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Monday, February 10, 2025

• Groundbreaking Formal Verification Further Enhances the Quality of CHERIoT-Ibex
• ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio
• intoPIX Drives Innovation in Automotive Ethernet and Data Transmission

Monday, February 10, 2025

• Exploring Rapidus' Path to 2nm Mass Production: 3 Key Challenges Ahead
• Rambus to Present at Loop Capital Expert Call and Morgan Stanley Technology, Media & Telecom Conference

Sunday, February 9, 2025

• Veriest Solutions Strengthens North American Presence at DVCon US 2025
• Gartner Says Worldwide Semiconductor Revenue Grew 18% in 2024
• CEA-Leti Announces FAMES Pilot Line In Nature Reviews Electrical Engineering
• SoftBank in talks to buy server chip firm Ampere
• CEA-Leti Announces FAMES Pilot Line in Nature Reviews Electrical Engineering
• T2M IP Announces Licensing of ASIL-B Qualified CAN XL, QSPI, LIN 2.0, I2C IP Cores to Leading Automotive Customer
• QuickLogic Unveils Aurora 2.9: Enhanced Performance and Seamless Integration
• QuickLogic Integrates Synopsys Synplify Synthesis for Best-in-Class Quality of Results
• EnSilica: Unaudited Results for the Half Year Ended 30 November 2024
• TSMC January 2025 Revenue Report and the Statement on the Impact of Earthquake
• Logic Fruit Announces Strategic Partnership with PACE at Aero India 2025
• Qualcomm says Arm has withdrawn license breach notice
• Onsemi's Treo Taps Weebit ReRAM
• EnSilica: Unaudited Results for the Half Year Ended 30 November 2024
• Gelsinger Invests In British AI Chip Startup Fractile
• CEA-Leti Announces FAMES Pilot Line In Nature Reviews Electrical Engineering
• UMC Reports Sales for January 2025
• Silicon Creations Expands Clocking IP Portfolio on TSMC N2P Technology including Novel Temperature Sensor Design

Thursday, February 6, 2025

• High-Performance 16-Bit ADC and DAC IP Cores Now Available for Licensing
• Samsung Foundry 2 nm initial yields highly promising after last year's 3 nm struggles

Wednesday, February 5, 2025

• Axiomise Launches footprint, Area Analyzer for Silicon Design
• Why UCIe is Key to Connectivity for Next-Gen AI Chiplets
• Arm Holdings plc Reports Results for the Third Quarter of the Fiscal Year Ended 2025
• Post-Quantum Cryptography–Securing Semiconductors in a Post-Quantum World
• Intel partners with Japanese research institution for next-generation quantum computer

Tuesday, February 4, 2025

• Mirabilis Design Adds System-Level Modelling Support for Industry-Standard Arteris FlexNoC and Ncore Network-on-Chip IPs
• GlobalFoundries Announces Leadership Transition to Drive Next Phase of Growth
• Accellera Board Approves Universal Verification Methodology for Mixed-Signal (UVM-MS) 1.0 Standard for Release
• Ceva-Waves Wi-Fi 6 IP Powers WUQI Microelectronics Wi-Fi/Bluetooth Combo Chip
• Cadence Virtuoso Studio advanced optimization enhances MediaTek's efficiency by 30%
• Global semiconductor revenue to hit $705 billion in 2025 on rising AI demand
• Arm Reports Record Revenue in Q3

Monday, February 3, 2025

• Dolphin Semiconductor strengthens its governance with two key Board appointments
• RISC-V in Space Workshop 2025 in Gothenburg
• intoPIX Unveils Cutting-Edge AV Innovations at ISE 2025
• Rambus Reports Fourth Quarter and Fiscal Year 2024 Financial Results
• CoMira Solutions unveils its new 1.6T Ethernet UMAC IP
• TSMC plans for 1nm-capable gigafab in Tainan, says report
• CHERI Protects Memory at the Hardware Level
• OpenAI, SoftBank tap Samsung for Stargate AI initiative
• The First Step to a Quantum-Safe Future With Samsung Knox
• Predictions for Multi-Die System Designs in 2025

Sunday, February 2, 2025

• UK Space Agency Awards EnSilica £10.38m for Satellite Broadband Terminal Chips
• Intel Halts Products, Slows Roadmap in Years-Long Turnaround
• UK Space Agency Awards EnSilica £10.38m for Satellite Broadband Terminal Chips
• TSMC Accelerates Efforts To Achieve 1nm Production, Plans To Set Up "Giga Fabs" In Taiwan
• AI chips in 2025: Smaller, faster, smarter
• Cadence aims to strengthen its presence in India's growing data center sector

Friday, January 31, 2025

• Forget CPUs! RaiderChip Has a Hardware-Based Generative AI Accelerator
• European Commission Funds €3 Million ($3.1 Million USD) Quantum Chip Project to Address Scalability Challenges

Thursday, January 30, 2025

• Rapidus aims to deploy 10 EUV machines for 2nm chip production in Japan
• Cadence: Leveraging Sustainability for a Competitive Edge
• Europe approves €48m for Envision AESC French battery gigafactory
• Barcelona will host a new quantum computer at the BSC-CNS

Wednesday, January 29, 2025

• Keysight and KD Partner to Advance Multigigabit Optical Automotive Ethernet Testing with New Signal Analysis Capability
• Ceva, Inc. Appoints Amir Faintuch to its Board of Directors
• Quadric Opens Subsidiary in Japan with Industry Veteran Jan Goodsell as President
• Codasip and RED Semiconductor Sign Memorandum of Understanding to Develop AI Acceleration Technologies
• intoPIX and EvertzAV Strengthen IPMX AV-over-IP Interoperability with Groundbreaking JPEG XS TDC Compression Capabilities at ISE 2025
• Baya Systems Welcomes Manish Muthal and Siva Yerramilli to Board of Directors
• Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors
• EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
• Intel 18A Process Technology Simply Explained
• Synopsys makes a bold prediction
• Poland Advances Development of Military Quantum Computer Prototype, Source Says
• More than €1 billion from the European Defence Fund to develop next generation defence technologies and innovation