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Tuesday, February 14, 2023

• CEVA, Inc. Announces Fourth Quarter and Full Year 2022 Financial Results
• Intrinsic ID Protects 500,000,000 Devices Globally: Leading the Way in Secure and Authenticated Connected Devices
• Andes And IAR Systems Together Enable Leading Vendor ILITEK To Accelerate The Development Of Its ISO 26262 Ready TDDI SoC ILI6600A

Monday, February 13, 2023

• Industry First PCI Express® 6.0 and CXL Interposer Improves Data Captures for Speeds up to 64 GT/s
• Arm China lays off 14% of staff
• Xiphera and Muspark Technologies announce a partnership to enter the Indian technology market
• intoPIX showcases its new JPEG XS solutions to simplify IP video production workflow at HPA Tech Retreat 2023

Monday, February 13, 2023

• Würth Elektronik Partners with Crypto Quantique for IoT Security

Sunday, February 12, 2023

• AccelerComm to deliver cell service from space with 5G NTN LEO
• A closer look at security verification for RISC-V processors
• Bluetooth SIG Introduces Wireless Standard for Electronic Shelf Label Market
• Wi-Fi 6 (ax)/BLE/15.4 22nm Combo RF IP Core, for IoT Application Is Available for Immediate Licensing
• TSMC January 2023 Revenue Report
• Würth Elektronik Partners with Crypto Quantique for IoT Security

Saturday, February 11, 2023

• Secure Optical Data Communication Using Quantum Cryptography and Li-Fi

Thursday, February 9, 2023

• AI Must Be Secured at the Silicon Level
• Sharp, Motorola Mobility, and Kyocera Join Access Advance's HEVC Advance Patent Pool as Licensees
• Andes Technology: Stepping into the 18th Year with Perseverance and Proud Accomplishments
• indie to Acquire GEO Semiconductor
• GlobalFoundries and GM Announce Long-Term Direct Supply Agreement for U.S. Production of Semiconductor Chips

Wednesday, February 8, 2023

• The Value of Semiconductor Packaging Technology in the Era of Heterogeneous Integration
• Rambus Reports Fourth Quarter and Fiscal Year 2022 Financial Results
• SMIC Reports 2022 Fourth Quarter Results
• Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs
• GlobalFoundries Acquires Renesas' Non-Volatile Resistive RAM Technology to Proliferate IoT and 5G Applications

Tuesday, February 7, 2023

• Fabless FPGA/eFPGA Players Ramp up Their Innovations–a Roundup
• Fixing security threat with post-quantum crypto on eFPGA
• Could RISC-V become a force in high performance computing?
• Embedded World 2023: Logic Fruit Technologies to Unveil Cutting-Edge Technology Solutions
• BrainChip partners with Al Labs on application development
• Could RISC-V become a force in high performance computing?
• Samsung Electronics Establishes LCA Verification on Product Carbon Footprint of Its Semiconductor Business
• HARMAN and proteanTecs Collaborate to Advance Predictive and Preventive Maintenance for Automotive Electronics
• ShortLink AB joins X-FAB's Design & Supply Chain Partner Network and IP Portal

Tuesday, February 7, 2023

• QuickLogic Drives eFPGA Innovation with New Auroraâ„¢ Development Tool Suite

Monday, February 6, 2023

• Arm results shine bright in SoftBank mire
• Rambus Spins 6.4 GT/s DDR5 Registering Clock Driver for Speedier Servers
• Worldwide Silicon Wafer Shipments and Revenue Set New Records in 2022, SEMI Reports
• AI-designed Chips Reach Scale with First 100 Commercial Tape-outs Using Synopsys Technology
• Arm Q3 FY22 financial results
• QuickLogic Drives eFPGA Innovation with New Aurora™ Development Tool Suite
• ZeroPoint Technologies raises EUR 3.2 million in seed funding to reduce energy consumption of data centers by more than 25%

Sunday, February 5, 2023

• Quantum-safe identities for a digital future
• What will TSMC do next?
• Aldec Releases Automated Static Linting and CDC Analysis for Microchip FPGA and SoC FPGA Designs
• Denying China IC Manufacturing Tools
• U.S. Ban on Huawei Seen Widening China Chip War
• Global Semiconductor Sales Increase 3.2% in 2022 Despite Second-Half Slowdown
• DVB-RCS2 Turbo Decoder and Encoder IP Core Available For Integration From Global IP Core
• GreenWaves Technologies announces a €20M financing
• UMC Reports Sales for January 2023
• Gartner Says Top 10 Semiconductor Buyers Decreased Chip Spending by 7.6% in 2022
• GUC Monthly Sales Report - January 2023
• Peripheral IPs with proven automotive compatibility are instantly licensable for extremely reliable performance.

Saturday, February 4, 2023

• TSMC opens up 7nm FINFET process to universities