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Monday, April 24, 2023

• Infrared vision: exceptionally sharp images
• UK government announces £100m investment in AI foundation models
• 6G is Happening, and Here's What You Need to Know
• Cadence and TSMC Collaborate on N16 79GHz mmWave Design Reference Flow to Accelerate Radar, 5G and Wireless Innovation
• Cadence Custom Design Migration Flow Accelerates Adoption of TSMC N3E and N2 Process Technologies
• Synopsys and TSMC Collaborate to Jumpstart Designs on TSMC's N2 Process with Optimized EDA Flows
• Sondrel engages The SHD Group to assist in bringing Architecting the Future to the American market
• Synopsys and TSMC Collaborate to Jumpstart Designs on TSMC's N2 Process with Optimized EDA Flows
• Rapid Silicon Launches Vega eFPGA IP for Programmable Solutions
• Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology
• Agile Analog launches innovative digitally wrapped analog IP subsystems
• Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC's N4P Process
• Analog Bits to Demonstrate Working Silicon on TSMC N3E Process at TSMC 2023 North America Technology Symposium
• Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology
• Andes Technology's N25F RISC-V Processor Enables Superior Performance And Low Power For Phison's X1 Enterprise SSD Controller
• OPENEDGES' 12nm LPDDR5/4 Memory Subsystem IP that Drives Innovation Licensed by ASICLAND
• Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology

Sunday, April 23, 2023

• Design IP revenues grew 20% last year
• Arm prototype processor raises business model questions
• Arm reportedly developing 'advanced' test chip for customers
• Flex Logix Announces InferXâ„¢ High Performance IP for DSP and AI Inference
• VyperCore Announces £4 million in Seed Funding
• Synopsys, TSMC and Ansys Strengthen Ecosystem Collaboration to Advance Multi-Die Systems
• Flex Logix Announces InferX™ High Performance IP for DSP and AI Inference
• Arm reported to be building a chip
• Dilithium core complements Xiphera's xQlave® family of post-quantum cryptography
• Introducing High-Speed Fractional PLL IP Cores with SSC that offers exceptional features in different process technologies
• Weebit Nano raises $15 million via upsized and scaled-back SPP
• Coherent Logix collaborates with Omni Design, AkiraNET Co. and Socionext to deliver reference design for Wi-Fi 6E/7

Saturday, April 22, 2023

• Omni Design's High Performance Analog Front Ends are Adopted in Socionext's Next Generation Communications SoCs
• Marvell Demonstrates Industry's First 3nm Data Infrastructure Silicon

Wednesday, April 19, 2023

• Anchoring Trust to Enhance IoT Security
• EdgeQ Closes $75M Series-B Investment and Ramps to Customers' Demand for Its Award-Winning 5G+AI Base Station-on-a-Chip for 5G Networks
• GlobalFoundries Files Lawsuit Against IBM to Protect its Intellectual Property and Trade Secrets
• TSMC Reports First Quarter EPS of NT$7.98
• EU agrees Chips Act terms
• EdgeCortix Expands Delivery of its Industry Leading SAKURA-I AI Co-processor Devices and MERA Software Suite
• Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY
• The Six Semiconductor of OPENEDGES Receives Best International Business Award from ACCE

Tuesday, April 18, 2023

• The Environmental Impact Of Using Plastic To Make Microchips
• The Need for Security is Everywhere. Intrinsic ID Showcases Expertise and PUF Innovations at Key Industry Events
• Volkswagen wants to become more agile with new R&D centre in China
• Cadence Unleashes the Future of Analog, Custom and RFIC Design with Pioneering AI-Powered Virtuoso Studio
• Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY
• Esperanto Technologies Announces RISC-V Industry Milestone of Generative AI Models Running on ET-SoC-1; Access to be Made Available to the RISC-V Research Community
• Europe consolidates quantum production and test
• Silicon Interfaces enhances Functional Safety ISO 26262-Compliant ASIL C Services Solution for Automotive
• The Need for Security is Everywhere. Intrinsic ID Showcases Expertise and PUF Innovations at Key Industry Events

Monday, April 17, 2023

• Arm liable for $8.5B SoftBank loan if IPO is a no-show
• Nordic Reveals "Revolution" of Wireless SoC Line: The nRF54 Series
• Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Hercules Microelectronics HME-H3 FPGA
• Rapid Silicon Partners with Elastics.cloud on CXL 3.0 Dual Mode Controller IP to Enhance its Custom FPGA Solutions
• eMemory's Security-enhanced OTP Qualifies on TSMC N5 Process and Continues to Tackle Automotive Solutions
• Cadence Demonstrates Interoperability with SK hynix's Highest Speed LPDDR5T Mobile DRAM at 9600Mbps

Sunday, April 16, 2023

• Spanish startup performs RISC-V open core surgery
• Process agnostic fully customisable RISC-V IP cores
• Cadence extends TSMC deal for physical verification on Azure
• Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud
• TSMC could partner with Bosch for 28nm fab in Germany
• Introducing the Cutting-Edge USB 3.0/ PCIe 3.0 Combo PHY IP Core in 28HPC+ for High-Performance SoC Designs
• Arm could be on the hook for $8.5bn of Softbank debt
• DVB-S2X LDPC/ BCH Encoder and Decoder IP Core Available For Integration From Global IP Core
• Semidynamics launches world's first fully customisable RISC-V IP cores

Thursday, April 13, 2023

• The Future of LiDAR Lies in ADAS
• TSMC could partner with Bosch for 28nm fab in Germany
• Fraunhofer IIS partners with Avid to enable support of MPEG-H Audio in Pro Tools
• CryptOne IP Core is ready for post-quantum reality
• Experience the Future of Video Processing with intoPIX and Imagine Communications at the 2023 NAB Show
• MainConcept and Fraunhofer IIS collaborate on MPEG-H Audio and xHE-AAC encoding for video and audio streaming services
• Pine64 launches world's first RISC-V tablet device - PineTab-V for presale
• IAR Embedded Secure IP upgrades solutions portfolio with late-stage security
• Pragmatic Semiconductor Announces Appointment of Semiconductor Industry Veteran, David Moore, as CEO
• Cadence Introduces EMX Designer, Delivering More Than 10X Increased Performance for On-Chip Passive Component Synthesis
• Strict Restrictions Imposed by US CHIPS Act Will Lower Willingness of Multinational Suppliers to Invest; Chinese Semiconductor Development Will Be Limited for Next Decade, Says TrendForce

Thursday, April 13, 2023

• Hardware Root of Trust: The Key to IoT Security in Smart Homes

Wednesday, April 12, 2023

• Battery recycling takes the driver's seat
• JEDEC Expands CAMM Standardization to include Two Key Memory Technologies
• VeriSilicon Brings Super Resolution Technology to Smart Display
• Get Ready to be Amazed by the one-of-a-kind exhibit "JPEG XS in Action" by intoPIX at NAB2023
• Frontgrade Products Enable ESA's JUICE Mission
• Global Semiconductor Equipment Billings Reach Industry Record $107.6 Billion in 2022, SEMI Reports
• IC Manage Partners with Library Technologies to Accelerate Library Characterization by 100x in the Cloud
• Ateme and Fraunhofer Join Forces to Deliver Next Generation Audio
• On your Wrist and in Space; Intrinsic ID is Everywhere. Come Find us at Key Industry Tradeshows in April
• EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices
• Synopsys Introduces the Industry's First Emulation System with Unmatched Capacity to Enable Electronics Digital Twins of Advanced SoCs
• Softbank reduces Alibaba holding to 3.8%