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Tuesday, January 14, 2025

• Vertical Compute, a new imec spin-off, raises €20 million to Revolutionize the Future of AI Computing

Monday, January 13, 2025

• RISC-V in AI and HPC Part 2: Per Aspera Ad Astra?
• Creonic Introduces Doppler Channel IP Core
• YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet
• Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
• RISC-V in AI and HPC Part 2: Per Aspera Ad Astra?
• Creonic Introduces Doppler Channel IP Core
• YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet
• Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
• € 20m for imec MRAM in-memory compute chiplet spinout
• MZ Technologies Unveils Next Generation Chiplet/Package Design Tool
• Ultra Accelerator Link™ Consortium (UALink™) Welcomes Alibaba, Apple and Synopsys to Board of Directors
• CES 2025: Automotive suppliers focus on software and safety
• Samsung reportedly to cut NAND production
• QuickLogic Signs Agreement with Magenta to Expand Distribution Network to Turkiye and UAE
• RISC-V in AI and HPC Part 2: Per Aspera Ad Astra?
• Creonic Introduces Doppler Channel IP Core
• YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet
• Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
• € 20m for imec MRAM in-memory compute chiplet spinout
• MZ Technologies Unveils Next Generation Chiplet/Package Design Tool
• Ultra Accelerator Link™ Consortium (UALink™) Welcomes Alibaba, Apple and Synopsys to Board of Directors
• CES 2025: Automotive suppliers focus on software and safety
• Samsung reportedly to cut NAND production
• QuickLogic Signs Agreement with Magenta to Expand Distribution Network to Turkiye and UAE
• RISC-V in AI and HPC Part 2: Per Aspera Ad Astra?
• Creonic Introduces Doppler Channel IP Core
• YorChip and ChipCraft announce low-cost, high-speed 200Ms/s ADC Chiplet
• Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
• € 20m for imec MRAM in-memory compute chiplet spinout
• MZ Technologies Unveils Next Generation Chiplet/Package Design Tool
• Ultra Accelerator Link™ Consortium (UALink™) Welcomes Alibaba, Apple and Synopsys to Board of Directors
• CES 2025: Automotive suppliers focus on software and safety
• Samsung reportedly to cut NAND production
• QuickLogic Signs Agreement with Magenta to Expand Distribution Network to Turkiye and UAE

Monday, January 13, 2025

• Foundry Giants' Advanced Node Expansion Efforts Beyond 2025: TSMC, Intel, Rapidus and More
• Europe's technology trends for 2025

Sunday, January 12, 2025

• Alphacore's Digital CMOS Impulse Ground-Penetrating Radar (GPR) Transceiver ASIC
• Synopsys Responds to the European Commission Approving its Proposed Acquisition of Ansys in Phase 1
• Exostiv Labs Unveils AMD Versal Adaptive SoC Device Support for Exostiv and Exostiv Blade Platforms
• TSMC December 2024 Revenue Report
• NASA Awards Alphacore Four Contracts for Radiation Hardened Microelectronics Innovation
• BrainChip Brings Neuromorphic Capabilities to M.2 Form Factor
• Imagination pulls out of RISC-V CPUs
• SIA Statement on Biden Administration Action Imposing New Export Controls on AI Chips

Sunday, January 12, 2025

• By 2032, SerDes Market Set to Cross USD 2,422.8 million

Friday, January 10, 2025

• FPGA company Altera announces independence from Intel

Thursday, January 9, 2025

• EU approves Synopsys' $35 billion Ansys deal under conditions

Thursday, January 9, 2025

• Cognizant collaborates with Siemens on solution accelerator for Software-Defined Vehicles
• Why Secure by Design Is Essential for Cybersecurity

Wednesday, January 8, 2025

• TTTech divests strategic stake in landmark transaction to NXP to fuel future growth with technology investments in core business
• Qualitas Semiconductor and Verisilicon signed a licensing agreement for 4nm PCIe 6.0 PHY IP
• M31's 12nm GPIO IP Adopted by C*Core Technology, Powering Innovation in Advanced Process Automotive Chips
• Ansys sells power design tool to Keysight in Synopsys deal
• First full wafer-scale fabrication of electrically-pumped GaAs-based nano-ridge lasers on 300 mm silicon wafers
• Multi-Die Health and Reliability: Synopsys and TSMC Showcase UCIe Advances
• Imagination quits RISC-V CPU business to focus on GPUs and AI

Wednesday, January 8, 2025

• 2025 Will See Huge Advances in Quantum Computing. So What is a Quantum Chip And How Does it Work?

