cloud connection
• Omni Design Technologies Announces Expanded Silicon IP Solutions on Multiple TSMC Processes
• Unleashing Edge AI Potential: Eta Compute's New Collaboration with NXP Semiconductors
• M31 Completes Validation of 7nm ONFI 5.1 I/O IP - Targeting for the Global AI Big Data Storage Market
• Untether AI Joins UCIe Consortium to Drive Chiplet Technology and Energy-Centric AI Acceleration
• Manufacturers Anticipate Completion of NVIDIA's HBM3e Verification by 1Q24; HBM4 Expected to Launch in 2026, Says TrendForce
• Eliyan Appoints former head of Facebook/Meta AI infrastructure Dr. Jason Taylor to Board of Directors
• Quantum Effect Technology Breakthrough in Analog Circuit Design
• Intel to place US$14 billion orders with TSMC, says report
• Logic Fruit Technologies Launches LIN Master Slave IP Core

Monday, November 27, 2023

• Secure-IC Among The 50 Most Promising SMEs
• STMicroelectronics, ERG Sign Agreement for the Supply of Renewable Energy in Italy
• Corporates embrace sustainability
• Siemens revolutionizes engineering simulation with HEEDS AI Simulation Predictor and Simcenter Reduced Order Modeling
• Bridging the Talent Gap in Flanders' Semiconductor Industry
• Arteris Celebrates 3rd Year of Automotive ISO 26262 TCL1 Functional Safety Compliance for Magillem SoC Integration Automation
• Jayson Bethurem Joins Flex Logix as VP Marketing & Business Development
• Production Proven USB 3.2 Gen1/Gen2 IP Cores to ensure a seamless throughput for Next-Gen SoCs available for Immediate licensing

Monday, November 27, 2023

• Weebit Nano receives wafers manufactured in GlobalFoundries' 22FDX® process

Sunday, November 26, 2023

• Tenstorrent Gains Momentum in Asia With Rapidus Partnership
• Market Leaders Collaborate with Synopsys to Realize Gains of Generative AI Across Synopsys.ai Full EDA Stack

Thursday, November 23, 2023

• "Sustainability is an important outcome of digital transformation" - Eryn Devola, Siemens Digital Industries

Thursday, November 23, 2023

• Faraday Unveils Enhanced Gigabit Ethernet PHY on UMC's 28HPC+ Process

Wednesday, November 22, 2023

• BrainChip Announces Dr. Tony Lewis as the New Chief Technology Officer
• Broadcom Completes Acquisition of VMware
• LeWiz Open Source LVDS Transceiver Design
• ProteanTecs Awarded "Overall Connected Vehicle Innovation of the Year" in AutoTech Breakthrough Awards

Wednesday, November 22, 2023

• Secure-IC announces the integration of Securyzrâ„¢ technology in MediaTek's new flagship smartphone chip, Dimensity 9300

Tuesday, November 21, 2023

• US puts $3bn into packaging development and manufacturing
• EIC-funded companies at Intel & Hugging Face Summit
• Arm Extends Cortex-M Portfolio to Bring AI to the Smallest Endpoint Devices
• Alchip Unveils Industry's First Automotive ASIC Design Platform
• Agile Analog appoints former GUC Europe President as new VP of Sales
• VeriSilicon's Vector Graphics GPU is selected by LG Electronics
• LC3plus audio codec software licensed by major Audio OEM

Monday, November 20, 2023

• Synopsys GenAI Capability Helps Accelerate Chip Design
• Axelera AI Platform Accelerates Edge Application Deployment
• Samsung Foundry aims to improve production of AI, high performance computing chips
• Xiphera's Crypto Module Offers Customisable Offload and Acceleration Solutions
• Secure-IC strengthens its innovation leadership in embedded cybersecurity with the acquisition of eShard patents portfolio
• Weebit Nano receives wafers manufactured in GlobalFoundries' 22FDX® process
• New RISC-V processors address demand for open source and performance

Monday, November 20, 2023

• Renesas Extends Tender Offer for Proposed Acquisition of Sequans

Sunday, November 19, 2023

• Red Bull Ford Powertrains pursues the sustainable future of motorsport with Siemens Xcelerator
• Ventana Micro Systems Unveils Second Generation Veyron Family RISC-V Processor, Paving the Way for Data Center-Class Performance
• Insyde Software Becomes the First Independent BIOS Vendor to Achieve Arm SystemReady SR-SIE Certification for the NVIDIA GH200 Grace Hopper Superchip Platform
• Weebit Nano's ReRAM IP achieves high temperature qualification in SkyWater Technology's S130 process