Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Videos
Subscribe to D&R SoC News Alert
English
Mandarin
Register
Login
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Videos
Subscribe to D&R SoC News Alert
Register
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller & PHY
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Design Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Search News
Keyword
Category
Foundry
Chiplet / Multi-Die
Design IP
Design Platform and Service
Processor
RISC-V
Artificial Intelligence
Automotive
Internet of Things
Security
Networking
Audio / Video
eFPGA / FPGA
Business
Sunday, April 2, 2023
Making Formal Verification the New Normal in IoT with Ashish Darbari - Founder, Axiomise | The IoT Podcast
SynSense closes strategic round to accelerate the development of their high-speed 3D neuromorphic processor DYNAPâ„¢-CNN2
Vtool appoints Wonderep to be its sales-channel partner in Israel
The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi
TurboConcept and Lomicro Information Technology today celebrate two years of successful collaboration
XMOS announces xcore®-voice: the next generation intelligent solution for smart voice applications
Unleashing the Full Potential of Your Display: eDisplayPort v1.4 PHY and Controller IP Cores are available for licensing for your Robust products
Wednesday, March 29, 2023
Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon's High-Performance Processors
CXL Testing Leverages PCIe Expertise
POLYN Introduces VibroSense, Industry-First Application-Specific Vibration Pre-Processing Chip Design
Interview: Aart de Geus on AI-driven EDA
Renesas Expands RISC-V Embedded Processing Portfolio with New Voice-Control ASSP Solution
Computing Hardware Expert Georgios Konstadinidis Joins proteanTecs Advisory Board
Tuesday, March 28, 2023
3D-IC: An Opportunity to Augment India's Semiconductor Ecosystem
Survey reveals software now central to automotive development
I hear you NOCing, But Can You Close Timing?
Veriest Solutions Promotes Dusica Glisic to Vice President of Frontend Engineering
Synopsys.ai Unveiled as Industry's First Full-Stack, AI-Driven EDA Suite for Chipmakers
Tachyum To Use UCIe Interconnect Standards In Prodigy 2
Networking Chip Startup Enfabrica Emerges from Stealth Mode to Solve Scalability and Price-Performance Challenges for AI Growth in Cloud
Report: Arm proposes change to IP royalty model
Monday, March 27, 2023
Mobiveil's PSRAM Controller IP Lets SoC Designers Leverage AP Memory's Xccela x8/x16 250 MHz PSRAM Memory
eMemory and UMC Expand Low-Power Memory Solutions for AIoT and Mobile Markets with 22nm RRAM Qualification
Monday, March 27, 2023
Andes Custom Extensionâ„¢ (ACE) Supports AndesCoreâ„¢ 45-Series Processors to Provide Flexible Acceleration
Sunday, March 26, 2023
Samsung Electronics Facing TSMC-Nvidia Alliance in Advanced Chip War
Is RISC-V Poised to Benefit From Arm's Licensing Changes?
MIPI A-PHY Specification Levels Up In-Vehicle Connectivity
Chinese web giant Baidu backs RISC-V for the datacenter
China forms its own chiplet standard amid isolation
2026 All-Time High in Store for Global 300mm Semiconductor Fab Capacity After 2023 Slowdown, SEMI Reports
Designing MPUs/MCUs with Functional Safety
Sensor Fusion Explores AI to Prep for ADAS, AV Designs
MIPI A-PHY Specification Levels Up In-Vehicle Connectivity
Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 22nm ULP is Available for Immediate Licensing for Smart Audio Chipsets
Thursday, March 23, 2023
Alphawave Semi Opens Pune Office, Continues Expansion into India
Wednesday, March 22, 2023
SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speckâ„¢" to mass production
Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports
CEO Interview: Ian Lankshear, EnSilica
Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration
OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip
Tuesday, March 21, 2023
Hidden impact of semiconductor manufacturing on climate change
IAR Delivers "Security Made Simple"
Infineon and UMC Extend Automotive Partnership
Renesas to Acquire Panthronics to Extend Connectivity Portfolio with Near-Field Communication Technology
The Impact Of Blockchain On IoT Data Privacy
BrainChip's Neuromorphic Technology Enables Intellisense Systems to Address Needs for Next-Generation Cognitive Radio Solutions
SoftBank and EdgeCortix Partner to Jointly Realize Low-latency and Highly Energy-efficient 5G Wireless Accelerators
Previous
|
Next
Did you miss last D&R News Alerts ?