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Tuesday, March 14, 2023

• Samsung to invest $230bn in ICs
• Introducing Signature IP Corporation - Providing a Configurable And Flexible Platform for SoC Development
• proteanTecs Collaborates with BAE Systems to Enable a Zero Trust Supply Chain for Defense Applications
• Telechips showcases Arm-based Dolphin5 automotive SoC at embedded world 2023
• Ashling and Imagination announce Ashling's RiscFree™ C/C++ SDK support for RISC-V-based Catapult family
• VeriSilicon delivered multi-format hardware video decoder Hantro VC9000D supporting 8K@120FPS VVC/H.266 to customers

Monday, March 13, 2023

• The Key to IoT Security in Smart Homes
• Imagination and CoreAVI partner for safety-critical automotive graphics applications
• Creonic Today Revealed Its New CCSDS 131.2 Wideband Demodulator IP Core with Immediate Availability
• Imagination and Telechips drive automotive display diversity with hardware virtualization
• ASUS IoT Announces Tinker V
• SPARK Microsystems Announces CDN$48 Million Financing Led by Idealist Capital
• At Embedded World 2023, Dolphin Design showcases AI-based vision applications at sub-mW level that fit in less than 1MB RAM
• VeriSilicon collaborates with Microsoft to deliver Windows 10 to the Edge
• Codasip and IAR demonstrate dual-core lockstep for RISC-V

Sunday, March 12, 2023

• Best in Show Winners: Processing & IP
• ARM adds custom instructions to M85 controller in RISC-V AI fightback
• Imperas in RISC-V three way deal
• Create high-performance SoCs using network-on-chip IP
• CEVA Wi-Fi 6 IP Powers ESWIN ECR6600 Smart Connectivity IC
• Rambus Expands Industry-Leading Security IP Portfolio with Arm CryptoCell and CryptoIsland IP
• Intrinsic Semiconductor Technologies Secures £7m Investment to Solve the Memory Bottleneck for Data Hungry Applications
• Imperas Collaborates with MIPS and Ashling to Accelerate RISC-V Application Software Development from SoC Concept to Deployment
• Total Revenue of Top 10 Foundries Fell by 4.7% QoQ for 4Q22 and Will Slide Further for 1Q23, Says TrendForce
• Veriest Solutions and Neuronix AI Labs Collaborate for Neural Network Acceleration
• 1G Ethernet PHY IP Cores is now available with Blackbox licensing option in various technology nodes for advanced networking applications
• Mythic Raises $13 Million to Bring Its Next-generation Analog Computing Solution to Market
• TSMC February 2023 Revenue Report
• Intrinsic ID Launches Software to Protect Billions of Smart, Connected Devices Addressing Worldwide Cybersecurity Challenges
• BrainChip integrates Akida with Arm Cortex-M85 Processor, Unlocking AI Capabilities for Edge Devices

Thursday, March 9, 2023

• Arm and ecosystem leaders empower developers for a future built on Arm
• ASICFPGA releases new ISP core supporting AXI4-Lite, AXI4-Stream, new AE, and new AWB
• EU Chips Act: Key Intellectual Property Considerations
• AmberSemi Announces Successful Tapeout of Silicon Chip for Patented AC Direct DC Power Delivery Technology
• Cadence Verisium AI-Driven Verification Platform Accelerates Debug Productivity for Renesas

Thursday, March 9, 2023

• Defacto's SoC Compiler 10.0 is Released

Wednesday, March 8, 2023

• Renesas to Demonstrate First AI Implementations on the Arm Cortex-M85 Processor Featuring Helium Technology at Embedded World
• CEVA Introduces UWB Radar Platform for Automotive Child Presence Detection to Meet Emerging Safety Specifications
• Atlas Credit Partners Provides $85MM Investment in Coherent Logix
• CEVA to Showcase Latest Wireless Connectivity and Smart Sensing Solutions at embedded world 2023
• Think Silicon to Showcase its Latest Ultra-Low-Power Graphics and AI Solutions for Edge Computing at Embedded World 2023
• Blueshift Memory to use Codasip custom compute to develop new memory-efficient processor technology
• QuantWare lands €6 million to roll out groundbreaking quantum processors
• Imagination launches its first edge AI course
• IAR Enables Robust End-to-End Embedded Security Solution with the Launch of IAR Embedded Trust
• TSMC's 3-nm progress report: Better than expected
• ProvenRun and SiFive deliver RISC-V-based secure Trusted Execution Environment (TEE)
• GOMACTech 2023: Menta, a major player in semiconductors for the defense industry
• Defacto's SoC Compiler 10.0 is Released
• GF to commercialize AR glasses MicroLED solution with FD-SOI technology
• Renesas to Demonstrate First AI Implementations on the Arm Cortex-M85 Processor Featuring Helium Technology at Embedded World

