D&R Headline News (Last 14 Days)

Headlines for Thursday May. 06, 2021

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CEVA's Bluetooth Dual Mode 5.2 Platform Achieves SIG Qualification, Expedites IC Design for TWS Earbuds and More

CEVA, Inc. , the leading licensor of wireless connectivity and smart sensing technologies, today announced that its RivieraWaves Bluetooth® Dual Mode 5.2 Platform has achieved Bluetooth SIG Qualification. S

• Arm v9, the Next 10 Years
• CCSDS 231.0-B-3 LDPC Encoder and Decoder IP Core from Creonic Now Available
• UMC Reports Sales for April 2021

Headlines for Wednesday May. 05, 2021

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Synopsys Completes Acquisition of MorethanIP

Synopsys, Inc. today announced it has completed its acquisition of MorethanIP, a provider of Ethernet Digital Controller IP supporting data rates from 10G to 800G.

• OmniVision Reduces Automotive Camera Design Complexity with the New, High-Performance OAX4000 ASIC Image Signal Processor
• PsiQuantum and GLOBALFOUNDRIES to Build the World's First Full-scale Quantum Computer
• Synopsys Delivers Enhanced Memory Design Productivity to Nanya Technology
• GUC Monthly Sales Report - Apr 2021
• Xilinx Reports Fiscal Fourth Quarter and Fiscal Year 2021 Results
• Lattice Semiconductor Reports First Quarter 2021 Results
• Achronix Announces First Quarter 2021 Financial Results and Business Highlights
• Karen Rogge Joins Rambus Board of Directors

Headlines for Tuesday May. 04, 2021

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Esperanto Technologies Adopts Movellus Maestro AI, Intelligent Clock Networks for Its ET-SoC-1 Chip

Movellus, Inc. today announced that Esperanto Technologies has adopted Movellus’ Maestro AI intelligent clocking solution for its ET-SoC-1 chips.

• Rambus Reports First Quarter 2021 Financial Results
• MIPI Alliance Releases Specifications to Streamline Integration of In-Vehicle Displays, Add Functional Safety to Display Data Streams
• SmartDV Unveils Automation Tool Suite for Use with Its Extensive Verification IP Portfolio
• Samsung Expected to Recapture #1 Semi Supplier Ranking in 2Q21
• Cadence Wins Four 2020 Samsung Foundry SAFE EDA Awards
• Synopsys to Showcase New Application Security Orchestration Solution at RSA Conference

Headlines for Monday May. 03, 2021

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Flex Logix And The Air Force Research Laboratory Sign A Broad License To Use EFLX Embedded FPGA IP In GLOBALFOUNDRIES' 12LP And 12LP+ Processes

Flex Logix® Technologies announced today that it has signed a broad license with the Air Force Research Laboratory, Sensors Directorate (AFRL/RY) to use Flex Logix's EFLX® eFPGA IP in GLOBALFOUNDRIES 12 nm process in any US Government program and activity.

• Silicon Wafer Shipments Edge Higher in First Quarter 2021 to Set New Record, SEMI Reports
• FPGAs in the Storm
• BLE/15.4 2.4GHz+Sub-GHz Multi-Protocol RF Transceiver Phy KGD & IP for adding wireless Connectivity to "any MCU/SoC"
• Q1 Global Semiconductor Sales Increase 3.6% Over Previous Quarter
• PathPartner Joins BlackBerry QNX Channel Partner Program to Deliver Safety-Critical and Secure Software Solutions for Automotive Industry
• Faraday Reports First Quarter 2021 Revenues at NT$1,535 Million

Headlines for Friday Apr. 30, 2021

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Thalia Design Automation successfully delivers voltage regulator in a 22nm process node with 45% reduction in design time using its AMALIA software

Thalia Design Automation, a leading IP reuse company, produced a temperature invariant reference voltage to replace a bandgap within an LDO migrated to a 22nm process node, using its AMALIA software with a 45% reduction in design time for the client.

