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Monday, April 18, 2022

• Report: Russia to develop its own semiconductors
• Intel: Our fabs can mass produce silicon qubit devices
• TSMC Dwarfs Samsung Electronics in Foundry Business
• Intel: Our fabs can mass produce silicon qubit devices
• Hon Hai acquires arQana's Wireless Telecommunications Business
• Synopsys Introduces Industry's Highest Performance Neural Processor IP
• Agnisys Announces ISO 26262 and IEC 61508 Qualification for Entire IDesignSpec Suite - SoC Specification Automation Flow
• Flex Logix Appoints Chris Passier as Vice President, Platform Software and Vancouver, Canada Site Executive
• OPENEDGES Prepares for Initial Public Offering
• JESD204B Tx & Rx SerDes IP Core (12.5Gbps & 16Gbps) in 28HPC+ and 40LL process technologies for High-Speed Serial Interface with Matching Controller IP Core is available for immediate licensing

Sunday, April 17, 2022

• TSMC's 2025 timeline for 2nm chips suggests Intel gaining steam
• MOSCHIP Announces High Speed Serial Trace Probe (HSSTP) PHY With Link Layer in 6nm

Wednesday, April 13, 2022

• How Investments in Manufacturing will Benefit the Semiconductor Ecosystem
• Siemens' new mPower Digital solution now certified for GlobalFoundries' platforms
• Mirabilis Design announces Meraki Tech-Sol as their official sales & marketing partner in India for the VisualSim product-line
• Automotive Functional Safety with DCD's CAN ALL IP Core
• QuickLogic Adds GlobalFoundries 22FDX Process to its Growing List of Australis IP Generator-Based eFPGA IP
• TSMC Reports First Quarter EPS of NT$7.82
• SEGGER and Renesas deliver Device Lifecycle Management (DLM) for RA MCUs
• Gartner Says Worldwide Semiconductor Revenue Grew 26% in 2021
• Total IC Unit Shipments Forecast to Climb 9% This Year
• Renesas Introduces Industry's First PCIe Gen6 Clock Buffers and Multiplexers
• Synopsys Study Highlights Challenges with Managing Open Source Risk in Software Supply Chains

Tuesday, April 12, 2022

• SiemensÂ’ New mPower Digital Solution Now Certified for GlobalFoundriesÂ’ Platforms
• Siemens' New mPower Digital Solution Now Certified for GlobalFoundries' Platforms
• New Fujitsu cloud service is based Arm chips used in the world's fastest supercomputer
• Virtual development environment for fast automotive application software development
• POLYN Technology Delivers NASP Test Chip for Tiny AI
• 2021 Global Semiconductor Equipment Sales Surge 44% to Industry Record $102.6 Billion, SEMI Reports

Monday, April 11, 2022

• Siemens' SynthAI Revolutionizes Machine Vision Training with Artificial Intelligence
• Photonic quantum computer made in Germany
• New Cadence High-Speed Ethernet Controller IP Family Enables Silicon-Proven Ethernet Subsystem Solutions up to 800Gbps
• Orthogone Technologies joins forces with Desjardins Capital to support its international growth plan
• Andes Enters RISC-V CPU IP Market in India with Partner Excelmax

Sunday, April 10, 2022

• Intel Says It'll Deliver 2025 Chip Tech a Half Year Early
• China opens new research institute to develop RISC-V processor project
• Chiplets Get a Formal Standard with UCIe 1.0
• 200mm Semiconductor Fab Capacity Set to Surge 21% to Mitigate Supply-Demand Imbalance, SEMI Reports
• Taipei Puts Case for Being Close to Core of Semiconductor Ecosystem
• MIPI CSI-2 Tx and Rx Controller IP Cores for Highly modular and configurable Camera Interfaces is available for immediate licensing
• Cadence Spectre FX FastSPICE Simulator Is Adopted by SK Hynix to Accelerate DRAM Design
• CFX announces commercial availability of anti-fuse OTP technology on 28HV process
• Top Five Leaders Continue Expanding Share of Global IC Fab Capacity
• Chiplets Get a Formal Standard with UCIe 1.0
• TSMC March 2022 Revenue Report

Saturday, April 9, 2022

• TSMC Q1 Revenue Record: 35.5% Increase Year-Over-Year

Thursday, April 7, 2022

• MACsec solution for 5G transport network security is available
• The Art of Predictability : How Axiomise is Making Formal Verification Mainstream
• UMC Reports Sales for March 2022
• Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications

Wednesday, April 6, 2022

• Intel, Micron, and Analog Devices Join MITRE Engenuity's Semiconductor Alliance to Define Principles for Joint Research and Collaboration for a More Resilient U.S. Semiconductor Industry
• SmartDV Expands Executive Team With McKenzie Ross as Vice President of Marketing
• Synopsys and Juniper Networks Invest in New Company to Pursue Fast-Growing Silicon Photonics Market
• Weebit Nano demo chips integrating its embedded ReRAM module successfully complete functional testing phase
• Claudia Fan Munce Joins Arteris IP Board of Directors
• SK hynix Looking to Buy Arm
• RISC-V startup recruits former Agile Analog CEO Ramsdale
• Andes Releases AndeSight IDE v5.1 to Simplify Software Development for RISC-V Heterogeneous Multiprocessor and AI
• Sondrel warns that packaging lead time have dramatically increased from 8 to more than 50 weeks