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Monday, August 14, 2023

• Egide raises €2.6m, pulls sale of US business
• Decarbonization Opens Pathway to a Sustainable Future
• 21 generative AI startups to watch, according to investors
• Collaboration looks to build AI Accelerator chip with analogue in-memory computing
• Imec integrates thin-film pinned photodiode into short-wave-infrared imaging sensors
• Arteris Wins Gold Stevie® Award in the 2023 International Business Awards® for Technical Innovation of the Year
• Arteris Wins Gold Stevie® Award in the 2023 International Business Awards® for Technical Innovation of the Year
• Intel and Synopsys Expand Partnership to Enable Leading IP on Intel Advanced Process Nodes

Sunday, August 13, 2023

• Socionext opens Bangalore office
• Intense Competition in Advanced Semiconductor Processes for Automobiles
• CEVA Joins Samsung SAFEâ„¢ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets
• Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 22nm, 40nm, 55nm is Available for Immediate Licensing for TWS, Audio Chipsets and Automotive Applications
• CEVA Joins Samsung SAFE™ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets
• OPENEDGES and Telechips Collaborates for Automotive Applications

Friday, August 11, 2023

• TSMC allocates $6bn for 2nm capacity in Taiwan

Thursday, August 10, 2023

• Siemens teams for China battery technology centre
• Associations align around MIPI CSI-2 automotive camera interface
• Rambus Initiates $100 Million Accelerated Share Repurchase Program
• TSMC July 2023 Revenue Report
• Socionext Strengthens Design and Development Capabilities with New Office in Bangalore, India
• Andes Technology and TetraMem Collaborate to Build Groundbreaking AI Accelerator Chip with Analog In-Memory Computing

Wednesday, August 9, 2023

• Understanding the Compute Hardware Behind Generative AI
• SMIC Reports 2023 Second Quarter Results
• BrainChip and Edge Impulse Offer a Neuromorphic Deep Dive into Next-Gen Edge AI Solutions
• Intel CEO Voices Concerns About CHIPS Funds, Export Controls
• UCIeâ„¢ (Universal Chiplet Interconnect Expressâ„¢) Consortium Releases its 1.1 Specification

Tuesday, August 8, 2023

• CAN-XL IP integrated CANsec accelerator
• Apple, Samsung, Intel, Nvidia to invest in record-breaking IPO of British chip maker Arm: Report
• 3-nm Race to Start in Semiconductor Industry with Chip for Apple iPhone 15
• Thalia announces new additions to its senior management team and Board
• CEVA, Inc. Announces Second Quarter 2023 Financial Results
• Allegro MicroSystems to Acquire Crocus Technology to Accelerate Innovation in TMR Sensing Technology
• MIPI Alliance and Automotive SerDes Alliance Enter Liaison Agreement to Enable Native MIPI CSI-2 Implementation with ASA-ML PHY
• Blueshift Memory announces successful development of computer vision AI accelerator chip

Tuesday, August 8, 2023

• TSMC Board of Directors Meeting Resolutions

Monday, August 7, 2023

• UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification
• Analog IP tackles side channel attacks
• Synopsys Partners with NowSecure and Secure Code Warrior to Expand Industry-Leading Application Security Testing Solutions Portfolio
• TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe
• UMC Reports Sales for July 2023
• Synopsys Appoints Rob Painter to Board of Directors
• Leading Semiconductor Industry Players Join Forces to Accelerate RISC-V

Sunday, August 6, 2023

• CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family
• Arteris Announces Financial Results for the Second Quarter 2023 and Estimated Third Quarter and Full Year 2023 Guidance
• CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family
• Renesas to Acquire Cellular IoT Technology Leader Sequans Through Tender Offer
• DVB-C Demodulator IP Core Available For Immediate Implementation From Global IP Core
• CEO Interview: Intrinsic ID's Pim Tuyls on Embedded Security
• Tenstorrent Raises a $100M Strategic Up-round Co-led by Hyundai Motor Group and the Samsung Catalyst Fund
• GUC Monthly Sales Report - July 2023
• Global Semiconductor Sales Increase 4.7% in Q2 Compared to Q1
• Unlock seamless video transmission between graphics adapters and LCD displays with readily licensable, silicon-proven LVDS IP cores tailored for the advanced 22FDX process node

Wednesday, August 2, 2023

• Certifiably Secure - Xiphera Announces a First Batch of CAVP Validated IP Cores
• PCI-SIG® Exploring an Optical Interconnect to Enable Higher PCIe Technology Performance
• Cadence Advances Pervasive Intelligence at the Edge with Next-Generation Extensible Tensilica Processor Platform
• Arasan announces its CAN-XL IP with seamlessly integrated CANsec Accelerator IP
• CDAC, Arm partner to enable semiconductor startups in India through Arm Flexible Access for Startups