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Monday, May 8, 2023
Accelerating Sustainability Investments Will Fuel Double-Digit Growth in European Digital Spending in 2023, Says IDC
Developing and verifying 5G designs: A unique challenge
LC3plus audio codec optimized for ARM®, RISC-V, HI-FI & Kalimba™ DSPs for Bluetooth® LE Audio are available for Immediate Licensing
FuriosaAI Enhances Next-Generation AI Chips with proteanTecs' Deep Data Analytics
Qualcomm to Acquire Autotalks
Sunday, May 7, 2023
Samsung to Detail Second-Gen 3nm Node, But Admits It Is Behind TSMC
IC designers leave Graphcore for Meta
LC3plus audio codec optimized for ARM®, RISC-V, HI-FI & Kalimba™ DSPs for Bluetooth® LE Audio are available for Immediate Licensing
Arteris Announces Financial Results for the First Quarter 2023 and Estimated Second Quarter and Full Year 2023 Guidance
Flex Logix Cancels AI Chip, Markets IP for AI and DSP
GUC Monthly Sales Report - April 2023
BrainChip Joins Arm Tech Talk to Discuss Cutting-Edge AI Solutions that Deliver Exceptional Performance and Efficiency
Thursday, May 4, 2023
Generative AI in factory automation and the edge
UMC Reports Sales for April 2023
Wednesday, May 3, 2023
NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry
Alphawave IP Group Plc Announces CFO Transition
The environmental footprint of semiconductor manufacturing
Tuesday, May 2, 2023
TSMC Teams Up With EDA Companies to Speed Up Design Flows
Via Licensing Alliance Appoints Three New Members to its Board of Directors
Via Licensing and MPEG LA Unite to Form Via Licensing Alliance, the Largest Patent Pool Administrator in the Consumer Electronics Industry
Crypto Quantique Announces Robert Clyde as Chairman of the Board of Directors
UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications
AccelerComm's LEOphy Shortlisted at SCF Industry Awards 2023
Monday, May 1, 2023
Alphawave confirms further delay to audited results
Menta, Codasip join RISC-V 3D neuromorphic AI project
Alps Alpine uses Siemens Symphony to verify mixed-signal touch chip
TSMC upends 3-nm roadmap with three new nodes
PsiQuantum Expands Development Engagement and Plan for Production Ramp of Quantum Computing Technology at SkyWater's Minnesota Fab
Worldwide Silicon Wafer Shipments Decline in Q1 2023, SEMI Reports
Tenstorrent Selects Arteris IP for AI High-Performance Computing and Datacenter RISC-V Chiplets
BrainChip Pushes the Edge in 2023 with Akida Innovations, Expanded Partner Ecosystem
Global Semiconductor Sales Decrease 8.7% in First Quarter; March Sales Tick Up Month-to-Month for First Time Since May 2022
Rambus Reports First Quarter 2023 Financial Results
Sunday, April 30, 2023
£21.5m raised to supercharge 5G radio performance | AccelerComm
Overcoming the Automotive-Grade IC Shortage
Fraunhofer picks Achronix eFPGAs for chiplet demonstrator
Soitec S.A.'s (EPA:SOI) latest 12% decline adds to one-year losses, institutional investors may consider drastic measures
Electronic System Design Industry Logs $3.9 Billion in Revenue in Q4 2022, ESD Alliance Reports
EC approves €7.4bn subsidy for ST-GloFo JV fab
Processor Startup Innovates Memory Allocation Management
EdgeCortix Expands Leadership Team by Appointing Jeffry A. Milrod as Vice President of Product Engineering
GlobalFoundries Completes Purchase of 800 Acres Adjacent to New York Manufacturing Facility
Softbank files to list Arm on the Nasdaq
TSMC's 3-nm Push Faces Tool Struggles
Cadence Reports First Quarter 2023 Financial Results
Samsung makes $3.4bn Q1 chip loss
EU-Funded NimbleAI to Deliver 3D Neuromorphic Chip
Arm Announces Confidential Submission of Draft Registration Statement for Proposed Initial Public Offering
LC3plus audio codec for various Audio Application Is Available for Immediate Licensing!!
Friday, April 28, 2023
Revolutionizing Autonomy: The Latest Technologies Advancing ADAS
Thursday, April 27, 2023
State aid: Commission approves French measure to support STMicroelectronics and GlobalFoundries to set up new microchips plant
Alphawave Semi: Q1 2023 Trading and Business Update
Alphawave to suspend shares
Thursday, April 27, 2023
Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dbloxâ„¢ Standard
Wednesday, April 26, 2023
STMicroelectronics Publishes 2023 Sustainability Report
TSMC on track to roll out advanced 2nm chips by 2025
Siemens announces certifications for TSMC's latest processes, celebrates recent achievements for Siemens and TSMC collaboration
Lattice Extends Low Power FPGA Portfolio with Launch of MachXO5T-NX Advanced System Control FPGAs
Xiphera adds lightweight cryptography to its stream cipher portfolio
M31 demonstrates high-speed interface IP development achievements on TSMC's 7nm & 5nm process technologies
Cadence Digital and Custom/Analog Design Flows Certified for TSMC's Latest N3E and N2 Process Technologies
Revenue Decline of Global Top 10 IC Design Houses Expanded to Nearly 10% in 4Q22, Decline Expected to Continue into 1Q23, Says TrendForce
Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard
Weebit Nano ReRAM now commercially available; fab & customer agreements progressing
Esperanto Technologies Launches New Cloud Access Program to Broaden Access to its Massively Parallel, Low Power RISC-V Solutions
HDL Design House develops its first full SoC from architecture definition to tapeout for an external customer
Creonic Introduces FEC IP Core Solution for SDA Free-Space Optical OCT V3.0 Standard
TSMC Showcases New Technology Developments at 2023 Technology Symposium
Signature IP Corporation Demonstrates Configurable NoC Products at Design & Reuse IP SoC Day
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