D&R Headline News (Last 14 Days)

Headlines for Thursday Jun. 22, 2017

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Imagination: Commencement of formal sale process for whole Group

Imagination Technologies announces that over the last few weeks it has received interest from a number of parties for a potential acquisition of the whole Group. The Board of Imagination has therefore decided to initiate a formal sale process for the Group and is engaged in preliminary discussions with potential bidders.

• Authentico Technologies and Intrinsic ID Announce Partnership to Develop Next-Generation Database Security
• Kalray raises $26 million, anticipating the launch of its third generation of microprocessor that will target two rapidly growing markets: autonomous vehicles and data centers
• Much Ado About China's Big IC Surge
• Faraday Strives for MFP ASIC Development, Shipment Grew at a CAGR of 38%
• Arastu Systems announces LPDDR3/4 Single Controller for optimal performance

Headlines for Wednesday Jun. 21, 2017

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Alibaba Fuels China's CPU Gambit

C-Sky Microelectronics Co., designer of China’s home-grown 32-bit embedded CPU processing cores, is quite possibly China’s best kept secret.

• Imagination announces extension of MIPS collaboration agreement with Sequans
• NVMe Revision 1.3 Expands Reach of Fast Storage for Enterprise, Client, and Cloud Power Users
• CEVA Computer Vision DSP Powers Evomotion ROD-1 360° Video Camera
• ARM CEO Simon Segars Joins SoftBank Group Board of Directors
• Siemens Lays Out Vision for Mentor
• IAR Systems supports ARM DesignStart Program with highly optimizing and reliable development tools
• Cellphone IC Sales Will Top Total Personal Computing in 2017

Headlines for Tuesday Jun. 20, 2017

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Synopsys and GLOBALFOUNDRIES Collaborate to Deliver Design Platform and IP Enablement for 7-nm FinFET Process

Synopsys, Inc. today announced the enablement of the Synopsys Design Platform and DesignWare® Embedded Memory IP on GLOBALFOUNDRIES 7-nm Leading-Performance (7LP) FinFET process technology.

• SILICONGATE Presents its Latest Power Solution for IoT at the 54rd DAC
• CommSolid NB-IoT IP solution successfully demonstrated in partnership with Keysight Technologies
• ArterisIP and ResilTech Announce Strategic Partnership to Facilitate ISO 26262 Compliance for Complex Autonomous Automotive Systems
• Menta Offers Validation Board for Embedded FPGA Supporting TSMC's 28nm HPC+ Process
• Cadence Expands Online Tool Access for ARM DesignStart Customers to Accelerate SoC Design Delivery
• Synopsys Delivers Verification IP and Test Suite for ARM AMBA 5 CHI Issue B Specification
• Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node
• Andes Technology Provides System Control Processor IP for Wave Computing's Revolutionary Dataflow Processing Unit Design
• GLOBALFOUNDRIES, ON Semiconductor Deliver the Industry's Lowest Power Bluetooth Low Energy SoC Family
• Eta Compute Announces New Reference Design for EtaCore ARM Cortex-M3, the World's Lowest Power Microcontroller IP
• Spectral announces "Enablement Package" for Silicon proven Reference SRAM designs on advanced process nodes

Headlines for Monday Jun. 19, 2017

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Truechip Collaborates with OmniPhy for Verification of PCIe Gen4 IP solution

Truechip Solutions, the Verification IP specialist and OmniPhy, a leading mixed-signal semiconductor IP company, today announced association for collaborative verification of PCIe Gen 4. The two companies enter into a partnership to provide the customers a solution that is comprehensively tested and bug free.

• UltraSoC announces industry's first processor trace support for RISC-V
• ANSYS And Synopsys To Partner In Accelerating Robust Design Optimization For Next Generation High-Performance Computing, Mobile And Automotive Products
• Sankalp Semiconductor Announces Availability of 16nm IO Libraries
• Shanghai Frequen Licenses and Deploys CEVA Bluetooth Low Energy IP in New IoT Product Line
• Silvaco to Acquire SoC Solutions
• GUC Successfully Rolls out HBM2 Total Solution
• Truechip Announces First Customer Shipment of Ethernet 400G/200G VIP
• Rambus Launches JEDEC-Standard DDR4 NVRCD for Emerging NVDIMM Applications
• North American Semiconductor Equipment Industry Posts May 2017 Billings
• Runtime Accelerates Time to Market with New License Allocation Management Solution

Headlines for Friday Jun. 16, 2017

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Barco Silex extends crypto offering with Chacha20/Poly1305 authenticated encryption

Barco Silex, leading provider of IP cores for embedded hardware security, adds an RFC7539-compliant crypto engine to its offering to provide its customers with future-proof authenticated encryption between networked applications, for example in the IoT.

• MediaTek Chooses TSMC for 7nm
• Avery Design Systems Unveils MIPI I3C VIP Targeting Sensors in Smartphone, IoT, Automotive Designs
• The new release of SoC-e IEEE 1588 IP Core supports 10 Gigabit Ethernet

Headlines for Thursday Jun. 15, 2017

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Avery Design Systems Unveils DDR5 VIP Solution Targeting DDR5 Design Ecosystem

Avery Design Systems today announced availability of DDR5 Verification IP (VIP) solution targeting the DDR5 ecosystem players including memory, chip set, and IP vendors.

