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Wednesday, May 11, 2016

• Sidense Exhibiting Secure and Reliable 1T-OTP at TSMC 2016 China and Taiwan Symposiums
• VeriSilicon Supports the Connected Car by Joining Automotive Grade Linux
• Istuary Innovation Group Selects Agnisys IDesignSpec for Enterprise Storage Chips
• EC funds SMEs to develop cyber-physical systems for robotics and industry
• From catching up to forging ahead: China's new role in the semiconductor industry
• Samsung prepares for China attacks on semiconductor

Wednesday, May 11, 2016

• PowerVR GPUs from Imagination pass OpenVX conformance with Khronos

Wednesday, May 11, 2016

• High Performance HEVC decoder IP released by Chips&Media

Wednesday, May 11, 2016

• ARM University Program Introduces New Mobile Gaming Education Kit

Tuesday, May 10, 2016

• Analysis of Cypress Semiconductor acquisition of Broadcom wireless IoT assets
• Synopsys Expands Portfolio of ARC Processors for Safety-Critical Automotive Applications to Include DSP and Cache Support
• NXP takes No.1 auto IC slot
• ON Semiconductor Expands Low Power Wireless Solutions Portfolio with SIGFOX and Arm for Rapid IoT Deployment
• Arm University Program Introduces New Mobile Gaming Education Kit
• Algo-Logic Systems Launches FPGA Accelerated CME Tick-To-Trade System

Tuesday, May 10, 2016

• Synopsys Verification Solution Certified for the Most Stringent Level of Automotive Safety Measures Defined by the ISO 26262 Standard

Tuesday, May 10, 2016

• TSMC April 2016 Revenue Report

Monday, May 9, 2016

• 10 Favorite FPGA-Based Prototyping Boards
• Sigfox plans to build IoT networks in U.S. 100 cities this year
• FPGAs for the Masses?
• VORAGO Technologies Announces Availability of Industry?s First Arm Cortex MCUs Built for Extreme Conditions
• Imagination Inside Innovative Video Analytics Engine
• Synopsys Verification Solution Certified for the Most Stringent Level of Automotive Safety Measures Defined by the ISO 26262 Standard
• Cypress Adopts Cadence Digital Implementation and Circuit Simulation Tools for 40nm Automotive Designs
• Automotive Electronics System Demand Fails to Boost Automotive IC Market in 2015
• Barco Silex launches flexible eSecure IP module as cornerstone for fully-secured IoT applications
• Gartner Says Worldwide Semiconductor Capital Spending to Decline 2 Percent in 2016
• HDL Design House Appoints New Representative for Central Europe, Nordic Region and the US
• Design, Test & Repair Methodology for FinFET-Based Memories
• Addressing Three Critical Challenges of USB Type-C Implementation

Monday, May 9, 2016

• InvenSense and ARM Innovation Ecosystem Accelerator Partner to Advance China's IoT Industry

Monday, May 9, 2016

• UMC Reports Sales for April 2016

Sunday, May 8, 2016

• Smart cities are a mystery to most of us
• FinFET Technology Market by Technology, Product, End-User and Geography - Global Forecast to 2022
• RFEL adds Wideband capability to its award-winning ChannelCore Flex advanced channeliser IP core
• Tezzaron Cuts Design Time in Half with Cadence Full-Flow Digital RTL-to-Signoff Solution
• MagnaChip and YMC Expand Cost-Effective 0.18um Multiple-Time Programmable (MTP) Manufacturing Processes
• Tsinghua buys 3% of Imagination
• InvenSense and Arm Innovation Ecosystem Accelerator Partner to Advance China's IoT Industry
• Altera Accelerates High-capacity FPGA Design with Quartus Prime Pro Design Software
• Why is NXP Moving to FD-SOI?
• EnSilica launches eSi-ECDSA cryptographic IP for standards-compliant automotive Car2x communications
• Credo 16-nm 28G and 56G PAM-4 SerDes Now Available on TSMC FinFET Compact Process

Friday, May 6, 2016

• Faraday Monthly Consolidated Sales Report - April 2016

Friday, May 6, 2016

• GUC Monthly Sales Report - April 2016

Thursday, May 5, 2016

• Samsung considers partnering with Chinese companies in semiconductors
• Analog, MEMS Drag On ST's Results
• OmniPHY Named One of 2016 20 Most Promising Semiconductor Companies by SiliconIndia

Wednesday, May 4, 2016

• A new architecture for consumer IoT applications

Wednesday, May 4, 2016

• eASIC Joins the OpenPOWER Foundation to Offer Custom-designed Accelerator Chips

Tuesday, May 3, 2016

• Faraday Reduces Packaging Design Time by 60 Percent Using Cadence OrbitIO Interconnect Designer and SiP Layout
• Texas Instruments Leads Industrial Semiconductor Vendor Share Ranking in 2015; Market Rises to $40.7 billion
• Creonic Participates in International SENDATE-TANDEM Research Project
• CMOS Image Sensors Expected To Set Record-High Sales for Another Five Years
• Faraday Showcases Virtual Platform Solution and 28nm IP at ChipEx 2016
• Chip Sales Edge Up Slightly

Monday, May 2, 2016

• High Performance HEVC decoder IP release by Chips&Media
• Semtech Announces the Industry's First Single Chip Hybrid PLC and LoRa Wireless Platform for Smart Grid, Smart Metering and IoT Applications
• Cadence Expands OrCAD Solution to Address Flex and Rigid-Flex Design Challenges for IoT, Wearables and Mobile Devices
• Russian mobile processor firm uses MIPS and PowerVR cores
• IEEE Releases the Accellera SystemC AMS Standard as IEEE 1666.1-2016
• NetSpeed Systems expands presence in Taiwan through partnership with Maojet Technology
• Sonics Develops Industry's First Energy Processing Unit Based on the ICE-Grain Power Architecture
• New Cadence Allegro Platform Accelerates Design of Compact, High-Performance Products Using Flex and Rigid-Flex Technologies

Monday, May 2, 2016

• How Intel Missed the Smartphone Call

Monday, May 2, 2016

• Attopsemi Published a Paper in ICMTS 2016, Yokohama, Japan

Monday, May 2, 2016

• Synopsys Delivers Next-Generation Verification IP for Micron's Hybrid Memory Cube Architecture

Monday, May 2, 2016

• Indian fabs, the free market and central planning

Monday, May 2, 2016

• CEVA, Inc. Announces First Quarter 2016 Financial Results

Monday, May 2, 2016

• BittWare and Atomic Rules announce an FPGA-based UDP Offload Engine IP Core for 10/25/50/100 GbE

Sunday, May 1, 2016

• MaxLinear Buys Microsemi's Broadband Wireless Unit
• Samsung cranks up third gen FinFET process
• Next-generation multi-platform video analytics SoC results from collaboration between Imagination and ELVEES
• Global Semiconductor Sales Increase Slightly in March
• Cadence Announces New Tensilica Vision P6 DSP Targeting Embedded Neural Network Applications
• Dongbu HiTek Provides Process Design Kits for Synopsys' Custom Compiler Solution
• Attopsemi Published a Paper in ICMTS 2016, Ultra-small and Ultra-reliable Innovative Fuse Scalable from 0.35um to 28nm
• Try and adopt Motu-Uta, the benchmark from Dolphin Integration for a fair evaluation of Standard Cell libraries
• Synopsys Delivers Next-Generation Verification IP for Micron's Hybrid Memory Cube Architectur