D&R Headline News (Last 14 Days)
Headlines for Thursday Mar. 04, 2021

Silex Insight unleashes their new video codec (Colibri), that will shape the future of AV over IP distribution over 1GbE
Silex Insight has developed a video codec with industry-leading quality, powerful features and incredible efficiency called Colibri. It is the smartest video codec Silex Insight has ever developed and the first one designed specifically for the AV over IP market with focus on graphical elements for distribution over 1GbE network.- IAR Systems announces availability of RISC-V development tools with certification for IEC 61508 and ISO 26262
- proteanTecs Joins the TSMC IP Alliance Program
- BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI
- Revenue per Wafer Climbs As Demand Surges for 5nm/7nm IC Processes
- GPU shipments soar once more in Q4
- Wanxiang Blockchain Forms RISC-V International Blockchain SIG with Ecosystem Partners
- Thalia successfully completes 20th 22nm analog IP reuse engagement
- Leopard Imaging Collaborates with Socionext, Hailo, and AWS to Launch EdgeTuring
- Airborne System Design Assurance: Aldec Adds 60+ New HDL Rules to ALINT-PRO's DO-254 Plug-In
Headlines for Wednesday Mar. 03, 2021

Achronix and Mobiveil Announce Partnership to Deliver High-Speed Controller IP and FPGA Engineering Services
Achronix and Mobiveil announced today a partnership to offer Mobiveil’s soft IP portfolio to designers targeting Achronix devices.Headlines for Tuesday Mar. 02, 2021

Wave Goodbye, Hello MIPS as Chapter 11 Resolved
Wave Computing said it has emerged from Chapter 11 and will continue business going forward as MIPS.Headlines for Monday Mar. 01, 2021

Arasan announces the immediate availability of its MIPI C-PHY / D-PHY Combo IP for SoC Designs on TSMC 22nm Process
Arasan Chip Systems today announced the immediate availability of its MIPI C-PHY / D-PHY Combo IP supporting speeds of up to 2.5 Gbps for SoC designs on TSMC 22nm process- AMD, TSMC & Imec Show Their Chiplet Playbooks at ISSCC
- Verisilicon High-Performance and High-Quality AI Video Processor Powers Leading Datacenters
- Introducing Dolphin Design's new Audio CODEC for TWS devices with ANC capabilities
- Velodyne Lidar Licenses TSN IP Core from CAST
- Flex Logix and DARPA Expand Partnership with the Addition of Silicon Proven EFLX eFPGA in 12 and 16 nm Process Technologies for DARPA's Toolbox Initiative
- Metrics Announces an EDA as a Service Partnership Program with Semiconductor Intellectual Property Vendors
- Imperas Donates Latest RV32/64K Crypto (scalar) Architectural Validation Test Suites to the RISC-V Verification Ecosystem
Headlines for Friday Feb. 26, 2021

Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market
Alphawave IP, the world leader in multi-standard connectivity IP solutions, today announced that it has negotiated a $54M multi-year exclusive subscription reseller agreement with VeriSilicon for the China market.Headlines for Thursday Feb. 25, 2021
Latest News- BrainChip Inc. and NaNose Medical Successfully Detect COVID-19 in Exhaled Breath with Fast High-Accuracy Results
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
- Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering
- Rambus and AMD Extend Patent License Agreement
- MulticoreWare Inc. Becomes CEVA's Trusted Partner for Imaging & Computer Vision
Headlines for Wednesday Feb. 24, 2021