• 7 of the Top 10 Smartphone Suppliers Headquartered in China
• Toshiba Selects Synopsys VC Formal Verification Solution
• Microsemi Announces SoftConsole v5.1, the World's First Freely Available Windows-Hosted Eclipse Integrated Development Environment Supporting RISC-V Open Instruction Set Architecture
• Google Ramps Mobile SoC Team
• Noesis Technologies releases its XTS mode AES processor IP Core
• Andes Technology and M31 Technology Collaborated on Optimal Power Efficiency CPU Implementation for IoT SoC Market
• Mentor Verification Is First to Deliver Portable Stimulus Technology Across the Full Enterprise Verification Platform
• Mobiveil to Exhibit at DAC in Avery Design Systems' Booth, Showcasing Portfolio of IP, Platforms, Solutions for Storage, IoT, Networking, Enterprise Markets
• PCI-SIG Publishes PCI Express 4.0, Revision 0.9 Specification

Headlines for Wednesday Jun. 14, 2017

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Arasan Announces Advanced Process Nodes for High Performance SD Card UHS-II Physical Layer Interface

Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automotive SoCs, announces availability of its SD Card UHS-II analog physical interface IP Core in advanced process nodes.

• Imagination launches the MIPS I6500-F, CPU IP designed for safety-critical systems in an autonomous age
• ReFLEX CES Partners with Orthogone Technologies to Provide Integrated Ethernet MAC/PCS IP Core Solutions on FPGA COTS Boards
• UMC Restructures Executive Team
• Visible Light Communication Technology Shines in China Innovation and Entrepreneurship Fair 2017
• Qualcomm Reportedly Taps TSMC's 7nm
• True Circuits Attends Design Automation Conference
• Achronix Revenues to Grow 700% YoY and Exceed $100M in 2017
• Mentor Achieves ISO 26262 Qualification for Oasys-RTL, Nitro-SoC and FormalPro Tool Reports

Headlines for Tuesday Jun. 13, 2017

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CAST Drives Automotive IP Forward with New AVB/TSN Ethernet and SAE J2716 Sensor Bus Cores plus CAN-FD Time-Stamping

Semiconductor intellectual property provider CAST, Inc. today announced three significant improvements to its automotive IP family. New IEEE 802.1AS AVB/TSN and SENT/SAE J2716 Cores now available; CAN/CAN-FD Controller Core now supports AUTOSAR-compliant time-stamping

• GLOBALFOUNDRIES on Track to Deliver Leading-Performance 7nm FinFET Technology
• ARM, Enea, Marvell and PicoCluster announce world's most compact OPNFV Pharos Lab
• QuickLogic Taps Semiconductor Intellectual Property Veteran for Advisory Board
• HDL Design House to Exhibit at DAC as ARM Approved Design Partner
• GLOBALFOUNDRIES Launches 7nm ASIC Platform for Data Center, Machine Learning, and 5G Networks
• UEFI Forum Appoints ARM to Board of Directors Fortifying Its Commitment to Firmware Innovation

Headlines for Monday Jun. 12, 2017

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Silab Tech Announces Release of XGS-PON SERDES IP Core

Silab Tech, a leading supplier of high speed serial interface intellectual property designs (IP cores) announced today the release of its XGS-PON PHY. This IP Core provides symmetrical 10Gbps interconnect solution for Next Generation Passive Optical Networks (PON).

• Vidatronic to Exhibit at 54th Design Automation Conference (DAC) in Austin, TX
• Magillem EDA solution selected by Renesas for design automation, IP packaging and content generation
• The European Commission opens in-depth investigation into Qualcomm's proposed acquisition of NXP
• EC Refs Whistle Qualcomm-NXP Deal
• BT, Intercede and Imagination collaborate on IoT security

Headlines for Friday Jun. 09, 2017

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Barco Silex updates its 4K over 1Gb OEM solutions with new features for Pro A/V applications.

Barco Silex, leading provider of video compression technology and OEM solutions in the pro A/V market, is announcing new features on its Viper OEM AV over IP solution. The new features include PTP synchronization, support for video wall, HDMI 2.0, and fine-tuned video compression.

• DARPA Funds Development of New Type of Processor
• Intel hints that Microsoft, Qualcomm's Windows 10/ARM x86 emulation could infringe on its IP
• TSMC May 2017 Revenue Report
• UMC Reports Sales for May 2017

Headlines for Thursday Jun. 08, 2017

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PCI-SIG Fast Tracks Evolution to 32GT/s with PCI Express 5.0 Architecture

PCI-SIG today announced 32GT/s as the next progression in speed for the PCIe 5.0 architecture, targeting high-performance applications such as artificial intelligence, machine learning, gaming, visual computing, storage and networking.

• Synopsys Expands embARC Initiative to Include Additional ARC Processors and Open Source Projects to Accelerate Development of Embedded Systems
• PLDA Announces "Inspector" - An Evolution of the PCI Express 4.0 PDK That Enables PCIe 4.0 Technology Design Validation and Performance Optimization Today
• Long-Term Internet of Things Semiconductor Forecast Reduced
• Mentor Catapult HLS Enables Stream TV's R&D Group SeeCubic to Develop Glasses-Free 3D Digital Display IP

Headlines for Wednesday Jun. 07, 2017

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Uniquify's LPDDR4 Super Combo Interface IP in Volume Production at 28nm Low-power Node

Uniquify today announced that its LPDDR4 Super Combo IP for the 28-nanometer (nm) low-power semiconductor process node is in volume production.

• China's ARM twist underlines strategic nature of tech
• Faraday Monthly Consolidated Sales Report - May 2017
• STMicroelectronics Standardizes on Synopsys VC Formal for Faster Verification Closure of Leading Microcontroller Designs
• VeriSilicon's Artificial Intelligence Engine Powers Multi-Sensory Experiences in NXP's i.MX 8 Flagship Applications Processor
• TSMC Promotes Dave Keller to President, TSMC North America
• Global Semiconductor Sales Increase 21 Percent Year-to-Year in April; Double-Digit Annual Growth Projected for 2017
• Record Fab Spending for 2017 and 2018