D&R Headline News (Last 14 Days)

Headlines for Friday May. 29, 2020

• Texas Instruments Maintains Firm Grip As World's Top Analog IC Supplier

Headlines for Thursday May. 28, 2020

Top Story

TSMC Delivers World-first 7nm Automotive Design Enablement Platform

TSMC today announced the availability of the world’s first 7nm Automotive Design Enablement Platform (ADEP), accelerating time-to-design for customers’ AI Inferencing Engines, Advanced Driver-assistance Systems (ADAS) and Autonomous Driving applications.

• Khronos Group Releases OpenVG 1.1 Lite to Bring High-Quality Vector Graphics to OpenGL ES 2.0-Compatible GPUs
• Synopsys' Silicon-Proven DesignWare DDR IP for High-Performance Cloud Computing Networking Chips Selected by NVIDIA
• Chip Equipment Becomes Trade War's Latest Battlefield
• DARPA Looks to Automate Security for IC Design

Headlines for Wednesday May. 27, 2020

Top Story

UltraSoC and Canis Labs partner to secure the CAN bus

UltraSoC and Canis Automotive Labs today announced a partnership that addresses one of the most serious cybersecurity vulnerabilities in the automotive industry: the lack of security features within the CAN bus, which is commonly used to interconnect in-vehicle systems such as brakes, steering, engine, airbags, door locks, and headlights.

• Synopsys Announces Support of TensorFlow Lite for Microcontrollers on Energy-Efficient ARC EM and ARC HS Processor IP
• Domain Specific Accelerators Will Drive Vector Processing on RISC-V
• GOWIN Semiconductor Integrates their latest HDMI/DVI RX and TX IP into GOWIN EDA IP Generator
• Menta joins PROMISE Consortium under the Horizon 2020 Initiative of the European Commission
• Cadence to Optimize Digital Full Flow and Verification Suite for Arm Cortex-A78 and Cortex-X1 CPU Mobile Device Development

Headlines for Tuesday May. 26, 2020

Top Story

New Arm IP delivers true digital immersion for the 5G era

Arm's next-generation mobile solution delivers massive performance and efficiency gains to enable true digital immersion in the 5G era.

• Synopsys Enables Tapeout Success for Early Adopters of Arm's Next Generation of Mobile IP
• CEVA to Host Online Seminar Series for Wireless Connectivity and Smart Sensing Technologies
• GlobalFoundries Abandons Chengdu Wafer Fab

Headlines for Monday May. 25, 2020

Top Story

The TSMC and Huawei Announcements Are Not as Linked as You May Think

The industry was rocked last week by two U.S. announcements that seem interconnected.

• Senators Seek Suspension of TSMC US Fab Project
• Do more with less energy! What's behind Dolphin Design's Energy Efficient Platforms?
• Lattice sensAI 3.0 Solutions Stack Doubles Performance, Cuts Power Consumption in Half for Edge AI Applications
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2020
• China to Fall Far Short of its "Made-in-China 2025" Goal for IC Devices

Headlines for Friday May. 22, 2020

• Panasonic Adopts Synopsys Custom Design Platform to Accelerate Next-Generation Automotive and Industrial Products
• North American Semiconductor Equipment Industry Posts April 2020 Billings
• Gyrfalcon is Named as a Top 10 Processor for AI Acceleration at the Endpoint in 2020 by EE Times

Headlines for Thursday May. 21, 2020

Top Story

eMemory Provides Intellectual Property for Secure NB-IoT Products

eMemory, the world’s leading supplier of intellectual property for NVM and security at the semiconductor level, is providing its intellectual property that ensures security in new chips for the narrowband-IoT (NB-IoT) market.

• Fuji Xerox Adopts Synopsys ZeBu Server for Multi-Function Printer SoC
• SimpleMachines selects UltraSoC embedded analytics to support next-generation compute platform
• Faraday Succeeds in Next-Gen Display ASIC with Display IP Solutions
• CEO interview: The importance of being agile
• S2C Announces New Prodigy Cloud System for Next Generation SoC Prototyping
• Cobham Advanced Electronic Solutions Radiation Hardened Microelectronics Support New Xilinx XQRKU060 FPGA
• Imec combines advanced machine learning algorithms and innovations in chip design to achieve cm accuracy and low-power ultra wideband localization

Headlines for Wednesday May. 20, 2020

Top Story

Politics Haunts TSMC's US Fab Plan

The announcement by Taiwan Semiconductor Manufacturing Co. (TSMC) last week to build a fab in the United States was very likely motivated by a number of political factors, according to people with knowledge of the matter. It’s a move that could haunt TSMC and its future.

• Mirabilis Design creates the first RISC-V system-level architecture exploration solution
• Imagination receives ISO 26262 statement of process conformance from HORIBA MIRA

Headlines for Tuesday May. 19, 2020

Top Story

Xilinx "Lifts Off" with Launch of Industry's First 20nm Space-Grade FPGA for Satellite and Space Applications

First to enable machine learning inference together with unlimited on-orbit reconfiguration for real time on-board-processing in space; delivers full radiation tolerance spanning all orbits

• Cadence Delivers 10 New Verification IP Targeting Automotive, Hyperscale Data Center and Mobile Applications
• SiFive Partners With Coherent Logix for Mission-Critical Processor Solutions
• Arteris IP FlexNoC Interconnect and AI Package Licensed by Blue Ocean Smart System for AI Chips
• CXL Protocol Adds Capabilities over PCIe
• Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Vision Solutions
• Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput

Headlines for Monday May. 18, 2020

Top Story

LeapMind Unveils "Efficiera", the New Ultra Low Power AI Inference Accelerator IP

LeapMind today announced that the company has developed "Efficiera", an ultra low power AI inference accelerator IP for targeting companies that design ASIC and FPGA circuits, and other related products.

• Cadence Expands Design IP Portfolio with 56G Long-Reach PAM4 SerDes on TSMC N7 and N6 Processes
• TSMC Ariz Fab a Tangled Web
• UltraSoC appoints Jonathan Lucas as VP of Software
• Synopsys and TSMC Collaborate to Enable Designs of HPC, Mobile, 5G, and AI SoCs with Certified Solutions on TSMC N5 and N6 Processes
• Mentor's Calibre and Analog FastSPICE platforms achieve certification for TSMC's newest processes

Headlines for Friday May. 15, 2020

Top Story

TSMC Announces Intention to Build and Operate an Advanced Semiconductor Fab in the United States

TSMC (TWSE: 2330, NYSE: TSM) today announced its intention to build and operate an advanced semiconductor fab in the United States with the mutual understanding and commitment to support from the U.S. federal government and the State of Arizona.

• EVS Media Infrastructure adopts intoPIX JPEG-XS solution for Neuron
• Aspinity and Infineon partner to accelerate development of intelligent sensing products with longer lasting batteries

Headlines for Thursday May. 14, 2020

Top Story

CAST Releases 100Gbps UDP/IP Core

CAST, Inc. today announced the availability of a new silicon intellectual property core enabling lean networking with the User Datagram Protocol (UDP) Internet Protocol (IP) at bidirectional speeds up to 100Gbps.

• CHIP Alliance's Newly Enhanced SweRV Cores Available to All for Free
• Prophesee, DMP partner to accelerate development of embedded machine vision and artificial intelligence (AI) applications using Event-Based Vision approach
• Veriest supports the development of Arbe's innovative automotive Radar device
• Louis Tannyeres, Former Senior Fellow at Texas Instruments, Appointed Executive Vice-President of Engineering at Kalray