D&R Headline News (Last 14 Days)

Headlines for Friday Jan. 22, 2021

• eInfochips Wins Design Services Company of the Year Award from IESA

Headlines for Thursday Jan. 21, 2021

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Arasan announces its Total eMMC IP solution for TSMC 22nm process

Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs today announced the immediate availability of its eMMC PHY IP for TSMC 22nm process technology

• Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
• Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC
• MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences
• Faraday Unveils Complete Imaging and Display High-Speed Interface IP Set on UMC 28nm and 40nm Processes
• Foxconn and Winbond Make Strategic Investment in Kneron

Headlines for Wednesday Jan. 20, 2021

Top Story

Industry R&D Spending To Rise 4% After Hitting Record in 2020

Intel stays on top of research and development ranking, but its share of total industry R&D expenditures dipped after its spending decreased 4% in 2020. AMD moved into the R&D top 10, says new report.

• Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics
• Attopsemi Released White Paper "I-fuse - Most Reliable and Fully Testable OTP"
• Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements

Headlines for Tuesday Jan. 19, 2021

• Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools
• Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC
• Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing

Headlines for Monday Jan. 18, 2021

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PLDA Announces XpressLINK-SOC CXL Controller IP with Support for the AMBA CXS Issue B Protocol

PLDA, the industry leader in high-speed interconnect solutions, today announced that PLDA’s industry-leading XpressLINK-SOC™ CXL IP provides full support for the AMBA® CXS Issue B (CXS-B) interface protocol.

• TSMC Boosts Capital Expenditure Budget on Strong Outlook
• DCD With EBBM in USA & Greece

Headlines for Thursday Jan. 14, 2021

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Qualcomm to Acquire NUVIA

Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has entered into a definitive agreement to acquire NUVIA for approximately $1.4 billion before working capital and other adjustments.

• Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO
• Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
• TSMC Reports Fourth Quarter EPS of NT$5.51
• BeagleBoard.org and Seeed Introduce the First Affordable RISC-V Board Designed to Run Linux
• Ginger Lee Named Chief Financial Officer for Palma Ceia SemiDesign
• TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
• Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology
• Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series
• Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices

Headlines for Wednesday Jan. 13, 2021

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Value of Semiconductor Industry M&A Agreements Sets Record in 2020

Five big acquisition announcements and more than a dozen smaller deals in 2020 pushed the total value of M&A agreements in the year to an all-time high of $118.0 billion, surpassing the previous record of $107.7 billion reached in 2015

• Netflix Now Streaming xHE-AAC Audio on Android Mobile
• Syntiant Surpasses Milestone of 10 Million Processors Shipped
• Arm's powerful compute and graphics platform at the heart of the new Samsung Exynos 2100

Headlines for Tuesday Jan. 12, 2021

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Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs

Synopsys, Inc. (Nasdaq: SNPS) and Socionext, Inc. today announced their collaboration to expand Socionext's use of Synopsys' broad DesignWare® IP to include Synopsys' HBM2E IP for maximum memory throughput in AI and high-performance computing (HPC) applications.

• CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family
• Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip
• Secure-IC And Menta Co-Develop Solution To Optimize Embedded Cybersecurity
• SEGGER introduces new Open Flashloader for direct programming of any RISC-V system

Headlines for Monday Jan. 11, 2021

Top Story

Wi-Fi Alliance Wi-Fi predictions for 2021

Wi-Fi® played a critical role in providing digital infrastructure to support increased connectivity demands during the global pandemic.

• Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras
• ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q3 2020
• Flex Logix Appoints Dana McCarty as Vice President of Sales and Marketing for AI Inference Products
• DSP Concepts and Cambridge Consultants work to accelerate audio and voice innovation
• Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core

Headlines for Friday Jan. 08, 2021

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Achronix to List on Nasdaq Through Merger with ACE Convergence

Achronix Semiconductor Corporation, a leader in high-performance field-programmable gate arrays (FPGAs) and embedded FPGA (eFPGA) IP, and ACE Convergence Acquisition Corp. (ACE) (Nasdaq: ACEV), a special-purpose acquisition company, today announced that they have entered into a definitive agreement for a business combination that would result in the combined entity continuing as a publicly listed company.

• UMC Reports Sales for December 2020
• TSMC December 2020 Revenue Report

Headlines for Thursday Jan. 07, 2021

Top Story

Andes Technology Provides RISC-V CPU Core to SK Telecom

Andes Technology Corp. today announced that its 64-bit AndesCore™ AX25 RISC-V processor has been adopted by SK Telecom (hereinafter referred to as “SKT”), Korea’s leading ICT company, for the development of artificial intelligence products.

• Kevin Steptoe Joins Palma Ceia SemiDesign as EVP Program Management
• DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor
• Jim Keller joins Tenstorrent as President and CTO.
• China Forecast to Fall Far Short of its "Made in China 2025" Goals for ICs
• IQ-Analog Antenna Processor ASIC Powers Lockheed Martin Phased Array Sensors
• Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Apps