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Tuesday, January 25, 2022
Rambus Delivers PCIe 6.0 Controller for Next-Generation Data Centers
UMC Reports 30.5% YoY Jump in Q4 2021 Revenue
Soitec CEO Succession Causing Serious Dissension
DVB-S2X/S2/S/T2/T/C Combo Demodulator & Decoder IP Core licensed to - Asia's leading TV Semiconductor Company
Ceremorphic Exits Stealth Mode; Unveils Technology Plans to Deliver a New Architecture Specifically Designed for Reliable Performance Computing
CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets
Thalia launches next generation IP reuse tools for smarter, more agile semiconductor product development
Jerome Nadel Joins BrainChip as Chief Marketing Officer
Analog IP supplier Agile Analog builds footprint in Asia-Pacific with new sales and engineering operation based in Taiwan
Report: Nvidia prepares to abandon Arm deal
Monday, January 24, 2022
The Future of Embedded FPGAs – eFPGA: The Proof is in the Tape Out
NucleiSys Adopts Breker's System Coherency TrekApp
CFX announces commercial availability of anti-fuse OTP technology on 55nm Logic process
Sunday, January 23, 2022
Four Important Wi-Fi Design Trends Worth Watching in 2022
NSITEXE taps Green Hills for RISC-V safety software
A Quantum Computer with 5,000+ Qubits Now in Europe
Kalray Enters into Exclusive Negotiations for the Acquisition of Arcapix Holdings Ltd, a Leading Provider of Software-defined Storage Solutions for Data-intensive Applications
Imagination wins Linley Group 2021 Analysts' Choice Award
Forecasters Foresee a $600B Chip Industry
BrainChip Reflects on a Successful 2021, with Move to Market Readiness Behind Next-Generation Edge-Based AI Solutions
Weebit Nano demonstrates its first crossbar ReRAM arrays
Prepare for chip recession says analyst
Cadence Announces Full DRAM Verification Solution for Automotive, Data Center, and Mobile Applications
MPEG LA Offers One-Stop License for ATSC 3.0
Real Wireless Research Shows One Third Reduction for Private Network Infrastructure Cost Using AccelerComm 5G physical layer IP solution
AI expands HBM footprint
Wi-Fi ax + BLE v5.3 + 15.4, 2.4GHz RF Transceiver IP core in 22nm, licensed to a Chinese customer for IoT chipset
Thursday, January 20, 2022
Kalray Enters into Exclusive Negotiations for the Acquisition of Arcapix Holdings Ltd, a Leading Provider of Software-defined Storage Solutions for Data-intensive Applications
Access Advance Welcomes HONOR to the HEVC Advance Patent Pool
Wednesday, January 19, 2022
Siemens collaborates with UMC on design kits for automotive and power applications
Amcor announces strategic investment in PragmatIC Semiconductor
Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip's Data Center Solutions SoC Development
Seeing Machines Might Be the Next Arm
Secure-IC Raises €20 Million to Accelerate the Deployment of its Cybersecurity Solutions for Connected Objects
Morello research program hits major milestone with hardware now available for testing
Wi-Fi Alliance 2022 Wi-Fi trends
Tuesday, January 18, 2022
Soitec Board Announces CEO Succession Plan - Pierre Barnabe To Succeed Ceo Paul Boudre At The Close Of The July 2022 Shareholders Meeting
Chip designer Alphawave gets 225% sales boost following IPO woes
TSMC price hike expected to impact CPUs and graphics cards this year
Samsung Reportedly Aims to Overtake TSMC's Foundry Business by 2030
Atmosic Announces $72 Million in Additional Funding and Launches New Bluetooth 5.3 SoC Family with Energy Harvesting Technology
NSITEXE and Green Hills Software Partner on RISC-V Solutions
MediaTek Shows The World's First Live Demos of Wi-Fi 7 Technology to Customers and Industry Leaders
Silex Insight integrates cryptographic coprocessor with Mbed TLS 3.x
Gartner Says Worldwide Semiconductor Revenue Grew 25.1% in 2021, Exceeding $500 Billion For the First Time
Arm Predicts Stagnation if Nvidia Deal Fails
Monday, January 17, 2022
MPEG-H Audio selected as sole mandatory audio system for Brazil's next-generation TV 3.0 broadcast service
Mercedes Applies Neuromorphic Computing in EV Concept Car
Airbus Selects Siemens Capital Software for E/E Systems Development
EnSilica and Omni Design Collaborating on Multiple SoCs
Imagination and Andes jointly validate GPU with RISC-V CPU IP
MIPI Alliance Releases A-PHY v1.1, Doubling Maximum Data Rate and Adding New Implementation Options to Automotive SerDes Interface
QuickLogic Announces Large Display Bridge Purchase Order and Provides Preliminary Selected Fourth Quarter Fiscal 2021 Financial Results
L&T Technology Services wins USD45 million EV deal from U.S. Auto Tier-1
Successful Transmission of High-Quality, Ultra-Low-Latency Video over 60 GHz Wireless Communications System
Faraday IP Solutions Certified by SGS-TUV for ISO 26262 ASIL-D Ready
BrainChip Achieves Full Commercialization of its AKD1000 AIoT Chip with availability of Mini PCIe Boards in high volume
IC Sales Seen Growing by Double-Digits for Third Year in a Row
Sunday, January 16, 2022
Fraunhofer's MPEG-H Audio selected as the sole mandatory audio system for Brazil's next-generation TV 3.0 broadcast service
Electronic System Design Industry Logs 17% Year-Over-Year Revenue Growth in Q3 2021, ESD Alliance Reports
Deep Vision Adopts SiFive RISC-V to Add OpenCV-Enabled AI Support
TSMC's 2022 Expansion Budget Exceeds $40 Billion
MIPI UFS 3.1, M-PHY 4.1, Unipro 1.8, ONFi 4.1 and many more IP Cores are available for immediate licensing for your advanced UFS Device Applications as a complete bundled solution
Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems
Baikal Electronics allies with IP-cores domestic developer
Alphawave IP: Q4 2021 Trading and Business Update
Thursday, January 13, 2022
Ceva Adds Homogenous AI Acceleration to Third-Gen Engine
SmartDV Joins Open RF Association
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