D&R Headline News (Last 14 Days)

Headlines for Friday Jul. 21, 2017

• Founders of DeepMind, OpenAI and Chief Scientist at Uber back Graphcore in new $30m funding round led by Atomico
• Flex Logix's EFLX Embedded FPGA Accelerates Processor Performance By 40-100X
• Neural Accelerator Battle Begins

Headlines for Thursday Jul. 20, 2017

Top Story

REFLEX CES Takes Its Autonomy with MBO Partenaires

The French specialist in complex electronic embedded systems associates with MBO Partenaires and takes its independence from the PLDA group. This spin-off, led by the manager Sylvain Neveu, allows the management team to hold the majority of the equity.

• Cadence Genus Synthesis Solution Enables Toshiba to Complete a Successful ASIC Tapeout with a 2X Logic Synthesis Runtime Improvement
• Innosilicon introduces next generation X11 miner, 30.2GH at 750W
• HDL Design House and AFuzion Synergy to Enhance DO-254 Projects
• Mentor Adds Veloce Strato Emulation Platform Software to Mentor Safe ISO 26262 Qualification Program

Headlines for Wednesday Jul. 19, 2017

• 2H17 DRAM, NAND ASP Growth to Cool, But Yearly Growth Strong
• S2C Prodigy Quad Virtex UltraScale FPGA Prototyping Logic Module Now Available for Large Scale Designs

Headlines for Tuesday Jul. 18, 2017

Top Story

Microsemi and Tamba Collaborate on New PolarFire Devices to Deliver Industry-Leading Low Power FPGA-Based 10G Ethernet Solution

Microsemi and Tamba Networks today announced their collaboration to incorporate Tamba Networks' Ethernet media access controller (MAC) in Microsemi's new cost-optimized, low power, mid-range PolarFire™ field programmable gate array (FPGA) to offer industry-leading low power FPGA-based 10G Ethernet solution.

• Solving Critical Bugs: Tracing from Power-Up for DesignWare ARC processors
• Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM

Headlines for Monday Jul. 17, 2017

Top Story

Does NVMe Have a Place in Industrial Embedded and IoT?

Is NVM Express (NVMe) overkill for embedded, industrial applications? Until recently, that's been the consensus, according to Scott Phillips, vice president of marketing at Virtium. But as big players such as Intel and Micron push the interface specification forward, Phillips said many industrial customers are approaching the company and asking about NVMe.

• Green Hills Software INTEGRITY-178 tuMP Multicore Operating System Selected by Commercial & Military Flight Critical Equipment Supplier for DO-178B Level A Certification on the Xilinx Zynq Ultrascale+ MPSoC
• Dolphin Integration sets up a large range of sponsored IPs at 55 nm to reduce SoC power consumption by up to 70%
• Imagination announces MIPSfpga 2.0: a comprehensive set of materials for teaching CPU architecture

Headlines for Friday Jul. 14, 2017

Top Story

Chuang Fei Xin Anti-Fuse One Time Programming Solution Qualified In Silterra High Voltage Technology

SilTerra Malaysia Sdn. Bhd., a Malaysian home grown leading semiconductor wafer foundry, and Zhuhai Chuangfeixin Technology Co., Ltd. ("CFX"), an memory IP design house, jointly announced the production release of Anti-Fuse One-Time-Programming (OTP) IP in SilTerra’s 160nm and 110nm High Voltage technology.

• GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks

Headlines for Thursday Jul. 13, 2017

Top Story

VeriSilicon's Vivante Vision Processor IP Enables ADAS for Mass Market

VeriSilicon today announced that Shenzhen Goke Semiconductor Co., Ltd (SGKS) has selected VeriSilicon Vivante GC7000UL-VX for the SGKS6802X Advanced Driver-Assistance Systems (ADAS) chip, part of SGKS’s ADAS product line used by automotive electronic components partners.

