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Monday, May 16, 2022

• Sustainability in semiconductor operations: Toward net-zero production
• Vietnam's Viettel Partners with Qualcomm on 5G Infrastructure Development
• The 'substantial contributions' Intel has promised to boost RISC-V adoption
• Quadric and MegaChips Form Partnership to Bring IP Products to ASIC and SoC Market
• Siemens collaborates with GlobalFoundries to provide trusted silicon photonics verification
• Andes Technology and Crypto Quantique in Global Partnership to Deliver the Ultimate RISC-V IoT Device Security
• Flex Logix Partners With Roboflow to Enable Specialized AI Models For Computer Vision Applications

Sunday, May 15, 2022

• Mindtree And Finastra Partner To Deliver Managed Services Payments Solutions In The Nordics, The UK And Ireland
• Where's Europe in the exascale race?
• First ARM SystemReady certification for the data centre
• Algae-powered computing: scientists create reliable and renewable biological photovoltaic cell
• Major milestones for Arm SystemReady in driving ecosystem standards
• Xiphera joins BittWare Partner Program to enable fast security implementation
• Roviero joins Arm AI Partner Program to future-proof AI-based IoT solutions
• Quadric Appoints Former Arm Vice President Steve Roddy as Chief Marketing Officer and Accelerates the Licensing of Its GPNPU Architecture
• Samsung raising foundry prices
• sureCore appoints Shanghai LoMicro Information Technology Co. Ltd to boost presence in Chinese market
• Introducing the largest portfolio of Verification IP Cores for all types of Testbench verifications of different protocols and interfaces for your advanced Design IPs which are now available for immediate licensing

Thursday, May 12, 2022

• OMNIVISION Announces Patent Litigation Victory Against ID Image Sensing LLC

Wednesday, May 11, 2022

• Faraday Continues Expanding Its Ethernet Solutions for Networking Demands in ASIC
• QuickLogic Partners with Intrinsic ID to Provide eFPGA Security Solutions
• India Prepares to Build Nation's First Chip Fab
• 2023 IC market to fall 22%, says Penn
• Arm delivers record revenues and record profits in FY21
• ADTechnology Receives Samsung Foundry 2022 Best Engineering Award for Design Service Collaboration
• OPENEDGES To Exhibit its 4-/8-bit mixed-quantization NPU IP at Embedded Vision Summit 2022

Tuesday, May 10, 2022

• Samsung Launches Industry's First 512GB CXL Memory Module
• Silicon Creations and Achronix Semiconductor Partner to Drive More Performance, Flexibility into High-Speed Trading
• Alphawave Launches US Presence with New Silicon Valley Office
• Arteris Announces Financial Results for the First Quarter 2022 and Estimated Second Quarter and Full Year 2022 Guidance

Tuesday, May 10, 2022

• TSMC Board of Directors Meeting Resolutions

Monday, May 9, 2022

• Silicon wafer manufacturer Okmetic invests nearly 400 million euros to build a new fab in Finland with aims to more than double the production capacity and business
• Capgemini has been selected by Airbus to implement a large-scale cloud transformation program driving innovation and sustainability
• TSMC Board of Directors Meeting Resolutions
• TSMC to move forward with the 1.4nm process next month to get a lead on its competitors
• proteanTecs Secures $45 Million Investment from Addition
• Closing the Communication Chasms in the SoC design and manufacturing supply chain
• MIPS Pivots to RISC-V with Best-In-Class Performance and Scalability
• CEVA, Inc. Announces First Quarter 2022 Financial Results
• Codasip appoints SH Lee to deliver RISC-V innovations to Korean OEMs
• Creonic GmbH joins NewSpace Initiative
• Exegy Acquires Enyx, Expands Global FPGA Leadership
• Latest Attopsemi I-fuse OTP Memories Based on Ground-Breaking New Architecture Now Available on X-FAB's 180 nm Technology

Sunday, May 8, 2022

• Is 2022 the year of the semiconductor fab industry makeover?
• ARM returns to losing IP market share
• OMNIVISION and Valens Semiconductor Partner to Offer Automotive OEMs a MIPI A-PHY-Compliant Camera Solution for Advanced Driver-Assistance Systems Applications
• BrainChip & MosChip to Demonstrate Capabilities of Neural Processor IP & ASICs for Smart Edge Devices at IESA AI Summit
• Tower Semiconductor Expands its Leading-Edge Power Management Platforms Supporting Higher Power and Higher Voltage ICs
• intoPIX, Adeas, and Nextera to showcase Reference design on IPMX at ISE 2022 on Xilinx Booth
• USB 3.0 PHY IP Cores in 16FFC process technology with High-performance backplane interconnect licensed to a Chinese company for Multimedia SoC application
• intoPIX to showcase its lightweight compression IP at Embedded Vision Summit 2022 on Lattice Booth

Thursday, May 5, 2022

• Intel may be changing Meteor Lake CPUs to compete with Apple
• UMC Reports Sales for April 2022
• Industry R&D Spending To Rise 9% After Hitting Record in 2021

Wednesday, May 4, 2022

• Steven Laub Joins Rambus Board of Directors
• CMC Delivers Over 400 Semiconductor Prototypes in Past Year
• GUC Monthly Sales Report - Apr 2022
• Using Agile Analog's process-agnostic Analog IPs can help solve current Semiconductor capacity challenges
• Tachyum Integrates IP From World's Leading Vendors for Tape-Out In 2022
• Rambus to Acquire Hardent, Accelerating Roadmap for Next-Generation Data Center Solutions