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Wednesday, March 18, 2020

• RISC-V is Here to Stay
• Data Demands Drive Co-Packaged Silicon and Optics for Switch Fabrics
• Inomize Selects Synopsys' Silicon-Proven 56G Ethernet PHY IP for High-Performance Computing and Communications SoC Design
• COVID-19 To Have Significant Effect on Worldwide Semiconductor Market in 2020, According to IDC

Tuesday, March 17, 2020

• Covid-19: The Power of Big Data and AI
• Intel Scales Neuromorphic Research System to 100 Million Neurons
• Open source of trouble: China's efforts to decouple from foreign IT technologies
• Trace and debug claim for RISC-V IP challenged by UltraSoC
• Blu Wireless announces the availability of its 60GHz mmWave evaluation kit
• New Highly Optimised LDPC Decoder in Software for Intel's FlexRAN Reference Software Will Increase Throughput by up to 3X
• TOSHIBA announced a Microcontroller employing Floadia's SONOS type Flash Memory IP "G1"
• Blu Wireless announces the availability of its 60GHz mmWave evaluation kit
• Codasip Awarded European Union Horizon 2020 Funding for Developing New RISC-V Processors

Monday, March 16, 2020

• Smart and Secure Embedded Solutions for IoT Design
• CEA-Leti Leading: Interview with CEO Emmanuel Sabonnadiere
• Chip making goes on at GlobalFoundries amid coronavirus
• Apple partner TSMC considers building powerful new chipsets in the U.S.
• Faraday Delivers System-Level ESD Protection Service to Reduce ASIC Time-to-Market
• Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput
• SiFive Launches Advanced Trace and Debug Portfolio, SiFive Insight
• Bragi and CEVA Collaborate to Redefine Hearable Devices
• SMIC Graduating from 14nm to Something Sort of Akin to 7nm
• Socionext Prototypes Low-Power AI Chip with Quantized Deep Neural Network Engine
• Cadence Elects Ita Brennan and Lewis Chew to Board of Directors

Sunday, March 15, 2020

• Covid-19 and The Success Story of Taiwan
• DAeRT: eInfochips' DFT Framework that Increases Productivity and Reduces Silicon Development Cycle
• Synopsys Unveils RTL Architect To Accelerate Design Closure
• eMemory Launches Reprogrammable NVM Solution on TSMC Platform

Thursday, March 12, 2020

• Silicon Labs to Expand Leading IoT Wireless Platform with Acquisition of Redpine Signals' Connectivity Business

Wednesday, March 11, 2020

• Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm
• Cadence Tensilica HiFi IP Accelerates AI Deployment with Support for TensorFlow Lite for Microcontrollers
• QuickLogic's eFPGA Qualified on GLOBALFOUNDRIES 22FDX Platform for IoT and Edge AI Applications
• Wireless SoCs Get Hardware Security

Tuesday, March 10, 2020

• Synopsys Advances State-of-the-Art in Electronic Design with Revolutionary Artificial Intelligence Technology
• RISC-V Foundation Announces Ratification of the Processor Trace Specification
• Andes to Presents Andes Custom Extensions to the RISC-V V5 CPU Core for Creating Highly Competitive True Wireless Stereo SoC Designs
• TSMC expected to start mass production of 5nm chips in April
• Xilinx Announces World's Highest Bandwidth, Highest Compute Density Adaptable Platform for Network and Cloud Acceleration
• "Black Swan" Event Triggers Revision to 2020 IC Market Forecast
• OPENEDGES announces a strategic partnership with The Six Semiconductor Inc to provide a complete GDDR6 memory interface solution

Monday, March 9, 2020

• Infineon gets go ahead for Cypress acquisition
• AI Sound Recognition on a Cortex-M0: Data is King
• Synopsys Custom Design Platform Secures Full-flow Displacement of Legacy Design Tools at Alphawave
• TSMC February 2020 Revenue Report
• Ambiq Micro's Next-Generation Subthreshold Power-Optimized Technology (SPOT) Platform Features CEVA's Bluetooth Low Energy IP

Sunday, March 8, 2020

• RISC-V Foundation Announces Ratification of the Processor Trace Specification
• AI Chipmaker Hailo Raises $60 Million in Series B Funding
• UMC Reports Sales for February 2020
• Transistor Count Trends Continue to Track with Moore's Law
• U.S. Considers Blocking Infineon's Purchase of Cypress
• Cadence Collaborates with STMicroelectronics on Networking, Cloud and Data Center Electronics
• Global Fab Equipment Spending Poised for 2021 Record High
• Dover Microsystems and Cadence Partner to Deliver Secure Processing with Silicon-Layer Security for Mission-Critical Applications