D&R Headline News (Last 14 Days)

Headlines for Friday Jul. 30, 2021

• Efabless & OpenROAD Advance Commercial Open Source Chip Design

Headlines for Thursday Jul. 29, 2021

Top Story

SmartDV Leads Industry with Greatest Number of Design and Verification MIPI Protocol Standards Solutions for Mobile Applications

SmartDV™ Technologies, the leader in Design and Verification Intellectual Property (IP), today announced the greatest number of commercially available Design and Verification IP solutions to support the MIPI protocol standards for mobile and other critical applications.

• Silicon Wafer Shipments Reach New High in Second Quarter 2021, SEMI Reports
• IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year
• Ampere to Acquire OnSpecta to Accelerate AI Inference on Cloud-Native Applications
• Optima Design Automation Announces TUV Certification of its Entire Safety Platform for ISO 26262 ASIL-D Functional Safety Verification

Headlines for Wednesday Jul. 28, 2021

Top Story

PUFsecurity's PUFiot Helps IoT Devices Meet FIDO Device Onboard Specification

For the trillions of connected devices worldwide, FIDO Alliance proposed a specification agreement in April of this year—FIDO Device Onboard (FDO), which defines how IoT devices are connected to the cloud simply and securely.

• JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications
• Cadence Tensilica Xtensa Processors Address Most Stringent Automotive Functional Safety Requirements with Full ISO 26262 Compliance to ASIL-D

Headlines for Tuesday Jul. 27, 2021

Top Story

CAST And Avery Design Systems Expand IP Partnership to Support Next Generation High-Bandwidth Automotive Networking And Control Systems

Avery Design Systems and CAST announced today they have expanded their partnership to offer joint solutions supporting the design and verification of automotive SoCs that utilize the emerging CAN XL and TSN Ethernet 1/10G networking and control protocols.

• TU Dresden, University of Manchester and GlobalFoundries Announce SpiNNaker2, a Breakthrough in AI Cloud Systems, Bringing Real-Time AI with below Millisecond Latency and high Energy Efficiency to Cloud Scale
• Cadence Announces Anirudh Devgan to Become CEO in December 2021; Lip-Bu Tan to Transition to Role of Executive Chairman at That Time
• Blaize, leading AI Solution for Edge Computing, Announces $71M Series D Financing to Further Accelerate Growth
• IoT Pioneer Wiliot Secures $200 Million Investment Round Led by SoftBank Vision Fund 2

Headlines for Monday Jul. 26, 2021

• Bankrupt Tsinghua Unigroup advertises for investors
• TSMC considers German fab
• TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman
• DDR Combo PHY & Controller IP Core Silicon Proven in 12nm & 28nm available for immediate licensing

Headlines for Friday Jul. 23, 2021

• Cadence Extends Digital Design Leadership with Revolutionary ML-based Cerebrus, Delivering Best-in-class Productivity and Quality of Results

Headlines for Thursday Jul. 22, 2021

Top Story

CEVA Continues to Lead the Way in Wireless Connectivity with Bluetooth 5.3 IP

CEVA today announced the general release of its RivieraWaves Bluetooth 5.3 IP. Supporting a multitude of features to further enhance security, robustness and low power operation, the RivieraWaves Bluetooth 5.3 IP is now available as a complete hardware/software solution for new designs and as a software-only upgrade for compatible existing designs.

• DVB-S2X Wideband Demodulator IP Core from Creonic Now Available with Time-Slicing Support (Annex M)
• Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution
• Kameleon Security Adds Investment from Xilinx to Deliver Hardware Cybersecurity for Servers
• Agile Analog brings analog IP to RISC-V International
• European Commission forms processor, semiconductor alliance
• Is TSMC-Sony A Sign Of Things To Come?
• NovaSparks Unveil the First FPGA Market Data Aggregator
• Moschip Continues to Soar Consecutively for the 6th Quarter
• Achronix Announces Record Second Quarter 2021 Financial Results and Business Highlights

Headlines for Wednesday Jul. 21, 2021

Top Story

Attopsemi's I-fuse OTP IP Now Qualified on a Japanese Wafer Fab's 130nm BCD and Embedded into ABLIC's IC Product

Attopsemi™ Technology, innovator of the revolutionary I-fuse™ OTP IP, together with ABLIC Inc., the IC vendor of best analog semiconductor solutions, have a successful collaboration. The companies jointly announced that I-fuse™ OTP IP is now qualified on a Japanese Wafer Fab’s 130nm BCD process, and embedded into ABLIC’s IC Products.

Headlines for Tuesday Jul. 20, 2021

Top Story

CAES Receives Contract from Vinnova to Advance High Performance RISC-V Space Computing

CAES, a leader in advanced mission-critical electronics for aerospace and defense, announced today that it has been awarded a contract from Vinnova, a Swedish government agency dedicated to promoting innovation, to develop next generation RISC-V based space computing capabilities.

• CrossBar Announces ReRAM Based PUF Keys
• GOWIN Semiconductor Announces their ISP (Image Signal Processor) IP Core and Solution
• GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing

Headlines for Monday Jul. 19, 2021

Top Story

Dolphin Design and CEA-List join forces for a new embedded AI computing platform

Dolphin Design and CEA-List have formed a new joint R&D lab of embedded systems. Their goal is to achieve the best tradeoff for Edge AI devices between SW flexibility, energy efficiency, and peak performance. Specifically, CEA-List's PNeuro® hardware accelerator integrates AI into the computing platform developed in the joint lab, and is combined with the processing platform developed by Dolphin Design.

• Samsung Foundry and Synopsys Collaborate to Accelerate Time to ISO 26262 Compliance for Automotive SoCs
• CXL Product Pipeline Gets Flowing
• TSMC in "Due Diligence" on Possible Japan Fab
• Chip Shortages May Persist Until 2023, Analysts Say
• Intel in talks to buy Globalfoundries
• Secure-IC establishes new references to secure the Internet of Things
• Precise-ITC 1.6T/800G/400G IP Product Series for Datacentre Application
• Imperas updates Free reference model riscvOVPsimPlus with new RISC-V P (SIMD/DSP) extension and Architectural Validation Test Suites

Headlines for Thursday Jul. 15, 2021

Top Story

Innatera Unveils Neuromorphic AI Chip to Accelerate Spiking Networks

Innatera, the Dutch startup making neuromorphic AI accelerators for spiking neural networks, has produced its first chips, gauged their performance, and revealed details of their architecture.

• Electronic System Design Industry Logs Record First-Quarter Revenue Growth, ESD Alliance Reports
• TSMC Reports Second Quarter EPS of NT$5.18
• Realtek selects Imagination GPU for use in DTV
• Quantware Launches the World's First Commercially Available Superconducting Quantum Processors, Accelerating the Advent of the Quantum Computer.
• Xenergic Raises 40 MSEK In New Share Issue
• Weebit completes design and tape-out of embedded ReRAM module
• Taiwan Maintains Edge as Largest Base for IC Wafer Capacity
• Xilinx Versal HBM Series with Integrated High Bandwidth Memory Tackles Big Data Compute Challenges in the Network and Cloud
• Is analog IC fab renaissance in the works?
• Accellera Board Approves Security Annotation for Electronic Design Integration Standard 1.0 for Release