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Monday, April 24, 2023
Infrared vision: exceptionally sharp images
UK government announces £100m investment in AI foundation models
6G is Happening, and Here's What You Need to Know
Cadence and TSMC Collaborate on N16 79GHz mmWave Design Reference Flow to Accelerate Radar, 5G and Wireless Innovation
Cadence Custom Design Migration Flow Accelerates Adoption of TSMC N3E and N2 Process Technologies
Synopsys and TSMC Collaborate to Jumpstart Designs on TSMC's N2 Process with Optimized EDA Flows
Sondrel engages The SHD Group to assist in bringing Architecting the Future to the American market
Synopsys and TSMC Collaborate to Jumpstart Designs on TSMC's N2 Process with Optimized EDA Flows
Rapid Silicon Launches Vega eFPGA IP for Programmable Solutions
Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology
Agile Analog launches innovative digitally wrapped analog IP subsystems
Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC's N4P Process
Analog Bits to Demonstrate Working Silicon on TSMC N3E Process at TSMC 2023 North America Technology Symposium
Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology
Andes Technology's N25F RISC-V Processor Enables Superior Performance And Low Power For Phison's X1 Enterprise SSD Controller
OPENEDGES' 12nm LPDDR5/4 Memory Subsystem IP that Drives Innovation Licensed by ASICLAND
Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology
Sunday, April 23, 2023
Design IP revenues grew 20% last year
Arm prototype processor raises business model questions
Arm reportedly developing 'advanced' test chip for customers
Flex Logix Announces InferXâ„¢ High Performance IP for DSP and AI Inference
VyperCore Announces £4 million in Seed Funding
Synopsys, TSMC and Ansys Strengthen Ecosystem Collaboration to Advance Multi-Die Systems
Flex Logix Announces InferX™ High Performance IP for DSP and AI Inference
Arm reported to be building a chip
Dilithium core complements Xiphera's xQlave® family of post-quantum cryptography
Introducing High-Speed Fractional PLL IP Cores with SSC that offers exceptional features in different process technologies
Weebit Nano raises $15 million via upsized and scaled-back SPP
Coherent Logix collaborates with Omni Design, AkiraNET Co. and Socionext to deliver reference design for Wi-Fi 6E/7
Saturday, April 22, 2023
Omni Design's High Performance Analog Front Ends are Adopted in Socionext's Next Generation Communications SoCs
Marvell Demonstrates Industry's First 3nm Data Infrastructure Silicon
Wednesday, April 19, 2023
Anchoring Trust to Enhance IoT Security
EdgeQ Closes $75M Series-B Investment and Ramps to Customers' Demand for Its Award-Winning 5G+AI Base Station-on-a-Chip for 5G Networks
GlobalFoundries Files Lawsuit Against IBM to Protect its Intellectual Property and Trade Secrets
TSMC Reports First Quarter EPS of NT$7.98
EU agrees Chips Act terms
EdgeCortix Expands Delivery of its Industry Leading SAKURA-I AI Co-processor Devices and MERA Software Suite
Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY
The Six Semiconductor of OPENEDGES Receives Best International Business Award from ACCE
Tuesday, April 18, 2023
The Environmental Impact Of Using Plastic To Make Microchips
The Need for Security is Everywhere. Intrinsic ID Showcases Expertise and PUF Innovations at Key Industry Events
Volkswagen wants to become more agile with new R&D centre in China
Cadence Unleashes the Future of Analog, Custom and RFIC Design with Pioneering AI-Powered Virtuoso Studio
Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY
Esperanto Technologies Announces RISC-V Industry Milestone of Generative AI Models Running on ET-SoC-1; Access to be Made Available to the RISC-V Research Community
Europe consolidates quantum production and test
Silicon Interfaces enhances Functional Safety ISO 26262-Compliant ASIL C Services Solution for Automotive
The Need for Security is Everywhere. Intrinsic ID Showcases Expertise and PUF Innovations at Key Industry Events
Monday, April 17, 2023
Arm liable for $8.5B SoftBank loan if IPO is a no-show
Nordic Reveals "Revolution" of Wireless SoC Line: The nRF54 Series
Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Hercules Microelectronics HME-H3 FPGA
Rapid Silicon Partners with Elastics.cloud on CXL 3.0 Dual Mode Controller IP to Enhance its Custom FPGA Solutions
eMemory's Security-enhanced OTP Qualifies on TSMC N5 Process and Continues to Tackle Automotive Solutions
Cadence Demonstrates Interoperability with SK hynix's Highest Speed LPDDR5T Mobile DRAM at 9600Mbps
Sunday, April 16, 2023
Spanish startup performs RISC-V open core surgery
Process agnostic fully customisable RISC-V IP cores
Cadence extends TSMC deal for physical verification on Azure
Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud
TSMC could partner with Bosch for 28nm fab in Germany
Introducing the Cutting-Edge USB 3.0/ PCIe 3.0 Combo PHY IP Core in 28HPC+ for High-Performance SoC Designs
Arm could be on the hook for $8.5bn of Softbank debt
DVB-S2X LDPC/ BCH Encoder and Decoder IP Core Available For Integration From Global IP Core
Semidynamics launches world's first fully customisable RISC-V IP cores
Thursday, April 13, 2023
The Future of LiDAR Lies in ADAS
TSMC could partner with Bosch for 28nm fab in Germany
Fraunhofer IIS partners with Avid to enable support of MPEG-H Audio in Pro Tools
CryptOne IP Core is ready for post-quantum reality
Experience the Future of Video Processing with intoPIX and Imagine Communications at the 2023 NAB Show
MainConcept and Fraunhofer IIS collaborate on MPEG-H Audio and xHE-AAC encoding for video and audio streaming services
Pine64 launches world's first RISC-V tablet device - PineTab-V for presale
IAR Embedded Secure IP upgrades solutions portfolio with late-stage security
Pragmatic Semiconductor Announces Appointment of Semiconductor Industry Veteran, David Moore, as CEO
Cadence Introduces EMX Designer, Delivering More Than 10X Increased Performance for On-Chip Passive Component Synthesis
Strict Restrictions Imposed by US CHIPS Act Will Lower Willingness of Multinational Suppliers to Invest; Chinese Semiconductor Development Will Be Limited for Next Decade, Says TrendForce
Thursday, April 13, 2023
Hardware Root of Trust: The Key to IoT Security in Smart Homes
Wednesday, April 12, 2023
Battery recycling takes the driver's seat
JEDEC Expands CAMM Standardization to include Two Key Memory Technologies
VeriSilicon Brings Super Resolution Technology to Smart Display
Get Ready to be Amazed by the one-of-a-kind exhibit "JPEG XS in Action" by intoPIX at NAB2023
Frontgrade Products Enable ESA's JUICE Mission
Global Semiconductor Equipment Billings Reach Industry Record $107.6 Billion in 2022, SEMI Reports
IC Manage Partners with Library Technologies to Accelerate Library Characterization by 100x in the Cloud
Ateme and Fraunhofer Join Forces to Deliver Next Generation Audio
On your Wrist and in Space; Intrinsic ID is Everywhere. Come Find us at Key Industry Tradeshows in April
EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices
Synopsys Introduces the Industry's First Emulation System with Unmatched Capacity to Enable Electronics Digital Twins of Advanced SoCs
Softbank reduces Alibaba holding to 3.8%
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