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Monday, October 3, 2022

• SEGGER and Cadence team up to add native J-Link support for Cadence Tensilica cores
• Nobel prize awarded for quantum entanglement
• EuroHPC JU Selects 6 Sites Across the EU for Quantum Computers
• Capgemini fuels collaboration with Panasonic Automotive Systems Company of America through transformative new data platform
• QuickLogic Partners with ChipMotion for eFPGA Implementations in SoC Designs
• Synopsys Expands Code Sight Standard Edition with IntelliJ Support
• Siemens' Aprisa digital implementation solution certified for Samsung Foundry's advanced 4nm processes
• Global Semiconductor Sales Increase 0.1% Year-to-Year in August
• EU chip plan would cost €500bn, says NXP CEO
• Samsung Foundry Certifies Cadence Voltus-XFi Custom Power Integrity Solution for 5LPE Process Technology
• Cadence and Samsung Foundry Collaborate to Certify RFIC Design Reference Flow on 8nm Process Technology

Monday, October 3, 2022

• Vidatronic Unveils OmniPOWERâ„¢ Distributed Power Systems Available for Licensing in FinFET Technologies

Monday, October 3, 2022

• easics launches nearbAIâ„¢ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences

Sunday, October 2, 2022

• Synopsys Unified Platform Tackles Verification Requirements
• SEMIFIVE Announces New 5nm HPC SoC Platform
• Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022, SEMI Reports
• Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs
• Siemens' Calibre platform now certified for Samsung's advanced 3nm process technology
• Mobileye files for IPO, reveals data
• Introducing superfast serial interfacing with JESD204B Tx - Rx PHY IP Cores in 12nm, 28nm and 40nm for all type of ADC/DAC and ASIC/FPGA connections

Saturday, October 1, 2022

• RF Module Eyes IoT Networking Using Satellite Comms

Friday, September 30, 2022

• Veridify Security Announces Commitment to Global Cybersecurity Success, Becomes a Cybersecurity Awareness Month 2022 Champion

Thursday, September 29, 2022

• Soitec Sees Big Opportunity in EVs with SmartSiC Wafers
• Intel Tackles Next-gen Computing with Quantum and Neuromorphic Innovations
• Wafer Makers Continue to Aggressively Expand Facilities
• Vidatronic Unveils OmniPOWER™ Distributed Power Systems Available for Licensing in FinFET Technologies

Thursday, September 29, 2022

• S2C Releases Neuroâ„¢ - Advanced Prototype Resource Management Software

Wednesday, September 28, 2022

• Foundry data shows the cracks in the semiconductor market
• S2C Releases Neuro™ - Advanced Prototype Resource Management Software
• Silicon Catalyst Announces POLYN Technology as Newest Company Admitted to Semiconductor Incubator
• Supply Chain Experts Weigh In on CHIPS Act
• SEGGER licenses C++ runtime library to SiFive for code size and performance efficiency
• AI "unicorn" Graphcore set to cut jobs
• Renesas Expands RZ/V Series with Built-in Vision AI Accelerator for Accurate Image Recognition and Multi-Camera Image Support
• Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA
• easics launches nearbAI™ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences

Tuesday, September 27, 2022

• Auto and Industrial keep foundry revenue growing
• Intel Accelerates Developer Innovation with Open, Software-First Approach
• Peking University released the first open-source dataset for machine learning applications in fast chip design
• Moving from SoCs to Chiplets Could Help Extend Moore's Law
• Samsung, Intel, TSMC confirm alliance in next-gen "chiplet" technology
• Automotive IC Marketshare Seen Rising to 10% by 2026
• Valens Semiconductor Collaborates with Intel to Boost Automotive MIPI A-PHY Implementations

Tuesday, September 27, 2022

• Vidatronic to Exhibit at Samsung Foundry Forum and SAFEâ„¢ Forum in San Jose in October

Monday, September 26, 2022

• Will Samsung join Arm's US listing process?
• European plugfest for MIPI I3C spec
• Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time
• U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification
• SiFive and ProvenRun Collaborate to deliver Best-in-Class Security for RISC-V Microprocessors
• Imagination and Baidu PaddlePaddle create open-source machine learning library for Model Zoo
• Arm announces new Board Members and new Chief Financial Officer
• Renesas Launches Integrated Development Environment That Enables ECU-Level Automotive Software Development Without Hardware
• Chips&Media Expands to New Markets such as Autonomous Vehicles
• PUFsecurity's Crypto Coprocessor PUFcc is PSA Certified Level 2 Ready

Monday, September 26, 2022

• QuiX Quantum wins €14 million contract with the German Aerospace Center to deliver a Universal Quantum Computer

Sunday, September 25, 2022

• VinFast and Renesas Sign Strategic Partnership to Advance Automobile Technology
• Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution
• HDMI 2.0 Tx PHY and Controller IP Cores is available with Source Code license (Unlimited use with modification rights)
• CXL Spec Grows, Absorbs Others to Collate Ecosystem
• GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V
• QuiX Quantum wins €14 million contract with the German Aerospace Center to deliver a Universal Quantum Computer

Thursday, September 22, 2022

• ST, CAES team on octacore RISC-V space chip with selectable cores
• Bosch plans acquisition of Radio Frequency specialist ItoM
• Functional Safety Certification Packages for Microchip FPGAs Speed Time to Market
• CAES Wins Contracts for Development of Next-Generation, Octa-Core, user-selectable CPU for Space

Thursday, September 22, 2022

• Split manufacturing for trustworthy electronics "Made in Germany"

Wednesday, September 21, 2022

• Arm Is The New RISC/Unix, RISC-V Is The New Arm
• Split manufacturing for trustworthy electronics
• Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks
• Flex Logix Selects Semifore for Advanced Inference Chip Design
• Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October
• IPrium releases IEEE 802.11n/ac/ax LDPC Encoder and Decoder
• Siemens collaborates with UMC to develop 3D integrated circuit hybrid-bonding workflow
• Inuitive launches NU4100, expanding its Edge-AI Vision-on-Chip IC portfolio