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Monday, May 30, 2022
Samsung's huge investment plan seen unlikely to unseat TSMC
Heads of Samsung and Intel Discuss Korea-U.S. Semiconductor Alliance
Socionext starts to ship HD-PLC LSI compliant with IEEE 1901-2020
Renesas Unveils Industry's First I3C Intelligent Switch Family for Next Generation Server, Storage and Communications Systems
imec Leads Semiconductor Value Chain in Joint Effort Toward Net-zero Emissions for Chip Manufacturing
PNG Image Decoder IP Core Available from CAST and IObundle
Faraday Launches Soteria! Security IP Subsystem for IoT ASIC
Imagination launches Open Access program, providing scale-ups with a low-cost path to differentiated silicon
Barry Paterson is the new Agile Analog CEO
Sunday, May 29, 2022
Capgemini opens new centers specialized in Cybersecurity and Cloud services in Malaga, Spain
ADTechnology to launch its 5nm A53-based Platform, ADP500 based on Samsung Foundry
Will Broadcom milk VMware dry or become a full stack company?
ARM battles RISC-V at Renesas
Elevate your Video and Display applications with the Multi-Stream Transport of DisplayPort/eDisplayPort v1.4 Rx PHY IP Cores in 22nm, 28nm and 40nm with Matching Controllers
SiPearl Collaborates with NVIDIA on Enabling Accelerated Computing Solutions with European Microprocessor
Hewlett Packard Enterprise and SiPearl Partner to Develop HPC Solutions with European Processors and Accelerate Europe's Adoption of Exascale Supercomputers
GBT Filed a Continuation Patent Application for its Long-Range Radio System
Friday, May 27, 2022
Synopsys Initiates $200 Million Accelerated Share Repurchase Agreement
Thursday, May 26, 2022
Semiconductor superpower: Will Samsung beat TSMC with the world's first 3nm chip?
Broadcom to Acquire VMware for Approximately $61 Billion in Cash and Stock
Wednesday, May 25, 2022
Samsung's 3nm technology: what do we know?
The Value of Small M&A Deals for Chipmakers
New Crypto Quantique device management service streamlines IoT security lifecycle with key integration of the Microchip Trust Platform Design Suite
Ex-Intel Global Senior VP Jim Finnegan joins Corigine
Tuesday, May 24, 2022
Spain Approves €12.25b Semiconductor Investment Plan
Synopsys Appoints Two New Directors
Siemens streamlines, secures embedded RISC-V development with latest Nucleus ReadyStart solution
London Stock Exchange welcomes EnSilica plc to AIM
ADTechnology to launch its 5nm A53-based Platform, ADP500™ based on Samsung Foundry
LeapMind announces "Efficiera Anomaly Detection model"
Monday, May 23, 2022
Samsung commits to $356 billion of investment over 5 years
mioty® ̶ The all-around talent for industrial IoT applications handles 3.5 million messages per day
Capgemini positioned as a Leader in the IDC MarketScape Worldwide Cloud Professional Services Vendor Assessment
Silex Insight & Intrinsic ID Join Forces
Samsung seeks foundry supremacy with 3nm chips
NSITEXE Selects ImperasDV for Automotive Quality RISC-V Processor Functional Design Verification
Rambus Completes Acquisition of Hardent
Top Three Suppliers Held 94% of 2021 DRAM Marketshare
X-FAB Adopts Cadence EMX Solver's Electromagnetic Simulation Technology to Support Innovative RF Designs Targeted at Communication and Automotive Markets
PUFsecurity's secure crypto coprocessor PUFcc wins COMPUTEX 2022 Best Choice Award
Renesas Will Demonstrate the First Working Silicon Based on the Recently Debuted Arm Cortex-M85 Processor
Sunday, May 22, 2022
MediaTek Enters 5G mmWave Market
Foundry's 2021 Revenue Growth Overtakes Overall Chip Industry
Synopsys and Analog Devices Collaborate to Accelerate Power System Design
Wireless RF Transceiver IP Cores for IoT applications, available for immediate licensing
Foundry's 31% Growth in 2021 Outpaced Overall Chip Industry
MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity
BrainChip Joins Arm AI Partner Program
Silicon Catalyst welcomes Flex Logix as an In-Kind Partner
EnSilica to list on London Stock Exchange's AIM market, expected to begin trading from 24th May
Friday, May 20, 2022
Imec Presents Sub-1nm Process and Transistor Roadmap Until 2036: From Nanometers to the Angstrom Era
Thursday, May 19, 2022
TSMC expected to announce plans for its 1.4 nm production nodes next month
Imagination Joins Baidu PaddlePaddle "Hardware Ecosystem Co-Creation Program"
GlobalFoundries Advances RF Leadership with GF Connexâ„¢ Portfolio and Customer Collaborations
Imagination Joins Baidu PaddlePaddle
QOI Image Compression IP Cores available from CAST and Ocean Logic
ReRAM Proves Resistant To Invasive Attacks
GlobalFoundries Advances RF Leadership with GF Connex? Portfolio and Customer Collaborations
Imagination Joins Baidu PaddlePaddle
Fujikura collaborates with GlobalFoundries to accelerate large-scale commercialization of 5G mmWave Technologies
Cortus joins the Alliance for Internet of Things Innovation (AIOTI)
Arasan announces its 2'nd Generation of CAN IP
VeriSilicon's Chip Design Process Obtains ISO 26262 Automotive Functional Safety Management System Certification
GlobalFoundries Unveils GF Labs to Accelerate Technology Innovation
GlobalFoundries Advances RF Leadership with GF Connex™ Portfolio and Customer Collaborations
Wednesday, May 18, 2022
TMC has released "TM7050 Visibility Improver" which improves the visibility of unclear video images
RFicient chips for a sustainable Internet of Things: Fraunhofer IIS research team wins Joseph von Fraunhofer Prize 2022
The world's first RISC-V laptop could arrive sooner than you think
Synopsys Posts Financial Results for Second Quarter Fiscal Year 2022
GlobalFoundries and Motorola Solutions Announce Strategic Agreement for Chip Supply
oneNav Announces Competitive pureL5 Field Test Performance Using its Latest Customer Evaluation System (CES)
Intrinsic ID Taps Former Arm Executive to Lead Business Development Efforts as Need for Embedded Security Soars
Cadence Digital Full Flow Achieves Certification for GlobalFoundries 12LP/12LP+ Process Platforms
Xiphera's new IP cores complement the existing ECC portfolio
SMIC Revenue Soars as Chinese Market Sours
China-Based IC Production to Represent 21.2% of China IC Market in 2026
How real is TSMC's bid for conversion to 1.4-nm process node?
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