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Wednesday, February 1, 2023
Single-Event Transient Study of 28 nm UTBB-FDSOI Technology Using Pulsed Laser Mapping
Gartner Highlights Top Trends Impacting Technology Providers Through 2025
Why embedded IoT benefits from software portability
GreenWaves Technologies announces a €20M financing
Xfuse, LLC Phoenix ISP Now Available as a Download for AMD Kria KV260 Vision AI Starter Kit
Rambus Delivers 6400 MT/s DDR5 Registering Clock Driver to Advance Server Memory Performance
Tuesday, January 31, 2023
Perfecto by Perforce Releases 2023 State of Test Automation Report
4 articles CIOs should read about open source in 2023
Rambus ups DDR5 data rate and bandwidth by 33%
UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow
Tuesday, January 31, 2023
Andes Technology Unveils The AndesCore® AX60 Series, An Out-Of-Order Superscalar Multicore RISC-V Processor Family
Monday, January 30, 2023
Weebit looks forward to first revenue in 2023
Intel Terminates RISC-V Development Project: What Happened?
TSMC Joins Hands with Apple and Sony to Keep Samsung in Check
QuickLogic Partners with Andes Technology for eFPGA Joint Promotion
Siemens advances integrated circuit verification with new, data-driven Questa Verification IQ software
Tachyum Successfully Runs UEFI on Prodigy FPGA
Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution
Hardware Root of Trust: The Key to IoT Security in Smart Homes
Faraday Announces Multi-site Manufacturing Support in ASIC
Sunday, January 29, 2023
NASA Recruits Microchip, SiFive, and RISC-V to Develop 12-Core Processor SoC for Autonomous Space Missions
Achieving Unprecedented Power Savings with Analog ML
U.S. and Japanese Chipmakers Join 2-nm War
Gidel introduces groundbreaking edge computer with NVIDIA Jetson Orin NX system-on-module and high-bandwidth camera frame grabber for real-time image acquisition compute and AI processing
Q4 loss at Intel
EU Parliament Adopts Position on Chips Act
Linaro to Acquire Arm Forge Software Tools Business
BrainChip Tapes Out AKD1500 Chip in GlobalFoundries 22nm FD SOI Process
Intel kills its RISC-V Pathfinder development kit programme
10-bit 3Msps Ultra low power SAR ADC IP core for Wireless Communication and Automotive SoCs is available for immediate licensing
Wednesday, January 25, 2023
BoW Strengthens Pathway to Chiplet Standardization
Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
Axiomise Accelerates Formal Verification Adoption Across the Industry
IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS
intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
Sevya joins TSMC Design Center Alliance
Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies
Tuesday, January 24, 2023
Best FPGA (Field-Programmable Gate Arrays) Companies in 2023
Japan chip venture Rapidus aims for 2-nm prototype line by 2025
CEA-Leti: innovation to fuel 6G wireless communications
OpenLogic by Perforce and the Open Source Initiative Release 2023 State of Open Source Report
Open Compute Project Foundation and JEDEC Announce a New Collaboration
Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design
Weebit Nano nears productisation, negotiating initial customer agreements
Monday, January 23, 2023
6G-IA and ETSI to bridge research, standards and industry
Semiconductor Companies Create Building Block for Chiplet Design
AI Compute Company Banks on Chiplets for Future Processors
Startup raises funds to advance neutral atoms quantum computing
VORAGO Technologies to Move All its Manufacturing Stateside in Strategic Partnership with SkyWater's Trusted Foundry
Nexperia invests in sustainable alternatives to batteries
Monday, January 23, 2023
Xiphera announces the first IP core for the quantum-secure xQlaveâ„¢ product family
Monday, January 23, 2023
The latest ASIL-B,C,D and ISO26262 Certified Silicon Proven Interface IP Cores are ready for immediate licensing
Sunday, January 22, 2023
Swedish quantum computer boost for industry
Scaling Up Quantum Computing by Interconnecting Quantum Processors
New Wave DV Releases Two New SOSA-Aligned 3U VPX ACAP (FPGA) Modules
Electronic System Design Industry Reports Revenue of $3.8 Billion in Q3 2022, ESD Alliance Reports
AI Must Be Secured at the Silicon Level
CEO Interview: Stephen Fairbanks of Certus Semiconductor
Accellera's Security Annotation for Electronic Design Integration Standard 1.0 Moves Toward IEEE Standardization
GUC Delivers its First TSMC N3 Chip and First AI-Optimized N5 Design Using Cadence Digital Solutions
OIF Marks 25th Anniversary, Launches New Physical & Link Layer Working Group Electrical Project and Adds 112G VSR Clause to CEI 5.0 IA at Q1 Technical and MA&E Committees Meeting
Xiphera announces the first IP core for the quantum-secure xQlave™ product family
Accellera Announces the Formation of the Clock Domain Crossing Working Group
The latest ASIL-B,C,D, ISO26262 Certified Silicon Proven Interface IP Cores are ready for immediate licensing
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