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Saturday, April 22, 2023

• Omni Design's High Performance Analog Front Ends are Adopted in Socionext's Next Generation Communications SoCs
• Marvell Demonstrates Industry's First 3nm Data Infrastructure Silicon

Wednesday, April 19, 2023

• Anchoring Trust to Enhance IoT Security
• EdgeQ Closes $75M Series-B Investment and Ramps to Customers' Demand for Its Award-Winning 5G+AI Base Station-on-a-Chip for 5G Networks
• GlobalFoundries Files Lawsuit Against IBM to Protect its Intellectual Property and Trade Secrets
• TSMC Reports First Quarter EPS of NT$7.98
• EU agrees Chips Act terms
• EdgeCortix Expands Delivery of its Industry Leading SAKURA-I AI Co-processor Devices and MERA Software Suite
• Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY
• The Six Semiconductor of OPENEDGES Receives Best International Business Award from ACCE

Tuesday, April 18, 2023

• The Environmental Impact Of Using Plastic To Make Microchips
• The Need for Security is Everywhere. Intrinsic ID Showcases Expertise and PUF Innovations at Key Industry Events
• Volkswagen wants to become more agile with new R&D centre in China
• Cadence Unleashes the Future of Analog, Custom and RFIC Design with Pioneering AI-Powered Virtuoso Studio
• Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY
• Esperanto Technologies Announces RISC-V Industry Milestone of Generative AI Models Running on ET-SoC-1; Access to be Made Available to the RISC-V Research Community
• Europe consolidates quantum production and test
• Silicon Interfaces enhances Functional Safety ISO 26262-Compliant ASIL C Services Solution for Automotive
• The Need for Security is Everywhere. Intrinsic ID Showcases Expertise and PUF Innovations at Key Industry Events

Monday, April 17, 2023

• Arm liable for $8.5B SoftBank loan if IPO is a no-show
• Nordic Reveals "Revolution" of Wireless SoC Line: The nRF54 Series
• Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Hercules Microelectronics HME-H3 FPGA
• Rapid Silicon Partners with Elastics.cloud on CXL 3.0 Dual Mode Controller IP to Enhance its Custom FPGA Solutions
• eMemory's Security-enhanced OTP Qualifies on TSMC N5 Process and Continues to Tackle Automotive Solutions
• Cadence Demonstrates Interoperability with SK hynix's Highest Speed LPDDR5T Mobile DRAM at 9600Mbps

Sunday, April 16, 2023

• Spanish startup performs RISC-V open core surgery
• Process agnostic fully customisable RISC-V IP cores
• Cadence extends TSMC deal for physical verification on Azure
• Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud
• TSMC could partner with Bosch for 28nm fab in Germany
• Introducing the Cutting-Edge USB 3.0/ PCIe 3.0 Combo PHY IP Core in 28HPC+ for High-Performance SoC Designs
• Arm could be on the hook for $8.5bn of Softbank debt
• DVB-S2X LDPC/ BCH Encoder and Decoder IP Core Available For Integration From Global IP Core
• Semidynamics launches world's first fully customisable RISC-V IP cores

Thursday, April 13, 2023

• The Future of LiDAR Lies in ADAS
• TSMC could partner with Bosch for 28nm fab in Germany
• Fraunhofer IIS partners with Avid to enable support of MPEG-H Audio in Pro Tools
• CryptOne IP Core is ready for post-quantum reality
• Experience the Future of Video Processing with intoPIX and Imagine Communications at the 2023 NAB Show
• MainConcept and Fraunhofer IIS collaborate on MPEG-H Audio and xHE-AAC encoding for video and audio streaming services
• Pine64 launches world's first RISC-V tablet device - PineTab-V for presale
• IAR Embedded Secure IP upgrades solutions portfolio with late-stage security
• Pragmatic Semiconductor Announces Appointment of Semiconductor Industry Veteran, David Moore, as CEO
• Cadence Introduces EMX Designer, Delivering More Than 10X Increased Performance for On-Chip Passive Component Synthesis
• Strict Restrictions Imposed by US CHIPS Act Will Lower Willingness of Multinational Suppliers to Invest; Chinese Semiconductor Development Will Be Limited for Next Decade, Says TrendForce

Thursday, April 13, 2023

• Hardware Root of Trust: The Key to IoT Security in Smart Homes

Wednesday, April 12, 2023

• Battery recycling takes the driver's seat
• JEDEC Expands CAMM Standardization to include Two Key Memory Technologies
• VeriSilicon Brings Super Resolution Technology to Smart Display
• Get Ready to be Amazed by the one-of-a-kind exhibit "JPEG XS in Action" by intoPIX at NAB2023
• Frontgrade Products Enable ESA's JUICE Mission
• Global Semiconductor Equipment Billings Reach Industry Record $107.6 Billion in 2022, SEMI Reports
• IC Manage Partners with Library Technologies to Accelerate Library Characterization by 100x in the Cloud
• Ateme and Fraunhofer Join Forces to Deliver Next Generation Audio
• On your Wrist and in Space; Intrinsic ID is Everywhere. Come Find us at Key Industry Tradeshows in April
• EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices
• Synopsys Introduces the Industry's First Emulation System with Unmatched Capacity to Enable Electronics Digital Twins of Advanced SoCs
• Softbank reduces Alibaba holding to 3.8%

Tuesday, April 11, 2023

• Infineon Renames IPC Division to Green Industrial Power
• Nordic Semi introduces fourth generation of multiprotocol SoCs
• Rambus Joins the Intel Foundry Services (IFS) Accelerator IP Alliance to Enable State-of-the-Art SoCs
• DENSO adopts VisualSim Architect to improve in-vehicle network design.
• APlabs Chooses CAST IP Cores for Next-Generation Automotive SoC
• Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design
• Xylon Reveals Industry's First L5 Autonomy Ready Data Logger and HIL System
• Arteris IP Selected By ASICLAND for Automotive, AI Enterprise and AI Edge SoCs
• Tiempo Secure and GreenWaves Technologies demonstrate Secure Element role as Master in an embedded system
• Cadence Strengthens Tensilica Vision and AI Software Partner Ecosystem for Advanced Automotive, Mobile, Consumer and IoT Applications
• Lawo and intoPIX Partner to Deliver End-to-End JPEG XS Support!

Monday, April 10, 2023

• UK wireless strategy aims to boost 5G/6G deployment
• Rapid Silicon Launches Revolutionary RapidGPT for FPGA Designers
• Renesas Samples Its First 22-nm Microcontroller
• TSMC March 2023 Revenue Report
• UMC Reports Sales for March 2023
• Village Island VICO-XI is Revolutionizing IP Video Conversion with Reduced Bandwidth and Microsecond Latency using intoPIX Technology