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Monday, May 18, 2026

• Bangladesh hosts semiconductor roadshow in South Korea
• RISC-V IP Cores: Built for functional safety (ASIL-B/D), high performance, and low power operation for automotive and industrial applications.
• Gov't to invest $113.3 mil. in strategic materials firms
• SEMI and semiconductor companies call for extended investment credit
• SEMIFIVE Reports 137% YoY Revenue Growth in Q1 2026, Accelerating Its Rise as a Key Global Player in AI ASIC
• TSMC forecasts $1.5 trillion global chip market by 2030
• Celebrating 4 Incredible Years Together at BOS Semiconductors
• SkyeChip Berhad IPO: In-Depth Analysis of Malaysia’s Latest Semiconductor Listing
• Automotive silicon in the era of AI, functional safety, and cybersecurity
• Synopsys Achieves First ISO/PAS 8800 Certification for AI-Driven Automotive Systems
• Smallest.ai and Tenstorrent Partnership Democratises Voice AI - 4x reduction in cost through hardware acceleration
• Tenstorrent Unveils TT-QuietBox 2, the First RISC-V AI Workstation With a Fully Open-Source Stack to Deliver Teraflop-Class Inference
• Niuxin's domestic advanced process DDR5/LPDDR5 IPs have both achieved a breakthrough of 6400Mbps.
• The next EDA wave: Lessons from DATE 2026
• MIPI Alliance Launches Physical AI Birds of a Feather (BoF) Group Focused on Humanoids
• Keysight and SRC UK Collaborate to Advance EW Modernization with Advanced Test and Simulation
• IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
• UMC Announces Release of 14nm eHV FinFET Platform, Advancing Innovation in Next-Generation Smartphone Displays

Friday, May 15, 2026

• IC Manage GDP-AI Transforms IP Lifecycle Management with Generative and Agentic AI

Thursday, May 14, 2026

• Korean economy projected to expand 2.5% in 2026 on chips: KDI
• TSMC Board of Directors Meeting Resolutions
• eMemory Technology Inc (ROCO:3529) Q1 2026 Earnings Call Highlights: Record Revenue Growth and Strategic Expansion
• QuickLogic Announces New Seven-Figure FPGA Hard IP Contract
• HighTec EDV-Systeme and SiFive: Together strengthening the RISC-V Ecosystem for Safe and Secure Automotive and Industrial Applications
• SiFive Sets New Bar for High-Performance RISC-V with Third-Generation Performance P550 and P570 IP
• OSYX Technologies and Andes Technology Announce Strategic Collaboration on RISC-V Virtualization
• CEA-Leti Platform Offers Chipmakers Nanometre- Scale Strain Mapping
• Siemens democratizes EDA software access for European electronics industry through the Chips JU European Chips Design Platform (EuroCDP) project
• Siemens unveils AI-powered library characterization to accelerate semiconductor design
• LTSCT Expands Advanced Power Design Capabilities with Synopsys
• Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing
• TES Electronic Solutions GmbH is extending its on-chip sensor IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.

Wednesday, May 13, 2026

• Ceva Advances Full-Stack Wireless Vision with Next Generation Bluetooth High Data Throughput and Integrated RF Design Win

Tuesday, May 12, 2026

• EXTOLL announces Availability of Industry´s first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
• Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency
• Chips&Media Completes Development of Next-Gen 'AV2' HW Decoder IP

Monday, May 11, 2026

• SEMIFIVE and ICY Tech Achieve Successful Tape-out of 8nm eMRAM-Based Edge AI SoC, Targeting First Commercialization in Asia
• LPDDR5/LPDDR4X PHY & Controller IP Core in 12FFC Licensed by Tier-1 U.S. Semiconductor Customer
• Malaysia launches advanced semiconductor packaging push to climb global value chain
• UK Semiconductor Centre appoints first CEO
• Intel plans to expand semiconductor investment in Vietnam
• European electronic components market returns to growth amid uneven recovery
• Neuron IP was awarded the 2026 Startup of the Year at the CHIPS NORTH Executive Summit in Ottawa, held May 4–5, 2026, recognizing their innovation in semiconductor technology.
• After GPUs, CPUs Take Center Stage as Intel Rally Lifts KOSDAQ Stocks
• NVIDIA and Corning partner on AI photonics expansion
• Renesas Completes Acquisition of Irida Labs to Expand Vision AI Software Capabilities and Accelerates System-Level Vision Solutions
• Nvidia Enters the Scene. Behind the $400 Million in Financing, RISC-V Ushered in Spring
• HighTec EDV-Systeme and SiFive: Together strengthening the RISC-V Ecosystem for Safe and Secure Automotive and Industrial Applications
• GlobalFoundries Outlines Long-Term Growth Roadmap and Announces First-Ever Dividend at 2026 Investor Day
• Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership

Thursday, May 7, 2026

• Siemens and Xometry partner to bring expanded AI-native supply chain intelligence to Siemens Xcelerator
• Accelerate Your Innovation: Why FPGA System on Modules (SoMs) Are the Strategic Choice
• Semidynamics and SiPearl Announce Strategic Cooperation to Develop EU-Sovereign Rack-Scale AI Compute Platform
• AI demand reshapes semiconductor capacity and intensifies supply chain competition
• Lenovo’s New ThinkPad Headset Uses Ceva Spatial Audio to Make Entertainment Content More Immersive and Drive All-Day Use
• Keysight and CATARC New Energy Vehicle Inspection Center Expand Strategic Collaboration to Advance Charging Test Technologies
• Fraunhofer IIS tests high bandwidths for non terrestrial networks (NTN)
• AI drives photonics innovation
• European scientists turn to light to halt internet energy crisis
• Infineon once again listed as a global leader in sustainability Read more at: https://www.bisinfotech.com/infineon-once-again-listed-as-a-global-leader-in-sustainability/
• QuickLogic to Showcase EOS™ S3 and eFPGA Solutions at Sensors Converge
• Omni Design Technologies Steps Up European Hiring and Advanced Data Center IP Push
• Analysts bullish on SkyeChip ahead of IPO, upside seen at up to 91%
• The Next Phase of Europe’s Semiconductor Strategy
• Global Semiconductor Sales Increase 25% from Q4 2025 to Q1 2026
• European Processor Initiative finishes second stage
• Nvidia Enters the Scene. Behind the $400 Million in Financing, RISC-V Ushered in Spring
• Why Codasip went all‑in on CHERI
• Keysight Expands PCIe® 7.0 Test Portfolio with New Receiver Stress Calibration
• SEMI ESD Alliance 2026 Executive Outlook Explores How Agentic AI Will Change Chip Design and Verification
• GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
• Apple Considers Samsung and Intel Foundries to Reduce Reliance on TSMC
• TSMC pushes next-gen chip expansion while Samsung grapples with union

Wednesday, May 6, 2026

• Rambus Introduces PCIe® 7.0 Switch IP with Time Division Multiplexing for Scalable AI and Data Center Infrastructure
• Siemens hardware-assisted verification validates Arm AGI CPU for scalable agentic AI