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Thursday, September 21, 2023

• MEEP: An HPC Systems Development Platform for RISC-V Based HW/SW Co-Design
• Q2 Revenue for Top 10 Global IC Houses Surges by 12.5% as Q3 on Pace to Set New Record, Says TrendForce
• Sustainable Innovation Month - Fostering Innovation Action
• Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings
• Rambus MACsec-IP-361 is Certified ASIL-B Ready

Wednesday, September 20, 2023

• Report: TSMC Could Push 2nm Node Back to 2026
• U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing
• Kalray announces the availability of its new processor "Coolidgeâ„¢2", the first DPU optimized for AI and data intensive processing
• Inuitive Adopts VeriSilicon's Advanced ISP IP for its Vision AI Processor
• Alphacore Recognized for its TID Results of 22-nm FDSOI SRAM Published in IEEE Transactions on Nuclear Science journal
• SMIC Well on Its Way to 5-nm Breakthrough, Observers Say
• Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports
• Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP
• CEVA, Inc. Appoints Iri Trashanski as Chief Strategy Officer
• BrainChip Engages VVDN to Deliver Industry's First Commercial Edge Box Based on Neuromorphic Technology
• Nordic combines Arm and RISC-V for "remarkable" EEMBC benchmarks
• Infineon heads European research project for advancing the circular economy and sustainability of the electronics industry

Tuesday, September 19, 2023

• OpenHW Group Appoints Florian 'Flo' Wohlrab as New CEO to Spearhead Open-Source Ecosystem Advancement
• SEMI Semiconductor Climate Consortium and BCG Issue First Insider Report of Semiconductor Value Chain's Carbon Emissions
• AccelerComm, Radisys, RFDSP & TTP unveil LEO Regenerative 5G RAN solution
• Intel launches compact RISC-V Nios processor core
• Nordic combines Arm and RISC-V for 'remarkable' EEMBC benchmarks
• UXL looks to standardise heterogeneous compute
• AiM Future Introduces Next-Generation NeuroMosAIc Processors, Expands Partnerships
• Cadence to Acquire Intrinsix Corporation from CEVA
• Thalia expands footprint in China with appointment of Business Partner Fionn Liu
• ADTechnology and BOS Semiconductor Collaborate to develop 5nm automotive semiconductors

Monday, September 18, 2023

• New RISC-V Market Report Will Provide 5-year Growth Projections for Semiconductor Devices and Insights on the Enabling Ecosystem
• Synopsys Aims to Advance IC Design Workforce in Vietnam
• Intel Innovation 2023: Empowering Developers to Bring AI Everywhere
• Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design
• TSMC in talks about chiplet packaging in Arizona
• QuickLogic and Xiphera Partner to Pioneer Post-Quantum Cryptography on eFPGAs
• Creonic Expands Satellite IP Core Portfolio with DVB-S2X Multi-Carrier Demodulator
• SandBox Semiconductor Adds Hybrid Metrology Capabilities to Industry's Leading Physics-based, AI-enabled Process Optimization Platform, Creating the First Software Solution to Holistically Address Process Development Challenges
• OPENEDGES and VisioNexT Shapes the Future of Vision AI SoCs
• Rambus Added to PHLX Semiconductor Sector Index (SOX)
• Arm Announces Closing of Initial Public Offering and Full Exercise of Underwriters' Option to Purchase Additional American Depositary Shares

Sunday, September 17, 2023

• HighTec, Synopsys team for AI on Infineon's AURIX TC4x
• Arm Begins 2nd Term on Nasdaq, at $54.5 Billion Valuation
• Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm
• Synopsys Demonstrates Industry's First Interoperability of PCI Express 6.0 IP with Intel's PCIe 6.0 Test Chip
• Driving Europe's Chip Renaissance: TSMC's Vision with ESMC
• TCL Joins Via Licensing Alliance's ATSC 3.0 Broadcasting Patent Pool
• Quadric Announces Llama2 LLM Support Immediately Available for Chimera GPNPUs
• Flex Logix Announces Reconfigurable Block RAM with ECC Option
• LIN Controller IP Core, equipped with a Safety package (Safe LIN, ISO 26262: Safety manual, FMEDA), tailored specifically for High-End Automotive and Consumer Applications is available for immediate licensing
• Panmesia Raises $12.5 Million in Seed Funding with a Valuation Exceeding $81.4 Million in the CXL Semiconductor Arena