Tianyihexin Licenses Codasip's L30 for Powering Intelligent Wearable Device Solutions
Codasip announced today that Nanjing Tianyihexin Electronics, an innovative company focused on leading-edge solutions in multi-touch and gesture recognition technologies, has selected Codasip’s L30 (originally Bk3) RISC‑V‑based core for their TWS headset and intelligent wearable devices solutions.- Synopsys Delivers Breakthrough Performance with New ZeBu Empower Emulation System for Hardware-Software Power Verification
- CEVA's MotionEngine Smart TV Software Comes to More Smart TV brands via LG webOS
- Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications
- RISC-V International Unveils Fast Track Architecture Extension Process and Ratifies ZiHintPause Extension
- Achronix Announces 2020 Financial Results and Business Highlights
- AccelerComm Unveils Fully Integrated PUSCH Decoder to Supercharge 5G NR for Performance-Critical Channels
- Xilinx Revolutionizes the Modern Data Center with Software-Defined, Hardware Accelerated Alveo SmartNICs
- North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time
- Cadence Completes Acquisition of NUMECA
Headlines for Tuesday Feb. 23, 2021

SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications
SiPearl, the company designing the high-performance, energy-efficient microprocessor for the European exascale supercomputer and Open-Silicon Research, the India based entity of OpenFive, a leading provider of custom silicon solutions with differentiated IP, today announced a multi-year joint collaboration to enable expansive development of innovative High Performance Computing (HPC) applications.- Eureka Technology IP Core Supports NASA's MARS 2020 Perseverance Rover Mission
- Nations' Latest BLE 5 IC Powered By CEVA Bluetooth Low Energy IP
- Tiempo Secure is a winner of the French Government's Great Cybersecurity Challenge to make smart objects more resilient to cyberattacks
Headlines for Monday Feb. 22, 2021

CEVA Moves to Standardize DSP-enabled Bluetooth Audio IP with New Bluebud Wireless Audio Platform for TWS Earbuds, Smartwatches and Wearables
CEVA today unveiled Bluebud™, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for the fast-growing Bluetooth audio markets, including True Wireless Stereo (TWS) earbuds, hearables, wireless speakers, gaming headsets, smartwatches and other wearable devices.- Samsung Foundry Certifies Synopsys IC Validator for 5nm and 4nm Advanced Process Technologies
- CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces Power Consumption by 30%
- IAR Systems introduces 64-bit Arm core support in leading embedded development tools
- Imagination's GPU selected by StarFive to create high-performance, small and low-cost BeagleV RISC-V AI single board computer
- Chipus Joins FDXcelerator Program Bringing Ultra-Low-Power and Compact Power Management Solution for Hearables and Wearables
- Secure-IC and MosChip Announce Strategic Partnership to Provide Turnkey ASIC Solutions With Embedded Security for Edge Applications
- Syntiant Adopts Movellus' Clock Network for its Low-Power NDP120 Deep Learning Processor
Headlines for Friday Feb. 19, 2021

Moschip Unveils Focused Strategy For Turn-Key ASIC Solutions
MosChip Technologies Limited, a semiconductor and system design services company, unveils today, focused strategy for turn-key ASIC solutions. MosChip has over a twenty-year track record in designing semiconductor IP, products, and SoCs for IoT, networking, industrial, and consumer applications.- Sales of Logic ICs Account for Largest Share of China's IC Market in 2020
- aicas and SiFive Bridge Flexibility and Performance with RISC-V, JamaicaVM Integration
- Achronix and Logic Fruit Introduce IP Solutions for Test and Measurement Applications
Headlines for Thursday Feb. 18, 2021

PLDA Announces a Unique CXL Verification IP Ecosystem, Delivering Robust Verification That Reduces Time-to-Design for CXL 2.0 Applications
PLDA, the industry leader in high-speed interconnect solutions, today announced their CXL™ Verification IP Ecosystem which includes IP from partners Truechip and Avery Design Systems, who are pioneering CXL design verification.- Synopsys Posts Financial Results for First Quarter Fiscal Year 2021
- Proposed Arm Buyout: Huang on So Many Levels
- Micro Magic, Inc. Delivers Ultra Low Power 64-Bit RISC-V Core
- Mark Redford Named Vice President, Operations & Supply Chain for Palma Ceia SemiDesign - Former Arm Executive
- JEDEC Publishes DDR4 NVDIMM-P Bus Protocol Standard
- SPARK Microsystems Announces CDN$17.5 Million Financing