D&R Headline News (Last 14 Days)
Headlines for Friday Jan. 22, 2021
Latest NewsHeadlines for Thursday Jan. 21, 2021

Arasan announces its Total eMMC IP solution for TSMC 22nm process
Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs today announced the immediate availability of its eMMC PHY IP for TSMC 22nm process technology- Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
- Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC
- MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences
- Faraday Unveils Complete Imaging and Display High-Speed Interface IP Set on UMC 28nm and 40nm Processes
- Foxconn and Winbond Make Strategic Investment in Kneron
Headlines for Wednesday Jan. 20, 2021

Industry R&D Spending To Rise 4% After Hitting Record in 2020
Intel stays on top of research and development ranking, but its share of total industry R&D expenditures dipped after its spending decreased 4% in 2020. AMD moved into the R&D top 10, says new report.- Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics
- Attopsemi Released White Paper "I-fuse - Most Reliable and Fully Testable OTP"
- Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements
Headlines for Tuesday Jan. 19, 2021
Latest News- Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools
- Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC
- Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing
Headlines for Monday Jan. 18, 2021

PLDA Announces XpressLINK-SOC CXL Controller IP with Support for the AMBA CXS Issue B Protocol
PLDA, the industry leader in high-speed interconnect solutions, today announced that PLDA’s industry-leading XpressLINK-SOC™ CXL IP provides full support for the AMBA® CXS Issue B (CXS-B) interface protocol.Headlines for Thursday Jan. 14, 2021

Qualcomm to Acquire NUVIA
Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has entered into a definitive agreement to acquire NUVIA for approximately $1.4 billion before working capital and other adjustments.- Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO
- Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
- TSMC Reports Fourth Quarter EPS of NT$5.51
- BeagleBoard.org and Seeed Introduce the First Affordable RISC-V Board Designed to Run Linux
- Ginger Lee Named Chief Financial Officer for Palma Ceia SemiDesign
- TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
- Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology
- Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series
- Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices
Headlines for Wednesday Jan. 13, 2021

Value of Semiconductor Industry M&A Agreements Sets Record in 2020
Five big acquisition announcements and more than a dozen smaller deals in 2020 pushed the total value of M&A agreements in the year to an all-time high of $118.0 billion, surpassing the previous record of $107.7 billion reached in 2015- Netflix Now Streaming xHE-AAC Audio on Android Mobile
- Syntiant Surpasses Milestone of 10 Million Processors Shipped
- Arm's powerful compute and graphics platform at the heart of the new Samsung Exynos 2100
Headlines for Tuesday Jan. 12, 2021

Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs
Synopsys, Inc. (Nasdaq: SNPS) and Socionext, Inc. today announced their collaboration to expand Socionext's use of Synopsys' broad DesignWare® IP to include Synopsys' HBM2E IP for maximum memory throughput in AI and high-performance computing (HPC) applications.- CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family
- Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip
- Secure-IC And Menta Co-Develop Solution To Optimize Embedded Cybersecurity
- SEGGER introduces new Open Flashloader for direct programming of any RISC-V system
Headlines for Monday Jan. 11, 2021

Wi-Fi Alliance Wi-Fi predictions for 2021
Wi-Fi® played a critical role in providing digital infrastructure to support increased connectivity demands during the global pandemic.- Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras
- ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q3 2020
- Flex Logix Appoints Dana McCarty as Vice President of Sales and Marketing for AI Inference Products
- DSP Concepts and Cambridge Consultants work to accelerate audio and voice innovation
- Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core
Headlines for Friday Jan. 08, 2021

Achronix to List on Nasdaq Through Merger with ACE Convergence
Achronix Semiconductor Corporation, a leader in high-performance field-programmable gate arrays (FPGAs) and embedded FPGA (eFPGA) IP, and ACE Convergence Acquisition Corp. (ACE) (Nasdaq: ACEV), a special-purpose acquisition company, today announced that they have entered into a definitive agreement for a business combination that would result in the combined entity continuing as a publicly listed company.Headlines for Thursday Jan. 07, 2021

Andes Technology Provides RISC-V CPU Core to SK Telecom
Andes Technology Corp. today announced that its 64-bit AndesCore™ AX25 RISC-V processor has been adopted by SK Telecom (hereinafter referred to as “SKT”), Korea’s leading ICT company, for the development of artificial intelligence products.- Kevin Steptoe Joins Palma Ceia SemiDesign as EVP Program Management
- DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor
- Jim Keller joins Tenstorrent as President and CTO.
- China Forecast to Fall Far Short of its "Made in China 2025" Goals for ICs
- IQ-Analog Antenna Processor ASIC Powers Lockheed Martin Phased Array Sensors
- Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Apps