D&R Headline News (Last 14 Days)

Headlines for Wednesday Nov. 20, 2019

Top Story

Alereon Adopts Omni Design's Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications

Omni Design Technologies today announced that Alereon, a leader in Ultra-Wideband solutions, has adopted Omni Design’s Analog-to-Digital (ADC) and Digital-to-Analog (DAC) Converters sampling at greater than 1GSPS for its next generation UWB chipset.

• North American Semiconductor Equipment Industry Posts October 2019 Billings
• Credo Joins Open Compute Project (OCP) to Accelerate 400G and Beyond Connectivity Solutions for Hyperscale Datacenters and Telecom
• Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk "I-fuse: A Disruptive OTP Technology"

Headlines for Tuesday Nov. 19, 2019

Top Story

Expanding Universe for HPC, NVIDIA CEO Brings GPU Acceleration to Arm

Broadening support for GPU-accelerated supercomputing to a fast-growing new platform, NVIDIA founder and CEO Jensen Huang Monday introduced a reference design for building GPU-accelerated Arm servers, with wide industry backing.

• Graphcore leveraged Mentor's Questa technologies to verify massive Colossus GC2 AI processor
• UVM-AMS Working Group Formed to Standardize UVM Analog/Mixed-Signal Extensions
• High-speed comms options enable in-life debug and optimization for datacenter, HPC and storage customers
• IntelliProp to Demo World's First UPI to Gen-Z Load/Store Host Adapter at SC19
• EasyIC Design joins Arm Approved Design Partner Program

Headlines for Monday Nov. 18, 2019

Top Story

Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP

Faraday Technology and United Microelectronics today announced the availability of Faraday's fundamental IP on UMC's 22nm ultra-low-power (ULP) and ultra-low-leakage (ULL) processes. The silicon-proven 22ULP/ULL fundamental IP, including multi-Vt standard cell libraries, ECO libraries, IO libraries, PowerSlash™ kit, and memory compilers, offers significant power reduction for the next level of SoC design.

• ArchiTek Select SiFive and DTS-Insight To Enable Next-Generation AI Solution Development
• Intel announces open oneAPI initiative and development beta release with Data Parallel C++ language for programming CPUs, GPUs, FPGAs, and other accelerators
• Synopsys Custom Compiler Adopted by Samsung Foundry to Accelerate IP Design for 5LPE Process Technology with EUV Technology
• Intel to Reclaim Number One Semiconductor Supplier Ranking in 2019
• NUVIA Raises $53 Million to Reimagine Silicon Design for the Data Center
• Moortec To Showcase Its Latest Embedded PVT Monitoring IP For 40nm-5nm At The 2019 ICCAD in Nanjing

Headlines for Friday Nov. 15, 2019

Top Story

Synopsys Completes Acquisition of DINI Group

Synopsys, Inc. (NASDAQ: SNPS) today announced it has completed its acquisition of DINI Group, an established leader in FPGA-based boards and solutions, headquartered in La Jolla, California.

• Diamond Design Software from Lattice Semiconductor Enables Enhanced Security Features for MachXO3D FPGAs
• Gyrfalcon's New Chip Raises Bar (12.6 TOPS/W) on High Performance Edge AI with Lower Power Use

Headlines for Thursday Nov. 14, 2019

• Nordic Semiconductor unveils world's first dual Arm Cortex-M33 processor wireless SoC for the most demanding low power IoT applications
• FlexIC Foundry enables custom flexible integrated circuit design
• Mirabilis Design unveils the first rapid prototyping platform for Artificial Intelligence Processors and Applications
• Gyrfalcon Technology and Sensory Deliver Enhanced AI Biometric Access on Edge Devices

Headlines for Wednesday Nov. 13, 2019

Top Story

Secure-IC and Andes Technology jointly provide cybersecurity enhanced RISC-V cores

Today, Secure-IC, the embedded security solutions provider from France specialized in embedded cybersecurity to protect against attacks, enters a strategic partnership with Andes Technology Corporation (TWSE: 6533), a founding member of the RISC-V Foundation and the leading supplier of 32/64-bit embedded CPU cores with solutions serving in excess of 1-billion diversified SoCs yearly.

• New Cadence UltraLink D2D PHY IP for Die-to-Die Connectivity Enables High-Performance Applications with Cost-Effective Packaging
• Efinix Rolls Out Trion T120 FPGAs
• Rambus Announces Comprehensive PCI Express 5.0 Interface Solution

Headlines for Tuesday Nov. 12, 2019

Top Story

Aerendir Mobile Inc. and SiFive Inc. Collaborate to Accelerate the Adoption of AI-Enabled Processors

Aerendir Mobile Inc. will merge its mathematical deep learning cores and AI infrastructure with innovative SiFive, Inc., RISC-V Core IP to enable a new low-cost board format for deep learning. This combined, unique approach will radically decrease the cost of true AI, allowing it to be enabled at the IoT Edge and End Point, inside affordable devices.

