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Saturday, July 29, 2023

• PCIe Eyes Road Ahead with AI, Automotive

Thursday, July 27, 2023

• IPCEI: Germany and France bet on joint EU platform for sustainable industry
• Infineon Technologies Utilizes Recyclable PCBs for Sustainable Electronics
• TSMC opens global R&D centre for 1nm push

Wednesday, July 26, 2023

• Creonic Unveils CCSDS 131.2 Wideband Modulator IP Core Achieving 1 GSymb/s
• A methodology for turning an SoC into chiplets
• Intel Looks to Regain Semiconductor Chip Leadership from TSMC; Separates Manufacturing and Fabless Units

Wednesday, July 26, 2023

• YorChip launches UniPHYâ„¢ - the first dual-use PHY for Chiplets

Tuesday, July 25, 2023

• GlobalFoundries Criticizes Germany's Subsidy of TSMC
• Worldwide Silicon Wafer Shipments Rise in Q2 2023, SEMI Reports
• Arm and industry leaders launch Semiconductor Education Alliance to address the skills shortage
• Intrinsic ID Announces QuiddiKey 100 - Providing a Strong Root of Trust Solution for Internet Connected Devices
• Two IP announcements herald a new normal in chip world

Monday, July 24, 2023

• Soitec Reports FY'24 First Quarter Revenue
• ARMv8 boost for Tegrion security controller
• A methodology for turning an SoC into chiplets
• YorChip launches UniPHY™️ - the first dual-use PHY for Chiplets
• Mobiveil and InPsytech Announce Successful Inter-Op Verification of Enterprise Flash Controller Design IP and ONFI 5.1 PHY IP
• Faraday Reports Second Quarter 2023 Results

Sunday, July 23, 2023

• Sustainability and Digitalization: The Road to Tech-Positive
• Promising Returns For Synopsys.ai Suite Of AI Solutions
• Siemens launches assistive AI solution for IC design and verification
• RISC-V Moving Toward Open Server Specification
• Cadence RTL design tool claims 5x faster RTL convergence
• Singapore opens US$2bn chiplet factory
• Chip Experts See Talent Shortage as Main Growth Hurdle
• 12bit 640Msps Dual-Channel IQ ADC High-Speed/High-Performance IP Cores for WiFi RF SoC is available for immediate licensing
• Has the electronics market bottomed out?
• Could AMD use IFS?

Friday, July 21, 2023

• IoT security label planned for smart consumer IoT devices in U.S.

Thursday, July 20, 2023

• Thalia raises $2.7m for IP reuse tool
• The revolutionary potential of 3D IC technology in the semiconductor ecosystem
• TSMC Reports Second Quarter EPS of NT$7.01
• Cadence to Acquire Rambus PHY IP Assets

Wednesday, July 19, 2023

• Schneider takes lead to decarbonise semiconductor value chain
• SK hynix adopts Siemens' Polarion to help gain Korea's first ASPICE certification
• Arm expands open-source partnerships to reinforce commitment to open collaboration
• Synopsys Accelerates Advanced Chip Design with First-Pass Silicon Success of IP Portfolio on TSMC 3nm Process
• Semidynamics announces fully customisable, 4-way, Atrevido 423 RISC-V core for big data applications
• Thalia Secures $2.7 Million Funding to Strengthen Position as Leading IP Reuse Partner for Semiconductor Industry
• BrainChip's Latest US Patent Award Extends Intellectual Property Strength and its Leadership in Edge Learning

Tuesday, July 18, 2023

• Minimize Design Risk and Achieve First-Pass Silicon Success on TSMC's N3E Process
• HCL Technologies US$ 300 Million Bet on India's Semiconductor Industry
• VSORA Announces All-in-One Single Chip Architecture to Meet Generative AI Processing Challenges
• How China is Building an Open National Chip Plan Around RISC-V
• Schneider Electric Partners with Intel and Applied Materials to Decarbonize Semiconductor Value Chain
• How semiconductor firms are chipping in on sustainability
• Passport for a sustainable European electronics supply chain
• VSORA reveals Jotunn generative AI processor
• Cadence, GlobalFoundries, Hoerzentrum Oldenburg and Leibniz University Hannover Collaborate to Advance Hearing Aid Technology
• Lightelligence Partners With ZeroPoint Technologies to Increase Data Center Connectivity Performance by Up to 50%
• Expedera Announces LittleNPU AI Processors for Always-Sensing Camera Applications
• New Wave Design and Verification Appoints Ike Song to Advisory Committee

Monday, July 17, 2023

• Samsung Shipping First GAAFET Silicon; 3nm and 4nm Yields Are Improving - Report
• OmniSpeech, Cadence Tensilica team up on voice AI technology
• Startups Help RISC-V Reshape Computer Architecture
• DENSO Adopts Attopsemi's OTP to Upgrade Future Automotive Products