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Friday, September 16, 2022

• Arm execs: We respect RISC-V but it's not a rival in the datacenter

Thursday, September 15, 2022

• QuantWare awarded subsidy from Quantum Delta NL for €1.1M project to develop the use of novel materials in superconducting quantum processors
• SkyWater to Provide Foundry Service for new NIST and Google Partnership to Create Supply of Chips for Researchers and Tech Startups
• QuantWare awarded subsidy from Quantum Delta NL for €1.1M project to develop the use of novel materials in superconducting quantum processors
• CMOS Image Sensors Stall in "Perfect Storm" of 2022
• NeuReality preps 7nm data centre AI chip

Wednesday, September 14, 2022

• Shortage of Low-end Chips May Disrupt Global Chip Supply Chains
• Apple to use updated TSMC technology
• Tachyum Enters QA Testing for Prodigy Universal Processor with New EDA Supplier
• Ubilite Introduces a Wi-Fi Chip With Less-Than-Bluetooth Power Consumption
• Silicon Catalyst welcomes NXP Semiconductors as Newest Strategic Partner
• NIST and Google to Create New Supply of Chips for Researchers and Tech Startups
• Redefining the global computing infrastructure with next-generation Arm Neoverse platforms

Tuesday, September 13, 2022

• Energy Autonomy Enables More Sustainable IoT Infrastructure
• Veriest supports the development of Mobileye's innovative automotive sensor products
• ARM shows Neoverse V2, plans V3 for 2023
• Flex Logix supports edge and embedded AI deployments with Mini-ITX system
• Credo Targets Hyperscale Data Centers and 5G Networks with New Optical DSPs
• VeriSilicon Announces the One-Stop VeriHealth Chip Design Platform for Smart Healthcare Applications
• New Cadence Joint Enterprise Data and AI Platform Dramatically Accelerates AI-Driven Chip Design Development
• Cadence Revolutionizes Verification Productivity with the Verisium AI-Driven Verification Platform
• Funding round fuels videantis' growth
• Chip industry in "hopeful denial" says Penn
• VeriSilicon AI-ISP Delivers Innovative Image Quality Enhancement that Breaks the Limits of Computer Vision

Tuesday, September 13, 2022

• 1G Ethernet PHY IP Cores solution for all your Gigabit network applications is available for immediate licensing

Monday, September 12, 2022

• Synopsys To Seed Startup Innovation With AI-Powered Chip Design Tools In The Cloud
• How 5G Has Changed Engineering Design
• SiFive rolls out automotive RISC-V roadmap
• Spreading the Quantum Knowledge
• TSMC says its next-gen 2nm mass production begins in 2025
• Global IP Core Announces the Availability of The WiMAX IEEE802.16e Modem and FEC IP Core For Licensing and Integration
• SiFive Rolls Out Powerful New RISC-V Portfolio to Address Unmet Performance and Feature Needs of Rapidly Evolving Next-Gen Digital Automobiles
• Flex Logix Unveils First AI Integrated Mini-ITX System to Simplify Edge and Embedded AI Deployment
• Avalanche Technology and UMC Announce 22nm Production of High-Density MRAM-Based Devices for Aerospace Applications
• CAST introduces the First CANsec IP Core for CAN XL Bus Security

Monday, September 12, 2022

• Rambus Initiates Accelerated Share Repurchase Program

Sunday, September 11, 2022

• CEA & Partners Present 'Powerful Step Towards Industrialization' Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium
• TSMC to mass produce chips on upgraded version of 3nm process in 2023
• Taiwan's TSMC 2nm chip fab ready for construction, to be operational by 2025
• ARM, IBM team on low power analog AI chip
• Expanded Partnership Between Arteris and Arm to Accelerate Automotive Electronics
• Hisense Selects Synaptics' DBM10L Processor For First AI-Enabled Always-On Voice Remote Control
• SoC.one and Imagination Technologies Partner to Enable Adoption of RISC-V for Automotive Design
• Cortus Announces the Launch of its New Secure Low Power RISC-V Microcontrollers
• 1G Ethernet PHY IP Cores solution for all your Gigabit network applications is available of immediate licensing!!

Thursday, September 8, 2022

• Andes Technology Corp. Announces Its RISC-V CPU IP Serves as the Computing Engine in the New Renesas R9A02G020 MCU ASSP
• OPENEDGES Listing on KOSDAQ this September
• Fraunhofer IIS and Astrodesign cooperate to offer JPEG XS solutions for video equipment manufacturer
• intoPIX SDKs rev up performance to meet the rapidly increasing encoding and decoding demand of Software-based Production & Pro-AV
• Brite Semiconductor Provides USB IP Total Solution
• Flex Logix's Barrie Mullins To present at the 2022 AI Hardware Summit

Wednesday, September 7, 2022

• Fraunhofer IIS announces its JPEG XS SDK 5.0 solutions achieving 25% higher speed for en- and decoding
• Memory Market Collapse to Lift TSMC to Top Spot in 3Q22 Ranking
• IPrium releases CCSDS 131.2 Turbo SCCC Modulator
• Chris Stevens, Industry Veteran Joins BrainChip to Lead WW Sales
• QuickLogic Awarded a $6.9 Million Base Contract to Develop Strategic Radiation Hardened FPGA Technology
• SiMa.ai Partners with GUC to Accelerate Time to Market for Industry's First Purpose-Built Machine Learning Platform for the Embedded Edge
• Samsung Sounds Alarm About '22 Chip Market Landing
• TSMC August 2022 Revenue Report
• Global Semiconductor Equipment Billings Increase 7% in Q2 2022, SEMI Reports
• intoPIX unveils new FastTicoRAW & FastTicoXS codecs for Apple silicon and makes the switch to ARM-based technology simple
• Renesas Extends Leading RISC-V Embedded Processing Portfolio with New Motor Control ASSP Solution
• TSMC becomes No.1 Chip Company

Tuesday, September 6, 2022

• Global Top Ten IC Design House Revenue Spikes 32% in 2Q22, Ability to Destock Inventory to be Tested in 2H22, Says TrendForce
• Morse Micro Raises $140M in Series B Funding to Accelerate IoT Connectivity and Revolutionize our Digital Future
• Global Semiconductor Sales Increase 7.3% Year-to-Year in July, but Growth Slows
• NASA Selects SiFive and Makes RISC-V the Go-to Ecosystem for Future Space Missions

Tuesday, September 6, 2022

• Alphawave Adopts Diakopto's PrimeXâ„¢ as Top-Level EM/IR Signoff Methodology for 5nm and 3nm Technologies

Monday, September 5, 2022

• Making chip design easy
• Archer Materials partners with GlobalFoundries to advance 12CQ chip fabrication - Quantum Computing
• Alphawave Adopts Diakopto's PrimeX™ as Top-Level EM/IR Signoff Methodology for 5nm and 3nm Technologies
• Intrinsic ID Collaborates with Synopsys to Boost SoC Security and Accelerate Time to Market
• UMC Reports Sales for August 2022
• SiMa.ai Develops the Industry's First Purpose-Built Machine Learning System-on-Chip with TSMC's Power Efficient Technology
• DELTACAST announces low-bitrate SMPTE 2110-22 video streaming support in its IP Virtual Card with intoPIX JPEG XS Software
• Sondrel complements its Architecting the Future IP platforms with pre-packaged supply chains for reduced risk