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Saturday, February 11, 2023

• Secure Optical Data Communication Using Quantum Cryptography and Li-Fi

Thursday, February 9, 2023

• AI Must Be Secured at the Silicon Level
• Sharp, Motorola Mobility, and Kyocera Join Access Advance's HEVC Advance Patent Pool as Licensees
• Andes Technology: Stepping into the 18th Year with Perseverance and Proud Accomplishments
• indie to Acquire GEO Semiconductor
• GlobalFoundries and GM Announce Long-Term Direct Supply Agreement for U.S. Production of Semiconductor Chips

Wednesday, February 8, 2023

• The Value of Semiconductor Packaging Technology in the Era of Heterogeneous Integration
• Rambus Reports Fourth Quarter and Fiscal Year 2022 Financial Results
• SMIC Reports 2022 Fourth Quarter Results
• Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs
• GlobalFoundries Acquires Renesas' Non-Volatile Resistive RAM Technology to Proliferate IoT and 5G Applications

Tuesday, February 7, 2023

• Fabless FPGA/eFPGA Players Ramp up Their Innovations–a Roundup
• Fixing security threat with post-quantum crypto on eFPGA
• Could RISC-V become a force in high performance computing?
• Embedded World 2023: Logic Fruit Technologies to Unveil Cutting-Edge Technology Solutions
• BrainChip partners with Al Labs on application development
• Could RISC-V become a force in high performance computing?
• Samsung Electronics Establishes LCA Verification on Product Carbon Footprint of Its Semiconductor Business
• HARMAN and proteanTecs Collaborate to Advance Predictive and Preventive Maintenance for Automotive Electronics
• ShortLink AB joins X-FAB's Design & Supply Chain Partner Network and IP Portal

Tuesday, February 7, 2023

• QuickLogic Drives eFPGA Innovation with New Auroraâ„¢ Development Tool Suite

Monday, February 6, 2023

• Arm results shine bright in SoftBank mire
• Rambus Spins 6.4 GT/s DDR5 Registering Clock Driver for Speedier Servers
• Worldwide Silicon Wafer Shipments and Revenue Set New Records in 2022, SEMI Reports
• AI-designed Chips Reach Scale with First 100 Commercial Tape-outs Using Synopsys Technology
• Arm Q3 FY22 financial results
• QuickLogic Drives eFPGA Innovation with New Aurora™ Development Tool Suite
• ZeroPoint Technologies raises EUR 3.2 million in seed funding to reduce energy consumption of data centers by more than 25%

Sunday, February 5, 2023

• Quantum-safe identities for a digital future
• What will TSMC do next?
• Aldec Releases Automated Static Linting and CDC Analysis for Microchip FPGA and SoC FPGA Designs
• Denying China IC Manufacturing Tools
• U.S. Ban on Huawei Seen Widening China Chip War
• Global Semiconductor Sales Increase 3.2% in 2022 Despite Second-Half Slowdown
• DVB-RCS2 Turbo Decoder and Encoder IP Core Available For Integration From Global IP Core
• GreenWaves Technologies announces a €20M financing
• UMC Reports Sales for January 2023
• Gartner Says Top 10 Semiconductor Buyers Decreased Chip Spending by 7.6% in 2022
• GUC Monthly Sales Report - January 2023
• Peripheral IPs with proven automotive compatibility are instantly licensable for extremely reliable performance.

Saturday, February 4, 2023

• TSMC opens up 7nm FINFET process to universities

Wednesday, February 1, 2023

• Single-Event Transient Study of 28 nm UTBB-FDSOI Technology Using Pulsed Laser Mapping
• Gartner Highlights Top Trends Impacting Technology Providers Through 2025
• Why embedded IoT benefits from software portability
• GreenWaves Technologies announces a €20M financing
• Xfuse, LLC Phoenix ISP Now Available as a Download for AMD Kria KV260 Vision AI Starter Kit
• Rambus Delivers 6400 MT/s DDR5 Registering Clock Driver to Advance Server Memory Performance

Tuesday, January 31, 2023

• Perfecto by Perforce Releases 2023 State of Test Automation Report
• 4 articles CIOs should read about open source in 2023
• Rambus ups DDR5 data rate and bandwidth by 33%
• UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

Tuesday, January 31, 2023

• Andes Technology Unveils The AndesCore® AX60 Series, An Out-Of-Order Superscalar Multicore RISC-V Processor Family

Monday, January 30, 2023

• Weebit looks forward to first revenue in 2023
• Intel Terminates RISC-V Development Project: What Happened?
• TSMC Joins Hands with Apple and Sony to Keep Samsung in Check
• QuickLogic Partners with Andes Technology for eFPGA Joint Promotion
• Siemens advances integrated circuit verification with new, data-driven Questa Verification IQ software
• Tachyum Successfully Runs UEFI on Prodigy FPGA
• Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution
• Hardware Root of Trust: The Key to IoT Security in Smart Homes
• Faraday Announces Multi-site Manufacturing Support in ASIC