D&R Headline News (Last 14 Days)

Headlines for Monday Feb. 18, 2019

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Chips&Media paving new road towards 8K with launch of Dual-CORE HEVC+H.264 combined codec IP

Chips&Media, a leading video technology provider, announced WAVE541C, Dual-CORE HEVC+H.264 combined codec IP optimally architected for 8K resolution video based on WAVE521C.

• TSMC January 2019 Revenue Report
• Palma Ceia SemiDesign Announces Silicon-Proven Dual Band LTE NB-IoT Transceiver for IoT Applications

Headlines for Friday Feb. 15, 2019

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UltraSoC extends on-chip analytics architecture for the age of machine learning, artificial intelligence and parallel computing

Developers in the automotive, storage and high performance computing industries can now integrate even more sophisticated hardware-based security, safety and performance tuning capabilities within their products, as well as reaping substantial time-to-market and cost benefits of using UltraSoC in the system on chip (SoC) development cycle.

• Cadence Selected as Primary EDA Tool Vendor by GLOBALFOUNDRIES
• Can MIPS Leapfrog RISC-V?

Headlines for Thursday Feb. 14, 2019

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Next-generation Armv8.1-M architecture: Delivering enhanced machine learning and signal processing for the smallest embedded devices

We’re introducing Arm Helium technology, the M-Profile Vector Extension (MVE) for the Arm Cortex-M series processors that will enhance the compute performance of the Armv8.1-M architecture on the secure foundation of Arm TrustZone.

• Soitec Becomes Strategic Partner of Silicon Catalyst Start-up Incubator
• Andes Technology Records 1 Billion SoC Shipments in 2018 Based on Its CPU IP and 3.5 Billion Since Inception
• SMIC Reports 2018 Fourth Quarter Results
• SmartDV Unveils SimXL Portfolio of Synthesizable Transactors for Hardware Emulation, FPGA Prototyping Platforms
• UMC Reports Sales for January 2019
• eSilicon builds momentum as a strong tier one FinFET ASIC supplier
• Taiwan Maintains The Largest Share of Global IC Wafer Fab Capacity

Headlines for Wednesday Feb. 13, 2019

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Can Arm Survive RISC-V Challenge?

Arm offers limited flexibility compared to RISC-V or MIPS. No one wants to spend months negotiating license terms under today's cost and time-to-market pressures.

• CEVA, Inc. Announces Fourth Quarter and Year End 2018 Financial Results
• Silicon Creations' PLL Technology Contributes to the First 7nm Mass Production Mining Chip

Headlines for Tuesday Feb. 12, 2019

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Andes Technology Corp. Targets Deeply Embedded Protocol Processing and Entry-level MCUs With the New N22, the Smallest RISC-V Core in its V5 Family

Andes Technology announces the new N22 32-bit RISC-V CPU core to target deeply embedded protocol processing such as high-speed communication and storage, and entry-level MCU applications such as small IoT and wearable devices.

• 200mm Fabs to Add 700,000 Wafers Through 2022, SEMI Reports
• AccelerComm Lands Funding for 5G New Radio and 4G LTE Networks IP
• Achronix Announces Partner Program for Speedster, Speedchip, and Speedcore Ecosystem
• ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly
• Sankalp Semiconductor to Exhibit & Participate at IESA Vision Summit 2019
• Pliops Raises $30 Million in Series B Funding Led by SoftBank Ventures Asia to Transform Data Center Infrastructure for Cloud, AI and ML

Headlines for Monday Feb. 11, 2019

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TDK-Micronas renews its trust in Dolphin Integration's RAM and ROM Silicon IPs

TDK-Micronas, a TDK group company and the most preferred partner for sensing and control, has renewed its trust in Dolphin Integration’s low power and dense RAM and ROM for its 3D Hall magnetic sensor products.

• AIStorm Raises $13.2M to Bring Real-Time AI-in-Sensor Technology to the Edge at a Fraction of the Cost
• GUC Monthly Sales Report - Jan 2019

Headlines for Friday Feb. 08, 2019

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China IC Production Forecast to Show a Strong 15% 2018-2023 CAGR

IC production in China represented 15.3% of its $155 billion IC market in 2018, up from 12.6% five years earlier in 2013.

• SoC-e networking IP porfolio extends with SpaceWire: The standard for Spacecraft communication networks

Headlines for Thursday Feb. 07, 2019

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Apple, Q'comm Fight Over Engineers

The latest battle of the all-out war between Apple and Qualcomm is taking a human toll. The iPhone designer is hiring cellular baseband engineers in San Diego, Qualcomm’s backyard.

• NVMe Over TCP Will Take Time to Eclipse RDMA
• New intoPIX FlinQ Image Technology Empowers Next Generation DM NVX Network AV
• Graphcore leverages Mentor DFT solutions to speed time to market for innovative AI acceleration chip
• Eclipse Ventures Adds Mike McNamara and Sanjay Jha As General Partners

Headlines for Wednesday Feb. 06, 2019

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Logic Design Solutions Introduces the first member of NVMe HOST RECORDER IPs

The NVME-HOST-RECORDER-ITX-Z7 IP completes an existing family of SATA RECORDER IP of Logic Design Solutions (LDS) in order to provide a complete panoply in embedded recording domain.

• Sital Technology Announces the World's First Secured 1553 Component
• SmartDV Supports RISC-V Movement with TileLink Verification IP for RISC-V Based Systems
• Audinate adds intoPIX best-in-class JPEG2000 Technology to new Dante AV Product Design Suite
• Arm takes centre stage at Mobile World Congress 2019
• AdaCore Enhances Security-Critical Firmware With NVIDIA
• EDN Names Achronix's Speedcore Gen4 eFPGA to its Hot 100 Products of 2018

Headlines for Tuesday Feb. 05, 2019

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MuxLab Leverages intoPIX's Ultra Low Latency JPEG 2000 to Manage 4K60 on 1GbE Networks

intoPIX announced today that MuxLab, a forerunner and manufacturer of AV over IP connectivity and distribution solutions, is adopting their JPEG 2000 Ultra Low Latency technology for future AV over IP products.

• Arteris IP FlexNoC Interconnect Used by NationalChip for Set Top Box (STB) Chips
• Xilinx Introduces HDMI 2.1 IP Subsystem

Headlines for Monday Feb. 04, 2019

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Mobile Semiconductor Introduces A New 55nm High Density Memory Compiler Especially Designed For IoT Devices

Mobile Semiconductor announced a new 55nm HD (High Density) memory compiler targeted at the cost sensitive IoT market. The new memory compiler boasts one of the highest density footprints in the industry dramatically reducing the die area and reducing customer product costs for sensors, smart locks, trackers and smart light bulbs.

• Renesas to Cut 1,000 Jobs in Japan
• Gartner Says Four Chinese OEMs Were Among the Top 10 Global Semiconductor Customers in 2018
• Global Semiconductor Sales Increase 13.7 Percent to $468.8 Billion in 2018
• FABU Technology Selects Synopsys' DesignWare IP Portfolio to Deliver Intelligence in ADAS and Autonomous Driving SoCs
• intoPIX and Macnica Preview a 4K AV over 1GbE Module Powered by TICO-XS and ST 2110 IP Transport for Pro AV Market at ISE 2019