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Monday, May 8, 2023

• Accelerating Sustainability Investments Will Fuel Double-Digit Growth in European Digital Spending in 2023, Says IDC
• Developing and verifying 5G designs: A unique challenge
• LC3plus audio codec optimized for ARM®, RISC-V, HI-FI & Kalimbaâ„¢ DSPs for Bluetooth® LE Audio are available for Immediate Licensing
• FuriosaAI Enhances Next-Generation AI Chips with proteanTecs' Deep Data Analytics
• Qualcomm to Acquire Autotalks

Sunday, May 7, 2023

• Samsung to Detail Second-Gen 3nm Node, But Admits It Is Behind TSMC
• IC designers leave Graphcore for Meta
• LC3plus audio codec optimized for ARM®, RISC-V, HI-FI & Kalimba™ DSPs for Bluetooth® LE Audio are available for Immediate Licensing
• Arteris Announces Financial Results for the First Quarter 2023 and Estimated Second Quarter and Full Year 2023 Guidance
• Flex Logix Cancels AI Chip, Markets IP for AI and DSP
• GUC Monthly Sales Report - April 2023
• BrainChip Joins Arm Tech Talk to Discuss Cutting-Edge AI Solutions that Deliver Exceptional Performance and Efficiency

Thursday, May 4, 2023

• Generative AI in factory automation and the edge
• UMC Reports Sales for April 2023

Wednesday, May 3, 2023

• NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry
• Alphawave IP Group Plc Announces CFO Transition
• The environmental footprint of semiconductor manufacturing

Tuesday, May 2, 2023

• TSMC Teams Up With EDA Companies to Speed Up Design Flows
• Via Licensing Alliance Appoints Three New Members to its Board of Directors
• Via Licensing and MPEG LA Unite to Form Via Licensing Alliance, the Largest Patent Pool Administrator in the Consumer Electronics Industry
• Crypto Quantique Announces Robert Clyde as Chairman of the Board of Directors
• UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications
• AccelerComm's LEOphy Shortlisted at SCF Industry Awards 2023

Monday, May 1, 2023

• Alphawave confirms further delay to audited results
• Menta, Codasip join RISC-V 3D neuromorphic AI project
• Alps Alpine uses Siemens Symphony to verify mixed-signal touch chip
• TSMC upends 3-nm roadmap with three new nodes
• PsiQuantum Expands Development Engagement and Plan for Production Ramp of Quantum Computing Technology at SkyWater's Minnesota Fab
• Worldwide Silicon Wafer Shipments Decline in Q1 2023, SEMI Reports
• Tenstorrent Selects Arteris IP for AI High-Performance Computing and Datacenter RISC-V Chiplets
• BrainChip Pushes the Edge in 2023 with Akida Innovations, Expanded Partner Ecosystem
• Global Semiconductor Sales Decrease 8.7% in First Quarter; March Sales Tick Up Month-to-Month for First Time Since May 2022
• Rambus Reports First Quarter 2023 Financial Results

Sunday, April 30, 2023

• £21.5m raised to supercharge 5G radio performance | AccelerComm
• Overcoming the Automotive-Grade IC Shortage
• Fraunhofer picks Achronix eFPGAs for chiplet demonstrator
• Soitec S.A.'s (EPA:SOI) latest 12% decline adds to one-year losses, institutional investors may consider drastic measures
• Electronic System Design Industry Logs $3.9 Billion in Revenue in Q4 2022, ESD Alliance Reports
• EC approves €7.4bn subsidy for ST-GloFo JV fab
• Processor Startup Innovates Memory Allocation Management
• EdgeCortix Expands Leadership Team by Appointing Jeffry A. Milrod as Vice President of Product Engineering
• GlobalFoundries Completes Purchase of 800 Acres Adjacent to New York Manufacturing Facility
• Softbank files to list Arm on the Nasdaq
• TSMC's 3-nm Push Faces Tool Struggles
• Cadence Reports First Quarter 2023 Financial Results
• Samsung makes $3.4bn Q1 chip loss
• EU-Funded NimbleAI to Deliver 3D Neuromorphic Chip
• Arm Announces Confidential Submission of Draft Registration Statement for Proposed Initial Public Offering
• LC3plus audio codec for various Audio Application Is Available for Immediate Licensing!!

Friday, April 28, 2023

• Revolutionizing Autonomy: The Latest Technologies Advancing ADAS

Thursday, April 27, 2023

• State aid: Commission approves French measure to support STMicroelectronics and GlobalFoundries to set up new microchips plant
• Alphawave Semi: Q1 2023 Trading and Business Update
• Alphawave to suspend shares

Thursday, April 27, 2023

• Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dbloxâ„¢ Standard

Wednesday, April 26, 2023

• STMicroelectronics Publishes 2023 Sustainability Report
• TSMC on track to roll out advanced 2nm chips by 2025
• Siemens announces certifications for TSMC's latest processes, celebrates recent achievements for Siemens and TSMC collaboration
• Lattice Extends Low Power FPGA Portfolio with Launch of MachXO5T-NX Advanced System Control FPGAs
• Xiphera adds lightweight cryptography to its stream cipher portfolio
• M31 demonstrates high-speed interface IP development achievements on TSMC's 7nm & 5nm process technologies
• Cadence Digital and Custom/Analog Design Flows Certified for TSMC's Latest N3E and N2 Process Technologies
• Revenue Decline of Global Top 10 IC Design Houses Expanded to Nearly 10% in 4Q22, Decline Expected to Continue into 1Q23, Says TrendForce
• Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard
• Weebit Nano ReRAM now commercially available; fab & customer agreements progressing
• Esperanto Technologies Launches New Cloud Access Program to Broaden Access to its Massively Parallel, Low Power RISC-V Solutions
• HDL Design House develops its first full SoC from architecture definition to tapeout for an external customer
• Creonic Introduces FEC IP Core Solution for SDA Free-Space Optical OCT V3.0 Standard
• TSMC Showcases New Technology Developments at 2023 Technology Symposium
• Signature IP Corporation Demonstrates Configurable NoC Products at Design & Reuse IP SoC Day