D&R Headline News (Last 14 Days)

Headlines for Friday Oct. 11, 2019

• 2019 Microprocessor Slump Snaps Nine Years of Record Sales

Headlines for Thursday Oct. 10, 2019

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GLOBALFOUNDRIES Brings New Level of Security and Protection on 22FDX Platform for Connected Systems

GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, announced today that it is working with Arm® to offer secure system-on-chip (SoC) solutions on GF’s 22FDX® platform, based on FD-SOI, for cellular IoT applications.

• Samsung Introduces Advanced Automotive Foundry Solutions Tailored to EMEA Market at Samsung Foundry Forum 2019 Munich
• GLOBALFOUNDRIES and Racyics GmbH Demonstrate Ultra-Low-Power Microcontroller for the Internet of Things
• GLOBALFOUNDRIES Qualifies Synopsys Fusion Design Platform on 12LP FinFET Platform
• Achronix, Cisco, Facebook, Netronome, NXP and zGlue Collaborate on Proof-of-Concept for Chiplet Solutions as Part of OCP ODSA Subproject

Headlines for Wednesday Oct. 09, 2019

Top Story

LG Launched Phone Powered by Gyrfalcon Technology Inc.'s AI Chip

The device uses GTI’s edge AI capabilities to improve the photo taking experience by end users by providing Image Enhancement and Real-time Video Bokeh Effect.

• Renesas Electronics Unveils RA Family of 32-Bit Arm Cortex-M Microcontrollers with Superior Performance and Advanced Security for Intelligent IoT Applications
• CCIX Consortium Releases CCIX Base Specification Revision 1.1 Version 1.0 with Support for 32GT/s
• UMC Reports Sales for September 2019
• TSMC September 2019 Revenue Report
• Cadence Collaborates with Arm and Samsung Foundry on Delivery of 5LPE Flow for Mission-Critical Applications Using Next-Generation "Hercules" CPU

Headlines for Tuesday Oct. 08, 2019

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Arm Announces Custom Instructions for embedded CPUs and Mbed OS Partner Governance

Arm Custom Instructions will initially be implemented in Arm Cortex®-M33 CPUs starting in the first half of 2020 at no additional cost to new and existing licensees, enabling SoC designers to add their own instructions for specific embedded and IoT applications without risk of software fragmentation.

• A Total Compute approach to delivering digital immersion under a common architecture
• Collaborating for an autonomous future: Arm and industry leaders establish the Autonomous Vehicle Computing Consortium
• Arm and silicon partners collaborate on IoT development through new Mbed OS Partner Governance model
• UltraSoC announces next-generation hardware-based cybersecurity products
• Qorvo Acquires Cavendish Kinetics, Inc.
• Silex Insight and Medium Inc. accelerate towards 1 million ECDSA signature verifications per second on a blockchain
• Synopsys, Arm, and Samsung Foundry Enable Accelerated Development of Next-Generation Arm "Hercules" Processor on 5LPE Process
• IC'Alps joins Arm Approved Design Partner program to better support customers with ASIC development
• Dream Chip Technologies joined Samsung Foundry's Design Solution Partner (DSP) Program

Headlines for Monday Oct. 07, 2019

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TSMC's N7+ Technology is First EUV Process Delivering Customer Products to Market in High Volume

TSMC (TWSE: 2330, NYSE: TSM) today announced that its seven-nanometer plus (N7+), the industry’s first commercially available Extreme Ultraviolet (EUV) lithography technology, is delivering customer products to market in high volume.

• Dialog Semiconductor to Acquire Creative Chips adding Industrial IoT Products to its Portfolio
• Adesto Engages with the European Space Agency to Develop Next-Generation Satellite Communications Technology
• Synopsys Announces Industry-First Unified Functional Safety Verification Solution to Accelerate Time-to-Certification for IPs and SoCs
• Achronix Exhibits High-Performance FPGA and eFPGA IP Solutions at Arm TechCon
• Moortec to Showcase its Latest Embedded PVT Monitoring IP for 40nm-5nm at the 2019 ARM TechCon in San Jose
• GUC Monthly Sales Report - Sep 2019
• Synopsys to Showcase Optimized Solutions for Arm-based Designs at Arm TechCon 2019

Headlines for Friday Oct. 04, 2019

Top Story

CAN to TSN Gateway from CAST Bridges CAN 2.0/FD Buses with Time Sensitive Ethernet

IP core provides easy integration of up to seven CAN buses with an Ethernet network in automotive and industrial systems; will be shown at TSN/A Conference

Headlines for Thursday Oct. 03, 2019

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IP Controller Core CAN 2.0b and CAN FD of Fraunhofer IPMS certified according to ISO security standard

Fraunhofer IPMS has certified its IP designs, CAN 2.0B and CAN FD Controller Core, for functional safety according to ISO26262:2018. System integrators can now be sure that this IP Core fulfills all criteria of the ASIL B level requirements.

