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Monday, June 13, 2022

• GaN Systems & TSMC Showcase Latest Power Electronics Advances at 2022 TSMC Technology Symposium
• Imagination GPU approved by HORIBA MIRA Certification Limited for functionally safe ADAS and HMI applications
• Allegro DVT Acquires Labwise Ltd. to Extend its Compliance Stream Business Line and Enrich its Products & Service Portfolio
• Real Intent Advances Meridian CDC with Multimode Coverage & Unprecedented 10X Efficiency
• Intrinsic ID Signs Representation Agreement with Kaviaz Technology to Extend the Commercial Reach of its Physical Unclonable Function (PUF) Security IP Solutions in Taiwan
• Renesas Announces Investment in Popular Open-Source Company Arduino to Access Huge Developer Community
• Codasip appoints Mike Eftimakis as VP of Strategy and Ecosystem
• intoPIX takes part in Major VSF Interoperability Demonstrations at VidTrans 2022

Sunday, June 12, 2022

• BrainChip, Edge Impulse Team to Develop Low-Cost Embedded ML Systems
• Global Fab Equipment Spending Expected to Reach Record $109 Billion in 2022, SEMI Reports
• Cadence Extends Cloud Leadership with Transformational Cadence OnCloud SaaS and e-Commerce Platform
• Altair Expands Electronic System Design Technology with Acquisition of Concept Engineering
• IAR Systems accelerates innovation for solutions based on Arm Cortex-M85 processor
• Synopsys Drives Chip Innovation for Next-Generation Mobile and HPC Designs on TSMC N3E and N4P Processes
• Cadence Digital and Custom/Analog Design Flows Certified by TSMC for Latest N3E and N4P Processes
• SkyWater Announces Availability of SRAM Memory Compiler for 90 nm Strategic Rad Hard by Process Offering
• Wi-Fi 6 (AX)/BLE/15.4 22nm Combo RF IP Core, Licensed to a leading Chinese Semiconductor Company for IoT Chipset
• Alphawave IP Announces Availability of Two New Interconnect IP Products in TSMC Advanced Processes
• Analog Bits to Demonstrate Pinless PLL and Sensor IP's in TSMC N5 Process at TSMC 2022 North America Technology Symposium
• TSMC May 2022 Revenue Report

Thursday, June 9, 2022

• SkyWater adds FDSOI SRAM IP
• Mosaid Announces Semiconductor Process License Agreement
• Cadence Cerebrus AI-Based Solution Delivers Transformative Results on Next-Generation Customer Designs
• Mosaid Acquires Major Semiconductor Process Portfolio
• Mark Potter and Christian Klingler Join proteanTecs Advisory Board
• CAES announces Space Grade Qualification of Quad Core LEON4FT Microprocessor

Wednesday, June 8, 2022

• Cadence Revolutionizes System Design with Optimality Explorer for AI-Driven Optimization of Electronic Systems
• Cadence Extends Cloud Leadership with Transformational Cadence OnCloud SaaS and e‑Commerce Platform
• World's Top Ten IC Design Company Revenue Reached US$39.43 billion in 1Q22, Marvell Growth Rate Tops List, Says TrendForce
• OIF Releases Common Electrical I/O 5.0 Implementation Agreement
• BSC and Intel announce a joint laboratory for the development of future zettascale supercomputers
• Toshiba and Japan Semiconductor Develop Highly Reliable Versatile Analog Platform with Floadia's G1 technology for Automotive Applications
• Texas Instruments Keeps A Firm Grip As World's Top Analog IC Supplier
• TEMPO AI chip tapes out with videantis processor platform
• Soitec reports full year results of fiscal year 2022
• CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection
• Renesas to Acquire Reality AI to Bring Advanced Signal Processing and Intelligence to the Endpoint
• Fraunhofer IPMS RISC-V processor core supported by debugging tool from Lauterbach
• First RISC-V-Based System-on-Chip (SoC) FPGA Enters Mass Production

