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Friday, July 2, 2010

• DOLPHIN Integration upgrades SLED and SMASH delivering block-busting innovation

Thursday, July 1, 2010

• CoFluent Design and NSW launch CoFluent-On-Demand SaaS program

Thursday, July 1, 2010

• TSMC Announces Automotive Qualified 0.25-Micron One-Time-Programmable IP

Wednesday, June 30, 2010

• Intel vs intilop; Intelop corporation announces its name change to "intilop"

Wednesday, June 30, 2010

• LSI and Seagate Co-develop Technology for Next-Generation High-Capacity Hard Disk Drives

Wednesday, June 30, 2010

• TowerJazz Licenses Its Y-Flash Non-Volatile Memory Technology to a Leading Digital Foundry

Wednesday, June 30, 2010

• Virage Logic Continues to Broaden Semiconductor IP Offering With New Portfolio of Production Proven Processor Peripheral Cores

Wednesday, June 30, 2010

• Tensilica adds FLAC Decoder to HiFi Audio Codec Library

Wednesday, June 30, 2010

• EVE Achieves Record Bookings of $19.9 Million in Q4 FY2010

Tuesday, June 29, 2010

• Lattice and Affarii Technologies Offer Complete Remote Radio Head Hardware Solution for Wireless Infrastructure

Tuesday, June 29, 2010

• Development of Close Proximity Wireless Technology with Integrated On-Chip Antenna

Tuesday, June 29, 2010

• GE Lighting and Rambus Sign License Agreement to Create LED Lighting Solutions for Global Markets

Tuesday, June 29, 2010

• Global Unichip selects TranSwitch for Next-Generation HDMI supporting full-rate 3-D High Definition Television

Monday, June 28, 2010

• Texas Instruments delivers industry's first discrete SuperSpeed USB 3.0 transceiver, offering more than 10 times the speed of USB 2.0

Monday, June 28, 2010

• PLX Sampling Industry's Highest-Performance USB SuperSpeed 3.0 Controllers

Monday, June 28, 2010

• PCI Express 3.0 delayed until 2011

Monday, June 28, 2010

• Analyst: China's IC manufacturing spend paying off

Monday, June 28, 2010

• L&T Infotech to collaborate with BWCI on LTE Radio Access Test Bed development

Monday, June 28, 2010

• SMSC's High Speed Inter-Chip (HSIC) USB4640 Available

Monday, June 28, 2010

• WiSpry and IBM Collaborate to Develop Next-Generation of Tunable Mobile Terminal Front-End Technology

Monday, June 28, 2010

• "Lattice Diamond" FPGA Design Software Heralds New Era for Low Power, Cost Sensitive FPGA Applications

Monday, June 28, 2010

• Mentor Graphics Adopts Shareholder Rights Plan

Friday, June 25, 2010

• Dolphin Integration introduces a new Panoply of Silicon IPs for reducing the 65 nm silicon area up to 10%

Thursday, June 24, 2010

• MIPS to restructure, align with Android

Thursday, June 24, 2010

• Elliptic Technologies Upgrades DRM Solution to Latest DTCP-IP Standard

Thursday, June 24, 2010

• nSys Announces Functional Coverage Test Suites for Upcoming PCI Express 3.0 Specification

Thursday, June 24, 2010

• Virage Logic Releases Major Update of the Open Source GNU and Linux Toolchains for Its ARC Processor Cores

Thursday, June 24, 2010

• Synopsys Demonstrates Interoperability of DesignWare IP for PCI Express 3.0 at PCI-SIG Developers Conference

Thursday, June 24, 2010

• IEEE Launches Next Generation of High-Rate Ethernet with New IEEE 802.3ba Standard

Thursday, June 24, 2010

• IBM, Samsung and GLOBALFOUNDRIES Set for Fab Synchronization to Produce Advanced Chips Based on 28nm Process Technology with STMicroelectronics

Wednesday, June 23, 2010

• InterDigital Expands Inventec Appliances Corporation Patent License Agreement to Include Inventec Appliances (Jiangning) Corporation

Wednesday, June 23, 2010

• MontaVista Software Delivers First Commercial Linux for ARM Cortex-A9 Processors

Wednesday, June 23, 2010

• JEDEC Announces Key Attributes of Upcoming Universal Flash Storage Standard

Wednesday, June 23, 2010

• Pleora Technologies Joins Altera Partnership Program

Wednesday, June 23, 2010

• Imagination Technologies - Preliminary Results for the twelve months to 30 April 2010

Wednesday, June 23, 2010

• Tensilica HiFi Audio DSP Becomes First IP Core Approved for Dolby MS10 Multistream Decoder

Tuesday, June 22, 2010

• Next Generation Virtual Platform Simulator released by Imperas and OVP Initiative Extends Simulation Speed Advantage By 50 Percent

Tuesday, June 22, 2010

• Altera Delivers Industry's First Single-Chip Solution for HD WDR Surveillance Cameras

Tuesday, June 22, 2010

• Arteris Joins TSMC Reference Flow With Network-on-Chip (NoC) Interconnect IP

Tuesday, June 22, 2010

• Freescale announces Kinetis - one of the most scalable portfolios of mixed signal ARM Cortex-M4 microcontrollers in the industry

Tuesday, June 22, 2010

• Mentor Graphics Announces Commercial Linux Platform for Freescale Semiconductor's Processors Based on Power Architecture Technology; Support for New QorIQ P3 and P5 Platform

Tuesday, June 22, 2010

• Sonics Expands Presence in China and Taiwan and Appoints Mac Hale Vice President of Asia Operations

Tuesday, June 22, 2010

• Actel Announces Power Management Solution for SmartFusion Intelligent Mixed Signal FPGAs

Tuesday, June 22, 2010

• IP Cores, Inc. Ships High-Speed Lossless Compression Core

Tuesday, June 22, 2010

• Freescale extends QorIQ family with quad-core P3 platform optimized for low power

Tuesday, June 22, 2010

• Arasan Chip Systems Announces highly integrated 10G Ethernet MAC IP Core

Tuesday, June 22, 2010

• Open-Silicon Promotes Taher Madraswala to Vice President of Engineering

Monday, June 21, 2010

• Wind River Adds Support for Microsoft Windows XP to Its Embedded Virtualization Offering

Monday, June 21, 2010

• Cognovo launches Software Defined Modem solution for LTE handsets

Monday, June 21, 2010

• Broadcom Announces Intention to Acquire Innovision Research & Technology PLC

Monday, June 21, 2010

• Cadence Global Services Enables Industry's First TD-LTE Baseband Chip from Innofidei

Monday, June 21, 2010

• Xilinx 7 Series FPGAs Slash Power Consumption by 50% and Reach 2 Million Logic Cells on Industry's First Scalable Architecture

Monday, June 21, 2010

• EC Funds Green Cloud Services Project Investigating Use of ARM Architecture in Data Centers

Monday, June 21, 2010

• Elpida, PTI, and UMC Partner on 3D IC Integration Development For Advanced Technologies Including 28nm