• Silicon Creations Named 2019 TSMC Partner of the Year for Analog / Mixed-Signal IP
• Los Alamos National Laboratory Teams with Arm to Develop Tailored, Efficient Processor Architectures
• Synopsys Completes Acquisition of QTronic GmbH
• NXP Launches the GHz Microcontroller Era

Headlines for Wednesday Oct. 02, 2019

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Xilinx Announces Vitis - a Unified Software Platform Unlocking a New Design Experience for All Developers

Xilinx today announced Vitis™ (pronounced Vī-tis), a unified software platform that enables a broad new range of developers – including software engineers and AI scientists – to take advantage of the power of hardware adaptability.

• M31 Technology Won TSMC's 2019 Partner of the Year Award for Specialty Process IP
• Adesto and Cadence Collaborate to Expand xSPI Ecosystem for Emerging IoT Devices

Headlines for Tuesday Oct. 01, 2019

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TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm its Technology Leadership and to Protect Its Customers and Consumers Worldwide

TSMC, the world’s leading global innovator in semiconductor manufacturing, filed multiple lawsuits on September 30, 2019 against GlobalFoundries in the United States, Germany and Singapore for its ongoing infringement of 25 TSMC patents by at least its 40nm, 28nm, 22nm, 14nm, and 12nm node processes.

• SmartDV Adds Support for Verilator Open Source HDL Verilog Simulator
• HDL Design House Appoints Frank Werner as Worldwide Sales Director
• Gen-Z Physical Layer Specification 1.1 now available for download
• Global Semiconductor Sales Down 15.9 Percent Year-to-Year in August
• Andes Technology and Tiempo Secure Announce Strategic Partnership to Enhance RISC-V Platform Security up to CC EAL5+ Certification

Headlines for Monday Sep. 30, 2019

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Huawei & Arm Meet Behind Closed Doors

Executives from Arm, Arm China and HiSilicon (Huawei’s chip division) met behind closed doors on Wednesday morning (Sept. 25th) at the Intercontinental Hotel in Shenzhen, and when they emerged they stood for a group photo that said more about the US-China trade war than anything the three companies had actually said in four months.

• New Lattice CrossLinkPlus FPGAs Accelerate and Enhance Video Bridging for World-class MIPI-based Embedded Vision Systems
• Total Wafer Shipments to Drop 6 Percent in 2019, Resume Growth in 2020, Set New High in 2022, SEMI Reports
• Synopsys Introduces PrimeECO Solution for Zero-Iteration Signoff-Driven Design Closure
• XMOS secures $19M funding to accelerate growth
• UltraSoC selected by Japan's NSITEXE for automotive development
• Titan IC to Accelerate Pattern and String Matching on Mellanox's New BlueField-2 I/O Processing Unit (IPU) Device
• SiFive Enables Embedded Vision With New DesignShare Partners
• Live webinar from Dolphin Design: Pushing the limit of SoC energy efficiency with a NEW secret technique

Headlines for Friday Sep. 27, 2019

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Sofics releases pre-silicon analog I/O's for high-speed SerDes for TSMC N5 process technology

Sofics bvba, a leading semiconductor integrated circuit IP provider announced that it has expanded its TakeCharge® Electrostatic Discharge (ESD) and Analog I/O portfolio with solutions for TSMC’s N5 process technology. The cells enable high speed and high frequency interfaces.

• Data Compression Accelerators from CAST Now Available on Xilinx Alveo Boards
• GLOBALFOUNDRIES Achieves More Than $1 Billion in Design Wins for 45RFSOI Solution for Mobile and Wireless Infrastructure Applications
• Multiple Mentor product lines now certified on TSMC's most advanced processes
• GLOBALFOUNDRIES Appoints Michael Hogan as SVP and General Manager to Support New Market Engagement Strategy

Headlines for Thursday Sep. 26, 2019

Top Story

Arm and TSMC Demonstrate Industry's First 7nm Arm-based CoWoS Chiplets for High-Performance Computing

Arm and TSMC, the High-Performance Computing (HPC) industry leaders, today announced an industry-first 7nm silicon-proven chiplet system based on multiple Arm® cores and leveraging TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging solution.

• New Version of Most Widely Used Camera and Imaging Interface - MIPI CSI-2 - Designed to Build Capabilities for Greater Machine Awareness
• SiFive Announces Key Enablement Of Trace And Debug
• Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC 5nm FinFET Plus (N5P) Process
• Truechip Announces First Customer Shipment of CXL Verification IP
• TSMC's Leading-Edge Fab Investments Set Stage for Sale Surge in 2H19
• Andes and Dover Microsystems Partner to Deliver Professional Network Security Solution for RISC-V
• Rambus Tapes Out 112G XSR SerDes PHY on Leading-edge 7nm Process
• Adesto Reaches Shipment Milestone of One Billion Non-Volatile Memory Devices
• Synopsys and TSMC Collaborate for Certification on 5nm Process Technologies to Address Next-generation HPC, Mobile Design Requirements
• Lattice Semiconductor and Synopsys Renew Partnership on FPGA Synthesis Tools
• Analog Bits Showcases Silicon of Analog and Mixed Signal IP Products on TSMC N7 Process Targeting Automotive Grade with Split Corner Lots and PVT Characterization Results Available