Thursday, September 14, 2023

• TSMC Accelerates Renewable Energy Adoption and Moves RE100 Target Forward to 2040
• Driving EuropeÂ’s Chip Renaissance: TSMCÂ’s Vision with ESMC

Wednesday, September 13, 2023

• Lawo and intoPIX Partner to Deliver Edge-Compute JPEG XS Support at IBC 2023
• Realtek and V-Nova Announce Support for MPEG-5 Part 2 LCEVC on Set-Top-Box SoCs
• X-Fab adds new passive integration technology for RF
• Arm Announces Pricing of Initial Public Offering
• Fraunhofer IIS and IHSE announce their partnership for new JPEG XS implementations at IBC 2023

Tuesday, September 12, 2023

• TSMC's semiconductor foundry in the United States will begin trial production in Q1 2024
• Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design
• Efabless Design Challenge Winners Advance the Power of AI in Chip Design
• Optima Design Automation Receives ISO 26262 ASIL D Ready Certification from SGS-TÃœV Saar
• Alchip Collaborates With Arteris To Expand ASIC Design Services
• Marquee Semiconductor Achieves ISO 9001 Certification for Exemplary Management System
• Optima Design Automation Receives ISO 26262 ASIL D Ready Certification from SGS-TÜV Saar
• intoPIX and Cobalt unveil the future of content delivery with JPEG XS: Introducing the Sapphire mini-converters and Sapphire openGear card powered by intoPIX technology
• Fraunhofer IIS introduces Application Support Package to facilitate JPEG XS Integration
• Esperanto Technologies Introduces First Generative AI Appliance Based on RISC-V, Enabling Developers to Easily Create and Deploy Purpose-Built Vertical Applications
• TSMC Special Board of Directors Meeting Resolutions

Monday, September 11, 2023

• From Synopsys to Google, New EDA Tools Apply Advanced AI to IC Design
• Cadence Unveils Next-Generation AI-Driven OrCAD X Delivering Up to 5X Faster PCB Design and Enabled with Cadence OnCloud
• 2024 Global Fab Equipment Spending Recovery Expected After 2023 Slowdown, SEMI Reports
• Bluespec's Accelerate-HLS Leverages RISC-V to Simplify and Speed the Development of HLS Applications
• Tachyum Offers Its TPU Inference IP to Edge and Embedded Markets
• Allegro DVT Launches a New Generation of High-Performance Multi-Format Video Encoder IP for 4K/8K Video Resolutions
• Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets
• Meet T2M at IBC 2023 to explore High Performance, Cost-effective, and Innovative Semiconductor IP Cores for your next generation SoCs
• GlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New Jobs
• Hailo Selected VeriSilicon's ISP and Video IP for its AI Vision Processors Empowering Intelligent Surveillance Cameras
• intoPIX showcases the new lightweight video compression standards and technologies driving automotive innovation at AutoSens 2023
• Signature IP Extends Global Footprint to Israel with Local Sales and Application Engineering Presence

Sunday, September 10, 2023

• Is Quantum Computing The Key To a Greener AI Future?
• Getting to grips with RF design
• Blue Pearl Adds Design Verification and Methodology Services to its Product Portfolio
• Flex Logix Announces Upgraded Emulation Models For EFLXâ„¢ eFPGA
• Renesas Commences Tender Offer for All Outstanding Shares and ADSs of Sequans
• SK hynix's memory chips next in Huawei's 5G phone saga
• Q2 2023 Global Semiconductor Equipment Billings Dip 2% Year-Over-Year, SEMI Reports
• NR-5G Polar Decoder and Encoder FEC IP Core Available For Licensing and Implementation from Global IP Core
• CAST adds Ascon Lightweight Encryption Engine to Security IP Cores Line
• Semiconductor industry sees revenue increase for the first time since 2021
• Enhanced Artel SMART openGear® Leverages intoPIX JPEG XS Technology for Ultimate Low-Latency Transport Solutions
• TSMC August 2023 Revenue Report