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Friday, October 20, 2023

• CXL Gets Off the Drawing Board

Thursday, October 19, 2023

• Neurxcore Introduces Innovative NPU Product Line for AI Inference Applications, Powered by NVIDIA Deep Learning Accelerator Technology
• Orthogone Technologies Unveils FPGA-Based Lightning-Fast PCIe DMA Controller Solution
• New POLYN Patent Covers Smart Tires, Industrial IoT Applications
• How Arm Total Design is built around 5 key building blocks
• Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards

Wednesday, October 18, 2023

• Analysts Debate Latest U.S. Export Controls
• CXL Gets Off the Drawing Board
• SEMIFIVE Signs MOU with TeraPixel Technologies to Collaborate on Semiconductor Design
• Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU
• Ansys Semiconductor Simulation Solutions Certified for UMC's 3D Chip Technology
• Prophesee launches the world's smallest and most power-efficient event-based vision sensor, bringing more intelligence, privacy and safety than ever to consumer Edge-AI devices
• US extends China chip ban
• Weebit Nano licenses ReRAM to DB HiTek, a global top-10 foundry

Tuesday, October 17, 2023

• GlobalFoundries Awarded $35 Million Funding from U.S. Government to Accelerate Manufacturing of Next-Generation GaN Chips
• Microelectronics for sustainability and technological sovereignty
• Ensuring security legislation compliance in IoT applications
• Cadence Collaborates with Broadcom to Implement AI-Driven Solutions with Impressive Quality of Results
• ARM edges closer to full 2nm chip designs with Total Design
• Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development
• Cadence Joins Arm Total Design to Accelerate Development of Arm-Based Custom SoCs
• M31 Opens Bangalore R&D Design Center in India Expands Recruitment of Global Talent
• Qualcomm to Bring RISC-V Based Wearable Platform to Wear OS by Google
• Harnessing the power of the ecosystem in the era of custom silicon on Arm
• Arm and Synopsys Strengthen Partnership to Accelerate Custom Silicon on Advanced Nodes
• Andes Technology Unveils Andes D23 and N225 Cores Pioneering the Next Generation of Compact, Performant, and Secure RISC-V Processor Technology
• Alphawave Semi Elevates Chiplet-Powered Silicon Platforms for AI Compute through Arm Total Design

Monday, October 16, 2023

• Chipmakers Fail to Meet Carbon-Emission Target, Experts Say
• TSMC abandons plans for 2nm chip plant after Taiwanese locals protest
• CEA-Leti Launches R&D Program to Improve "Cooperation" Between Autonomous Vehicles Via V2X Communication
• CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs
• Codasip announces next-generation RISC-V processor family for Custom Compute
• Silicon Creations Named 2023 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP
• Fraunhofer IESE Partners With Arteris To Accelerate Advanced Network-on-chip Architecture Development for AI/ML Applications
• Synopsys Partners with Indian Institute of Technology Bombay to Develop Talent for Semiconductor Industry

Sunday, October 15, 2023

• The Path to A Sustainable Semiconductor Industry
• Fraunhofer-Roadmap: European Commission and expert community discuss a sustainable and competitive bioeconomy for the EU
• LeapMind's New AI Chip Paves the Way for Unprecedented Cost-Effective AI Computing
• Electronic System Design Industry Posts $4 Billion in Revenue in Q2 2023, ESD Alliance Reports
• Access Advance Announces Newest VVC Advance Licensors and Licensees
• eMemory Won TSMC OIP Partner of the Year Award for the 14th Consecutive Year
• 14-bit, 4.32GSps Wide Band ADC with Time-Interleaved Pipeline Architecture, Now Available for WhiteBox Licensing - Unlimited Usage and Modification Rights Included
• OPENEDGES Extends Partnership with InnoGrit Corp for 6nm LPDDR5/4X/4 Memory Controller IP
• GOWIN Semiconductor Expands its GW1NZ Series of Low-Cost, Small-Size, and Low-Power Devices

Thursday, October 12, 2023

• Semiconductor startup, Enosemi, launches with a committed commercial license to key silicon photonics design IP created by Luminous Computing
• Imagination Optimizes PPA and Speeds the Delivery of Low-Power GPUs Using AI-Driven Cadence Cerebrus in the OnCloud Platform

Wednesday, October 11, 2023

• Denso invests $500 million in silicon carbide wafer company
• European Innovation Award EARTO 2023 for sustainable and cost-effective manufacturing process of aerogels
• Ericsson Antenna Technology Germany starts research project for 6G communication technologies
• Workshop Sustainable and Greener Manufacturing of ECS
• Chips JU Consultation Workshop : "Sustainable and Greener Manufacturing of ECS"
• Credo Joins with Industry Players to Announce Effort to Standardize CXL Active Electrical Cables & Optics at OCP Global Summit 2023
• Thalia appoints Sou Bennani-McCord as Global VP of Sales

Tuesday, October 10, 2023

• Artificial Intelligence (AI) Utilizing Deep Learning Techniques to Enhance ADAS
• Soitec inaugurates new plant for SmartSiC wafer production
• ADTechnology to start 3nm 2.5D ASIC design project for HPC application
• Embedded Flash memory developer Floadia has raised 1.05 billion yen from INABATA and others
• Tasking, Synopsys team for safer automotive virtual ECUs
• Achronix Announces FPGA-Powered Accelerated Automatic Speech Recognition Solution
• Highly configurable 32-Bit MCU features embedded hardware security module
• SiFive Announces Differentiated Solutions for Generative AI and ML Applications Leading RISC-V into a New Era of High-Performance Innovation
• JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation
• BrainChip and Circle8 Clean Technologies/AVID Group Work to Reduce and Recycle Waste Through Joint Development of Intelligent "Smart Bins"
• Arteris Interconnect IP Deployed in NeuReality Inference Server for Generative AI and Large Language Model Applications

Tuesday, October 10, 2023

• GlobalFoundries and Microchip Announce Microchip's 28nm SuperFlash® Embedded Flash Memory Solution in Production

Monday, October 9, 2023

• New Synopsys Research Reveals Vast Majority of Organizations Report DevOps Delays Due to Critical Security Issues
• RISC-V group says export ban on open-source chip standard would slow innovation
• Siemens launches Tessent tool for Verilog and RTL design for test
• AMD to Acquire Open-Source AI Software Expert Nod.ai
• Accellera Releases Portable Test and Stimulus Standard 2.1
• Efabless Raises $6.3 Million in Series A-1 Extension, Featuring Investments from GlobalFoundries, Synopsys, and New North Ventures
• Update on Israel situation; Weebit's operations unaffected
• Omni Design to Present Next Generation LiDAR Solutions at CadenceLIVE Europe
• Leti Innovation Days Tokyo 2023

Sunday, October 8, 2023

• Siemens extends leadership in EDA design-for-test with the launch of Tessent RTL Pro
• TSMC looks to standardise chiplet protocols in "world changing" move
• TSMC September 2023 Revenue Report
• 1G Ethernet PHY IP Core is now available in 14nm LPP for Blackbox License and in 28FDSOI as Whitebox License for maximum flexibility