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Tuesday, November 30, 2021

• videantis achieves Automotive SPICE Level 2 certification
• Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud
• Arteris Announces Financial Results for the Third Quarter 2021 and Estimated Fourth Quarter and Full Year 2021 Guidance
• Agnisys Delivers Novel AI Technology and FPGA Support for IP and SoC Specification Automation
• First SoC ever to pass CC EAL5+ certification thanks to Tiempo Secure TESIC Secure Element IP
• Flex Logix Joins the Edge AI and Vision Alliance
• LeapMind Announces Efficiera v2 Ultra-Low Power AI Inference Accelerator IP
• Arasan Chip Systems announces Immediate availability of MIPI I3C PHY I/O IP

Monday, November 29, 2021

• Siemens Bags Three TSMC OIP Partner of the Year Awards for Next-gen Design Enablement
• Siemens Expands Collaboration with AWS to Facilitate Cloud-Based Digital Transformation for Industry
• Soitec and Mersen announce strategic partnership to develop new silicon carbide (SiC) substrates for the electric vehicle market
• Nvidia reportedly using TSMC N5 node for GeForce RTX 4000 Series
• IAR Systems and Codasip collaborate to enable low-power RISC-V based applications
• Key ASIC Signed LOI to Acquire Wafer FAB in The US
• Micron and UMC Announce Global Settlement
• CEO interview: Minima's Tuomas Hollman on why static timing sign-off is over
• USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP cores with Superfast speed and High-power efficiency for lag-less data processing is Silicon Proven and available in 8nm LPP for licensing
• MIPS selects Imperas Reference Models for RISC-V Processor Verification

Sunday, November 28, 2021

• Silicon Catalyst Partners with Sony Semiconductor Solutions to Accelerate Semiconductor Startups
• Synopsys Expands Use of AI to Optimize Samsung's Latest Mobile Designs
• intoPIX Unveils "TicoXS FIP" During its ProAV Virtual Event This Week
• Profile of a traceability tool promising automation in SoC designs

Thursday, November 25, 2021

• First RISC-V smartphones could launch in 2022

Wednesday, November 24, 2021

• WiLAN Subsidiary Acquires Wired Connectivity Patent Portfolio
• North American Semiconductor Equipment Industry Posts October 2021 Billings
• GPU shipments increase year-over-year in Q3
• SynSense and Prophesee partner to combine neuromorphic engineering expertise for developing one-chip event-based smart sensing solution for ultra-low power edge-AI
• Samsung Selects Texas as Site for $17 Billion Fab
• Siemens receives three 2021 TSMC OIP Partner of the Year awards for next-generation design enablement
• The Democratization of Chip Design
• AMIQ EDA Joins OpenHW Group and Contributes Linting Capabilities for CORE-V Open-Source RISC-V Cores and Testbenches

Tuesday, November 23, 2021

• SC21: Chinese Supercomputer Approaches Quantum Performance
• Samsung set to compete against TSMC with new foundry in US
• Do We Need 6G?
• Samsung choses Austin for $17bn 3nm fab
• VeriSilicon Image Signal Processor IP Achieved ISO 26262 Automotive Functional Safety Certification

Monday, November 22, 2021

• Project to reduce energy use of 5G video streaming
• Microchip Adds Second Development Tool Offering for Designers Using Its Low-Power PolarFire RISC-V SoC FPGA for Embedded Vision Applications at the Edge
• CEVA SensPro Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic)
• Grovf Inc. Releases Low Latency RDMA RoCE V2 FPGA IP Core for Smart NICs

Sunday, November 21, 2021

• CEA-Leti Spinoff Weaves RFID Chips, Raises €15m in Funding
• Codasip Adopts Imperas for RISC-V Processor Verification
• MediaTek and TSMC Unveil the World's First 7nm 8K Resolution Digital TV System-on-Chip
• Announcing superfast, HD Audio & Video through HDMI 2.0 Tx & Rx PHY & Controller IP Cores uncompressed data transfer in 28HPC+ and 12FFC!
• BrainChip Partners with MegaChips to Develop Next-Generation Edge-Based AI Solutions

Saturday, November 20, 2021

• 5 Trends Shaping the Automotive Perception Market

Thursday, November 18, 2021

• CXL Consortium Showcases First Public Demonstrations of Compute Express Link Technology at SC21
• Elmos adopts Arm Cortex-M IP for its next-generation automotive MCU based product family