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Friday, September 8, 2023

• CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market

Thursday, September 7, 2023

• The Future Of Renewable Energy Is Built On Semiconductors
• Samsung Says It Will Beat TSMC's 4nm Production Capacity
• intoPIX to Celebrate Successful Collaboration with Bridge Technologies at IBC 2023
• Andes Announces General Availability of the New AndesCoreâ„¢ RISC-V Multicore Vector Processor AX45MPV
• OneNav Closes $17 Million Round, Launches GNSS Augmentation Product
• GBT Receives Patent Grant Notification Covering its Integrated Circuits Reliability Verification Analysis and Auto-Correction Technology

Wednesday, September 6, 2023

• Creonic Introduces NCR Processor IP Core for DVB-S2X/DVB-RCS2 Satellite Communication
• Global Semiconductor Sales Increase 2.3% Month-to-Month in July
• Arm IPO Likely to Lag Early Expectations, Observers Say
• Numem Announces Series A Funding Led by Cambium Capital to Propel Memory Solutions for AI and IoT
• Synopsys Extends Synopsys.ai EDA Suite with Industry's First Full-Stack Big Data Analytics Solution
• Comcores now offers standalone Reed Solomon Forward Error Correction (RSFEC) IP cores
• BrainChip Showcases Foundation for next generation AI solutions at AI Hardware & Edge AI Summit
• MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
• Rambus Completes Sale of PHY IP Assets to Cadence
• Flanders Semiconductors: The New Hub for Semiconductor Ecosystem at the Heart of Europe
• Synopsys Extends Synopsys.ai EDA Suite with Industry's First Full-Stack Big Data Analytics Solution

Tuesday, September 5, 2023

• TSMC to decide this week whether to invest in Arm IPO
• Neural Networks Can Help Keep Connected Vehicles Secure
• Credo Introduces Industry's First Monolithically Integrated CMOS VCSEL Driver in an 800G DSP
• Intel and Tower Semiconductor announce new US foundry agreement
• New MIPS CEO Sameer Wasson to Drive Company's RISC-V Market Penetration and Innovation
• CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market
• GUC Announced 5nm HBM3 PHY and Controller Silicon Proven at 8.4 Gbps
• VisualSim Secure Model Protector enables companies to collaborate in new product development
• UMC Reports Sales for August 2023

Monday, September 4, 2023

• Samsung To Take Major Step in Revolutionizing the Road Ahead at IAA MOBILITY 2023
• Codasip, Siemens to deliver trace for custom processors
• Toshiba sample software package expands microcontroller development tools ecosystem
• SEMI to License Server Certification Protocol to Help Combat Software Piracy
• Top Ten Semiconductor Foundries Report a 1.1% Quarterly Revenue Decline in 2Q23, Anticipated to Rebound in 3Q23, Says TrendForce
• Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement
• Agile Analog joins TSMC Open Innovation Platform IP Alliance Program
• Codasip collaborates with Siemens to deliver trace solution for custom processors
• Arm Announces Launch of IPO Roadshow
• Cybertek Solution Wins Multiple Contracts in Asia
• GUC Monthly Sales Report - Aug 2023

Sunday, September 3, 2023

• Indie Semiconductor Expands Quality Operations
• Logic Fruit Technologies Elevates FPGA Innovation with AMD Xilinx Premier Partnership
• Embrace the future of sensor communication in your SoC with proven MIPI I3C SMaster, Master, and Slave Controller IP Cores. Licensing opportunities are available for immediate implementation
• OPENEDGES Highlights Advanced Memory Subsystem IPs at the AI Hardware & Edge AI Summit 2023
• Arm prices IPO

Friday, September 1, 2023

• First 22nm FGPA with hardened RISC-V cores

Thursday, August 31, 2023

• Autonomous cargo drone with sustainable structures and intelligent battery systems
• Vital signs: Improving the safety and comfort of vehicles using AI algorithms
• Microchip's PolarFire® FPGA's Single-Chip Crypto Design Flow "Successfully Reviewed" By the United Kingdom Government's National Cyber Security Centre
• Alphawave Semi Announces Appointment of David Reeder to Board of Directors
• Nextera-Adeas ST 2110 IP cores are now available on Intel FPGAs

Wednesday, August 30, 2023

• GlobalFoundries Announces 9SW RFSOI Technology for Next-Generation Mobile and 5G Applications
• TOSHIBA RELEASES 3RD GENERATION SILICON CARBIDE MOSFETS WITH REDUCED SWITCHING LOSSES
• BorgWarner To Integrate STMicroelectronics Silicon-Carbide Technology
• Allegro DVT Fosters Adoption of MPEG-5 LCEVC Video Codec, Releases a Full Range of LCEVC Products
• Samsung Expands Semiconductor Foundry Services to Compete with TSMC and Intel
• Cadence Collaborates with Arm to Accelerate Neoverse V2 Data Center Design Success with Cadence AI-driven Flows

Tuesday, August 29, 2023

• BOSCH STARTS PRODUCTION OF 800-VOLT SIC TECHNOLOGY FOR ELECTRIC VEHICLES
• Cadence Collaborates with Arm to Accelerate Neoverse V2 Data Center Design Success with Cadence AI-driven Flows
• Intel Reveals Two New Xeon Processor Lines at Hot Chips 2023
• Exclusive Interview: ST's Muggeri Discusses Industrial Automation, WBG, and Sustainability
• SiFive unveils P870 high-performance core, discusses future of RISC-V
• GlobalFoundries Enhances Technology Platforms to Enable Critical Applications for Next Generation Electric and Autonomous Vehicles
• GlobalFoundries Announces 9SW RFSOI Technology for Next-Generation Mobile and 5G Applications
• Flexibility, durability and trust - RISC-V conquers the processor market

Monday, August 28, 2023

• Delivering 'open core surgery'
• REALIZING TIGHT-BINDING HAMILTONIANS USING SITE-CONTROLLED COUPLED CAVITY ARRAYS
• Semiconductor Industry News: Recent IPOs, Acquisitions, and Fallen Deals
• Delivering 'open core surgery'
• QuickLogic Unveils Customizable eFPGA IP on GlobalFoundries' 12LP Process
• GOWIN Semiconductor & Andes Technology Corp. Announce The First Ever RISC-V CPU and Subsystem Embedded 22nm SoC FPGA
• Driving the Custom Silicon Revolution with Arm Neoverse Compute Subsystems
• Cutting-edge 18-bit 100dB Stereo Audio ADC IP Core proven in 28nm Silicon, Offering Unmatched Audio Signal Processing Capabilities is available for immediate Licensing into Audio Chipsets, Digital Cameras, and Automotive Applications
• BrainChip and Tata Elxsi Partner to Provide Intelligent, Ultralow-Power Solutions

Sunday, August 27, 2023

• BrainChip Receives First Shipment of AKD1500 Chips in Silicon from Technology Partner GlobalFoundries
• GlobalFoundries Unveils Key Innovations at Technology Summit 2023
• Huawei and Ericsson Sign Long-Term Patent Cross-Licensing Agreement
• Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era
• QuickLogic and YorChip Partner to Develop Low-Power, Low-Cost UCIe FPGA Chiplets
• T2M Unveils Top-Selling Gigabit Ethernet PHY IP Core with Unlimited Usage and Full Modification rights, available for licensing immediately
• Nuclei, the World's First RISC-V CPU IP Vendor, Accomplishes ISO 26262 ASIL-D Product Certificate
• M31's EPS Soared 24.7% in H1, showing sequential growth
• Racyics becomes Arm Approved Design Partner
• oneNav's Patented pureL5 GNSS Solution Proven in Silicon