• TSMC Logs First 10nm Sales
• Mentor Accelerates Android Development for Xilinx Zynq UltraScale+ MPSoC
• Veriest Solutions and CEVA Collaborate for Neural Network Signal Processing IP Project
• Semi Content in Electronic Systems Forecast to Set New Record in 2017
• Imec Aims 2-D FETs at Sub-5-nm Node
• Suppliers Beware: The Perils of Vertical Integration
• TSMC Reports Second Quarter EPS of NT$2.56
• Faraday Unveils 28HPC USB 3.1 PHY and 40LP Type-C PHY with PD Controller

Headlines for Wednesday Jul. 12, 2017

Top Story

Arasan Announces IP solutions for the Next Generation of Mobile Storage - UFS 3.0

Arasan extends its long history of support for JEDEC and MIPI standards with the availability of UFS 3.0 controller IP, supporting a maximum throughput of 11.6 Gbps with M-PHY HS-Gear 4 2-lane operation, providing the highest data transfer rate with low power consumption for advanced mobile applications such as smartphone and tablets.

• NGCodec Joins the Alliance for Open Media
• 200mm Fabs Thriving; SEMI's Updated 200mm Fab Report Now Available

Headlines for Tuesday Jul. 11, 2017

Top Story

Rambus Reportedly Exploring Sale Possibilities

Memory technology licensor and chip vendor Rambus Inc. is working with a financial advisor to study options for its sale, according to a report by the Bloomberg news service.

• Nagoya University and Cadence Collaborate to Port AUTOSAR-Compliant TOPPERS Automotive Kernel to Tensilica Processors and DSPs
• Gartner Says Worldwide Semiconductor Revenue to Reach $400 Billion in 2017
• Uniquify Joins FDXcelerator Program to Deliver DDR Memory IP to GLOBALFOUNDRIES 22FDX Technology Platform
• U.S. Paves Roads to Trusted Fabs
• STMicroelectronics Partners with Kilopass For One-Time Programmable Anti-Fuse NVM Memory
• GUC Opens New Korea Office

Headlines for Monday Jul. 10, 2017

Top Story

Apple hits back at Imagination's 'misleading' statements, disputes timeline

The war of words between Apple and Imagination Technologies seems to be escalating. A few days after Imagination’s annual report accused Apple of making ‘unsubstantiated allegations,’ the Cupertino company has hit back.

• TSMC June 2017 Revenue Report
• The fastest C-Compiler for i251 from Dolphin Integration is now available with our free discovery license!
• IP-Maker NVMe IP, ready for persistent memories
• UMC Reports Sales for June 2017

Headlines for Friday Jul. 07, 2017

• Graphcore's 'Colossus' chip due before end of year
• Faraday Monthly Consolidated Sales Report- June 2017

Headlines for Thursday Jul. 06, 2017

Top Story

Imagination fades in 2016 semiconductor IP market

ARM continued to dominate a semiconductor intellectual property (IP) market that grew strongly in 2016, but Imagination struggled as its restructuring during that year hurt sales, according to a report from IPnest. The strongest growth companies were Rambus and Ceva.

• Imagination Technologies -- Full Year Results 2017
• GUC Monthly Sales Report - June 2017
• Foresight announces sale of IoT technology business Simulity Labs Limited to ARM
• ESD Alliance Reports EDA Industry Revenue Increase For Q1 2017
• Cista Design Inc. Selects Kilopass OTP NVM for Next Generation CMOS Image Sensor on SMIC Independently Developed 130nm Back Side Illumination Technology Platform
• China Makes Two IoT Calls
• AppoTech Ltd. Selects Andes Technology Corporation N968A CPU For Its Next Generation Audio Codec
• Baidu Deploys Xilinx FPGAs in New Public Cloud Acceleration Services
• Spectra7 Microsystems Inc. Announces Closing of $4.6 Million Bought Deal Financing and First Tranche of Private Placement of $1.3 Million
• Micron Fab Incident Disrupts DRAM Supply