D&R Headline News (Last 14 Days)

Headlines for Thursday Jan. 26, 2023

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Axiomise Accelerates Formal Verification Adoption Across the Industry

Axiomise, the leading provider of cutting-edge formal verification solutions, marked its fifth anniversary in 2022 with an impressive list of highlights, including training, consulting, services, and custom app development such as formalISA.

• IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS
• Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
• intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
• Sevya joins TSMC Design Center Alliance
• Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies

Headlines for Wednesday Jan. 25, 2023

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Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design

Avery Design Systems, a leader in functional verification solutions, and high-speed connectivity IP innovator CoMira Solutions today announced a partnership aimed at enabling chiplet design using the UCIe (Universal Chiplet Interconnect Express) die-to-die interface standard.

• Weebit Nano nears productisation, negotiating initial customer agreements
• Open Compute Project Foundation and JEDEC Announce a New Collaboration

Headlines for Tuesday Jan. 24, 2023

• VORAGO Technologies to Move All its Manufacturing Stateside in Strategic Partnership with SkyWater's Trusted Foundry
• Nexperia invests in sustainable alternatives to batteries

Headlines for Monday Jan. 23, 2023

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Xiphera announces the first IP core for the quantum-secure xQlave™ product family

Xiphera introduces XIP6110B, the first member of the xQlave™ product family of quantum-secure cryptographic IP cores. XIP6110B implements CRYSTALS-Kyber Key Encapsulation Mechanism (KEM) that was recently selected as one of the four PQC algorithms to be standardised by the American NIST (National Institute of Standards and Technology).

• New Wave DV Releases Two New SOSA-Aligned 3U VPX ACAP (FPGA) Modules
• AI Must Be Secured at the Silicon Level
• Electronic System Design Industry Reports Revenue of $3.8 Billion in Q3 2022, ESD Alliance Reports
• CEO Interview: Stephen Fairbanks of Certus Semiconductor
• Accellera's Security Annotation for Electronic Design Integration Standard 1.0 Moves Toward IEEE Standardization
• Accellera Announces the Formation of the Clock Domain Crossing Working Group
• GUC Delivers its First TSMC N3 Chip and First AI-Optimized N5 Design Using Cadence Digital Solutions
• OIF Marks 25th Anniversary, Launches New Physical & Link Layer Working Group Electrical Project and Adds 112G VSR Clause to CEI 5.0 IA at Q1 Technical and MA&E Committees Meeting
• The latest ASIL-B,C,D and ISO26262 Certified Silicon Proven Interface IP Cores are ready for immediate licensing

Headlines for Friday Jan. 20, 2023

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Comcores TSN technology and 5G communication expertise to be deployed in a significant EU funded project with pan-European partners

The OCTAPUS initiative is an EU funded project, which started in September 2022 and is funded until February 2026. OCTAPUS stands for “Optical Circuit switched Time-Sensitive Network (TSN) architecture for highspeed Passive optical networks and next generation Ultra-dynamic & reconfigurable central office environments”, and the goal is to deliver an agile, low-cost and energy efficient Photonic Integrated Circuit (PIC) technology framework.

Headlines for Thursday Jan. 19, 2023

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Andes Technology Collaborates with LDRA to Deliver Integrated Tool Suite for Safety-Critical Software on Andes RISC-V CPU Solutions

Andes Technology, a leading supplier of high efficiency, low-power 32/64-bit RISC-V processor cores and founding premier member of RISC-V International, today announced the integration of AndeSight™ IDE with LDRA tool suite.

• Foundry Revenue Is Forecasted to Drop by 4% YoY for 2023 Due to Slow Inventory Consumption and Falling Wafer Input from Customers, Says TrendForce

Headlines for Wednesday Jan. 18, 2023

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Analog Bits Awarded ISO 9001 and ASIL B Ready Certifications

Analog Bits, the industry’s leading provider of low-power mixed-signal IP (Intellectual Property) solutions, has received ISO 9001 Certification for design and development of low-power clocking, sensors, and interconnected IPs.

Headlines for Tuesday Jan. 17, 2023

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Gartner Says Worldwide Semiconductor Revenue Grew 1.1% in 2022

Worldwide semiconductor revenue increased 1.1% in 2022 to total $601.7 billion, up from $595 billion in 2021, according to preliminary results by Gartner, Inc. The combined revenue of the top 25 semiconductor vendors increased 2.8% in 2022 and accounted for 77.5% of the market.

• Settlement Reached in Lawsuit Brought by Tachyum Against Cadence

Headlines for Monday Jan. 16, 2023

• National Instruments up for sale
• Analog IPs Automate Integration, Tune to Fab Nodes
• Unveiling the Future of Home Entertainment: a truly immersive Multimedia experience through HDMI 1.4 Tx-Rx PHY and Controller IP Cores

Headlines for Friday Jan. 13, 2023

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Alphawave to outline long-term strategy and financial targets

Alphawave IP Group plc (LSE: AWE, “Alphawave”, the “Company”), today will host its inaugural Capital Markets Day for investors and financial analysts in London. At the event, the management team will present the Company’s long-term business strategy and financial targets as it enters the next stage of technology leadership in connectivity for digital infrastructure markets.

• Alphawave Semi: Q4 2022 Trading and Business Update
• Imagination collaborates with Synopsys to accelerate 3D visualisation in mobile and data centre
• Certus Semiconductor releases ESD library in GlobalFoundries 12nm Finfet process

Headlines for Thursday Jan. 12, 2023

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The Importance of 3D IC Ecosystem Collaboration

Not too long ago, packaging technologies were thought of as inconvenient back-end processes. But times have changed, and rising advancements in artificial intelligence, big data, cloud computing and autonomous vehicles have pushed the computing envelope unlike ever before (along with the need for packaging technologies).

• Apple to replace Broadcom IC with in-house designed part
• EDA Tools for Analog: Where Do I Go From Here?
• Arteris Announces New Employment Inducement Grants
• VSORA Secures $4.2 Million in Financing from Otium Capital, Angel Investors
• Chipletz selects Siemens' EDA solutions for its Smart Substrate IC packaging technology
• TSMC Reports Fourth Quarter EPS of NT$11.41
• Should open source sniff the geopolitical wind and ban itself in China and Russia?
• Creonic DVB-GSE Encapsulator and Decapsulator IP Cores Are Now Available with Data Rates of up to 4Gbit/s
• Alphawave IP Announces Appointments to its Executive Leadership team
• Bluespec collaborates with Synopsys to address growing verification demands for RISC-V design community