D&R Headline News (Last 14 Days)

Headlines for Wednesday May. 22, 2019

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Arasan announces the immediate availability of its MIPI CSI-2 v2.1 IP supporting C-PHY v1.2 and D-PHY v2.1

Arasan Chip Systems announces the immediate availability its MIPI CSI-2 v2.1 Tx and Rx IP Cores seamlessly integrated with its MIPI C-PHY v.1.2 IP supporting speeds of upto 3.5gsps and D-PHY v2.1 supporting speeds of upto 4.5gbps.

• Huawei: ARM memo tells staff to stop working with China's tech giant
• MVSILICON License and Deploy CEVA Bluetooth IP in its latest Wireless Audio Platform
• Fraunhofer IIS Licenses MPEG-H Audio Patents to LG Electronics
• US Grants 90-Day Reprieve for Huawei Suppliers
• North American Semiconductor Equipment Industry Posts April 2019 Billings
• After 2Q19 Bottom, Expectations Increase for a 3Q19 IC Market Rebound
• Sankalp Semiconductor to Exhibit at Design Automation Conference - 2019

Headlines for Tuesday May. 21, 2019

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Achronix Introduces Ground-Breaking FPGA Family, Delivering New Levels of Performance with Adaptability for High-Bandwidth Data Acceleration Applications

The Achronix Speedster®7t family – based on a new, highly optimized architecture – goes beyond traditional FPGA solutions featuring ASIC-like performance, FPGA adaptability and enhanced functionality to streamline design.

• sureCore Appoints Cedric Plomion Global Sales Director
• Arteris IP and Wave Computing Collaborate on Reference Architecture for Enterprise Dataflow Platform
• Faraday Geared Up for Data Communication Applications in ASIC Development
• Innovative Logic USB IP Portfolio Strengthens RISC-V Ecosystem
• Minima Processor names Semiconductor Veteran Tuomas Hollman as CEO
• Marvell to Acquire Avera Semi, Creating an Infrastructure ASIC Powerhouse
• ClioSoft and Silvaco Collaborate to Integrate ClioSoft's SOS Design Data Management Platform with Silvaco's Analog Custom Design Tools

Headlines for Monday May. 20, 2019

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INGChips selects Dolphin Integration's Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash

Dolphin Integration, a leading provider of semiconductor IP, announced today that INGChips, a fabless semiconductor company that focuses on ultra low power IoT wireless SoC, has selected Dolphin Integration’s comprehensive set of Power Management IPs for INGChips’ Bluetooth Low-Energy (BLE) SoC in 40 nm with embedded Flash memory.

• Synopsys and Kudan Collaborate to Accelerate Development of Intelligent Computer Vision Processing SoCs
• Lattice's New MachX03D FPGA Enhances Security with Hardware Root-of-Trust Capabilities
• CEVA Announces Availability of SLAM Software Development Kit for CEVA-XM Intelligent vision DSPs and NeuPro AI Processors
• Cadence Palladium and Protium Platforms Enable Innovium to Accelerate First-Pass Silicon Success for the Data Center Market

Headlines for Friday May. 17, 2019

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Intel Recaptures Number One Quarterly Semi Supplier Ranking from Samsung

Intel replaced Samsung as the number one quarterly semiconductor supplier in 4Q18 after losing the lead spot to Samsung in 2Q17. While Samsung held the full-year number one ranking in 2017 and 2018, Intel is forecast to easily recapture the number one ranking for the full-year of 2019, a position it previously held from 1993 through 2016.

• Intrinsic ID Secures EUR 11 Million Loan from European Investment Bank
• lowRISC Expands and Appoints New Members to the Board of Directors from Google and ETH Zurich

Headlines for Thursday May. 16, 2019

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SmartDV Reduces Protocol Debug Time with Smart ViPDebug

SmartDV™ Technologies today unveiled Smart ViPDebug™, a protocol debugger that reduces debug time by rapidly identifying violations and reducing the time needed to find the cause of violations through its linked waveform and transaction database views.

Headlines for Wednesday May. 15, 2019

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New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile and Surveillance Markets

Cadence today expanded the high end of its popular Tensilica® Vision DSP product family with the introduction of the Cadence® Tensilica Vision Q7 DSP delivering up to 1.82 tera operations per second (TOPS).

• Making virtual more of a reality with the new Arm Mali-D77 display processor
• Arm demonstrates new IoT test chip and board for highly efficient, secure IoT designs
• Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform
• AI Chipmaker Hailo Releases Industry-Leading Deep Learning Processor
• eSilicon Announces Production Qualification of 5G Infrastructure ASIC
• Cadence Announces Broad Next-Generation Memory Standard Support in Samsung Foundry's Advanced Process Technologies
• Cadence Tapes Out 112G Long-Reach SerDes IP on Samsung Foundry's 7LPP Process Technology
• Silicon Labs Partners with Pulsic, Selecting Animate as Its Automated Layout Solution for Analog IC Designs

Headlines for Tuesday May. 14, 2019

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Wave Computing Adds MIPS32 microAptiv Cores to MIPS Open Program

Wave Computing today announced it will include the MIPS32® microAptiv™ cores in the newest release of MIPS Open program components.

• Arteris IP FlexNoC Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS
• Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores
• EDA Vendors Spread Wings as Market Softens
• Tiempo Secure Joins Deutsche Telekom's nuSIM Partnering Network
• Eta Compute Awarded Additional Patent For Asynchronous Microprocessor Technology

Headlines for Monday May. 13, 2019

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Amphion Semiconductor introduces 4K/UHD capable AV1 video decoder hardware IP extension to its Malone video decoder family

Amphion has announced the scheduled availability of a hardware based AV1 decoding extension to its Malone family of high performance video decoders for SoC implementation.

• Cadence Custom/AMS Flow Certified for Samsung 28nm FD-SOI Process Technology
• Samsung Foundry Begins Partnership with Silvaco to Launch their Semiconductor IP Assets
• Elektrobit and Synopsys Collaborate to Accelerate Automotive Electronic System Virtual Development
• Does a SCM Controller Need a Translation Table?
• Agile Analog secures $5M in funding to change the semiconductor industry
• Moortec Support Canaan Creatives Mass Production ASIC on TSMC 7nm Process
• PowerVR GPU and NNA available on SiFive platform

Headlines for Friday May. 10, 2019

• TSMC April 2019 Revenue Report
• Intel Targets 2021 for 7 nm
• Texas Instruments Widens Its Lead As World's Top Analog IC Supplier
• ON Semiconductor Executive Named to Alphacore Inc. Advisory Board
• ClioSoft Achieves TUV SUD Certification in Support of Automotive ISO 26262 Standard

Headlines for Thursday May. 09, 2019

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Imagination announces ray tracing technology for licensing

Imagination Technologies announces its PowerVR Ray Tracing technology for licensing, enabling state-of-the-art realistic image rendering using light-modelling techniques to be integrated into graphics processing units (GPUs) across mobile, automotive, server and other markets.

• CoreHW and RoodMicrotec to establish long-term supply chain partnership
• UMC Reports Sales for April 2019
• eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip
• Algo-Logic Systems Delivers Ultra-Low-Latency Pre-Trade Risk Check (PTRC) Solution Powered by Xilinx
• Wave Computing Appoints Industry Veteran Art Swift CEO
• Efinix Partners with Samsung to Develop Quantum eFPGAs on 10nm Silicon Process
• SMIC Reports 2019 First Quarter Result
• SmartDV Appoints HyperSilicon Exclusive Sales Representative in China

Headlines for Wednesday May. 08, 2019

• GOWIN Semiconductor Joins Arm DesignStart Offering Free Arm Cortex-M Processors for its FPGA Product Families

Headlines for Tuesday May. 07, 2019

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eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip

eSilicon announced today the tapeout of a 7nm test chip to validate the latest neuASIC™ IP platform release. eSilicon’s neuASIC IP platform provides a library of IP that supports a wide range of functions found in artificial intelligence applications.

• Fudan Microelectronics Group Selects Synopsys' DesignWare Bluetooth IP for Smart IoT System-on-Chips
• Cycle-accurate trace boosts performance optimization capabilities of UltraSoC embedded analytics infrastructure
• Arteris IP FlexNoC & Resilience Package Licensed by Semidrive for ISO 26262-Compliant Autonomous Driving Chips
• Cadence Delivers Smart JasperGold Formal Verification Platform
• Codasip Presence at upcoming events: China Roadshow, DAC 2019, and RISC-V Workshop Zurich