TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
By Alan Patterson, EETimes (April 29, 2024)
Taiwan Semiconductor Manufacturing Co. (TSMC) has changed the tech leadership game with the announcement of its latest A16 chipmaking process, which analysts say may be a leap ahead of Intel’s 18A node. Analysts also told EE Times that it is unclear which company will win the process-tech championship.
The world’s leading chip foundry in April announced plans to roll out its newest process A16 chips by 2026. That process includes advanced packaging and 3D IC technologies expected to power AI innovations from TSMC’s top customers like Nvidia and AMD.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC's A16 and N2P Process Technologies
- TSMC drives A16, 3D process technology
- eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- eMemory's Security-Enhanced OTP Qualifies on TSMC N4P Process, Pushing Forward in High-Performance Leading Technology
Breaking News
- Weebit Nano Q3 FY25 Quarterly Activities Report
- Codasip launches complete exploration platform to accelerate CHERI adoption
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications