D&R Headline News (Last 14 Days)

Headlines for Monday May. 25, 2020

Top Story

The TSMC and Huawei Announcements Are Not as Linked as You May Think

The industry was rocked last week by two U.S. announcements that seem interconnected.

• Senators Seek Suspension of TSMC US Fab Project
• Do more with less energy! What's behind Dolphin Design's Energy Efficient Platforms?
• Lattice sensAI 3.0 Solutions Stack Doubles Performance, Cuts Power Consumption in Half for Edge AI Applications
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2020
• China to Fall Far Short of its "Made-in-China 2025" Goal for IC Devices

Headlines for Friday May. 22, 2020

• Panasonic Adopts Synopsys Custom Design Platform to Accelerate Next-Generation Automotive and Industrial Products
• North American Semiconductor Equipment Industry Posts April 2020 Billings
• Gyrfalcon is Named as a Top 10 Processor for AI Acceleration at the Endpoint in 2020 by EE Times

Headlines for Thursday May. 21, 2020

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eMemory Provides Intellectual Property for Secure NB-IoT Products

eMemory, the world’s leading supplier of intellectual property for NVM and security at the semiconductor level, is providing its intellectual property that ensures security in new chips for the narrowband-IoT (NB-IoT) market.

• Fuji Xerox Adopts Synopsys ZeBu Server for Multi-Function Printer SoC
• SimpleMachines selects UltraSoC embedded analytics to support next-generation compute platform
• Faraday Succeeds in Next-Gen Display ASIC with Display IP Solutions
• CEO interview: The importance of being agile
• S2C Announces New Prodigy Cloud System for Next Generation SoC Prototyping
• Cobham Advanced Electronic Solutions Radiation Hardened Microelectronics Support New Xilinx XQRKU060 FPGA
• Imec combines advanced machine learning algorithms and innovations in chip design to achieve cm accuracy and low-power ultra wideband localization

Headlines for Wednesday May. 20, 2020

Top Story

Politics Haunts TSMC's US Fab Plan

The announcement by Taiwan Semiconductor Manufacturing Co. (TSMC) last week to build a fab in the United States was very likely motivated by a number of political factors, according to people with knowledge of the matter. It’s a move that could haunt TSMC and its future.

• Mirabilis Design creates the first RISC-V system-level architecture exploration solution
• Imagination receives ISO 26262 statement of process conformance from HORIBA MIRA

Headlines for Tuesday May. 19, 2020

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Xilinx "Lifts Off" with Launch of Industry's First 20nm Space-Grade FPGA for Satellite and Space Applications

First to enable machine learning inference together with unlimited on-orbit reconfiguration for real time on-board-processing in space; delivers full radiation tolerance spanning all orbits

• Cadence Delivers 10 New Verification IP Targeting Automotive, Hyperscale Data Center and Mobile Applications
• SiFive Partners With Coherent Logix for Mission-Critical Processor Solutions
• Arteris IP FlexNoC Interconnect and AI Package Licensed by Blue Ocean Smart System for AI Chips
• CXL Protocol Adds Capabilities over PCIe
• Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Vision Solutions
• Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput

Headlines for Monday May. 18, 2020

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LeapMind Unveils "Efficiera", the New Ultra Low Power AI Inference Accelerator IP

LeapMind today announced that the company has developed "Efficiera", an ultra low power AI inference accelerator IP for targeting companies that design ASIC and FPGA circuits, and other related products.

• Cadence Expands Design IP Portfolio with 56G Long-Reach PAM4 SerDes on TSMC N7 and N6 Processes
• TSMC Ariz Fab a Tangled Web
• UltraSoC appoints Jonathan Lucas as VP of Software
• Synopsys and TSMC Collaborate to Enable Designs of HPC, Mobile, 5G, and AI SoCs with Certified Solutions on TSMC N5 and N6 Processes
• Mentor's Calibre and Analog FastSPICE platforms achieve certification for TSMC's newest processes

Headlines for Friday May. 15, 2020

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TSMC Announces Intention to Build and Operate an Advanced Semiconductor Fab in the United States

TSMC (TWSE: 2330, NYSE: TSM) today announced its intention to build and operate an advanced semiconductor fab in the United States with the mutual understanding and commitment to support from the U.S. federal government and the State of Arizona.

• EVS Media Infrastructure adopts intoPIX JPEG-XS solution for Neuron
• Aspinity and Infineon partner to accelerate development of intelligent sensing products with longer lasting batteries

Headlines for Thursday May. 14, 2020

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CAST Releases 100Gbps UDP/IP Core

CAST, Inc. today announced the availability of a new silicon intellectual property core enabling lean networking with the User Datagram Protocol (UDP) Internet Protocol (IP) at bidirectional speeds up to 100Gbps.

• CHIP Alliance's Newly Enhanced SweRV Cores Available to All for Free
• Prophesee, DMP partner to accelerate development of embedded machine vision and artificial intelligence (AI) applications using Event-Based Vision approach
• Veriest supports the development of Arbe's innovative automotive Radar device
• Louis Tannyeres, Former Senior Fellow at Texas Instruments, Appointed Executive Vice-President of Engineering at Kalray

Headlines for Wednesday May. 13, 2020

Top Story

GigaDevice Announces a Patent Licensing Agreement with Rambus

GigaDevice, a leading provider of non-volatile memory，32-bit microcontroller (MCU) and sensor solutions, today announced that it signed an RRAM (Resistive Random Access Memory) patent licensing agreement with the leading semiconductor IP provider, Rambus Inc.

• SMIC Reports 2020 First Quarter Results.
• Foxconn Partners with Socionext and Hailo to Launch Next-Generation AI Processing Solution for Video Analytics at the "Edge"
• Arm hardware and software ecosystems will converge at virtual Arm DevSummit, formerly known as Arm TechCon
• Eta Compute Partners with Edge Impulse to Accelerate the Development and Deployment of Machine Learning at the Edge
• OpenFabrics Alliance (OFA) and Gen-Z Consortium Announce MoU Agreement

Headlines for Tuesday May. 12, 2020

Top Story

Coherent Logix Selects Kandou's SerDes IP for its Low-Power, High-Performance C-Programmable Processors

Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, confirmed today that Coherent Logix will implement its Glasswing™ SerDes intellectual property (IP) in its low-power, high-performance C-programmable processors used in a variety of embedded system applications.

• Riedel adopts intoPIX TICO-XS FPGA IP-cores to empower broadcasts & events.
• SmartDV Ships First Design and Verification IP for MIPI RFFE v3.0 Specification
• Arteris IP FlexNoC Interconnect Licensed by Picocom for 5G New Radio Infrastructure Baseband SoCs
• SMIC Aims to Raise More Than $3B for Expansion
• VeriSilicon VIP9000 and ZSP are Adopted by iCatch Next Generation AI-powered Automotive Image Processing SoC
• Perceptia Devices Offers Research License
• Configurable Analog Semiconductor IP Enables Faster IoT Chip Design
• TSMC Board of Directors Meeting Resolutions

Headlines for Monday May. 11, 2020

Top Story

Synopsys Accelerates High-Performance Computing SoC Designs with Industry's Broadest IP Portfolio for TSMC's 5nm Process Technology

Synopsys today announced the industry's broadest portfolio of high-quality IP on TSMC's 5nm process technology for high-performance computing system-on chips (SoCs).

• TSMC Expected to Rebound in 2021 on AMD Gains
• Xylon's MPSoC Multi-Camera Vision Kit Updated
• Dolphin Design Enables Next Generation Energy-Efficient Battery-Operated IoT Devices with New IP Platforms on TSMC 22ULL Process
• Arasan Announces the Availability of MIPI D-PHY IP for TSMC 22nm Process Technology
• UMC Reports Sales for April 2020
• CEVA, Inc. Announces First Quarter 2020 Financial Results
• TSMC April 2020 Revenue Report
• RISC-V International and GlobalPlatform Partner to Enhance Security Design of IoT Devices