Search News

Sunday, January 8, 2023

• All the PCIe 5.0 SSDs Coming Out in the Next Year or So
• Supermicro launches Arm-powered servers
• MIPS Rolls Out Its First RISC-V Processor Core – It's a Big 'Un
• CEVA Audio Front End Software Solution Becomes Alexa Voice Service (AVS) Qualified
• Rapid Silicon Announces $30M Series A Round
• CCSDS AR4JA LDPC Encoder and Decoder FEC IP Core Available For Licensing and Implementation from Global IP Core
• Display Port/eDisplay Port v.1.4 Tx-Rx PHY & Controller Silicon Proven IP Cores with high Bandwidth and 4K/8K Resolution is ready for immediate licensing
• Digital Blocks AMBA Peripherals I3C, I2C, eSPI, xSPI Controller IP Core Families Extend Leadership with enhancements containing feature-rich, system-level integration features.

Thursday, January 5, 2023

• Sino Wealth License and Deploy CEVA Bluetooth® Low Energy IP for its Connectivity MCUs
• Cadence Tensilica HiFi DSP Enables Highly Energy-Efficient Audio Playback for Dolby Atmos for Cars
• UMC Reports Sales for December 2022

Wednesday, January 4, 2023

• VESA Showcases Product Demos Supporting DisplayPort 2.1 and Other High-Performance Video Standards at CES 2023
• SNIA Spec Gets Data Moving in CXL Environment
• SkyWater Technology Expands Borrowing Capacity by Closing New $100 Million Senior Secured Revolving Credit Facility
• Syntiant Unveils NDP115 Neural Decision Processor at CES 2023
• Ventana Introduces CES Audience to World's Highest Performance RISC-V CPU, Veyron V1
• SpacemiT makes important breakthroughs in RISC-V High-Performance Cores
• CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution
• €270m for RISC-V chiplets to build European exascale supercomputers
• GUC Monthly Sales Report - December 2022
• Dolphin Design and Neovision joint forces to make AI processing viable for ambient computing electronics

Tuesday, January 3, 2023

• intoPIX shows the new lightweight video compression standards and technologies driving automotive at CES 2023
• CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances
• Google announces official Android RISC-V support
• intoPIX shows the new lightweight video compression standards and technologies driving automotive at CES 2023
• CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances

Monday, January 2, 2023

• RISC-V chip to drive next generation app store of hearables
• RISC-V Summit 2022: All Your CPUs Belong to Us
• Estimated Shipments of iPhone 14 Devices in 2022 Have Been Lowered to 78.1 Million Units Due to Impact of COVID-19 Lockdown on Foxconn's Base in Zhengzhou, Says TrendForce
• RISC-V Summit 2022: All Your CPUs Belong to Us
• Edge Impulse and BrainChip Partner to Further AI Development with Support for the Akida platform
• Weebit Nano tapes-out first 22nm demo chip

Sunday, January 1, 2023

• Seven semiconductor trends for 2023
• Octacore ARM SystemReady AI chip targets IoT
• USB 3.0 IP, MIPI D-PHY v1.2 IP, Display Port v1.4 IP, 1G Ethernet IP, the Best-Selling Interface IP Cores solutions through T2M in 2022
• eDisplay Port Tx PHY and Controller IP Cores in 12FFC and 40ULP for an immersive UHD experience at 8K
• Digital Blocks DMA Controller Verilog IP Core Family Extends Leadership with enhancements to AXI4 Memory Map and Streaming Interfaces

Saturday, December 31, 2022

• Should open source sniff the geopolitical wind and ban itself in China and Russia?

Friday, December 30, 2022

• Analysts Estimate TSMC's 3nm Yields Between 60% and 80%

Thursday, December 29, 2022

• Prelude to the War of 3-nano Semiconductor... TSMC "Starting mass production"

Wednesday, December 28, 2022

• Taiwan Brings 96 Startups to Attend CES 2023
• €270m for RISC-V chiplets to build European exascale supercomputers

Tuesday, December 27, 2022

• Smarter Edge Equals Smarter Living Using AIoT
• TSMC looks at Dresden for possible European plant
• 6G project aims to connect cars and drones
• intoPIX Showcases Ultra-low Latency Wireless Display Concept at CES Las Vegas 2023
• TSMC holds 3nm ceremony