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Monday, May 22, 2023
Synopsys Named a Leader in the 2023 Gartner® Magic Quadrant™ for Application Security Testing for Seventh Consecutive Year
Automotive Industry Looks Beyond EVs for Decarbonization
Chiplet interconnect handles 40 Gbps/bump
Sequans Introduces Taurus 5G NR: The World's First Chipset Specifically Optimized for 5G Broadband IoT Devices
Imagination launches IMG CXM, the smallest GPU to bring effortless user interfaces into homes
PCI-SIG Certifies VectorPath Accelerator Card for PCIe Gen5 x16 @ 32 GT/s
Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities
Sunday, May 21, 2023
Samsung To Officially Unveil Its 3nm, 4nm Technologies In June, With Up To 34 Percent Power Efficiency Improvements
Green, Digital Transformation: Infineon Launches EU Projects for Power Electronics and Artificial Intelligence
Jean-Louis CHAMPSEIX, VP, Head of Corporate Sustainability, highlights " Sustainability has been a guiding principle in STMicroelectronics" and "How Semiconductors Contribute to Green and Low Carbon"
Arm expands global engineering teams with two new primary sites
Axelera AI Raises $50M to Democratize Edge AI
Audio Pioneer xMEMS Announces General Availability of the World's Only All-Silicon, Solid-State Fidelity Micro Speakers
We don't compete with our customers - TSMC
Quadric's DevStudio Speeds Software Development with Industry's First Integrated ML + DSP Cloud-Based Code Development Platform
CEVA and proteanTecs Announce Partnership to Optimize Reliability and Power of Complex SoCs
Fabless Semiconductor Innovator Stathera Announces US $15M Series A Funding Round
NVIDIA Grace Drives Wave of New Energy-Efficient Arm Supercomputers
USB 4.0 Host and Device Controller IP Cores unleashing the Power of High-Speed Connectivity with tunnelling of Display Port and PCIe is now available for Licensing
Syntiant's Deep Learning Computer Vision Models Deployed on Renesas RZ/V2L Microprocessor
New £1 billion strategy for UK's semiconductor sector
Thursday, May 18, 2023
Efabless Announces AI Generated Open-Source Silicon Design Challenge
K-Best MIMO Decoder IP Core Available For Immediate Integration From Global IP Core
Wednesday, May 17, 2023
China's semiconductor developers eye shift to RISC-V architecture amid growing chip demand in cars, data centres and AI, executive says
Arasan Announces immediate availability of its SUREBOOTâ„¢ Total xSPI PHY IP
SiliconAlly: GigaPHY Testchip is back from Fabrication and Packaging
proteanTecs' Die-to Die Interconnect Monitoring IP Passes TSMC9000 Pre-Silicon Assessment
Rambus and Socionext Renew Patent License Agreement
proteanTecs to Present in Open Compute Project (OCP) Webinar on Silent Data Errors for Resilient Data Centers
Synopsys Posts Financial Results for Second Quarter Fiscal Year 2023
Arasan Announces immediate availability of its SUREBOOT™ Total xSPI PHY IP
Tuesday, May 16, 2023
GlobalFoundries, Samsung Electronics, and TSMC Join Imec's "Sustainable Semiconductor Technologies & Systems" (SSTS) Program
MIPI DevCon Returns to Silicon Valley to Explore MIPI in Automotive, IoT and Mobile
Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers
Semiconductor Manufacturing Monitor Points to Moderating Industry Contraction in Q2 2023, SEMI Reports
Weebit Nano to present recent ReRAM-based developments at the International Memory Workshop (IMW) 2023
Transitioning to a Circular Economy for Greener Electronic Systems
VESA Updates Adaptive-Sync Display Standard with Tighter Specifications
BrainChip and Teksun Demonstrate Rapid Adoption of AI Solutions at Embedded Vision Summit
Arasan announces the immediate availability of its 2nd Generation MIPI D-PHY for GlobalFoundries 22nm SoC Designs
Monday, May 15, 2023
Infineon to lead European research project on Industry 5.0 for more sustainability and resilience in European manufacturing
Imec teams for US driverless car research lab and incubator
How Vehicle Design Is Influencing Processors
NXP and TSMC to Deliver Industry's First Automotive 16 nm FinFET Embedded MRAM
BrainChip and Quantum Ventura Partner to Develop Cyber Threat Detection
Monday, May 15, 2023
Andes Technology Announces The New Product Line, AndesAIREâ„¢, Ultimately Efficient AI/ML Solutions For Edge And End-Point Inference
Sunday, May 14, 2023
Can AI solve its sustainability problem?
Socionext Conducts Asset Management Demonstration experiment Using ZETA-compliant ZETag® IoT Tags
AccelerComm secures £21.5m funding to supercharge 5G radio performance
Indian chip startups get seed funds from Sequoia Capital
Ethernovia Raises $64 Million to Accelerate the Revolution of Vehicle Networks
proteanTecs to Present in Open Compute Project (OCP) Webinar on Silent Data Errors for Resilient Data Centers
Upgrade Your Display and Camera SOC's with proven MIPI C-D Combo PHY and CSI / DSI Controller IP Cores for both Tx and Rx
Andes Technology Announces The New Product Line, AndesAIRE™, Ultimately Efficient AI/ML Solutions For Edge And End-Point Inference
Thursday, May 11, 2023
Samsung Electronics Accelerating Foundry Facility Expansion While TSMC Slows Down
TSMC says new chips to be world's most advanced
Nordic teams for IoT software SIM
Perforce survey reveals software has become central to automotive development
Japanese foundry Rapidus is making cutting edge 2 nm nodes with IBM, plans to compete with TSMC and Samsung by 2027
Wednesday, May 10, 2023
Canonical enables Ubuntu on StarFive's VisionFive 2 RISC-V single board computer
Arteris Selected by BOS Semiconductors for Next-Generation Automotive Chips
Kalray, Arteris, Secure-IC, and Thales, Win the Call for Projects Related to the AI Acceleration Strategy of the "France Relance 2030 - Future Investments" Plan
BrainChip Showcases Edge AI Technologies at 2023 Embedded Vision Summit
SMIC Reports 2023 First Quarter Results
Alphawave Semi Update on Audit Process
CryoCMOS Consortium develops 4K & 77K transistor models to enable CryoIP development
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