D&R Headline News (Last 14 Days)

Headlines for Friday Dec. 03, 2021

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FTC Sues to Block $40 Billion Semiconductor Chip Merger

The Federal Trade Commission today sued to block U.S. chip supplier Nvidia Corp.’s $40 billion acquisition of U.K. chip design provider Arm Ltd. Semiconductor chips power the computers and technologies that are essential to our modern economy and society.

• CAST Introduces 8K Video Codecs and Advanced Image Signal Processing IP Cores
• Imagination B-Series GPU IP selected for Innosilicon graphics card

Headlines for Thursday Dec. 02, 2021

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SiFive Raises RISC-V performance bar with New Best-in-Class SiFive Performance P650 Processor

The SiFive Performance P650 processor is expected to be the fastest licensable RISC-V processor IP core in the market, bringing RISC-V into new markets and applications, and will debut to lead partners in Q1 2022.

• RISC-V International Ratifies 15 New Specifications, Opening Up New Possibilities for RISC-V Designs
• Synopsys Extends Industry Leadership as Customers Surpass 500 Tapeouts Using Flagship Fusion Compiler Solution
• Codasip appoints Ron Black as CEO
• Andes RISC-V Superscalar Multicore A(X)45MP and Vector Processor NX27V Upgrade Their Spec. and Performance
• HPMicro Semiconductor Announces the Release of the HPM6000 Series of Microcontrollers with AndesCore Dual D45 Cores
• Alphawave IP: Acquisition of Precise-ITC and completion of major milestones for China Product Partnership

Headlines for Wednesday Dec. 01, 2021

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First SoC ever to pass CC EAL5+ certification thanks to Tiempo Secure TESIC Secure Element IP

For the first time in the world, a complex System-on-Chip (SoC) such as Sequans 5G-ready LTE-M and NB-IoT Monarch 2 platform for the Internet of Things has just received the Common Criteria (CC) EAL 5+ certification with a Target of Evaluation based on Tiempo Secure TESIC Secure Element IP.

• Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud
• Agnisys Delivers Novel AI Technology and FPGA Support for IP and SoC Specification Automation
• Flex Logix Joins the Edge AI and Vision Alliance
• Arteris Announces Financial Results for the Third Quarter 2021 and Estimated Fourth Quarter and Full Year 2021 Guidance
• Arasan Chip Systems announces Immediate availability of MIPI I3C PHY I/O IP
• LeapMind Announces Efficiera v2 Ultra-Low Power AI Inference Accelerator IP
• videantis achieves Automotive SPICE Level 2 certification

Headlines for Tuesday Nov. 30, 2021

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IAR Systems and Codasip collaborate to enable low-power RISC-V based applications

IAR Systems®, the world leader in software tools and services for embedded development, and Codasip, the leading supplier of customizable RISC-V processor IP, today announced their partnership enabling joint customers to build low-power embedded applications based on RISC-V.

• CEO interview: Minima's Tuomas Hollman on why static timing sign-off is over
• MIPS selects Imperas Reference Models for RISC-V Processor Verification
• Micron and UMC Announce Global Settlement
• Key ASIC Signed LOI to Acquire Wafer FAB in The US

Headlines for Monday Nov. 29, 2021

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intoPIX Unveils "TicoXS FIP" During its ProAV Virtual Event This Week

Not yet officially announced but not exactly a secret either; intoPIX, leading expert in video compression for ProAV, has again extended its large range of JPEG XS codecs with the addition of the Flawless Imaging Profile (FIP) in its revolutionary “TicoXS FIP” Codec.

• Silicon Catalyst Partners with Sony Semiconductor Solutions to Accelerate Semiconductor Startups
• Synopsys Expands Use of AI to Optimize Samsung's Latest Mobile Designs
• Profile of a traceability tool promising automation in SoC designs
• USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP cores with Superfast speed and High-power efficiency for lag-less data processing is Silicon Proven and available in 8nm LPP for licensing

Headlines for Thursday Nov. 25, 2021

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Samsung Selects Texas as Site for $17 Billion Fab

Samsung has chosen a small Texas town near Austin as the site of a $17 billion chip fab, supporting the U.S. effort to strengthen its domestic electronics supply chain.

