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Thursday, March 23, 2023

• Alphawave Semi Opens Pune Office, Continues Expansion into India

Wednesday, March 22, 2023

• SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speckâ„¢" to mass production
• Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports
• CEO Interview: Ian Lankshear, EnSilica
• Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration
• OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip

Tuesday, March 21, 2023

• Hidden impact of semiconductor manufacturing on climate change
• IAR Delivers "Security Made Simple"
• Infineon and UMC Extend Automotive Partnership
• Renesas to Acquire Panthronics to Extend Connectivity Portfolio with Near-Field Communication Technology
• The Impact Of Blockchain On IoT Data Privacy
• BrainChip's Neuromorphic Technology Enables Intellisense Systems to Address Needs for Next-Generation Cognitive Radio Solutions
• SoftBank and EdgeCortix Partner to Jointly Realize Low-latency and Highly Energy-efficient 5G Wireless Accelerators

Monday, March 20, 2023

• CEO Interview: Ian Lankshear, EnSilica
• Electronics Tech Hub Seeks to Set Example for Green Semi Manufacturing
• NVIDIA, ASML, TSMC and Synopsys Set Foundation for Next-Generation Chip Manufacturing
• Omni Design Opens Design Center in Hyderabad, India
• Agile Analog joins Intel Foundry Services Accelerator IP Alliance Program to drive forward semiconductor design innovation
• SkyWater Establishes Cryogenic Lab, Utilizes FormFactor's Leading Tool for RTS Noise Detection in Read-Out Integrated Circuit Applications

Sunday, March 19, 2023

• Perforce Joins AWS ISV Accelerate Program and Launches Turnkey Cloud Solution for Helix Core in AWS Marketplace
• Sustainability In Semiconductors - Why Eco-Friendly Initiatives Are Important In The Tech Industry
• Securing Memory will Take More than Cryptography Alone
• TDK announces availability of automated ML Platform Integration for Arm® Keil® MDK
• 12bit 2Msps Silicon proven SAR ADC IP Core with Ultra-low power is available in different technology nodes for various applications that includes IoT, Medical, Consumer, etc
• Remote.It Simplifies Secure Access to Arm Virtual Devices
• TDK announces availability of automated ML Platform Integration for Arm® Keil® MDK

Friday, March 17, 2023

• CoreHW secures €4M investment to accelerate growth in indoor positioning solutions

Thursday, March 16, 2023

• Samsung's Mega Investment Plan to Compete with TSMC
• CoreHW secures €4M investment to accelerate growth in indoor positioning solutions
• M31 hit a record high of revenue and profit in last year, and it expects to sustain a double digit growth throughout the year

Wednesday, March 15, 2023

• intoPIX revolutionizes the gaming experience at GDC 2023: Image quality BEYOND reality

Wednesday, March 15, 2023

• Ashling and Imagination announce Ashling's RiscFreeâ„¢ C/C++ SDK support for RISC-V-based Catapult family

Tuesday, March 14, 2023

• Samsung to invest $230bn in ICs
• Introducing Signature IP Corporation - Providing a Configurable And Flexible Platform for SoC Development
• proteanTecs Collaborates with BAE Systems to Enable a Zero Trust Supply Chain for Defense Applications
• Telechips showcases Arm-based Dolphin5 automotive SoC at embedded world 2023
• Ashling and Imagination announce Ashling's RiscFree™ C/C++ SDK support for RISC-V-based Catapult family
• VeriSilicon delivered multi-format hardware video decoder Hantro VC9000D supporting 8K@120FPS VVC/H.266 to customers

Monday, March 13, 2023

• The Key to IoT Security in Smart Homes
• Imagination and CoreAVI partner for safety-critical automotive graphics applications
• Creonic Today Revealed Its New CCSDS 131.2 Wideband Demodulator IP Core with Immediate Availability
• Imagination and Telechips drive automotive display diversity with hardware virtualization
• ASUS IoT Announces Tinker V
• SPARK Microsystems Announces CDN$48 Million Financing Led by Idealist Capital
• At Embedded World 2023, Dolphin Design showcases AI-based vision applications at sub-mW level that fit in less than 1MB RAM
• VeriSilicon collaborates with Microsoft to deliver Windows 10 to the Edge
• Codasip and IAR demonstrate dual-core lockstep for RISC-V