Tuesday, January 7, 2025

• Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
• VeriSilicon's Display Processing IP DC8200-FS has achieved ISO 26262 ASIL B certification
• BrainChip Unveils Edge AI Box Partner Ecosystem for Gestures, Cybersecurity, Image Recognition, and Computer Vision
• Synopsys Responds to the UK Competition and Markets Authority Provisionally Accepting its Proposed Remedies in Phase 1 Regarding its Proposed Acquisition of Ansys
• Ansys and Synopsys Announce Agreement with Keysight Technologies for Sale of Ansys PowerArtist
• Ceva Powers Oritek's Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles
• Silicon Photonics Pioneer CEA-Leti Will Unveil Major R&D Gains At Photonics West Jan. 25-30
• Cadence: Leading the EDA Industry with AI-Powered Platforms
• Samsung invests in neural sensor startup Pison
• Chiplet technology and advanced SoCs are shaping the future of software-defined vehicles

Tuesday, January 7, 2025

• Secure-IC's worldwide leading safe & secure automotive solutions achieve a new breakthrough: Securyzrâ„¢ S700 neo series reach ASIL-D grade

Tuesday, January 7, 2025

• Siemens launches new program to empower startups with cutting-edge technology

Monday, January 6, 2025

• Qualitas Semiconductor Secures Multiple Project Licensing Agreements with Pansemi Following Successful Initial Collaboration
• GUC Taped Out UCIe 40Gbps IP using Adaptive Voltage Scaling (AVS)
• UMC Reports Sales for December 2024
• Qualitas Semiconductor Secures Multiple Project Licensing Agreements with Pansemi Following Successful Initial Collaboration
• GUC Taped Out UCIe 40Gbps IP using Adaptive Voltage Scaling (AVS)
• UMC Reports Sales for December 2024
• Secure-IC's worldwide leading safe & secure automotive solutions achieve a new breakthrough: Securyzr™ S700 neo series reach ASIL-D grade
• QuickLogic Announces Strategic Process for SensiML
• Ceva Embedded AI NPUs Gain Traction in AIoT and MCU Markets, with Multiple Customer Wins and Enhanced AI Software Studio
• Ceva Expands Embedded AI NPU Ecosystem with New Partnerships That Accelerate Time-to-Market for Smart Edge Devices
• Nvidia and TSMC team up on a silicon photonics chip prototype

Sunday, January 5, 2025

• Is Imagination Technologies for sale again?
• Samsung's New 2025 Monitors Bring AI Capabilities, Gaming Performance and Enhanced Productivity to CES
• GUC Monthly Sales Report - December 2024
• GlobalFoundries and IBM Announce Settlement and Resolution of All Litigation Matters
• Flash Memory LDPC Decoder IP Core Available For Integration From Global IP Core
• CXL Update Emphasizes Security
• Ceva Wi-Fi 6 and Bluetooth IPs Power Bestechnic's New Combo Products
• MediaTek and Ceva Collaborate for More Immersive Spatial Audio Mobile Entertainment Experience
• Quantum Motion Announces Partnership with Semiconductor Manufacturer GlobalFoundries
• Siemens unveils breakthrough innovations in industrial AI and digital twin technology at CES 2025
• Samsung Expands 'AI for All' Vision at CES 2025 To Bring AI Everyday, Everywhere
• RISC-V in AI and HPC Part 1: Per Aspera Ad Astra?
• Is Imagination Technologies for sale again?
• Samsung's New 2025 Monitors Bring AI Capabilities, Gaming Performance and Enhanced Productivity to CES
• GUC Monthly Sales Report - December 2024
• GlobalFoundries and IBM Announce Settlement and Resolution of All Litigation Matters
• Flash Memory LDPC Decoder IP Core Available For Integration From Global IP Core
• CXL Update Emphasizes Security
• Ceva Wi-Fi 6 and Bluetooth IPs Power Bestechnic's New Combo Products
• MediaTek and Ceva Collaborate for More Immersive Spatial Audio Mobile Entertainment Experience

Friday, January 3, 2025

• Intel Is Raining Edge AI Processors at CES 2025

Thursday, January 2, 2025

• Ansys to Demonstrate Solutions that Power Next-Generation Mobility Technology at CES 2025
• Sustainable PCB Manufacturing: Eco-Friendly Materials and Practices
• TSMC To Lose Qualcomm's 2nm Chip Business To Samsung, Potentially Avoiding Higher Costs And Overcoming Production Hurdles
• Cadence Announces Fourth Quarter and Fiscal Year 2024 Financial Results Webcast
• Siemens Xcelerator: Eplan and Siemens Enable Data Interoperability in Machine Engineering

Wednesday, January 1, 2025

• Weebit Nano licenses its ReRAM technology to onsemi
• Ceva Unveils Ceva-Waves Links200 - A Breakthrough Multi-Protocol Wireless Connectivity Platform IP Featuring Next generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4
• Softbank Izanagi AI processor expected next year
• HDMI 2.2 confirmed to launch at CES 2025
• Silvaco To Present at the 27th Annual Needham Growth Conference
• Industry Weighs in With 2025 Forecasts Company Predictions
• TSMC sets up 2nm pilot line with production due to start in 2026