• Silicon Wafer Area Shipments Fall for Fourth Consecutive Quarter
• Synopsys DesignWare ARC Data Fusion IP Subsystem Incorporated by Himax in Their Artificial Intelligence WiseEye ASIC
• Xilinx Vitis Unified Software Platform Now Available for Download
• Xilinx Announces the World's Highest Performance Adaptive Devices for Advanced ADAS and AD Applications
• Blaize Emerges from Stealth to Transform AI Computing
• Rianta Releases Ethernet MAC/PCS/FEC IP Suite for ASICs targeting Datacenter, Networking and 5G Mobile Infrastructure
• GOWIN Semiconductor Releases the First FPGA with Integrated Bluetooth Radio
• Achronix to Showcase 7nm FPGA Solutions at SC19
• SMIC Reports 2019 Third Quarter Result
• New Smart Meter using Adesto's Memory and Communications Technologies Begins Pilot Program in Africa and Middle East
• Mentor introduces Tessent Safety ecosystem to meet IC test requirements of the autonomous vehicles era

Headlines for Monday Nov. 11, 2019

Top Story

eSilicon to be Acquired by Inphi and Synopsys

eSilicon announced today the signing of a definitive agreement with Inphi Corporation to acquire eSilicon. Concurrently, Synopsys announced the signing of a definitive agreement to acquire eSilicon’s embedded memory (SRAM, TCAM, multi-port memory compiler) and interface (HBM and HBI™) IP assets.

• Samsung Foundry Deploys Industry-Leading Synopsys TestMAX XLBIST Dynamic In-System Test Solution for Automotive Safety
• Synopsys to Acquire Certain IP Assets from eSilicon
• Inphi to Acquire eSilicon, a Leading Provider of 2.5D Packaging, SerDes and Custom Silicon
• MediaTek Delivers 112G Long Range SerDes IP, Silicon-Proven on 7nm for ASIC Services
• Accolade Technology Partners with Titan IC in Search Acceleration on FPGA-based SmartNICs and ATLAS Packet Conditioners
• Arasan Announces MIPI D-PHY IP compliant to the latest MIPI D-PHY v2.1 Specifications for TSMC 16nm
• Palma Ceia SemiDesign to Showcase Complete NB-IoT Solution during Synopsys ARC Processor Summit in Beijing

Headlines for Friday Nov. 08, 2019

Top Story

MediaTek's World-Leading 8K DTV SoC in Volume Production on TSMC 12FFC Technology

MediaTek (TWSE: 2454) and TSMC (TWSE: 2330, NYSE: TSM) today announced that the industry’s first 8K digital TV system-on-chip (SoC) manufactured with 12nm technology, the MediaTek S900, has entered volume manufacturing with TSMC.

• UMC Reports Sales for October 2019
• TSMC October 2019 Revenue Report

Headlines for Thursday Nov. 07, 2019

Top Story

CEVA, Inc. Announces Third Quarter 2019 Financial Results

CEVA announced today its financial results for the third quarter ended September 30, 2019. Total revenue for the third quarter of 2019 was $23.5 million, a 10% increase compared to $21.4 million reported for the third quarter of 2018.

• Abaco Announces Industry's First 6U VPX Solution to Feature New Xilinx RF System-on-Chip Technology
• Synopsys VC LP for Low Power Signoff Verification Delivers Up to 5X Runtime Gain at Samsung
• SmartDV to Exhibit at SemIsrael Expo, ICCAD China 2019

Headlines for Wednesday Nov. 06, 2019

Top Story

Top 5 Share of Semiconductor Industry Capex to Set New Record in 2019

The share of semiconductor industry capital spending held by the top five companies (i.e., Samsung, Intel, TSMC, SK Hynix, and Micron) is forecast to reach an all-time high of 68% this year, surpassing the previous record high of 67% recorded in 2013 and 2018

• Cadence Announces Tempus Power Integrity Solution for Signoff Timing-Aware IR Drop Analysis
• Announcing OpenTitan, the First Transparent Silicon Root of Trust
• Marvell Completes Acquisition of Avera Semi

Headlines for Tuesday Nov. 05, 2019

Top Story

GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP Platform for AI Applications

GLOBALFOUNDRIES® (GF®) and SiFive, Inc. announced today at GLOBALFOUNDRIES Technology Conference (GTC) in Taiwan that they are working to extend high DRAM performance levels with High Bandwidth Memory (HBM2E) on GF’s recently announced 12LP+ FinFET solution, with 2.5D packaging design services to enable fast time-to-market for Artificial Intelligence (AI) applications.

• Renesas and Altair Semiconductor Announce Collaboration for Cellular IoT Solutions
• IAR Systems delivers development from device to cloud through integration with Amazon Web Services
• Dream Chip Technologies (DCT) joins the Arm Functional Safety Partnership Program
• GUC Monthly Sales Report - Oct 2019
• Rambus Reports Third Quarter 2019 Financial Results
• AdaCore Introduces Support for C++ Embedded Environments