Search News

Thursday, January 12, 2023

• Cadence Now Supports Dolby Atmos for Cars
• Certus Semiconductor releases ESD library in GlobalFoundries 12nm Finfet process
• Imagination collaborates with Synopsys to accelerate 3D visualisation in mobile and data centre
• Alphawave to outline long-term strategy and financial targets
• Alphawave Semi: Q4 2022 Trading and Business Update

Thursday, January 12, 2023

• Arteris Announces New Employment Inducement Grants

Wednesday, January 11, 2023

• Andes Unveils Details of its Entry Level D23 RISC-V Processor Core
• The Importance of 3D IC Ecosystem Collaboration
• Apple to replace Broadcom IC with in-house designed part
• EDA Tools for Analog: Where Do I Go From Here?
• VSORA Secures $4.2 Million in Financing from Otium Capital, Angel Investors
• Chipletz selects Siemens' EDA solutions for its Smart Substrate IC packaging technology
• TSMC Reports Fourth Quarter EPS of NT$11.41
• Creonic DVB-GSE Encapsulator and Decapsulator IP Cores Are Now Available with Data Rates of up to 4Gbit/s
• Alphawave IP Announces Appointments to its Executive Leadership team

Tuesday, January 10, 2023

• ADAS Back in the Driver's Seat at CES 2023
• Bluespec collaborates with Synopsys to address growing verification demands for RISC-V design community
• Quantum Computing–Top Questions Answered
• Samsung and SK Hynix planing to procure fewer silicon wafers
• PDF Solutions and proteanTecs Announce Collaboration to Deliver Combined Solutions for Semiconductor Analytics to Address the Needs of Data Centers and Automotive Makers
• Imagination's IMG DXT GPU unlocks scalable, premium ray tracing for all mobile gamers

Tuesday, January 10, 2023

• €270m for RISC-V chiplets to build European exascale supercomputers

Monday, January 9, 2023

• Capgemini Reinforces Its Focus On Global Industries And Sustainability Services With Top Leadership Appointments
• Nvidia, Intel team up on energy efficient AI server
• Quad-core Risc-V development board with 3D GPU in Pico-ITX
• IntelÂ’s Process Progress
• Samsung Foundry Achieves "Perfect Level" 3nm Yield Rates, Levelling up to TSMC
• Semiconductor and Embedded Systems Architecture Labs (SEAL) makes new technology available to everyone for learning and innovation
• Arteris Acquires Semifore to Accelerate System-on-Chip Development
• RISC-V SBC VisionFive 2 Officially Shipped
• TSMC December 2022 Revenue Report
• Tachyum Closes DDR5 Timing at over 6400MT/s Providing Massive Bandwidth for Prodigy Chip
• Preparing engineering students with technology skills for the industrial world
• Global Semiconductor Sales Decrease 2.9% Month-to-Month in November
• Ceremorphic Introduces Custom Silicon Development for Advanced Nodes Using In-House Technology to Speed Customer HPC Chip Development

Sunday, January 8, 2023

• All the PCIe 5.0 SSDs Coming Out in the Next Year or So
• Supermicro launches Arm-powered servers
• MIPS Rolls Out Its First RISC-V Processor Core – It's a Big 'Un
• CEVA Audio Front End Software Solution Becomes Alexa Voice Service (AVS) Qualified
• Rapid Silicon Announces $30M Series A Round
• CCSDS AR4JA LDPC Encoder and Decoder FEC IP Core Available For Licensing and Implementation from Global IP Core
• Display Port/eDisplay Port v.1.4 Tx-Rx PHY & Controller Silicon Proven IP Cores with high Bandwidth and 4K/8K Resolution is ready for immediate licensing
• Digital Blocks AMBA Peripherals I3C, I2C, eSPI, xSPI Controller IP Core Families Extend Leadership with enhancements containing feature-rich, system-level integration features.

Thursday, January 5, 2023

• Sino Wealth License and Deploy CEVA Bluetooth® Low Energy IP for its Connectivity MCUs
• Cadence Tensilica HiFi DSP Enables Highly Energy-Efficient Audio Playback for Dolby Atmos for Cars
• UMC Reports Sales for December 2022

Wednesday, January 4, 2023

• VESA Showcases Product Demos Supporting DisplayPort 2.1 and Other High-Performance Video Standards at CES 2023
• SNIA Spec Gets Data Moving in CXL Environment
• SkyWater Technology Expands Borrowing Capacity by Closing New $100 Million Senior Secured Revolving Credit Facility
• Syntiant Unveils NDP115 Neural Decision Processor at CES 2023
• Ventana Introduces CES Audience to World's Highest Performance RISC-V CPU, Veyron V1
• SpacemiT makes important breakthroughs in RISC-V High-Performance Cores
• CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution
• €270m for RISC-V chiplets to build European exascale supercomputers
• GUC Monthly Sales Report - December 2022
• Dolphin Design and Neovision joint forces to make AI processing viable for ambient computing electronics

Tuesday, January 3, 2023

• intoPIX shows the new lightweight video compression standards and technologies driving automotive at CES 2023
• CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances
• Google announces official Android RISC-V support
• intoPIX shows the new lightweight video compression standards and technologies driving automotive at CES 2023
• CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances

Monday, January 2, 2023

• RISC-V chip to drive next generation app store of hearables
• RISC-V Summit 2022: All Your CPUs Belong to Us
• Estimated Shipments of iPhone 14 Devices in 2022 Have Been Lowered to 78.1 Million Units Due to Impact of COVID-19 Lockdown on Foxconn's Base in Zhengzhou, Says TrendForce
• RISC-V Summit 2022: All Your CPUs Belong to Us
• Edge Impulse and BrainChip Partner to Further AI Development with Support for the Akida platform
• Weebit Nano tapes-out first 22nm demo chip