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Friday, February 20, 2009

• Test, Packaging & Delivery - Through Partnership, Moortec Offer Total ASIC Solution

Friday, February 20, 2009

• Aspex Semiconductor reaches profitability - wins significant contracts

Friday, February 20, 2009

• Faraday Reported 2008 Fourth Quarter Results

Thursday, February 19, 2009

• Maxim and Universal Electronics Purchase Zilog Universal Remove Control and Secure Transaction Businesses

Thursday, February 19, 2009

• Innovative Logic announces USB3.0 Device Controller IP

Thursday, February 19, 2009

• NVIDIA Responds To INTEL Court Filing

Thursday, February 19, 2009

• Viewpoint: Consolidation is all about timing

Thursday, February 19, 2009

• Tower Semiconductor Reports Fourth Quarter and Fiscal Year 2008 Financial Results

Thursday, February 19, 2009

• Synopsys Posts Financial Results for First Quarter Fiscal Year 2009

Thursday, February 19, 2009

• ARC International Introduces New Members of Executive Management Team

Wednesday, February 18, 2009

• Independent BDTI Benchmarks Recognize CEVA-TeakLite-III as Most Area Efficient and Energy Efficient of all Processors in Its Class

Wednesday, February 18, 2009

• Lime Microsystems selects Jazz Semiconductor's 0.18-micron SiGe process for its Configurable Multi-band, Multi-standard Transceiver Targeting WCDMA, CDMA, LTE and WiMAX Femtocells

Wednesday, February 18, 2009

• Jasper Design Automation Raises $7 Million in Series D Funding

Wednesday, February 18, 2009

• Actel Rolls Out Low-Cost IGLOO nano Starter Kit

Wednesday, February 18, 2009

• MOSAID Expands Into New Markets With Acquisition of 300 Communications Patents

Tuesday, February 17, 2009

• Texas Instruments extends OMAP 3 family with 45 nm products to address a broad range of mobile performance needs

Tuesday, February 17, 2009

• ZeroG Wireless Announces Availability of the Industry's First 'Wi-Fi I/O' for Embedded Systems

Tuesday, February 17, 2009

• Newport Media Announces World's First 65nm System-on-Chip (SoC) for China's CMMB Mobile TV

Tuesday, February 17, 2009

• Discretix CryptoCell Security Platform for 4G LTE Chipsets

Tuesday, February 17, 2009

• SafeNet Security IP Helps Secure Texas Instruments Next-Generation OMAP Applications Processors

Tuesday, February 17, 2009

• ST-Ericsson fails to produce promised Symbian-on-A9 demo

Tuesday, February 17, 2009

• RAD3 Communications Announces Wireless Communications IP Library

Monday, February 16, 2009

• ST-Ericsson collaborates with ARM to demonstrate the world's first Symmetric Multi Processing mobile platform technology on Symbian OS

Monday, February 16, 2009

• Imagination announces first member of new vector graphics IP core family

Monday, February 16, 2009

• Imagination delivers HD H.264 High Profile capability in latest video encoder IP cores

Monday, February 16, 2009

• DOLPHIN Integration extends SoC GDS capabilities to include OASIS reading and writing

Monday, February 16, 2009

• On2 Technologies Announces the Hantro 8270 Area and Speed Optimized 1080p Hardware Video Encoder

Monday, February 16, 2009

• On2 Technologies Licenses Video Codecs to Shanghai InfoTM

Monday, February 16, 2009

• Xilinx and Wintegra Collaborate on LTE Baseband Targeted Design Platform for Faster, Lower Cost Development of 4G Wireless Basestations

Monday, February 16, 2009

• ARM Extends Performance, Size and Power Efficiency Leadership with the First Cortex Processor on 32nm Process

Monday, February 16, 2009

• ARM NEON Technology to Help Enable Deployment of Dolby Mobile Technology

Monday, February 16, 2009

• Strength of the ARM Ecosystem Demonstrated at MWC with More Than 60 Partners Showing ARM Technology

Monday, February 16, 2009

• ARM Announces 10 Billionth Mobile Processor

Monday, February 16, 2009

• Intelop announces major enhancements to their TCP-Offload Engine SoC IP that also has integrated GEMAC, ARP module and AMBA 2.0 bus and PCIe interface running at 2-Gbps capable of managing thousands of simultaneous TCP sessions

Monday, February 16, 2009

• CircuitSutra partners with GreenSocs to provide high quality SystemC based SoC modelling services

Monday, February 16, 2009

• BitSim AB and the Swedish Institute of Space Physics in Uppsala (IRF) have signed an agreement for electronics development with AD-conversion and signal processing for breakthrough radio research

Friday, February 13, 2009

• SP Devices Launches New 1.1 GS/s 12 bit Digitizer

Friday, February 13, 2009

• OVP Simulator Smashes SystemC TLM-2.0 Performance Barrier

Friday, February 13, 2009

• Global Unichip reports 9.28B NTD 2008 revenue; Delivers 9th consecutive year of top line growth; More than 66%NRE revenue from 90nm and below projects

Thursday, February 12, 2009

• Rumor mill: UMC to join IBM 'fab club'?

