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Tuesday, December 28, 2021

• 3Q21 Revenue of Global Top 10 Fabless Companies Hits $33.7B
• Siemens mPower Solution Now Certified for TSMC's N7 and N5 Nodes
• TSMC reportedly getting everything lined up for 2nm production in 2025

Monday, December 27, 2021

• Edge Computing, AI, and the Cloud
• Leti proposes FD-SOI spin qubit platform for quantum computing

Sunday, December 26, 2021

• Arm CPUs Make Gains in Data Centers
• Access Advance Welcomes Microsoft as a Licensor and Licensee of the HEVC Advance Patent Pool
• GlobalFoundries Announces Extension of AMD Wafer Supply Agreement to Guarantee Supply

Wednesday, December 22, 2021

• Despite Withdrawals, CES Organizers Push on With 2022 Show

Tuesday, December 21, 2021

• A Novel Machine-Learning based SoC Performance Monitoring Methodology under Wide-Range PVT Variations with Unknown Critical Paths
• CAES developing 16-core RISC-V based microprocessor for space
• Synopsys Chosen by Juniper Networks to Accelerate Development of Photonic ICs for Next-Gen Data Centers
• Successful conclusion of European Processor Initiative Phase One
• First Open Wi-Fi 'HaLow' development platform
• Weebit Nano receives first silicon demonstration wafers integrating its embedded ReRAM module
• The European Space Agency (ESA) has awarded a contract to CAES, in the frame of the ARTES Competitiveness & Growth programme, to develop System-on-Chip for space applications
• Kneron Announces $25 Million Funding To Advance Smart City Technology For Auto

Monday, December 20, 2021

• 17 Semiconductor Companies Forecast to Have >$10B Sales in 2021
• Interview with the CEO at Silex Insight - Michel Van Maercke
• Renesas Completes Acquisition of Celeno
• 17 Semiconductor Companies Forecast to Have >$10.0 Billion in Sales This Year
• Real Intent Joins DARPA Toolbox Initiative to Provide Mil/Aero/Defense Grade Static Sign-Off
• North American Semiconductor Equipment Industry Posts November 2021 Billings

Sunday, December 19, 2021

• SiPearl awarded a €17.5M funding from the EIC Accelerator program
• Intel CEO Says Chip Shortage To Last Until 2023
• UK doubles venture capital investment in tech
• Taiwan approves TSMC fab investment plan in Japan
• Teledatics Introduces World's First Open Wi-Fi "HaLow" Development Platform
• Imagination's Series3NX neural network accelerator helps UNISOC to create 5G smartphone platform
• Teledatics Introduces World's First Open Wi-Fi
• Creonic GmbH is Heavily Invested in the Expansion and Research of 6G Technologies
• SiPearl awarded a ?17.5M funding from the EIC Accelerator program
• Imagination appoints Carol Chesney to board as non-executive director
• Hardent VESA DSC IP Cores Licensed by Teledyne LeCroy for DisplayPort Test Solution
• PCIe 5.0 & PCIe 4.0 PHYs and Controller IP Cores are available for immediate licensing to maximize your Interface speed for complex SoCs

Thursday, December 16, 2021

• Kandou Closes $75 Million in Series D Funding
• Gowin Automotive-grade FPGAs Pass SAIC's 2500h Heat Resistance Tests
• TSMC Introduces N4X Process