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Friday, August 11, 2023
TSMC allocates $6bn for 2nm capacity in Taiwan
Thursday, August 10, 2023
Siemens teams for China battery technology centre
Associations align around MIPI CSI-2 automotive camera interface
Rambus Initiates $100 Million Accelerated Share Repurchase Program
TSMC July 2023 Revenue Report
Socionext Strengthens Design and Development Capabilities with New Office in Bangalore, India
Andes Technology and TetraMem Collaborate to Build Groundbreaking AI Accelerator Chip with Analog In-Memory Computing
Wednesday, August 9, 2023
Understanding the Compute Hardware Behind Generative AI
SMIC Reports 2023 Second Quarter Results
BrainChip and Edge Impulse Offer a Neuromorphic Deep Dive into Next-Gen Edge AI Solutions
Intel CEO Voices Concerns About CHIPS Funds, Export Controls
UCIeâ„¢ (Universal Chiplet Interconnect Expressâ„¢) Consortium Releases its 1.1 Specification
Tuesday, August 8, 2023
CAN-XL IP integrated CANsec accelerator
Apple, Samsung, Intel, Nvidia to invest in record-breaking IPO of British chip maker Arm: Report
3-nm Race to Start in Semiconductor Industry with Chip for Apple iPhone 15
Thalia announces new additions to its senior management team and Board
CEVA, Inc. Announces Second Quarter 2023 Financial Results
Allegro MicroSystems to Acquire Crocus Technology to Accelerate Innovation in TMR Sensing Technology
MIPI Alliance and Automotive SerDes Alliance Enter Liaison Agreement to Enable Native MIPI CSI-2 Implementation with ASA-ML PHY
Blueshift Memory announces successful development of computer vision AI accelerator chip
Tuesday, August 8, 2023
TSMC Board of Directors Meeting Resolutions
Monday, August 7, 2023
UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification
Analog IP tackles side channel attacks
Synopsys Partners with NowSecure and Secure Code Warrior to Expand Industry-Leading Application Security Testing Solutions Portfolio
TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe
UMC Reports Sales for July 2023
Synopsys Appoints Rob Painter to Board of Directors
Leading Semiconductor Industry Players Join Forces to Accelerate RISC-V
Sunday, August 6, 2023
CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family
Arteris Announces Financial Results for the Second Quarter 2023 and Estimated Third Quarter and Full Year 2023 Guidance
CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family
Renesas to Acquire Cellular IoT Technology Leader Sequans Through Tender Offer
DVB-C Demodulator IP Core Available For Immediate Implementation From Global IP Core
CEO Interview: Intrinsic ID's Pim Tuyls on Embedded Security
Tenstorrent Raises a $100M Strategic Up-round Co-led by Hyundai Motor Group and the Samsung Catalyst Fund
GUC Monthly Sales Report - July 2023
Global Semiconductor Sales Increase 4.7% in Q2 Compared to Q1
Unlock seamless video transmission between graphics adapters and LCD displays with readily licensable, silicon-proven LVDS IP cores tailored for the advanced 22FDX process node
Wednesday, August 2, 2023
Certifiably Secure - Xiphera Announces a First Batch of CAVP Validated IP Cores
PCI-SIG® Exploring an Optical Interconnect to Enable Higher PCIe Technology Performance
Cadence Advances Pervasive Intelligence at the Edge with Next-Generation Extensible Tensilica Processor Platform
Arasan announces its CAN-XL IP with seamlessly integrated CANsec Accelerator IP
CDAC, Arm partner to enable semiconductor startups in India through Arm Flexible Access for Startups
Tuesday, August 1, 2023
Siemens Helps SK hynix Achieve ASPICE Certification
University of Virginia Joins the BrainChip University AI Accelerator Program
Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controller to SoC Designers
JEDEC Publishes New Standard to Support CXL Memory Module Implementation
Monday, July 31, 2023
Synopsys Launches Software Risk Manager to Simplify Enterprise-Scale Application Security Testing
Renesas adopts Visual Studio IDE across entire range
Dolphin Design enables Orca's RF SoCs for direct-to-satellite communications
Weebit Nano qualifies its ReRAM module for automotive grade temperature
Rambus Reports Second Quarter 2023 Financial Results
LeapMind's Ultra Low-Power AI accelerator IP "Efficiera" Achieved industry-leading power efficiency of 107.8 TOPS/W
Sunday, July 30, 2023
Esperanto Merging HPC and ML in Upcoming RISC-V Processor
Huawei plans to use SMIC's 'nearly-7nm' process
America Faces Significant Shortage of Tech Workers in Semiconductor Industry and Throughout U.S. Economy
Weebit Nano: Q4 FY23 Quarterly Activities Report
Remi El-Ouazzane: "A Tsunami of TinyML Devices is Coming"
Huawei planning on using SMIC to fab 7nm ICs this year
PCIe Eyes Road Ahead with AI, Automotive
Production-proven CAN Controller IP Core, equipped with a Safety package (Safe DCAN-FD, ISO 26262: Safety manual, FMEDA), tailored specifically for High-End Automotive and Consumer Applications is available for immediate licensing
Terapines ZCC Toolchain Fully Supports Andes RISC-V Processors
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