D&R Headline News (Last 14 Days)

Headlines for Monday Feb. 06, 2023

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Gartner Says Top 10 Semiconductor Buyers Decreased Chip Spending by 7.6% in 2022

The top 10 global original equipment manufacturers (OEMs) decreased their chip spending by 7.6% and accounted for 37.2% of the total market in 2022, according to preliminary results by Gartner, Inc. Global inflation and recession pressures sharply weakened demand for PCs and smartphones in 2022, impacting global OEMs production.

• Denying China IC Manufacturing Tools
• U.S. Ban on Huawei Seen Widening China Chip War
• UMC Reports Sales for January 2023
• GUC Monthly Sales Report - January 2023
• DVB-RCS2 Turbo Decoder and Encoder IP Core Available For Integration From Global IP Core
• Global Semiconductor Sales Increase 3.2% in 2022 Despite Second-Half Slowdown
• Aldec Releases Automated Static Linting and CDC Analysis for Microchip FPGA and SoC FPGA Designs
• Peripheral IPs with proven automotive compatibility are instantly licensable for extremely reliable performance.

Headlines for Thursday Feb. 02, 2023

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Rambus Delivers 6400 MT/s DDR5 Registering Clock Driver to Advance Server Memory Performance

Rambus today announced the availability of its new 6400 MT/s DDR5 Registering Clock Driver (RCD) and sampling to the major DDR5 memory module (RDIMM) manufacturers.

• GreenWaves Technologies announces a €20M financing
• Xfuse, LLC Phoenix ISP Now Available as a Download for AMD Kria KV260 Vision AI Starter Kit

Headlines for Wednesday Feb. 01, 2023

• UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

Headlines for Tuesday Jan. 31, 2023

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Faraday Announces Multi-site Manufacturing Support in ASIC

Faraday Technology today announced to offer multi-site manufacturing support across all regions for ASIC customers. With its long-term close collaboration with global foundry and OSAT vendors, Faraday is able to provide customers the multi-site support to mitigate manufacturing risks due to economy, accidents, epidemics, or geopolitics.

• Siemens advances integrated circuit verification with new, data-driven Questa Verification IQ software
• Tachyum Successfully Runs UEFI on Prodigy FPGA
• Hardware Root of Trust: The Key to IoT Security in Smart Homes
• Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution
• QuickLogic Partners with Andes Technology for eFPGA Joint Promotion

Headlines for Monday Jan. 30, 2023

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Intel kills its RISC-V Pathfinder development kit programme

Intel has discontinued its recent programme that brought together a wide range of RISC-V technologies.

• EU Parliament Adopts Position on Chips Act
• Linaro to Acquire Arm Forge Software Tools Business
• BrainChip Tapes Out AKD1500 Chip in GlobalFoundries 22nm FD SOI Process
• Gidel introduces groundbreaking edge computer with NVIDIA Jetson Orin NX system-on-module and high-bandwidth camera frame grabber for real-time image acquisition compute and AI processing
• Q4 loss at Intel
• 10-bit 3Msps Ultra low power SAR ADC IP core for Wireless Communication and Automotive SoCs is available for immediate licensing

Headlines for Thursday Jan. 26, 2023

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Axiomise Accelerates Formal Verification Adoption Across the Industry

Axiomise, the leading provider of cutting-edge formal verification solutions, marked its fifth anniversary in 2022 with an impressive list of highlights, including training, consulting, services, and custom app development such as formalISA.

• IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS
• Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
• intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
• Sevya joins TSMC Design Center Alliance
• Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies

Headlines for Wednesday Jan. 25, 2023

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Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design

Avery Design Systems, a leader in functional verification solutions, and high-speed connectivity IP innovator CoMira Solutions today announced a partnership aimed at enabling chiplet design using the UCIe (Universal Chiplet Interconnect Express) die-to-die interface standard.

• Weebit Nano nears productisation, negotiating initial customer agreements
• Open Compute Project Foundation and JEDEC Announce a New Collaboration

Headlines for Tuesday Jan. 24, 2023

• VORAGO Technologies to Move All its Manufacturing Stateside in Strategic Partnership with SkyWater's Trusted Foundry
• Nexperia invests in sustainable alternatives to batteries

Headlines for Monday Jan. 23, 2023

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Xiphera announces the first IP core for the quantum-secure xQlave™ product family

Xiphera introduces XIP6110B, the first member of the xQlave™ product family of quantum-secure cryptographic IP cores. XIP6110B implements CRYSTALS-Kyber Key Encapsulation Mechanism (KEM) that was recently selected as one of the four PQC algorithms to be standardised by the American NIST (National Institute of Standards and Technology).

• New Wave DV Releases Two New SOSA-Aligned 3U VPX ACAP (FPGA) Modules
• AI Must Be Secured at the Silicon Level
• Electronic System Design Industry Reports Revenue of $3.8 Billion in Q3 2022, ESD Alliance Reports
• CEO Interview: Stephen Fairbanks of Certus Semiconductor
• Accellera's Security Annotation for Electronic Design Integration Standard 1.0 Moves Toward IEEE Standardization
• Accellera Announces the Formation of the Clock Domain Crossing Working Group
• GUC Delivers its First TSMC N3 Chip and First AI-Optimized N5 Design Using Cadence Digital Solutions
• OIF Marks 25th Anniversary, Launches New Physical & Link Layer Working Group Electrical Project and Adds 112G VSR Clause to CEI 5.0 IA at Q1 Technical and MA&E Committees Meeting
• The latest ASIL-B,C,D and ISO26262 Certified Silicon Proven Interface IP Cores are ready for immediate licensing