Thursday, February 12, 2009

• CEO Interview: Moshe Gavrielov of Xilinx

Thursday, February 12, 2009

• Analysis: Dell has dragged the Linux-ARM Trojan horse inside the Wintel PC

Thursday, February 12, 2009

• eInfochips announces VMM based HDMI Verification IP for the Synopsys DesignWare Verification IP Alliance program

Thursday, February 12, 2009

• Tata Elxsi announces multicore DSP-based WiMAX base station and carrier class CPE for public safety and defence applications

Thursday, February 12, 2009

• ARM Mali GPU Licensees Increase to 18 with Addition of Amlogic and Mtekvision

Thursday, February 12, 2009

• Eureka Technology and Dolphin Technology offer complete DDR2/DDR3 Solution for High Performance SoC/ASIC Designs

Wednesday, February 11, 2009

• GDT announces H.264 XE silicon IP core

Wednesday, February 11, 2009

• New DesignWare Verification IP Alliance Program Expands Availability of High-Quality VMM-Enabled Verification IP

Wednesday, February 11, 2009

• Silicon Image Introduces Industry's First Silicon Implementation of 40-nm Low-Power HDMI Version 1.3 Transmitter Analog IP Core

Wednesday, February 11, 2009

• Tensilica Enables New Bluetooth Devices with the SBC Decoder and Encoder on Its HiFi 2 Optimized Audio DSP

Wednesday, February 11, 2009

• CEVA Unveils Industry's Highest Performance DSP Architecture for 3.5G/4G Terminals and Infrastructure SoCs

Wednesday, February 11, 2009

• Mitsubishi Electric Develops High-Speed and Compact IP Core for Processing Graphics in Built-in Display Systems

Wednesday, February 11, 2009

• Tower Semiconductor and Triune Systems to Collaborate on Power Management Platform

Wednesday, February 11, 2009

• Mentor Graphics Announces Preliminary Fiscal 2009 Results and Schedules Fourth Quarter Conference Call

Wednesday, February 11, 2009

• Legend's MSIM SPICE Circuit Simulator Certified for TSMC's Advanced Nanometer Circuit Designs

Tuesday, February 10, 2009

• Accent Expands ASIC Operations and Opens Design Facility in China

Tuesday, February 10, 2009

• Tensilica Demonstrates Audio, Video and Next-Generation Baseband DSP at Mobile World Congress in Barcelona

Tuesday, February 10, 2009

• ARM Showcases Innovation in Mobile Technology at 2009 GSMA Mobile World Congress

Tuesday, February 10, 2009

• ARM Extends Its Leadership In Media Processing With Acquisition Of Video Technology Company

Tuesday, February 10, 2009

• CSR and SiRF combine forces for Bluetooth and GPS market leadership

Tuesday, February 10, 2009

• MoSys, Inc. Reports Fourth Quarter and Full Year 2008 Financial Results

Tuesday, February 10, 2009

• ALLEGRO licenses its H.264/MPEG-4 AVC High-Definition Video Encoding IP to one of the world’s top 10 IC vendors

Monday, February 9, 2009

• IMEC reports low-cost low-power 60GHz solutions in digital 45nm CMOS

Monday, February 9, 2009

• eSilicon CEO sees new ASIC landscape

Monday, February 9, 2009

• SiliconBlue Announces Volume Production Shipments of its iCE65 Ultra-Low Power FPGAs

Monday, February 9, 2009

• Avery Design Systems Announces USB 3.0 Verification Solution

Monday, February 9, 2009

• Fastest 8051 IP core downloadable demo from Evatronix.

Monday, February 9, 2009

• CoWare and Rambus Announce Unique ESL Architecture Design Environment for Rambus' XDR Memory Architecture

Monday, February 9, 2009

• TMC and Dolphin Integration enter in a partnership for microprocessor cores to enable better competitiveness in the highly price-sensitive smart-card market

Monday, February 9, 2009

• MIPI Alliance Delivers Seven Vital Mobile Device Interface Specifications in 2008

Monday, February 9, 2009

• Synopsys Defines Next Era of Rapid Prototyping

Monday, February 9, 2009

• Toshiba Develops World's Highest-Bandwidth, Highest Density Non-Volatile RAM

Monday, February 9, 2009

• Freescale Introduces 45-nm PowerQUICC III Processor with Low Power, High Performance and Optimal Flexibility

Monday, February 9, 2009

• ESL: Where are we and where are we going

Monday, February 9, 2009

• I&C Technology Selects Mixed-Signal IP from S3 for Mobile TV SoC

Monday, February 9, 2009

• Analysis: Plug-and-play IP goal remains elusive

Monday, February 9, 2009

• Intelop delivers industry's first customizable/scalable multi-port Network Switch + 1G/100 MB EMAC + Motorola CPU interface Silicon IP for industrial automation applications