Tuesday, June 7, 2022

• €140m 3D chip research centre opens in Dresden
• CEVA Bluetooth® 5.3 Platform IP Supports New Auracastâ„¢ Broadcast Audio, Transforming the Shared Audio Experience
• CEVA Bluetooth® 5.3 Platform IP Supports New Auracast™ Broadcast Audio, Transforming the Shared Audio Experience
• QuantWare awarded €7.5M from the European Innovation Council to rapidly scale superconducting quantum processors
• QuantWare awarded €7.5M from the European Innovation Council to rapidly scale superconducting quantum processors
• Agile Analog signs first Chinese licensee for its analog IP
• Arm introduces new image signal processor to advance vision systems for IoT and embedded markets
• Intrinsic ID Announces Embedded SRAM PUF Security IP for Military-Grade IP protection in Intel FPGAs
• Spectronite introduces a high-performance 5G wireless solution for mobile operators
• The Automotive Industry is driving down acceptable chip defect levels
• Agile Analog signs first Chinese licensee for its analog IP
• 14-bit, 4.32Gsps Ultra high speed Wideband, Time-Interleaved Pipeline ADC IP Cores available for license to customers for wide range of applications

Monday, June 6, 2022

• proteanTecs Raises $45M to Enable Deep Data Analytics for Electronics Monitoring
• IntoPIX teams up with Nextera and Adeas to participate in live IPMX interoperability demonstrations at InfoComm 2022
• Imagination expands with new UK office in Manchester
• Real Intent Extends Meridian RDC's Low Noise Reporting & Debug Technology Leadership
• Global Semiconductor Sales Increase 21.1% Year-to-Year, 0.7% Month-to-Month in April
• TSMC Commits to Nanosheet Technology at 2 nm Node
• UMC Reports Sales for May 2022

Sunday, June 5, 2022

• Taiwan talks show EU urgency on chips
• Cyient to Acquire Portugal-Based Celfinet to Strengthen its Wireless Communications Offerings
• Flex Logix Launches EasyVision - Turnkey AI/ML Solution with Ready-to-Use Models and AI Acceleration Hardware
• GBT is Researching the Development of a Unified, Machine Learning-driven, Automated IC Design Environment
• GUC Monthly Sales Report - May 2022
• AP Memory launches brand-new product series of 512Mb Ultra-High-Speed (UHS) and 32Mb Ultra-Low-Swing (ULS) PSRAM
• Silicon qualified, Ultra-low power Analog Data-Convertors IP Cores (ADCs) available for license to the customers for wide range of IoT applications

Wednesday, June 1, 2022

• u-blox releases full-featured platform to test and validate IoT solutions
• Cadence Accelerates Industrial, Automotive, Hyperscale Data Center, and Mobile SoC Verification with Expanded VIP and System VIP Portfolio
• CAES and Ashling announce Ashling's RiscFree C/C++ Toolchain for CAES' NOEL-V Processors
• Semiconductor Growth Still Seen at 11% Despite 2022 Headwinds
• Credo Introduces Industry Leading 40Gbps PAM3 SerDes Technology To Address New Markets Requiring High-speed, Low-Power Connectivity
• CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
• Global Semiconductor Equipment Billings Grow 5% Year-Over-Year in Q1 2022, SEMI Reports
• Riviera-PRO Supports OpenCPI for Heterogeneous Embedded Computing of Mission-Critical Applications
• Trusted Objects adds Crypto Quantique's QuarkLink Platform to its Software Root-of-Trust for End-to-End IoT Device Security
• Intrinsic ID to Attend Multiple Industry Events in June Addressing Increasing Need for Device-Level Security
• NEUCHIPS' Purpose-Built Accelerator Designed to Be Industry's Most Efficient Recommendation Inference Engine
• aiMotive ships first aiWare4 NPU production RTL