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Monday, April 4, 2022

• Automation for the automators of things
• Can SiFive thrive? Chip designer needs a strong RISC-V ecosystem to succeed
• Chinese Companies Hold Only 4% of Global IC Marketshare
• Flex Logix Leads eFPGA Market with more than 17 Licensed Customers
• Arteris IP FlexNoC Interconnect and Resilience Package Licensed in Neural Network Accelerator Chip Project Led by BMW Group
• BrainChip and SiFive Partner to Deploy AI/ML Technology at the Edge
• New Arm-based cloud services from Microsoft highlight the power of choice in computing
• MIPI UFS Controller, MIPI Unipro Controller and MIPI M-PHY IP Cores available in different Fabs and Nodes for all High-density Flash Storage applications in advanced SoCs
• Eurosmart publishes PP-0117 Secure Sub-System SoC Protection Profile: Tiempo Secure IP products are ready

Sunday, April 3, 2022

• Forget the metaverse – Labster raises $47m to build the 'eduverse'
• Samsung and Western Digital begin far-reaching collaboration
• Nvidia to Use TSMC's 4-nm Process to Produce H100 GPUs
• Electronic System Design Industry Logs 14.4% Year-Over-Year Revenue Growth in Q4 2021, ESD Alliance Reports
• Hynix mulling a bid for Arm
• SMIC Announces 2021 Annual Results
• VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium

Friday, April 1, 2022

• Why Did Intel x86 Beat RISC Processors in the 1990s?

Thursday, March 31, 2022

• RISC-V takes steps to minimize fragmentation

Wednesday, March 30, 2022

• Samsung Foundry Adopts Leading Voltage-Timing Signoff Solution from Synopsys and Ansys for Advanced-Node, Energy-Efficient Chips
• Chip demand is slowing says TSMC chairman
• Arm transfers most of its Arm China shareholding to Softbank
• M31 Speeds Delivery of Silicon IP by 5X Using the Cadence Library Characterization Solution in the Cloud
• Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development
• SEGGER Embedded Studio for Arm now with hard real-time C++ support
• ARIES Embedded Presents New MCXL Reference IP Design
• intoPIX announces TicoRAW integration into the new Novitec industrial camera portfolio
• SiFive Appoints Nicole Singer as Chief Human Resources Officer to Drive SiFive Growth and Hiring
• WiLAN and Kyocera Enter New Wireless License

Tuesday, March 29, 2022

• TSMC says demand for smartphones, PCs starting to slow
• Samsung, TSMC Appeal For The $52 Billion US Chip Program
• Arm plans transfer of shares in China JV to speed up U.S. IPO - FT
• AMD may be looking towards RISC-V in future CPUs
• Alena Shiltova becomes Marketing Communications Manager at Menta
• Synopsys Launches Industry's First Broad-Scale Cloud SaaS Solution to Transform Chip Development Landscape
• Alma Technologies Launches Scalable Encoder and Decoder Semiconductor IP for VESA DSC 1.2b Visually Lossless Compression
• CAST Receives ISO 9001:2015 Certification
• Flex Logix Announces Production Availability of InferX X1M Boards for Edge AI Vision Systems
• QuickLogic Announces a New $1.5 Million eFPGA Contract
• IAR Systems enables powerful AI/ML applications based on Alif Semiconductor's microcontrollers and fusion processors
• Microcontrollers Get a Lift from Automotive After 2021 Rebound

Monday, March 28, 2022

• Samsung retains top spot in Q4 2021
• Arm to command 22 percent of servers in 2025
• Ashling to supply toolchain for MIPS RISC-V cores
• eTopus Announces PCIe IP Gen 1-6 and 800G Support For 7/6nm With Support For SoC & Chiplet Clients
• ElectraIC is now a Partner of Xilinx
• Edgewater Wireless selects CMC Microsystems as fabrication services Partner
• ARM-based Server Penetration Rate to Reach 22% by 2025 with Cloud Data Centers Leading the Way, Says TrendForce
• Movellus to Provide Intelligent Clock Network IP to BAE Systems
• Wacom, STMicroelectronics, and CEVA Collaborate to Enhance the Digital Pen Experience
• Advancing VHDL's Verification Capabilities with VHDL-2019 Protected Types

Sunday, March 27, 2022

• RISC-V is coming to the internet of things
• Gidel FPGA boards used for next generation wireless communication research
• Samsung Sued for Infringement of HEVC Essential Patents
• Introducing DDR5/DDR4/LPDDR5 Combo PHY IP Core, Silicon Proven in 12FFC for Next-Gen High performance SoCs is available for immediate licensing
• AI Chip Company Syntiant Raises $55 Million to Accelerate Growth
• MIPS Chooses Ashling's RiscFree Toolchain for its RISC-V ISA Compatible IP Cores
• Samsung retains top spot in Omdia Q4 2021 semiconductor market analysis

Wednesday, March 23, 2022

• Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services
• Analog Market Momentum to Continue Throughout 2022
• Amid Rising Volume and Pricing, Top 10 IC Design Companies Post 2021 Revenue Topping US$100 Billion
• The Semiwise's Flat Field Transistor enables the continuation of DRAM scaling
• Cadence Selected by Microsoft for RAMP Phase II Program
• CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale
• Imagination launches next-gen mobile gaming at GDC 2022
• O-RAN Fronthaul Transport Subsystem is now available
• In-Memory Computing, AI Draws Research Interest
• TSMC to Boost 4nm & 5nm Output by 25%: Ada Lovelace, Hopper, RDNA 3, Zen 4