Tuesday, March 7, 2023

• Intel wants another €4-5bn to build German fab
• TSMC's 3-nm progress report: Better than expected
• CAST Announces Very Versatile I2S-TDM Digital Audio Transceiver IP Core
• sureCore announces range of off-the-shelf, ultra-low power memory IP to help fast-track power critical designs
• Tiempo Secure announces TESIC RISC-V Secure Element IP and development kit
• proteanTecs Joins Intel Foundry Services (IFS) Accelerator IP Alliance Program
• Orca Launches ORC5000 Platform for Low-Power ASIC Designs

Monday, March 6, 2023

• Understanding conditions for the single electron regime in 28 nm FD-SOI quantum dots: Interpretation of experimental data with 3D quantum TCAD simulations
• Samsung Foundry, Anaflash partner on embedded flash memory
• DVB-T2 Demodulator + Decoder LDPC/ BCH IP Core Available For Immediate Implementation From Global IP Core
• Weebit Nano ReRAM IP now available in SkyWater Technology's S130 process
• Attopsemi OTP IP embedded in Fingerprintsâ„¢ biometric solution to facilitate biometric technology
• Infineon and UMC Extend Automotive Partnership with Long-Term Agreement for 40nm eNVM Microcontroller Production
• Weebit Nano partners with University of Florida's Nino Research Group to examine effects of radiation on Weebit ReRAM
• Attopsemi OTP IP embedded in Fingerprints™ biometric solution to facilitate biometric technology
• intoPIX showcases its innovative image processing and compression solutions for human & machine vision at Embedded World 2023
• Sondrel extends multi-year, multi-million dollar EDA license with Synopsys
• Andes Technology's N25F RISC-V Processor Enables Superior Immersive Scenarios for ASPEED Technology's Powerful Image Stitching SoC AST1230

Sunday, March 5, 2023

• 2023 a Breakout Year for RISC-V
• Intel Tapes Out Chips on 1.8nm and 2nm Production Nodes (Updated)
• Spectral Design & Test Announces AI/ML Based Breakthrough Technology to Do Fast and Accurate Characterization & Validate Memory Compilers
• BrainChip Introduces Second-Generation Akida Platform
• JEDEC Creates New Automotive Steering Subcommittee
• Global Semiconductor Sales Decrease 5.2% Month-to-Month in January
• GUC Monthly Sales Report - February 2023
• DCD Presents RISC-V, Automotive & Cyber during Embedded World 2023
• New controller IP core for secure data
• Tata Consultancy Services and Renesas Partner to Open Innovation Center to Develop Next-Generation Semiconductor Solutions
• Arm priced at $30-70bn
• Alphawave Semi Opens Ottawa Office, Expanding Canadian Presence and Technical Leadership
• Chevin Technology partners with Intel®
• Unlocking Lightning-Fast Data Transfer: USB 3.2 Gen2x2 total solution for Host and Device functionalities in 28nm HPC+ technology
• OPENEDGES Announces LPDDR5X/5/4x/4 PHY Tapeout at 7nm process node
• UMC Reports Sales for February 2023

Friday, March 3, 2023

• 6G Set to Primarily Be an Industrial IoT Network

Thursday, March 2, 2023

• Intel expands ecosystem with quantum computing SDK
• CAST Enhances RISC-V Processor Line for Low-Power and Functional Safety Applications

Thursday, March 2, 2023

• HDL Design House has opened New design center in NiÅ¡ - Serbia

Thursday, March 2, 2023

• Floadia Completes eFlash IP Qualification on TSMC 130BCD plus Process and Achieves the World's Highest Data Retention for 10 Years at 200°C