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Monday, March 21, 2022

• MICLEDI Microdisplays Announces Agreement with GlobalFoundries to Collaborate on MicroLED Displays for AR Glasses
• Imec.xpand secures additional funding
• SEMIFIVE Acquires Analog Bits
• Michal Siwinski Joins Arteris IP as Chief Marketing Officer
• IObundle and CAST Partner on Audio and Graphics IP Cores
• Andes and IAR Systems Enable Leading Automotive-Focused IC Design Companies to Accelerate Time to Market
• Avalanche Technology and Efabless Partner for System-On-Chip Development using Google's Open-Source Program

Sunday, March 20, 2022

• QuickLogic Delivers eFPGA IP for TSMC 22nm Process from Australis IP Generator
• South Korea Slow in 5G Convergence
• China's chip champion SMIC appoints new chairman amid intensifying US scrutiny
• CAES Introduces Family of Radiation Hardened NOR Flash Memories for Space FPGAs
• Global Semiconductor Materials Market Revenue Tops $64 Billion in 2021 to Set New Record, SEMI Reports
• Menta Announces Joint Partnership with Trusted Semiconductor Solutions

Wednesday, March 16, 2022

• SEGGER releases new Embedded Studio for RISC-V with hard real-time C++ support
• MPEG LA Expands AVC License to Include Complete MVC Coverage
• Top 10 Foundries Post Record 4Q21 Performance for 10th Consecutive Quarter at US$29.55B, Says TrendForce
• Quadric Announces $21M to Advance Its Disruptive Edge AI Platform
• Xylon Demonstrates Hot Swapping of Programmable FPGA/SoC Chip Parts
• Intrinsic ID Optimizes SRAM PUF Security Technology for Advanced Process Nodes with QuiddiKey 4.x
• Imagination announces ambitious global recruitment drive
• Intel to Further Increase Foundry Investment
• Arm Plans 15% Workforce Reduction as it Prepares for Life Beyond Nvidia
• Intrinsic ID optimises SRAM PUF security technology
• RISC-V Processor Core of Fraunhofer IPMS now ready for Edge AI

Tuesday, March 15, 2022

• Siemens' Analog FastSPICE certified for UMC's 28nm HPCᵁ+ process technology
• Siemens' Analog FastSPICE certified for UMC's 28nm HPCᵁ+ process technology
• 2022 Flash Memory CapEx Expected to Reach $29.9B; Set New High
• SiFive Leadership in RISC-V Powers $2.5B+ Company Valuation
• Arm to lay-off up to 1,000 workers as it preps for IPO

Monday, March 14, 2022

• Top 10 Foundries Post Record 4Q21 Performance for 10th Consecutive Quarter
• Samsung's foundry market share rises in Q4, narrowing down gap with TSMC: report
• Synopsys Improves Interoperability Between CODE V and LightTools
• PCIe 6.0 Designed to Meet Automotive, AI Bandwidth Demands
• Weebit scaling down its ReRAM technology to 22nm

Sunday, March 13, 2022

• Grenoble INP - Phelma, UGA and Soitec sign their first partnership agreement
• New process to help tech firms develop safer AI
• Russia and The 5G Cold War
• SEGGER announces that Renesas has licensed emWin for all RX microcontrollers
• HDMI 2.0 Tx PHY in 12FFC along with Controller IP Core with high lossless Audio/Video data transfer, licensed for a 4KTV SoC
• Rambus Announces James Mitarotonda to Become Board Advisor
• IAR Systems extends powerful RISC-V solutions with 64-bit support
• Codasip University Program spurs innovation and boosts curriculums
• Alphawave IP Announces Definitive Agreement to Acquire Entire OpenFive Business Unit from SiFive for US$210m in cash

Thursday, March 10, 2022

• China's foundry growth to remain slow for next 5 years

Wednesday, March 9, 2022

• Imagination and Realtek launch world-first image compression DTV SoC
• QuickLogic Announces a New Approximately $1M eFPGA Contract
• AlphaICs welcomes IEEE Fellow Michael Shebanow as Chief Technology Officer
• PragmatIC Semiconductor leads project to digitise reusable packaging
• QuantWare releases 25-qubit Contralto QPU
• Zepp Health signs licence agreement for sureCore's EverOn ultra-low voltage memory IP
• TSMC February 2022 Revenue Report
• OPENEDGES Announces Silicon Proven 12nm LPDDR54 PHY IP
• Rambus Accelerates Automotive SoC Design with ASIL-B Certified Embedded Hardware Security Module
• SEGGER collaborates with HPMicro making Embedded Studio for RISC-V available at no cost
• GUC Announces 2.5D and 3D Multi-Die APT Platform for AI, HPC, Networking ASICs