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Thursday, March 24, 2016

• Silicon Lacks Clear Metrics

Thursday, March 24, 2016

• EDA Consortium Reports EDA Industry Revenue for Q4 2015

Thursday, March 24, 2016

• GLOBALFOUNDRIES Releases New 7SW SOI RF PDK Featuring Latest Keysight Technologies Advanced Design System Software

Thursday, March 24, 2016

• Analog Bits to Demonstrate Half-Power SERDES at TSMC's San Jose Technology Symposium

Wednesday, March 23, 2016

• IoT sensor platform spec emerges

Wednesday, March 23, 2016

• GL Communications Inc. selects Achronix Speedster22i FPGAs for 10/40/100G PacketExpert

Wednesday, March 23, 2016

• Embedded systems will be everywhere, expert predicts

Tuesday, March 22, 2016

• EnSilica launches Kalman Filter acceleration IP core for advanced driver assistance systems (ADAS)
• Microsemi Announces Definitive Agreement to Divest Business to Mercury Systems, Inc.
• Apple has no plans to buy Imagination
• US leads growing global industrial semiconductor market, IHS says
• Samsung is developing a new OS for the Internet of Things
• Synopsys' PrimeTime Speeds Timing and Power Closure for Complex SoC and IoT Designs
• Toshiba Launches Arm Cortex-M3-based Microcontrollers with Latest 65nm Flash Embedded Logic Process for Motor Control and Consumer Devices
• Toshiba Announces Immediate IP Subsystem Availability of 10 Gigabit Ethernet for Custom LSI Platforms

Tuesday, March 22, 2016

• Palm OS licensed to three device vendors

Monday, March 21, 2016

• Cadence工具获台积电7纳米早期设计及10纳米芯片生产认证
• Sigfox makes global stride with Altice IoT partnership
• The DATE 2016 conference and exhibition in Dresden attracted 1400 experts
• Imagination Stock Rises on Report of Apple Talk
• GUC Delivers 28G Multi-Standard SerDes IP

Monday, March 21, 2016

• ReRAM Startup in Reverse Takeover for Funds

Monday, March 21, 2016

• Acorn Technologies Introduces New Positioning IP Core for LTE Baseband Chipset Market

Monday, March 21, 2016

• SK Hynix, Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems Announce "Start your HBM/2.5D Design Today" Webinar

Monday, March 21, 2016

• Chip Market May Contract Again

Monday, March 21, 2016

• DINI Group announces full integration with EXOSTIV FPGA Debug Solution

Monday, March 21, 2016

• Network-on-chip startup to receive $2 million from government

Sunday, March 20, 2016

• Altera Demonstrates Dual-mode 56-Gbps PAM-4 and 30-Gbps NRZ Transceiver Technology for Stratix 10 FPGAs and SoCs

Friday, March 18, 2016

• Mobiveil will demonstrate its UNH certified NVM Express IP (UNEX) in the Members- Only NVM Express Meeting Next Week

Thursday, March 17, 2016

• Acorn Technologies Licenses hellaPHY to Sequans Communications

Wednesday, March 16, 2016

• Imagination to lay off another 200 people
• Analog Devices Enhances IoT Sensing Portfolio with SNAP Sensor Acquisition
• Imagination Technologies: Restructuring update
• GUC Announces Progress in LPDDR4 IP and Reaffirms Commitment to DIMM Application of DDR3/4

Wednesday, March 16, 2016

• Altera and MorethanIP Announce Industry’s First Fibre Channel IP Cores For FPGAs

Tuesday, March 15, 2016

• Xilinx All Programmable Optical Transport Network (OTN) IP Subsystems Honored by 2016 Lightwave Innovation Reviews
• The Internet Of Things And Machine Learning
• Rapid prototyping platforms for embedded developers
• TSMC Details Silicon Road Map
• Rambus Cryptography Research Division Licenses Advanced Security Technologies to Altis Semiconductor

Tuesday, March 15, 2016

• Credo 16-nm 56G PAM-4 SerDes IP Now Available

Tuesday, March 15, 2016

• ARM and TSMC Announce Multi-Year Agreement to Collaborate on 7nm FinFET Process Technology for High-Performance Compute

Tuesday, March 15, 2016

• Quantum Computer May Crack Public-Key Encryption

Monday, March 14, 2016

• Google says
• Exploring design methodologies for next-generation IoT sensors
• Cadence Design IP to Support TSMC 16FFC and 28HPC+ Process Technologies
• TSMC and MediaTek Extend Collaboration on Ultra-Low Power Technology to Capture the Emerging IoT Market
• SEMI reports 2015 semiconductor equipment sales of US$36.5 billion
• Semiconductor (Silicon) IP Market Worth 7.01 Billion USD by 2022
• Bluetooth Transport Discovery Service Enables Collaborative IoT
• It is time to prioritize security for Internet of Things and wearables
• Cryptographic keys protect production FPGAs, says Microsemi
• TSMC, Arm Aim 7nm at Data Centers
• Socionext transceiver claims record for 100Gbit/s transmission on a single wavelength
• Microsemi Announces New Secured FPGA Production Programming Solution to Prevent Overbuilding, Cloning, Reverse Engineering, Malware Insertion and Other Security Threats
• Imagination announces latest PowerVR Graphics SDK including full support for new Vulkan API
• GLOBALFOUNDRIES Broadens SiGe Power Amplifier Portfolio, Enhancing RF Performance and Efficiency for Wireless Devices

Monday, March 14, 2016

• True Circuits Announces New Line of Low Power, 32KHz IoT PLLs

Monday, March 14, 2016

• Silicon Shift Ahead in Comms

Monday, March 14, 2016

• Mellanox and Cadence Demonstrate PCI Express 4.0 Multi-Lane PHY IP Interoperability

Monday, March 14, 2016

• Lattice Semiconductor and MediaTek Deliver the World’s Most Power Efficient 4K Video Solution Over USB Type-C

Monday, March 14, 2016

• Flex Logix Announces Program for Fast-Track Evaluation and Prototyping

Monday, March 14, 2016

• RivieraWaves Announces its Wi-Fi Partnership with Celeno

Monday, March 14, 2016

• New Wave Design and Verification Acquires Advanced IO's Assets

Monday, March 14, 2016

• Zoran Corporation reports first quarter 2002 results

Monday, March 14, 2016

• TI India working on single-chip solution for mobile phones

Monday, March 14, 2016

• Multiband OFDM Alliance releases UWB PHY specs

Monday, March 14, 2016

• DSP Group buys Bermai's Wi-Fi chip IP

Monday, March 14, 2016

• elitePLUS semiconductor Technologies released a fully functional 400G PCS VIP.

Sunday, March 13, 2016

• TSMC认证Synopsys IC Compiler II适合10-nm FinFET生产，并开始7-nm工艺的初步设计
• TSMC Certifies Synopsys IC Compiler II for 10-nm FinFET Production and 7-nm Early Design Starts
• Synopsys Announces Broad IP Portfolio for TSMC 16FFC Process
• Cadence Announces DDR4 and LPDDR4 IP Achieve 3200 Mbps on TSMC 16nm FinFET Plus Process
• eMemory Announces Industry's First 16nm FinFET Compact (FFC) Process Verified OTP Silicon IP
• M31 Technology Announces Its Release of TSMC's 28HPC+ ULL SRAM Compilers for the Intelligent Device Market