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Thursday, June 1, 2023

• RISE project gives RISC-V an open source software lift
• Axiomise Launches Next-Generation formalISA App for RISC-V Processors

Wednesday, May 31, 2023

• The Next Step for Green Energy
• NVIDIA Collaborates With SoftBank Corp. to Power SoftBank's Next-Gen Data Centers Using Grace Hopper Superchip for Generative AI and 5G/6G
• University of Oklahoma Joins the BrainChip University AI Accelerator Program
• Xiphera extends its Transport Layer Security product family
• The game-changing addition of intoPIX JPEG XS codec by Providius heralds a new era of IP media analysis
• Vtool appoints Incusolution to be its sales-channel partner in Korea
• Tachyum Testing Applications on Prodigy FPGA
• UltraRISC Selects Valtrix STING for Verification of RISC-V SoC Designs
• Semidynamics announces largest, fully customisable Vector Unit in the RISC-V market, delivering up to 2048b of computation per cycle for unprecedented data handling
• The Six Semiconductor of OPENEDGES Joins Canada's Semiconductor Council

Tuesday, May 30, 2023

• Can AI Invent New Battery Materials?
• Intel Foundry Services Ushers in a New Era
• Industry Leaders Launch RISE to Accelerate the Development of Open Source Software for RISC-V
• Semiconductor Manufacturing on the Way to Net Zero
• Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era
• Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future

Monday, May 29, 2023

• Trillion-dollar Nvidia subsidized to create Taiwan AI R&D center
• Cadence and SHTP Partner to Empower the Next Generation of IC Designers in Vietnam
• SDV Safety Calls for Partnerships, Open Source
• Socionext introduces 60GHz radio-frequency ranging sensors for automotive applications
• Capgemini and Google Cloud expand long-standing partnership to create first-of-its-kind Generative AI Center of Excellence to accelerate client value
• Arm Platform TCS23 Sets Benchmark to Power Advanced, Holistic Mobile Computing Experiences
• Arm tapes out Cortex X4 on TSMC N3E
• Samsung's June 2023 Reveal: Enhanced 3nm & 4nm Chip Fabrication Process
• U.S. Government Accredits GlobalFoundries to Manufacture Trusted Semiconductors at New York Facility
• MIPS Leverages Siemens' Veloce proFPGA platform to Implement and Make Available Capabilities of its New High-Performance eVocore P8700 RISC-V Multiprocessor
• Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions
• AndeSentry™ Collaborative Framework Enables Comprehensive RISC-V Security Solutions
• SDIC Licenses 8051 Microcontroller IP Cores from CAST

Sunday, May 28, 2023

• Environmental impact of AI: Pioneering solutions for a sustainable future
• SK hynix Enters Industry's First Compatibility Validation Process for 1bnm DDR5 Server DRAM
• MediaTek Partners With NVIDIA to Provide Full-Scale Product Roadmap to the Automotive Industry
• Socionext Introduces Ultra-compact, Ultra-low-power 60GHz Radio-frequency Ranging Sensors for Automotive Applications
• M31 Technology: Q1 EPS NT$2.24, Up 75% YoY, Revenue Growth for the 19th Consecutive Month
• New Arm Total Compute Solutions enable a mobile future built on Arm
• Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Nodes
• JESD204C PHY & Controller IP Cores with proven automotive compatibility are instantly licensable for extremely reliable performance for your SOC's

Thursday, May 25, 2023

• Rambus's expectations on faster GDDR6 memory
• Partnership enhances deep data analytics in SoCs

Thursday, May 25, 2023

• Synopsys Initiates $300 Million Accelerated Share Repurchase Agreement

Wednesday, May 24, 2023

• Apple Signs Multibillion-Dollar Deal with Broadcom for US-Made 5G RF Components
• CEA-Leti to Report New Integration & Packaging Gains for Next-Generation LiDAR Steering on Autonomous Vehicles at ECTC
• China bars Micron ICs destined for key infrastructure
• FIVEberry Establishes Broad and Easy Access to RISC-V Technology
• Crypto Quantique signs first major client in Taiwan
• Alphawave Semi has published its audited results for the year ended 31 December 2022
• DRAM Industry Q1 Revenues Decline 21.2% QoQ, Marking Third Consecutive Quarter of Downturn, Says TrendForce
• Nanusens announces that it can now create ASICs with embedded sensors
• Generative AI is changing the world – but can it continue to succeed with our current data infrastructure?
• TSMC lays out a killer roadmap
• JEDEC Publishes Major Update to JEP30 PartModel Guidelines

Tuesday, May 23, 2023

• Silex Technology Announces High-Performance 802.11ah Wi-Fi HaLow SDIO Module
• SiFive Gives WorldGuard to RISC-V International to Make this Robust Security Model More Accessible to the RISC-V Community
• 3nm AI chips and 6nm microcontrollers will be key to TSMC Dresden fab
• Experts Weigh Impact of Intel-Arm Collaboration
• Apple announces multibillion-dollar deal with Broadcom for components made in the USA
• Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets
• BrainChip and CVEDIA Team to Advance State-of-the-Art Edge AI and Neuromorphic Computing

Monday, May 22, 2023

• Synopsys Named a Leader in the 2023 Gartner® Magic Quadrant™ for Application Security Testing for Seventh Consecutive Year
• Automotive Industry Looks Beyond EVs for Decarbonization
• Chiplet interconnect handles 40 Gbps/bump
• Sequans Introduces Taurus 5G NR: The World's First Chipset Specifically Optimized for 5G Broadband IoT Devices
• Imagination launches IMG CXM, the smallest GPU to bring effortless user interfaces into homes
• PCI-SIG Certifies VectorPath Accelerator Card for PCIe Gen5 x16 @ 32 GT/s
• Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities