D&R Headline News (Last 14 Days)
Headlines for Friday Feb. 07, 2025
Latest NewsHeadlines for Thursday Feb. 06, 2025

Why UCIe is Key to Connectivity for Next-Gen AI Chiplets
Deploying AI at scale presents enormous challenges, with workloads demanding massive compute power and high-speed communication bandwidth.- Arm Holdings plc Reports Results for the Third Quarter of the Fiscal Year Ended 2025
- CHERI Protects Memory at the Hardware Level
- Axiomise Launches footprint, Area Analyzer for Silicon Design
Headlines for Wednesday Feb. 05, 2025

Ceva-Waves Wi-Fi 6 IP Powers WUQI Microelectronics Wi-Fi/Bluetooth Combo Chip
Ceva today announced that WUQI Microelectronics, a leading semiconductor fabless company focus on connectivity and edge AI chips, has licensed and deployed the Ceva-Waves Wi-Fi 6 High-Performance STA IP platform in its WQ9201 Wi-Fi/Bluetooth combo chip.- Accellera Board Approves Universal Verification Methodology for Mixed-Signal (UVM-MS) 1.0 Standard for Release
- Mirabilis Design Adds System-Level Modelling Support for Industry-Standard Arteris FlexNoC and Ncore Network-on-Chip IPs
Headlines for Tuesday Feb. 04, 2025

CoMira Solutions unveils its new 1.6T Ethernet UMAC IP
CoMira Solutions today announced its new 1.6T Ethernet UMAC IP. This specified UMAC IP delivers 1.6Tbps bandwidth with low latency and minimized logic size, which is ideal for AI, ML, and hyperscale data centers.- Rambus Reports Fourth Quarter and Fiscal Year 2024 Financial Results
- intoPIX Unveils Cutting-Edge AV Innovations at ISE 2025
- RISC-V in Space Workshop 2025 in Gothenburg
- Dolphin Semiconductor strengthens its governance with two key Board appointments
Headlines for Monday Feb. 03, 2025

Intel Halts Products, Slows Roadmap in Years-Long Turnaround
Intel has scrapped product launches and slowed its process technology roadmap as it embarks on a path toward a rebound that will take years, according to analysts surveyed by EE Times.Headlines for Thursday Jan. 30, 2025

EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.- Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors
- intoPIX and EvertzAV Strengthen IPMX AV-over-IP Interoperability with Groundbreaking JPEG XS TDC Compression Capabilities at ISE 2025
- TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity
- Quadric Opens Subsidiary in Japan with Industry Veteran Jan Goodsell as President
- Ceva, Inc. Appoints Amir Faintuch to its Board of Directors
- Codasip and RED Semiconductor Sign Memorandum of Understanding to Develop AI Acceleration Technologies
- Baya Systems Welcomes Manish Muthal and Siva Yerramilli to Board of Directors
Headlines for Wednesday Jan. 29, 2025

Mixel Announces the Opening of New Branch in Da Nang, Vietnam
This office represents a key milestone for Mixel as its first in Asia. It will enable Mixel to expand its engineering talent, better serve its global customer base and strengthen its presence in the region.- intoPIX and Nextera-Adeas Announce Latest IPMX Demo Design with JPEG XS on Compact FPGAs at ISE 2025
- Certus releases radiation-hardened I/O Library in GlobalFoundries 12nm LP/LP+
Headlines for Tuesday Jan. 28, 2025
Latest News- Plexus and intoPIX Expand IPMX Solutions Offering
- Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025
Headlines for Monday Jan. 27, 2025

RaiderChip unveils its fully Hardware-Based Generative AI Accelerator: The GenAI NPU
The new embedded accelerator boosts inference speed by 2.4x, combining complete privacy and autonomy with a groundbreaking innovation: it eliminates the need for CPUs.Headlines for Thursday Jan. 23, 2025

Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
Andes Technology today announced that its D45-SE processor has successfully achieved ISO 26262 ASIL-D with the certification of SGS TÜV. This certification marks a significant achievement for Andes Technology, confirming that the D45-SE processor meets the highest automotive safety standards required for safety-critical applications in the automotive industry.- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project