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Thursday, November 2, 2023

• Synopsys Receives Multiple Partner of the Year Awards at TSMC 2023 OIP Ecosystem Forum
• STMicroelectronics sees its forte in sustainability to maintain lead in supply chain
• First Generative AI tool for power integrity sign off
• Ansys medini Accelerates Andes' Development of Automotive-Grade IP
• VSORA to Receive $13.18 Million in Funding from the European Innovation Council Accelerator Program

Wednesday, November 1, 2023

• Are We Ready for the 2nm Process Node?
• Nvidia Trains LLM on Chip Design
• Global Semiconductor Sales Increase 1.9% Month-to-Month in September
• Raspberry Pi Receives Strategic Investment from Arm, Further Extending Long-Term Partnership
• Semidynamics and Arteris Partner To Accelerate AI RISC-V System-on-Chip Development
• Sophgo Licenses SiFive RISC-V Processor Cores to Drive High-Performance AI Computing Innovation
• proteanTecs Enhances Astera Labs' Connectivity Solutions with Performance and Reliability Monitoring
• Worldwide Silicon Wafer Shipments Fall in Q3 2023, SEMI Reports
• Zero ASIC Democratizing Chip Making
• Imperas RISC-V Solutions for Developers - Accelerating RISC-V

Tuesday, October 31, 2023

• New EU Rule Requires Proof of Sustainability
• Axiomise Heads to Silicon Valley Next Week for RISC-V Summit North America
• Andes Technology to Exhibit Groundbreaking RISC-V Solutions for AI and Automotive at RISC-V Summit North America 2023
• A consortium led by Semiwise wins an Innovate UK grant to develop Virtual Reality Semiconductor Training Fab.
• Arm Collaborates with Industry Leaders to Build AI Foundations of the Future
• Xiphera Enhances the Performance of Its Portfolio with New Cryptographic IP Cores
• sureCore and Intrinsic announce collaboration to accelerate time to market for innovative ReRAM technology

Monday, October 30, 2023

• Sustainability key to semiconductor roadmap for the chiplet era
• From Connectivity to Intelligence: How Edge AI is Revolutionizing IoT Innovation
• Realtek Deploys Cadence Tempus Timing Solution to Deliver Working Silicon on N12 Design
• Details about Samsung Foundry's 1.4nm process node surface
• Quantum tunneling avoids thermal noise in analog circuits
• Codasip delivers processor security to actively prevent the most common cyberattacks
• Synopsys Delivers Seamless Interoperability for Semiconductor Design Ecosystem with New Synopsys Cloud OpenLink Program
• lowRISC Announces New OpenTitan Project Partner, zeroRISC
• Rambus Reports Third Quarter 2023 Financial Results
• Renesas' New Ultra-High Performance MCUs are Industry's First Based on Arm Cortex-M85 Processor
• UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI
• Tenstorrent Teams with Imperas to Provide Model of the Tenstorrent Ascalon RISC-V Core

Sunday, October 29, 2023

• Cadence Bags Four TSMC OIP Partner of the Year Awards
• DSPs target sensor intelligence and edge AI inference needs
• Aniah simultaneously validates ISO9001 and ISO27001 certifications, reinforcing its commitment to Quality and Cybersecurity
• Flex Logix adoption expands into datacenters
• Stephane Cordova joins Thalia as Director of Sales Europe
• EnSilica to supply beamforming SatCom ICs to Germany's VITES to enable power- and cost-efficient flat panel terminals for NGSO-constellations
• Weebit Nano signs Tier-1 licensing agreement; on track to generate first IP revenues in 2023

Friday, October 27, 2023

• RISC-V Releases Abound Ahead of 2023 RISC-V Summit

Wednesday, October 25, 2023

• Multielement Ink is Promising for Sustainable Semiconductor Manufacturing
• Synopsys Honored at TSMC 2023 OIP Ecosystem Forum with Multiple Partner of the Year Awards
• Weebit Nano's ReRAM IP Awarded "Embedded Solution Product of the Year" in the Electronic Industry Awards
• Global Silicon Wafer Shipment Growth to Bounce Back in 2024 After 2023 Decline, SEMI Reports
• MosChip Technologies announces its new Managing Director & CEO

Tuesday, October 24, 2023

• SiFive lays off 20% of staff, re-aligns business
• SEMICON Europa 2023 to Highlight Chip Industry Investments, Sustainability and Talent Strategies to Shape $1 Trillion Era
• Layoffs at SiFive as RISC-V upstart faces a crossroads
• Stanley Electric Taps Siemens Platform for Latest MEMS IC Design
• Rambus Boosts AI Performance with 9.6 Gbps HBM3 Memory Controller IP
• China's FD-SOI ecosystem needs more engagement to work as a leapfrogging strategy
• NeuReality and Veriest Achieve Great Engineering Feat to Advance AI Chips for World's Largest Data Centers
• DVB-C2 LDPC/ BCH Decoder FEC IP Core From Global IP Core
• Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference

Monday, October 23, 2023

• Modular mobile devices for less electronic waste
• AI Silicon IP Provider Expedera Opens R&D Office in Singapore
• How 'E-Waste Mining' Can Pay Off
• Plastic Fischer Adopts Siemens Xcelerator to Reduce Plastic Waste in World Oceans
• Infineon to pilot new AI developer model to enhance sensor innovation
• Codasip's New RISC-V Processor Family Dials In on Custom Compute
• Intrinsic ID Looks Back on 15 Years of Building Digital Trust
• Sofics releases its ESD technology on TSMC 3nm process
• Cadence Reports Third Quarter 2023 Financial Results
• PCI-SIG® Announces Authorized Test Labs Now Available for PCI Express® Technology
• Faraday Reports Third Quarter 2023 Results
• PCI-SIG® Announces Authorized Test Labs Now Available for PCI Express® Technology
• Semidynamics launches first fully-coherent RISC-V Tensor unit to supercharge AI applications

Sunday, October 22, 2023

• lowRISC Announces Expansion of OpenTitan Project with New Hardware
• Renesas Extends Tender Offer for Proposed Acquisition of Sequans
• Green Mountain Semiconductor Inc. awarded a contract from NASA to Pave the Way for Space-Ready Neural Processors
• Qualinx's Series A Financing for All-Digital GNSS IoT Wireless Technology Hits $20 Million
• Alphawave Semi Announces Appointment of Rahul Mathur as Chief Financial Officer
• Socionext Begins Development of SoCs for Advanced ADAS and AD Using 3nm Automotive Process
• Revolutionizing Automotive Connectivity: Cutting-Edge Silicon IP Cores Now Available with T2M