• GPU shipments increase year-over-year in Q3
• Microchip Adds Second Development Tool Offering for Designers Using Its Low-Power PolarFire RISC-V SoC FPGA for Embedded Vision Applications at the Edge
• SynSense and Prophesee partner to combine neuromorphic engineering expertise for developing one-chip event-based smart sensing solution for ultra-low power edge-AI
• The Democratization of Chip Design
• WiLAN Subsidiary Acquires Wired Connectivity Patent Portfolio
• North American Semiconductor Equipment Industry Posts October 2021 Billings
• Siemens receives three 2021 TSMC OIP Partner of the Year awards for next-generation design enablement
• AMIQ EDA Joins OpenHW Group and Contributes Linting Capabilities for CORE-V Open-Source RISC-V Cores and Testbenches

Headlines for Wednesday Nov. 24, 2021

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VeriSilicon Image Signal Processor IP Achieved ISO 26262 Automotive Functional Safety Certification

VeriSilicon (688521.SH), a leading Silicon Platform as a Service (SiPaaS®) company, today announced its Image Signal Processor (the Vivante ISP) IP ISP8000L-FS V5.0.0, designed for advanced and high-performance camera applications, has now been certified ASIL-B as Safety Element out of Context (SEooC) in compliance with the ISO 26262 standard.

Headlines for Tuesday Nov. 23, 2021

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CEVA SensPro Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic)

SensPro has already been licensed by multiple leading automotive semiconductor players for next-generation automotive SoCs. As an automotive IP supplier, the SensPro safety certification reflects the company’s commitment to a safety-focused design methodology for its processors, tools and software targeting automotive applications.

• Grovf Inc. Releases Low Latency RDMA RoCE V2 FPGA IP Core for Smart NICs

Headlines for Monday Nov. 22, 2021

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MediaTek and TSMC Unveil the World's First 7nm 8K Resolution Digital TV System-on-Chip

MediaTek and TSMC today unveiled the world’s first 7-nanometer 8K digital TV flagship system-on-chip (SoC), the MediaTek Pentonic 2000. Built with TSMC’s N7 advanced process technology, the MediaTek Pentonic 2000 offers unparalleled performance and power efficiency with features including powerful artificial intelligence (AI) engines, Motion Estimation and Motion Compensation (MEMC), Versatile Video Coding (VVC) decoding and picture-in-picture (PiP) technology.

• BrainChip Partners with MegaChips to Develop Next-Generation Edge-Based AI Solutions
• Announcing superfast, HD Audio & Video through HDMI 2.0 Tx & Rx PHY & Controller IP Cores uncompressed data transfer in 28HPC+ and 12FFC!
• Codasip Adopts Imperas for RISC-V Processor Verification

Headlines for Friday Nov. 19, 2021

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Elmos adopts Arm Cortex-M IP for its next-generation automotive MCU based product family

Elmos Semiconductor SE (FSE: ELG) today announced a long-term partnership with semiconductor IP leader Arm, whose energy-efficient processor designs have enabled advanced computing in more than 200 billion chips to date.

Headlines for Thursday Nov. 18, 2021

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sureCore designs special high performance multi-port memory for Semidynamics AI chip

sureCore, the embedded memory specialist, has designed a power and area efficient, high performance, multi-port, embedded memory solution for Semidynamics’ new RISC-V-based, tensor processing chip.

• Annual Revenue Growth to Skyrocket Among Top 25
• UK Widens Probe of Nvidia-Arm Deal
• Imperas Models - reference for the newly ratified RISC-V Specifications
• GlobalFoundries, Ford to Address Auto Chip Supply and Meet Growing Demand
• Access Advance Welcomes ZTE as a Licensor and Licensee of the HEVC Advance Patent Pool
• Samsung and Its Foundry Partners Reveal Solutions for a Strong Design Infrastructure at 3rd SAFE Forum 2021
• DCD-SEMI joins CAN in Automation, a leading CAN manufacturers' group
• DVB-S2X/S2/S/T2/T/C Combo Demodulator/Decoder IP Cores licensed to America's leading TV Semiconductor Company