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Thru-Silicon Vias, Current State of the TechnologyPackage Matters - Javier DeLaCruzJan. 31, 2011 |
Ready for primetime in ASICs…almost
Thru-silicon-vias (TSVs) have become a very hot topic in in recent months. Ever since Xilinx reported that they are using a 2.5D TSV approach for their Virtex-7 FPGAs (http://bit.ly/ayfOgy), the industry started to salivate with the prospects of this new technology. While this technology may be accessible for larger stacked memory, FPGAs, MEMS devices, and CMOS image sensors, this does not inherently mean it is ready for ASIC applications. Before we get into some of the details, it is important we take a moment to calibrate with the terminology used in this space.
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