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Tuesday, November 22, 2022

• Samsung's Latest Best-in-Class Technologies Take Center Stage at RSNA 2022
• SkyWater CEO Expands "Technology Foundry" Model
• 2023 Semi Capex Forecast Sees Largest Decline Since 2008-09

Tuesday, November 22, 2022

• Faraday FPGA-Go-ASICâ„¢ Succeeds in Penetrating the Market

Monday, November 21, 2022

• Ericsson to set up 6G research centre in UK
• Samsung Has Reportedly Secured 3nm Orders from NVIDIA, Qualcomm & More
• Arm public offer likely to be postponed beyond Q123
• Intel foundry boss to leave
• Faraday FPGA-Go-ASIC™ Succeeds in Penetrating the Market
• Aniah raises €6 million to speed up the deployment of its verification and design support software for semiconductors

Monday, November 21, 2022

• CEVA Introduces Voice User Interface Solution for TI SimpleLinkâ„¢ Wi-Fi® Wireless MCUs

Monday, November 21, 2022

• Alphawave IP announced as one of Deloitte's Technology Fast 50â„¢ and North American Technology Fast 500â„¢ 2022 award winners

Sunday, November 20, 2022

• Tesla becomes TSMC's first EV client for 4nm chips with 3x faster self-driving calculations
• Capgemini develops new AI solution to advance the treatment of River Blindness
• Wi-Fi 6 and 5G provide today's optimal wireless IoT connectivity
• TSMC to produce 3-nanometer chips at its Arizona factory
• Imagination partners with MulticoreWare Inc. and demonstrates superior performance of its GPUs
• CAES Supports NASA's Return to the Moon
• Embrace the new age of ultra-high-definition multimedia with HDMI 2.0 Rx PHY IP Cores in 12FFC process technology with matching controller
• BrainChip Names Former Arm Executive Nandan Nayampally as Chief Marketing Officer

Friday, November 18, 2022

• Vidatronic Named to the 18th Annual Aggie 100â„¢, Honored as Fastest-Growing Company

Thursday, November 17, 2022

• RISC-V Is Far from Being an Alternative to x86 and Arm in HPC
• Synopsys Wins Six Partner of the Year Awards at TSMC 2022 OIP Ecosystem Forum

Thursday, November 17, 2022

• Infineon plans €5bn 300mm fab in Dresden

Thursday, November 17, 2022

• Small code, high performance: Latest IAR Embedded Workbench for RISC-V leverages CoDenseâ„¢ from Andes

Wednesday, November 16, 2022

• How AI is Reshaping the Edge Computing Landscape
• Why RISC-V Architecture Is the Future of Embedded Design
• Are You Ready for PCIe 6.0?
• Truechip Announces First Customer Shipment of MIPI A-PHY Verification IP
• Stellantis Accelerates Autonomous Driving Journey with Acquisition of aiMotive, a Leading Artificial Intelligence and Autonomous Driving Start-up
• Alphawave IP announced as one of Deloitte's Technology Fast 50™ and North American Technology Fast 500™ 2022 award winners
• Secure-IC and Unseenlabs Partner to Retrofit Satellites already in Mission Mode with the Capability to Secure and Authenticate Data using Post-Quantum Cryptography
• Vidatronic Named to the 18th Annual Aggie 100™, Honored as Fastest-Growing Company
• Synopsys To Play A Key Role In Enabling Intel Foundry Services For US DOD Chip Program
• Small code, high performance: Latest IAR Embedded Workbench for RISC-V leverages CoDense™ from Andes
• intoPIX enables JPEG XS high frame rates real-time encoding from 120fps to more than 1000fps with the TicoXS FPGA IP-cores

Tuesday, November 15, 2022

• Singapore as a Base for French Investment and Expansion in ASEAN
• Infineon plans $5bn 300mm fab in Dresden
• CAES GR712RC Microprocessor Selected by Argotec for Multiple Space Missions
• Silicon Frontline Accepted as Partner in Samsung Foundry SAFEâ„¢ Program
• Cadence Introduces Industry's Leading-Performance, Silicon-Proven 22Gbps GDDR6 IP at TSMC N5
• Efinix Releases TinyML Platform for Highly Accelerated AI Workloads on Its Efficient FPGAs
• DSP Concepts and Analog Devices Collaborate on Solution for Rapid Design of In-Vehicle Audio Entertainment Systems
• eMemory Collaborates with Renesas on the Development of its Pure 5V OTP IP Using 130nm BCD Plus Process for Automotive Applications
• intoPIX extends the FastTicoRAW SDK capabilities with lossless RAW coding for measurement and analysis

Monday, November 14, 2022

• AR/VR: Three predictions for 2023
• NASA Uses RISC-V Vector Spec to Soup Up Space Computers
• CEVA Introduces Voice User Interface Solution for TI SimpleLink™ Wi-Fi® Wireless MCUs
• TSMC Expansion in Arizona to Target 3-nm Node
• StarFive Releases StarFive StarStudio IDE, which supports both Linux and Baremetal Development
• EASii IC announces first silicon for its DVB-S2X satellite Modem ASIC

Sunday, November 13, 2022

• SiPearl and AMD collaborate to address exascale supercomputing in Europe
• Fraunhofer IPMS combines latest hardware in microsensor and actuator technology with artificial intelligence
• Signing of a Large Contract with an Industry Leader for Kalray's DPU Processor
• Arasan announces MIPI CSI IP for FPGA supporting full C-PHY 2.0 speeds
• Nexperia invests in sustainable alternatives to batteries by acquiring Delft-based Nowi
• ZeroPoint Technologies can reduce data center energy consumption by 25%
• JEDEC Announces Publication of the SPD5118 Hub and Serial Presence Detect Device and the DDR5 SPD Contents Specifications
• Consortium forms Rapidus to get Japan back into chip race at 2nm
• Marvell Announces Innovative CXL Development Platform for Multi-Host Memory Pooling
• QuickLogic Inks eFPGA Sales Rep Agreement with CHIP-gogo in Japan
• Ultra-high-speed 14-bit at 4.32Gbps ADC IP Cores are available for licensing, with increased accuracy and high sampling rate for a variety of applications

Thursday, November 10, 2022

• Report says Apple, TSMC talk about moving 3nm chip production to U.S.
• Guerrilla RF Starts Sampling its Second Series of Digital Step Attenuators Based on Rapid Fire™ Technology
• Arm technology is defining the future of computing: Record royalties highlight increasing diversity of products and market segment growth
• Cryogenic CMOS design enabled by Semiwise
• After 1Q23 Bottom, Expectations Increase for a 2Q23 IC Market Rebound
• Bringing next-level 3D gaming to life with Arm Immortalis
• ShortLink AB and Dolphin Design partner to create a highly energy-efficient Sub-GHz ASIC design platform