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Monday, July 11, 2022

• US Government funding enables SkyWater to further develop IP for its 90 nm rad-hard FDSOI platform to be used in strategic defense and space applications
• Taiwan's TSMC still leads chipmaking sector despite achievements by Samsung
• Dutch Startup on the Way to Make Quantum Photonic Processors Real
• RISC-V TEE "Penglai Enclave" officially entered StarFive chip platform
• Codasip expands design team to Greece
• Intrinsic ID Signs Representation Agreement for South Korea with Progate Technology to Further Extend Commercial Reach of its PUF-Based Security Solutions in the Asia Pacific Region
• Truechip Introduces Automation Products - NoC Verification and NoC Performance - for Revolutionizing the Verification Spectrum
• US Department of Defense Awards SkyWater a $27M Option to Facilitate American-Made Semiconductors Critical to National Security and Domestic Supply Chains

Sunday, July 10, 2022

• proteanTecs Welcomes Anurag Mittal to Executive Team
• Samsung Electronics Places Big Bet on 3-nm Foundry Technology
• Electronic System Design Industry Logs 12.1% Year-Over-Year Revenue Growth in Q1 2022, ESD Alliance Reports
• Imperas announces the latest updates to RVVI and welcomes the adoption by many leading RISC-V processor developers
• Crypto Quantique announces first post-quantum computing IoT security platform compliant with new NIST standards
• Synopsys Delivers Higher Productivity and Quality for Advanced-Node 5G/6G SoCs on Samsung Foundry's Low-Power Process
• Inuitive Partners With Arteris IP for the Next Generation of Vision Processing for Edge Devices
• Siemens' state-of-the-art Symphony Pro platform expands mixed signal IC verification capabilities
• Cadence to Acquire Future Facilities, A Pioneer in Data Center Digital Twins
• Breker Verification Systems and Codasip Announce Cooperation to Drive Open, Commercial-Grade RISC-V SoC Verification Processes
• Agile Analog announces RC Oscillator IP
• Experience DDR5/DDR4/LPDDR5 Combo PHY and matching Controller IP Cores seamless RAM interfacing speeds, with Silicon Proven 12FFC technology
• Agile Analog announces IR Drop Sensor IP
• Creonic Introduces Microchip FPGAs as Supported Technologies
• STMicroelectronics and GlobalFoundries to advance FD-SOI ecosystem with new 300mm manufacturing facility in France
• Flex Logix Collaborating with Microsoft to Help Build Secure State-of-the-Art Chips for US Department of Defense (DoD)

Friday, July 8, 2022

• True Circuits Attends Design Automation Conference

Thursday, July 7, 2022

• TSMC June 2022 Revenue Report
• Cadence Introduces the Voltus-XFi Custom Power Integrity Solution, Delivering over 3X Productivity Gains
• Nordic Semiconductor to acquire U.S. memory specialist Mobile Semiconductor
• Fabless Suppliers Hold Record 34.8% Share of Global IC Sales
• True Circuits Attends Design Automation Conference

Wednesday, July 6, 2022

• RISC-V Opens the Door on 48-bit Computing
• First RISC-V-Based SoC FPGA Enters Mass Production
• Imperas Announces Partnership with Breker to Drive Rigorous Processor-to-System Level Verification for RISC-V
• QuiX Quantum lands €5.5 million for development of world's most powerful photonic quantum computer
• Innolink - The advanced Chiplet solution complies with the Universal Chiplet Interconnect Express (UCIe) standard
• Brite Semiconductor Introduces Two Innovative Technologies For DDR PHY
• Order Cancellations Strike, 8-inch Fab Capacity Utilization Rate Declines Most in 2H22, Says TrendForce
• GUC Demonstrate World's First HBM3 PHY, Controller, and CoWoS Platform at 7.2 Gbps

Tuesday, July 5, 2022

• Imperas announce the latest RISC-V test suites are now available free with riscvOVPsimPlus
• Digital Core Design and Resquant are ready for quantum computing-resistant cryptography
• proteanTecs to Showcase Deep Data Analytics at DAC and SEMICON West 2022
• Nestwave Announces that Renesas has Adopted its IoT Geolocation Technology for Forthcoming LTE-M/NB-IoT Module
• WiLAN Signs Second Wireless License in Automotive Industry
• UMC Reports Sales for June 2022
• Outsourcing Supply Chain Management for chip manufacture can increase yields and quality
• Global Semiconductor Sales Increase 18.0% Year-to-Year, 1.8% Month-to-Month in May

Monday, July 4, 2022

• Automotive Cybersecurity: More Than In-Vehicle and Cloud
• Europe Needs 2-nm Manufacturing Process by 2030, says Soitec's CEO
• Ultra-low power memory targets the metaverse
• Faraday to Showcase FPGA-Go-ASIC Service at DAC in San Francisco
• Ludicrous Low Power (L2P) by SILICONGATE
• Multiport Memory With Analog Port Patent Issued
• Infineon to strengthen its leading expertise as IoT solution provider by acquiring verification expert NoBug in Romania and Serbia
• GUC Monthly Sales Report - June 2022

Monday, July 4, 2022

• Vidatronic Announces Power Management IP Now Certified on Globalfoundries' 22FDX® Platform for IoT Applications

Sunday, July 3, 2022

• Optima Launches New IC Security Verification Solution
• SEGGER's product line fully supports Arm Cortex-M85
• Enhance your High-Density data processing capabilities to new heights with the USB 3.2/ PCIe 3.1/ SATA 3.2 Combo PHY IP Core interface in 28HPC+/HPC process technology
• Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets
• Veriest Joins the Global Semiconductor Alliance

Thursday, June 30, 2022

• The First RISC-V Laptop Announced With Quad-Core CPU, 16GB RAM, Linux Support
• Samsung Leads Chip Industry with Nanochip Production
• Sondrel appoints Gareth Jones as VP ASIC
• Accenture Completes Acquisition of XtremeEDA to Expand Silicon Design Capabilities in Canada and US

Wednesday, June 29, 2022

• Multiport Memory With Analog Port Patent Issued
• 2022 a Focus for 12-inch Capacity Expansion, 20% Annual Growth Expected in Mature Process Capacity, Says TrendForce
• The Role of Hardware Root of Trust in Edge Devices
• Alphacore Joins Forces with Quantum Leap Solutions to Bring World-Class Design IP to the North American Commercial Market
• Breker Verification Systems Joins RISC-V International as a Strategic Member to Drive Cache Coherency and SoC Integration Verification Methodologies
• ETSI and MIPI Alliance Announce Incorporation of MIPI I3C Basic into ETSI Smart Secure Platform
• Xiphera's first financing round successfully completed
• Intel Foundry Services Forms Alliance to Enable Design in the Cloud
• New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale Designs
• Top Five MPU Suppliers Expand Share of Sales to 86% in 2021
• New S2C Multi-FPGA Prototyping Software Eases the Pain
• SiFive expands global operations, opening UK R&D Centre in Cambridge
• Truechip Adds USB 4 Hub Model & USB 4 Retimer Model to its Verification IP Portfolio
• Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture