20 Most Popular News

Updated: Wed, 30 Apr 2025 01:00:02 +0200

Today		Yesterday
	1	1	QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip This milestone marks the first time eFPGA Hard IP has been delivered for a sub-5nm process node and is expected to set new standards for low power consumption, high performance, and optimal silicon area utilization (PPA).
	2	8	Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration Building on a series of recent collaborations, Siemens has achieved certification for its Calibre® nmPlatform software suite—including nmDRC, nmLVS, Calibre® YieldEnhancer™, and PERC™ tools—alongside its Analog FastSPICE (AFS) and Solido™ solutions, for TSMC’s cutting-edge N2P and A16 processes.
	3	7	Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale Aion Silicon (formerly Sondrel), a premier ASIC/SoC architecture and design partner, today announced it has joined the Intel Foundry Accelerator Design Services Alliance.
	4	5	TSMC Unveils Next-Generation A14 Process at North America Technology Symposium A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency. It is also expected to enhance smartphones by improving their on-board AI capabilities, making them even smarter. Planned to enter production in 2028, the current A14 development is progressing smoothly with yield performance ahead of schedule.
	5	2	BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation BOS and Intel co-promote Automotive AI solution to China and global customers at AutoShanghai 2025 event using BOS Eagle-N and Intel Malibou-lake system.
	6	3	Baya Systems, Imagination Technologies and Andes Technology to Present on Heterogeneous Compute Architectures at Andes RISC-V CON Silicon Valley In a joint developer track session with Imagination Technologies and Andes Technology, Baya chief software architect Dr. Eric Norige and Imagination director of product management Pallavi Sharma will present on heterogeneous system-on-chip (SoC) strategies designed to optimize performance for AI, machine learning and graphics-intensive workloads.
	7	New!!!	New Audio Sample Rate Converter (ASRC) IP Core from CAST Offers Versatility with High Fidelity Synchronous and asynchronous ASRC has a broad channel capacity, high conversion ratios, and fast performance, all with outstanding low distortion.
	8	10	NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips NEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened electronic subsystems to support future space missions.
	9	New!!!	VeriSilicon Launches the Industry-Leading Automotive-Grade Intelligent Driving SoC Design Platform The newly launched automotive-grade high-performance intelligent driving SoC design platform adopts a flexible, configurable architecture, supporting efficient collaboration among multiple co-processors, including high-performance multi-core Central Processing Units (CPUs), image signal processors, video codecs, and neural network processors.
	10	6	Premier ASIC and SoC Design Partner Rebrands as Aion Silicon Trusted Semiconductor Design Partner Combines Deep Expertise with a Fresh Vision to Deliver High-Performance Custom Chip Solutions for AI, Automotive, 5G, networking, and other applications
	11	9	Xylon Introduces Xylon ISP Studio Xylon ISP Studio is a powerful PC-based tool designed to simplify and accelerate HDR Image Signal Processing (ISP) pipeline development and tuning on AMD FPGA and adaptive SoC platforms.
	12	14	Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership Siemens Digital Industries Software today announced that it has signed an exclusive OEM agreement for its EDA business to bring Alphawave Semi’s portfolio of high-speed interconnect silicon IP to market through its sales channel.
	13	4	Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices Crypto Quantique announces a new lightweight root-of-trust (RoT) IP block to enable security feature implementation in resource-constrained microcontrollers and IoT devices. Called QRoot Lite, the implementation complies to the Measurement & Attestation RootS of Trust (MARS) specification developed by the Trusted Computing Group (TCG) as a lightweight, hardware security IP block for measurement, storage and reporting to attest to the health and trustworthiness of embedded IoT devices and sensors.
	14	11	Wi-Fi 7 (802.11be) RF Transceiver IP Core Ready for High Speed Wireless Connectivity Applications T2M IP, a leading provider of semiconductor IP cores and advanced connectivity solutions, today announced the availability of its partner’s next-generation Dual-Band Wi-Fi 7 RF Transceiver IP Core with an integrated Front-End Module (FEM).
	15	17	Alphawave IP Response to announcement from Qualcomm Alphawave is confident in its strategy to become a leading semiconductor company and the value this will deliver for shareholders. There can be no certainty that any firm offer will be made nor as to the terms on which any offer might be made and accordingly shareholders are advised to take no action.
	16	20	S2C and Andes Technology Announce FPGA-Based Prototyping Partnership to Accelerate Advanced RISC-V SoC Development S2C, a global leader in FPGA-based prototyping solutions, and Andes Technology, a premier provider of high-performance, low-power RISC-V processor IP solutions, today announced the results of a strategic collaboration designed to significantly enhance FPGA prototyping capabilities for developers of advanced System-on-Chip (SoC) devices.
	17	New!!!	BrainChip Collaborates with Chelpis-Mirle on Security Solution BrainChip today announced that Chelpis Quantum Corp. has selected its Akida AKD1000 chips to serve as the processor for built-in post-quantum cryptographic security.
	18	New!!!	Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC's A16 and N2P Process Technologies Cadence today announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through certified design flows, silicon-proven IP and ongoing technology collaboration.
	19	16	Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks Alphawave Semi’s platform of ready-to-integrate subsystem IP for 64G UCIe, 224G SerDes, 800G/1.6T UALink and UEC plus reference chiplet architecture designs will underpin future AI deployments
	20	New!!!	Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform Andes Technology in collaboration with Imagination Technologies today announces the successful demonstration of Android 15 (Vanilla Ice Cream) running on a high-performance RISC-V-based hardware system.

20 Most Popular News

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