Headlines for Thursday Apr. 29, 2021

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SiFive and Samsung Foundry Extend Partnership to Accelerate AI SoC Development

Configurable SiFive RISC-V AI SoC Development Platform is built on 14nm Samsung process technology to accelerate custom Machine Learning solutions

• RISC-V International Welcomes Chengwei Capital as a Premier Member
• Global Unichip Corporation Deploys Cadence Clarity 3D Solver to Achieve 5X Speedup of Systems Analysis for 112G Long-Reach Network Switch
• Fabless Suppliers Held a Record 33% of the 2020 IC Market
• CEVA Lauded by Frost & Sullivan for Addressing the Challenges of Connected Devices with Its Smart Sensing MotionEngine Software

Headlines for Wednesday Apr. 28, 2021

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Vidatronic Announces Series of Integrated Power Management Unit (PMU) IP Cores Optimized for Augmented/Virtual Reality Applications

Vidatronic today announced a new series of integrated PMU IP cores in a standard 180 nm process. Designed to meet the performance requirements of augmented/virtual reality applications, the IP cores offer ultra-low power consumption while also providing high reliability and great performance.

• Arm Leverages Synopsys Fusion Compiler to Enable Best PPA for Latest Neoverse Platforms
• Astera Labs and Avery Design Partner on CXL 2.0 Verification for Smart Retimer Portfolio to Improve Performance in Data-Centric Applications
• ARM pushes chiplets and 3D packaging for Neoverse chips
• Valens Announces Successful Tapeout of First MIPI A-PHY Compliant Chipsets for Long-Reach, Ultra-High-Speed Automotive Connectivity
• Alphawave IP aims for 100 engineers in UK design center
• Achronix Adopts eMemory IP for FPGA Hardware Root of Trust
• ACL Digital Partners with Mobiveil, High-Speed Silicon IP Platform Leader
• Achronix and Napatech Partner to Target Data Center Networking
• Skyworks to Acquire the Infrastructure & Automotive Business of Silicon Labs

Headlines for Tuesday Apr. 27, 2021

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Transforming compute for next-generation infrastructure

Back in September when we introduced these new Neoverse N2 and Neoverse V1 platforms to our roadmap, it was a testament to the groundswell of Neoverse interest and adoption across our growing ecosystem. Today we’re pleased to share some of the new features of these platforms

• Synopsys and Arm Deliver Comprehensive Solutions to Increase Performance and Accelerate Time-to-Market for High-Performance Computing, Data Center and AI SoCs
• Lattice and Rambus to Partner on Next-Generation Security Solutions
• Tiempo Secure Selects IC'Alps to Accelerate Silicon Implementation of Secure Element IP for IoT Applications
• BitSim and NOW Electronics joins forces BitSim
• Silicon Catalyst Announces Six Newly Admitted Companies to Semiconductor Incubator
• SiPearl launches the recruitment of 10 engineers per month in France & Germany

Headlines for Monday Apr. 26, 2021

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Nvidia-ARM deal runs into security issues in the UK

The UK government has issued a public interest intervention notice instructing investigators to look into Nvidia's proposed $40 billion acquisition of ARM from SoftBank.

• Flex Logix Appoints CFO and VP of Inference Hardware to Senior Management Team; Announces Expansion to Austin, TX
• Anritsu Corporation Selects PLDA's PCIe Solution for its Next Generation of Handheld Spectrum Analyzers
• videantis and Continental sign strategic supplier contract and announce SOPs with videantis-enabled camera system
• Defacto Technologies Announces SoC Compiler, v9

Headlines for Friday Apr. 23, 2021

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Alphawave IP plans move to UK for $4.5bn IPO

Alphawave IP of Canada plans UK flotation and Cambridge design centre in a move that would value the company at US$4.5bn.

• Andes Announces the New Upgrade of AndeSight IDE v5.0: a comprehensive software solution to accelerate RISC-V AI and IoT developments
• Seamless Microsystems Announces Highest-Performance ADC for Automotive RADAR
• Vidatronic Appoints Mike Holland as VP of IP Licensing Sales, Positioning Company to Drive Continued Growth
• Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs Targeting High-End and Always-On Applications
• PCI Express Gen5 PHY & Controller IP Cores available in major Fabs & Foundries for Graphics, Memory and Storage Applications

Headlines for Thursday Apr. 22, 2021

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Tenstorrent Selects SiFive Intelligence X280 for Next-Generation AI Processors

SiFive today announced that Tenstorrent, an AI semiconductor and software start-up developing next-generation computers, will license the new SiFive Intelligence X280 processor in its AI training and inference processor.

• Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm
• EnSilica completes PPAP on safety-critical automotive ASIC design
• BrainChip Simplifies Deep Learning with Launch of MetaTF
• sureCore Unveils New Low Voltage Register Files