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Tuesday, November 2, 2021

• Four automotive functional safety mistakes that must be avoided
• Silicon Creations Named 2021 TSMC Partner of the Year for Analog / Mixed-Signal IP
• Nextchip licenses aiMotive's aiWare4 for their Apache6 automotive domain processor
• Tessolve Joins GlobalFoundries' Design Enablement Network Program as a Design Partner to Bring Advanced Design Solutions to Accelerate Customer Product Development
• TSMC Recognizes Long-Standing Collaboration with Synopsys on Semiconductor Innovation with Multiple OIP Partner of the Year Awards
• Sondrel develops Performance Verification Environment to fast-track ASIC creation
• proteanTecs UCT Supports TSMC 3nm Process Technology to Accelerate Lifecycle Health Monitoring

Monday, November 1, 2021

• Codasip appoints Brett Cline to drive company growth worldwide
• Morse Micro Unveils Wi-Fi CERTIFIED HaLow Platform and Industry's First 8MHz Reference Design
• Wi-Fi CERTIFIED HaLow delivers long range, low power Wi-Fi
• USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP Cores for High Bandwidth, Low Power data communication in PCs, Mobiles, SSDs, and other Multimedia Devices.
• IBM and NeuReality team up to build the next generation of AI inference platforms
• Rambus Reports Third Quarter 2021 Financial Results
• DDR5 Ecosystem Ramps Up
• GlobalFoundries Announces Closing of Initial Public Offering
• Synopsys Acquires AI-Powered, Real-Time Performance Optimization Leader Concertio
• Weebit delivers its most successful quarter, achieving key business and technical milestones

Sunday, October 31, 2021

• Siemens Collaborates with TSMC on Design Tool Certifications for Advanced Technologies
• Alphawave IP Receives Prestigious 2021 TSMC OIP Partner of the Year Award for High-Speed SERDES IP
• Andes Technology Issues GDR to Be Listed on Luxembourg Stock Exchange for Expansion Plan
• M31 Technology Receives 2021 TSMC OIP Partner of the Year Award

Friday, October 29, 2021

• GlobalFoundries CEO: We're sold out of semiconductor chip capacity through 2023

Thursday, October 28, 2021

• Blue Cheetah Bunch-of-Wires (BoW) Chiplet Interface Solution Targets Rapid Flexibility, Scalability, and Low Overhead
• Annual Foundry Revenue Expected to Reach Historical High in 2022
• Cadence Extends Battery Life and Improves User Experience for Next-Generation Hearables, Wearables and Always-On Devices
• Truechip Introduces Silicon IP For Network on Chip (NoC) Focussed For Tilelink RISC-V Chips
• proteanTecs Receives 2021 TSMC OIP Partner of the Year Award
• eMemory Receives 2021 TSMC OIP Partner of the Year Award for Embedded Memory IP

Wednesday, October 27, 2021

• Samsung plans to triple foundry chip production capacity by 2026
• SiPearl: collaboration with Intel to accelerate exascale supercomputing deployment in Europe
• Faraday Reports Third Quarter 2021 Revenues at NT$2,218 Million, Up 31% QoQ
• Semiconductor Sector Shows Signs of Cooling
• S2C Delivers VU19P FPGA-based Logic Matrix LX2 - a New Benchmark in High-performance & High-density Prototyping
• Morris Chang says domestic US chip supply chain is impossible
• Rapid Silicon Announces Seed Funding of $15M
• Samsung to triple foundry capacity
• AccelerComm Announces 5G IP with O-RAN Acceleration Abstraction Layer (AAL) Interface
• Codasip Founder Karel Masarik elected to RISC-V Technical Steering Committee
• Annual Foundry Revenue Expected to Reach Historical High Once Again in 2022 with 13% YoY Increase with Chip Shortage Showing Sign of Easing
• Europe opens extended investigation into ARM-Nvidia deal
• SiFive has briefly pulled back the curtains on its most powerful Risc-V processor yet.
• GlobalFoundries Announces Pricing of Initial Public Offering
• Achronix Demonstrates Speedster7t High-Performance Interfaces
• VESA Publishes Embedded DisplayPort Standard Version 1.5

Tuesday, October 26, 2021

• Synopsys and TSMC Drive Chip Innovation with Development of Broadest IP Portfolio on TSMC N4P Process
• SD 5.1/eMMC 5.1 Host and Device Controllers with Matching PHYs for all kind of Portable Memory Storage Devices, making it easy to integrate a wide range of Applications in your products
• 5GCroCo Project Advances Cross-border Connectivity for Cars
• Renesas and wolfSSL Enable Ready-to-Use IoT Security Solutions Based on Embedded TLS Stack
• Siemens collaborates with TSMC on design tool certifications
• Samsung to finalise US fab investment
• TSMC Details The Benefits of Its N3 Node
• JEDEC Publishes Update to DDR5 SDRAM Standard Used in High-Performance Computing Applications
• TSMC Recognizes Partners of the Year at 2021 OIP Ecosystem Forum
• Xilinx and Leading Broadcast and AV System and IP Integrators Deliver Complete, Production-Ready Multimedia Streaming End-Point Solutions
• Achronix and MoSys Partner to Target 5G Wireless and Broadband Networking Acceleration
• Omni Design Announces Availability of LiDAR Receiver Subsystem
• Arteris IP Announces Pricing of Initial Public Offering
• Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies for Advanced Multi-Chiplet Designs
• Siemens collaborates with TSMC on design tool certifications for TSMC's advanced technologies and other industry milestones

Monday, October 25, 2021

• GlobalData: China Emerges as Powerhouse for AI Unicorns
• New Allwinner RISC-V Chip Uncovered on Tiny Board
• Codasip boosts custom RISC-V performance in latest tool
• Agile Analog broadens analogue IP portfolio
• Codasip boosts Studio processor design tools with AXI automation
• QuickLogic Announces First eFPGA IP From Australis IP Generator on UMC 22nm Process
• TSMC Expands Advanced Technology Leadership with N4P Process
• Analog Bits to Present Papers, Demo of N5 Working Silicon, and Roadmap on IPs for TSMC N4 and N3 Processes

Sunday, October 24, 2021

• Functional safety tools certified on RISC-V
• IAR Systems extends functional safety offering for RISC-V with leading build tools for Linux
• North American Semiconductor Equipment Industry Posts September 2021 Billings
• Crypto Quantique partners with Macronix to add ArmorFlash support to its IoT security management platform
• videantis processing platform reduces cost, increases flexibility of fail-operational systems
• ISDB-S3 Demodulator IP Core is now available for licensing to STB & TV SoC Manufacturers
• Xiphera expands its AEAD portfolio

Thursday, October 21, 2021

• Vidatronic Joins the Silicon Catalyst Semiconductor Ecosystem as an In-Kind Partner