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Saturday, February 25, 2023

• Intel and partners have introduced a "green PC" – it's 90% recyclable
• Arm's Growing Cloud Server Momentum

Thursday, February 23, 2023

• Eyes on Hera with Faintstar2 detector chip

Thursday, February 23, 2023

• Synopsys Initiates $300 Million Accelerated Share Repurchase Agreement

Wednesday, February 22, 2023

• Intel CEO Sees 'Green Shoots' Emerging
• EQUALITY consortium selected by the EU's Horizon Europe Program to develop quantum algorithms for industrial applications
• Ventana Micro Selects Imperas Solutions for RISC-V Processor Verification
• M31 earned NT$12.16 per share in 2022 and approved dividend of NT$8 in cash and NT$1 equivalent in stock
• Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller
• Startup AiM Future Set to Commercialize LG's AI IP
• Intrinsic ID to Showcase its Expanding Line of Security Solutions at Embedded World 2023
• CEVA Announces its Most Powerful and Efficient DSP Architecture to Date, Addressing the Massive Compute Requirements of 5G-Advanced and Beyond
• Secure-IC & Trasna are introducing a revolutionary PUF solution that eliminates the need of enrollment phase

Tuesday, February 21, 2023

• Veriest Solutions to Present Two Verification Papers at DVCon US Conference
• Amid an Uncertain US Fab Market, TI Announces 300mm Wafer Fab in Utah
• Socionext Introduces New 7nm ADC and DAC for 5G Direct RF Transmitters and Receivers
• Renesas develops technologies for automotive gateway SoCs
• Pushing the System-in-Package Concept Into the Future
• Pleora Scores a 10 with New High-Performance GigE Vision Embedded Interface
• Arteris Unveils Next-Generation FlexNoC 5 Physically Aware Network-on-Chip IP

Tuesday, February 21, 2023

• Low power PLL for short-range mmwave industrial radar

Monday, February 20, 2023

• China dominates semiconductor patent activity
• Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller
• CEVA, Inc. Announces Inducement Award in Connection with Appointment of Amir Panush as Chief Executive Officer
• Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller
• Qualinx Raises €8 Million to Bring Game-Changing Digital RF Technology to Market
• Non-Volatile Memory: What Will 2023 Bring?
• Faraday Reports Record-High Revenue and Net Income for Full-Year 2022
• Qualinx Raises €8 Million to Bring Game-Changing Digital RF Technology to Market

Sunday, February 19, 2023

• Arctic Semiconductor Ships Its First 5G RF Chipset, IceWings, for the 5G Market
• Weebit Nano to demonstrate new silicon at Embedded World 2023
• Cadence Delivers 13 New VIP and Expands System VIP Portfolio to Accelerate Automotive, Hyperscale Data Center and Mobile SoC Verification
• Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
• Arm China profit falls 90%
• 12bit 5Gsps Current Steering DAC IP Core for Highspeed Communication and Automotive SoCs is available for immediate licensing
• ESA and UK Space Agency back EnSilica to develop satellite broadband chip

Friday, February 17, 2023

• Verification IP for chiplet designs

Thursday, February 16, 2023

• Infineon begins construction of new plant in Dresden
• Accurate Positioning Systems and Proximity Solutions with CoreHW Bluetooth® AoA and AoD Antenna Modules

Wednesday, February 15, 2023

• Imec Digs Deeper Into ChipmakingÂ’s Sustainability Issue
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2023
• Oculi Forms strategic partnership with GlobalFoundries to advance edge sensing technology
• embedded world 2023: Codasip presents on custom compute and RISC-V design
• Tachyum Validates Prodigy Universal Processor with Kubernetes for High-Performance, High-Density Computing for Containers
• Cadence Reports Fourth Quarter and Fiscal Year 2022 Financial Results
• NIST Selects "Lightweight Cryptography" Algorithms to Protect Small Devices
• The Six Semiconductor of OPENEDGES Technology Collaborates with imec.IC-link US to Tape-out Two 7nm Testchip

Tuesday, February 14, 2023

• CEVA, Inc. Announces Fourth Quarter and Full Year 2022 Financial Results
• Intrinsic ID Protects 500,000,000 Devices Globally: Leading the Way in Secure and Authenticated Connected Devices
• Andes And IAR Systems Together Enable Leading Vendor ILITEK To Accelerate The Development Of Its ISO 26262 Ready TDDI SoC ILI6600A

Monday, February 13, 2023

• Industry First PCI Express® 6.0 and CXL Interposer Improves Data Captures for Speeds up to 64 GT/s
• Arm China lays off 14% of staff
• Xiphera and Muspark Technologies announce a partnership to enter the Indian technology market
• intoPIX showcases its new JPEG XS solutions to simplify IP video production workflow at HPA Tech Retreat 2023