D&R Headline News (Last 14 Days)

Headlines for Thursday Oct. 03, 2024

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Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs

Crypto Quantique has announced a collaboration with ADLINK Technology Inc., a global leader in edge computing, to simplify the secure boot process for industrial PCs (IPCs) using its QuarkLink security platform.

• Launching MosChip DigitalSky™ for Building Connected Intelligent Enterprises
• Xiphera Partners with IPro for the Israeli Chip Design Market

Headlines for Wednesday Oct. 02, 2024

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EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP

EXTOLL has been selected by Frontgrade Technologies, a leading provider of mission critical electronics for aerospace and defense, as a key SerDes IP block supplier for its ASIC development portfolio.

• Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes
• Achronix Releases Groundbreaking Speedster AC7t800 Mid-Range FPGA, Driving Innovation in AI/ML, 5G/6G and Data Center Applications

Headlines for Tuesday Oct. 01, 2024

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BrainChip Introduces Lowest-Power AI Acceleration Co-Processor

BrainChip today introduced the Akida™ Pico, the lowest power acceleration co-processor that enables the creation of very compact, ultra-low power, portable and intelligent devices for wearable and sensor integrated AI into consumer, healthcare, IoT, defense and wake-up applications.

• Comcores announces the launch of the Centralized Network Configurator for TSN-based networks
• RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
• QuickLogic Delivers eFPGA IP Targeting TSMC N12e Process in Record Time
• MulticoreWare collaborates with Arm to optimize and advance x265 video encoding on AWS Graviton4

Headlines for Monday Sep. 30, 2024

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Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology

Alphawave Semi has unveiled the availability of the industry’s first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP subsystem, built on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging technology.

• Qualcomm and Sequans Complete Sale of 4G IoT Technology
• Paul Williamson on Edge AI, Llama 3.2 on Arm
• Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports

Headlines for Thursday Sep. 26, 2024

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SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment

SIAE MICROELETTRONICA has selected EnSilica to assist the design of Application-Specific Integrated Circuits (ASICs) for its next-generation telecommunication infrastructure products.

• Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award
• M31 Launches ONFi5.1 I/O IP on TSMC 5nm Process
• Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
• TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions
• Siemens extends collaboration with TSMC to advance integrated circuit and systems design
• EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP
• eMemory Won TSMC OIP Partner of the Year Award for the Outstanding Development of its NVM IP on Advanced Nodes
• Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP
• MIPI Alliance Releases A-PHY v2.0, Doubling Maximum Data Rate of Automotive SerDes Interface To Enable Emerging Vehicle Architectures
• EnSilica joins TSMC Design Center Alliance

Headlines for Wednesday Sep. 25, 2024

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Certus Semiconductor releases I/O library in TowerJazz's 65nm process

Certus is excited to announce that its 1.2V/3.3V wire-bond I/O library in TowerJazz’s 65nm process is silicon-verified, and exceeding expectations.

• Preferred Networks Inc. adopts Siemens' PowerPro software for next-generation AI chip design
• Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America
• Introducing a Versatile 1G Ethernet PHY IP Core with BroadR-Reach™ Technology for Automotive and Industrial Applications
• Silvaco Expands its Victory TCAD and Digital Twin Modeling Platform to Planar CMOS, FinFET and Advanced CMOS Technologies

Headlines for Tuesday Sep. 24, 2024

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Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications

Partnership enables AI developers to train, optimize and deploy embedded ML models on the Ceva-NeuPro-Nano NPU IP, pre-silicon, via Edge Impulse Platform

• GenAI v1-Q launched with 4 bits Quantization support to accelerate larger LLMs at the Edge
• GUC Announces Adoption of HBM3E IP by CSP Data Center
• Alphawave Semi and InnoLight Extend PCIe over Optics Collaboration with Demonstration of 128Gbps Gen 7.0 over Low Latency Linear Pluggable Optics at ECOC 2024
• SigmaSense Teams Up with Dolphin Design to Deliver Power Efficiency in their Advanced SDC300 Touch Controller

Headlines for Monday Sep. 23, 2024

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Comcores and Extoll successfully completed the interoperability test of Comcores JESD204C IP core and Extoll SerDes PHY

Comcores and EXTOLL have successfully performed the interoperability test of Comcores JESD204C IP with Extoll PHY.

• JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents
• Analog Bits to Demonstrate Power Management and Embedded Clocking and High Accuracy Sensor IP at the TSMC 2024 Open Innovation Platform Ecosystem Forum
• VyperCore plans 5nm RISC-V server chip and card
• Alphawave Semi - Interim results for the six months ended 30 June 2024
• RAAAM Memory Technologies and NXP Semiconductors Announce Collaboration to Implement High Density On-Chip Memory
• Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio
• XtremeSilica Successfully Ships First SDRAM Controller for Tapeout GF40nm

Headlines for Thursday Sep. 19, 2024

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Cryptomathic and PQShield form strategic alliance to offer PQC solutions for code signing and data protection in compliance with latest NIST and CNSA recommendations

Two foremost software security experts and pioneers in cryptographic agility and post-quantum cryptography join forces to offer comprehensive, quantum-resistant software solution after new PQC standards are released by NIST

• Synopsys Enters Definitive Agreement with Keysight Technologies For Sale of Optical Solutions Group