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Monday, October 3, 2022
SEGGER and Cadence team up to add native J-Link support for Cadence Tensilica cores
Nobel prize awarded for quantum entanglement
EuroHPC JU Selects 6 Sites Across the EU for Quantum Computers
Capgemini fuels collaboration with Panasonic Automotive Systems Company of America through transformative new data platform
QuickLogic Partners with ChipMotion for eFPGA Implementations in SoC Designs
Synopsys Expands Code Sight Standard Edition with IntelliJ Support
Siemens' Aprisa digital implementation solution certified for Samsung Foundry's advanced 4nm processes
Global Semiconductor Sales Increase 0.1% Year-to-Year in August
EU chip plan would cost €500bn, says NXP CEO
Samsung Foundry Certifies Cadence Voltus-XFi Custom Power Integrity Solution for 5LPE Process Technology
Cadence and Samsung Foundry Collaborate to Certify RFIC Design Reference Flow on 8nm Process Technology
Monday, October 3, 2022
Vidatronic Unveils OmniPOWERâ„¢ Distributed Power Systems Available for Licensing in FinFET Technologies
Monday, October 3, 2022
easics launches nearbAIâ„¢ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences
Sunday, October 2, 2022
Synopsys Unified Platform Tackles Verification Requirements
SEMIFIVE Announces New 5nm HPC SoC Platform
Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022, SEMI Reports
Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs
Siemens' Calibre platform now certified for Samsung's advanced 3nm process technology
Mobileye files for IPO, reveals data
Introducing superfast serial interfacing with JESD204B Tx - Rx PHY IP Cores in 12nm, 28nm and 40nm for all type of ADC/DAC and ASIC/FPGA connections
Saturday, October 1, 2022
RF Module Eyes IoT Networking Using Satellite Comms
Friday, September 30, 2022
Veridify Security Announces Commitment to Global Cybersecurity Success, Becomes a Cybersecurity Awareness Month 2022 Champion
Thursday, September 29, 2022
Soitec Sees Big Opportunity in EVs with SmartSiC Wafers
Intel Tackles Next-gen Computing with Quantum and Neuromorphic Innovations
Wafer Makers Continue to Aggressively Expand Facilities
Vidatronic Unveils OmniPOWER™ Distributed Power Systems Available for Licensing in FinFET Technologies
Thursday, September 29, 2022
S2C Releases Neuroâ„¢ - Advanced Prototype Resource Management Software
Wednesday, September 28, 2022
Foundry data shows the cracks in the semiconductor market
S2C Releases Neuro™ - Advanced Prototype Resource Management Software
Silicon Catalyst Announces POLYN Technology as Newest Company Admitted to Semiconductor Incubator
Supply Chain Experts Weigh In on CHIPS Act
SEGGER licenses C++ runtime library to SiFive for code size and performance efficiency
AI "unicorn" Graphcore set to cut jobs
Renesas Expands RZ/V Series with Built-in Vision AI Accelerator for Accurate Image Recognition and Multi-Camera Image Support
Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA
easics launches nearbAI™ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences
Tuesday, September 27, 2022
Auto and Industrial keep foundry revenue growing
Intel Accelerates Developer Innovation with Open, Software-First Approach
Peking University released the first open-source dataset for machine learning applications in fast chip design
Moving from SoCs to Chiplets Could Help Extend Moore's Law
Samsung, Intel, TSMC confirm alliance in next-gen "chiplet" technology
Automotive IC Marketshare Seen Rising to 10% by 2026
Valens Semiconductor Collaborates with Intel to Boost Automotive MIPI A-PHY Implementations
Tuesday, September 27, 2022
Vidatronic to Exhibit at Samsung Foundry Forum and SAFEâ„¢ Forum in San Jose in October
Monday, September 26, 2022
Will Samsung join Arm's US listing process?
European plugfest for MIPI I3C spec
Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time
U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification
SiFive and ProvenRun Collaborate to deliver Best-in-Class Security for RISC-V Microprocessors
Imagination and Baidu PaddlePaddle create open-source machine learning library for Model Zoo
Arm announces new Board Members and new Chief Financial Officer
Renesas Launches Integrated Development Environment That Enables ECU-Level Automotive Software Development Without Hardware
Chips&Media Expands to New Markets such as Autonomous Vehicles
PUFsecurity's Crypto Coprocessor PUFcc is PSA Certified Level 2 Ready
Monday, September 26, 2022
QuiX Quantum wins €14 million contract with the German Aerospace Center to deliver a Universal Quantum Computer
Sunday, September 25, 2022
VinFast and Renesas Sign Strategic Partnership to Advance Automobile Technology
Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution
HDMI 2.0 Tx PHY and Controller IP Cores is available with Source Code license (Unlimited use with modification rights)
CXL Spec Grows, Absorbs Others to Collate Ecosystem
GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V
QuiX Quantum wins €14 million contract with the German Aerospace Center to deliver a Universal Quantum Computer
Thursday, September 22, 2022
ST, CAES team on octacore RISC-V space chip with selectable cores
Bosch plans acquisition of Radio Frequency specialist ItoM
Functional Safety Certification Packages for Microchip FPGAs Speed Time to Market
CAES Wins Contracts for Development of Next-Generation, Octa-Core, user-selectable CPU for Space
Thursday, September 22, 2022
Split manufacturing for trustworthy electronics "Made in Germany"
Wednesday, September 21, 2022
Arm Is The New RISC/Unix, RISC-V Is The New Arm
Split manufacturing for trustworthy electronics
Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks
Flex Logix Selects Semifore for Advanced Inference Chip Design
Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October
IPrium releases IEEE 802.11n/ac/ax LDPC Encoder and Decoder
Siemens collaborates with UMC to develop 3D integrated circuit hybrid-bonding workflow
Inuitive launches NU4100, expanding its Edge-AI Vision-on-Chip IC portfolio
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