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Thursday, October 5, 2023

• Samsung Electronics and TSMC Grapple with 3-Nano Yield Challenges
• GUC Monthly Sales Report - September 2023
• UMC Reports Sales for September 2023
• Marquee Semiconductor Expands Presence in India with New Location at Veer Surendra Sai University of Technology Campus in Odisha
• ADTechnology and Zaram Technology to develop the next-generation of telecommunications semiconductor chips
• Arteris Wins Autonomous Vehicle Technology of the Year Award
• EDGX Announces Collaboration with BrainChip to Develop Disruptive Data Processing Solutions for Space

Wednesday, October 4, 2023

• JUPITER Exascale Supercomputer, lead customer for SiPearl
• Global Semiconductor Sales Increase 1.9% Month-to-Month in August
• Using Open-Source Hardware to Speed Product Development
• Swiss-Based Enclustra Announces US Operations in San Diego to Realize the Full Potential of Embedded Chip Technologies
• SmartDV Rolls Out Multi-Phase Expansion Plan
• MachineWare announces new ARM processor simulation and SystemC profiling products, adds Windows support
• Renesas Extends Tender Offer and Receives CFIUS Clearance for Proposed Acquisition of Sequans
• Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet
• Cadence Completes Acquisition of Intrinsix
• ELES and proteanTecs Partner to Enhance Reliability Testing with Deep Data Analytics
• Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub

Tuesday, October 3, 2023

• imec looks to automotive chiplet programme
• Renesas partners with EdgeCortix to streamline AI/ML development
• TSMC's 3Dblox 2.0 and 3DFabric Alliance Achievements Set the Stage for the Future of 3D IC
• TSMC selects IC'Alps for its Design Center Alliance (DCA)
• EdgeCortix Closes $20 Million in Additional Funding Round
• Intel Announces Intent to Operate Programmable Solutions Group (PSG) as Standalone Business

Monday, October 2, 2023

• Soitec Opens New Plant, Positioning SmartSiC™ as a Future EV Standard
• Tachyum Books Purchase Order to Build System with 25,000x ChatGPT4 Capacity and 25x Faster than Current Supercomputers
• BrainChip Makes Second-Generation Akida Platform Available to Advance State of Edge AI Solutions
• CEA and Siemens collaborate on research to expand applications of Digital Twin for industry
• Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect

Monday, October 2, 2023

• Alphawave Semi Earns Great Place to Work® Certificationâ„¢ for 2023-24

Sunday, October 1, 2023

• Alphawave Semi Earns Great Place to Work® Certification™ for 2023-24

Wednesday, September 27, 2023

• Circular Economy, a Path to a Sustainable Ecosystem: Infineon's Security Solutions Support the Industry, the Consumer, and the Environment Alike
• Capgemini boosts its semiconductor capabilities in Europe with acquisition of HDL Design House
• Intrinsic ID Becomes World's First IP Vendor with PSA Certified Level 3 Root of Trust Component
• How the Worlds of Chiplets and Packaging Intertwine
• Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Advanced 4nm RF FinFET Process
• EU Turns Rivals into Allies
• M31 Announces Low-Power IP Solutions for TSMC's N12e Process
• Microchip FPGAs Speed Intelligent Edge Designs and Reduce Development Cost and Risk with Tailored PolarFire® FPGA and SoC Solution Stacks
• Nanusens technology is key to enabling AI to be smarter
• Percepio Enables Trace Observability for All RTOS, Middleware and Silicon Vendor APIs
• China Gears Up for Chip Dumping, Ex-DoC Official Says
• TSMC Announces Breakthrough Set to Redefine the Future of 3D IC

Wednesday, September 27, 2023

• GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit

Wednesday, September 27, 2023

• Chips&Media Announces the Release of "WAVE-N," the New Neural Processor IP

Tuesday, September 26, 2023

• AT&S conducts green electronics research for Europe
• Accelerating RISC-V development with network-on-chip IP
• Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows
• Siemens and TSMC collaborate to help mutual customers optimize designs using foundry's newest advancements
• Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process
• GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit
• GlobalFoundries and Microchip Announce Microchip's 28nm SuperFlash® Embedded Flash Memory Solution in Production
• Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
• PrimisAI Forms to Revolutionize Hardware Design with Leading AI Solutions
• Cadence Digital and Custom/Analog Design Flows Achieve the Latest TSMC N2 Certification

Tuesday, September 26, 2023

• QuickLogic Announces New eFPGA Contract Targeting GlobalFoundriesâ„¢ 22FDX® Platform

Tuesday, September 26, 2023

• Ashling's RiscFreeâ„¢ SDK Now Supports RISC-V® Processor Cores from CAST

Monday, September 25, 2023

• Infineon's Circular Economy Security Advancing Sustainability for All
• Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs
• QuickLogic Announces New eFPGA Contract Targeting GlobalFoundries 22FDX® Platform
• Cadence AI-Powered Virtuoso Studio Supports RF and mmWave Design Reference Flows for TSMC N16RF, N6RF and N4PRF
• Unlocking IoT Security: Crypto Quantique Introduces QuarkLink Ignite - A Free IoT Security SaaS Platform
• Ashling's RiscFree™ SDK Now Supports RISC-V® Processor Cores from CAST
• Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies
• Codasip selects Verilock to provide secure hardware authentication technology
• Synopsys Unveils Industry's Broadest Portfolio of Automotive-Grade IP on TSMC's N5A Process Technology
• Introducing Tomi Jalonen - Xiphera's Sales Representative for Central European Markets
• SambaNova Unveils New AI Chip, the SN40L, Powering its Full Stack AI Platform
• Kneron Announces $49M in Additional Funding, Bringing Total Series B to $97M
• GlobalFoundries Announces Opening of New Malaysia Office to Support Global Manufacturing Operations

Sunday, September 24, 2023

• Efabless Launches 3rd AI-Generated Open-Source AI Contest to Extend the Caravel SoC Platform with AI-Generated Peripherals
• Synopsys tools tape out 2nm chips at TSMC
• Alphawave Semi: Interim results for the six months ended 30 June 2023
• Arm shares return to offer price
• Synopsys and TSMC Collaborate to Accelerate 2nm Innovation for Advanced SoC Design with Certified Digital and Analog Design Flows
• Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes
• proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem
• Flex Logix Expands Upon Industry-leading Embedded FPGA Customer Base
• Unlock the Power of DisplayPort v1.4 Tx/Rx PHY and Controller IP Cores: Maximize the Potential of Your Next-Generation Products
• proteanTecs Joins TSMC 3DFabricâ„¢ Alliance, Expanding Its Support of the 3D IC Ecosystem
• GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding