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D&R Headline News (Last 14 Days)
Headlines for Thursday Oct. 22, 2020
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PLDA demonstrates successful PCIe 5.0 Link Training at 32 GT/s with its PCIe 5.0 controller and Broadcom PHY
PLDA, the industry leader in PCI Express® controller IP solutions has today unveiled their PCIe 5.0 demonstration. The demo showcases stable PCIe 5.0 Link Training (32 GT/s) and exceptional signal integrity with a Broadcom® PCIe 5.0 PHY platform.- TSMC Sees HPC As Next Inflection Point
- Arm partners with Mentor to offer complete verification service
- Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
- M31 Technology Receives 2020 TSMC OIP Partner of the Year Award for Specialty Process IP
- eMemory Receives 2020 TSMC OIP Partner of the Year Award for Embedded Memory IP
- SmartDV Appoints Karthik Gopal as Asia General Manager
- Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade
- GlobalFoundries Offers Ambitious Tech Plans, While Eying an IPO
Headlines for Wednesday Oct. 21, 2020
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Faraday Brings Advanced Audio ASIC Solutions to the Music Entertainment Industry
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced gains in advanced to high-end audio applications with adoption and recognition from some of the top brands in musical instruments.- Arm Awarded TSMC OIP Partner of the Year Award for Processor IP for Six Years in a Row
- Alphawave IP Receives Prestigious 2020 TSMC OIP Partner of the Year Award for High-Speed SerDes IP
- Silicon Creations Named 2020 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP
- Microchip Acquires High-Level Synthesis Tool Provider LegUp to Simplify Development of PolarFire FPGA-based Edge Compute Solutions
- TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions
- IAR Systems brings functional safety tools to RISC-V with certification for IEC 61508 and ISO 26262
Headlines for Tuesday Oct. 20, 2020
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Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip
Flex Logix Technologies, Inc. today announced availability of its InferX™ X1, the industry’s fastest AI inference chip for edge systems.- Codasip Announces a New Design Center in France
- Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence
- TSMC Announces 2020 OIP Partner of the Year Awards for Excellence in Accelerating Silicon Innovation
- Cadence Reports Third Quarter 2020 Financial Results
- SmartDV to Exhibit at Virtual Samsung SAFE Forum 2020 with Portfolio of Design and Verification IP
- TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC
- SK hynix to Acquire Intel NAND Memory Business
Headlines for Monday Oct. 19, 2020
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Latest NPU adds to Arm's AI Platform performance, applicability, and efficiency
With an ever-increasing range of devices adding artificial intelligence (AI) functionality, Arm today announced the latest member of its Ethos product line, the Arm Ethos-U65 microNPU (Neural Processing Unit).- Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution
- Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI
- Dolphin Design's SPEED platforms receive the "Solar Impulse Efficient Solution" Label, rewarding profitable solutions that protect the environment.
- Perforce Software Accelerates SoC Development With Methodics IPLM 3.0 Launch
- Wipro to acquire Eximius Design, strengthens leadership in VLSI and systems design services
Headlines for Thursday Oct. 15, 2020
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CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio
CSEM, a leader in ultra-low-power RF design, announced today at the GLOBALFOUNDRIES® (GF®) Global Technology Conference (GTC) EMEA that CSEM has released its Bluetooth Dual-Mode silicon IP on GF’s 22nm FD-SOI (22FDX®) platform for next generation of portable audio devices.- TSMC Reports Third Quarter EPS of NT$5.30
- GLOBALFOUNDRIES Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Feature on 22FDX Platform
- Xilinx and Spline.AI Develop X-Ray Classification Deep-Learning Model and Reference Design on AWS
- Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports
- JEDEC Announces Publication of JEDEC Module Sideband Bus
- GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution
Headlines for Wednesday Oct. 14, 2020
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China Forecast to Represent 22% of the Foundry Market in 2020
China was responsible for essentially all of the total pure-play foundry market increase in 2018. In 2019, the U.S./China trade war slowed China’s economic growth but its foundry marketshare still increased by two percentage points to 21%.- Synopsys and SiMa.ai Collaborate to Bring Machine Learning Inference at Scale to the Embedded Edge
- Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design for Automotive Applications
- TriEye Shortens Time to Market for Next-Generation CMOS-Based SWIR Image Sensors with the Cadence Spectre X Simulator
Headlines for Tuesday Oct. 13, 2020
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Imagination launches IMG B-Series: Doing more with multi-core
Imagination Technologies announces IMG B-Series, a new expanded range of GPU IP. With its advanced multi-core architecture, B-series enables Imagination customers to reduce power while reaching higher levels of performance than any other GPU IP on the market.- Synopsys Demonstrates Industry's First PCI Express 5.0 IP Interoperability with Intel's Future Xeon Scalable Processor
- Arteris IP FlexNoC Interconnect Again Licensed by KYOCERA for Enterprise Printing and Imaging Solutions
- Innosilicon Achieves World-First Tapeout Success on SMIC N+1 Process
- MIPI Alliance and IEEE Sign Agreement to Bring Automotive SerDes Standard to Broader Ecosystem
- Innosilicon selects Imagination's new BXT Multi-Core GPU IP for cloud computing
- Synopsys to Enable New Levels of Insight into SoC Designs and Systems with Industry's First Silicon Lifecycle Management Platform
- Synopsys Names Shankar Krishnamoorthy General Manager of the Digital Design Group
- OPENEDGES AI Accelerator (NPU) & Memory Subsystem IP licensed for Eyenix AI-powered surveillance camera chipset
- New Cadence Clarity 3D Transient Solver Delivers Up to 10X Faster System-Level EMI Simulation
- Cadence Brings Verification IP to the Chip Level with New System VIP Solution
Headlines for Monday Oct. 12, 2020
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AMD Reported to Be Negotiating Purchase of Xilinx
AMD is said to be negotiating to buy Xilinx, and a deal could come as soon as next week. If the two companies agree, the deal would likely be worth approximately $30 billion, according to The Wall Street Journal.- AMD and Xilinx: A Match Made in Silicon Valley?
- Synopsys IC Compiler II Delivers First-Pass Silicon Success for Graphcore's Multi-Billion Gate AI Processor
- AMD-Xilinx Deal: Bringing The Fight To The Data Center
- Cadence Pegasus Verification System Certified for TSMC N16, N12 and N7 Process Technologies
- Menta Appoints ETSI as United States East Coast Representative
- intoPIX Ships v2.0 of FastTICO-XS SDK for x86-64 CPU platforms to speed up JPEG-XS workflows
- Numem Selected by NASA for 'DNN Radiation Hardened Co-Processor Companion Chip to NASA's Upcoming High-Performance Spaceflight Computing Processor'
- Visit Vidatronic at the Virtual GLOBALFOUNDRIES Technology Conference (GTC) - EMEA on October 16th
- Attend Andes Technology's Presentation "A RISC-V Out-of-Order Processor" at the Linley Processor Conference
Headlines for Thursday Oct. 08, 2020
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Huang "Confident" Nvidia-Arm Deal Will Get Past Regulators
Nvidia CEO Jensen Huang is confident that the Nvidia-Arm deal, the biggest in semiconductor history at $40 billion, will get past global regulators.- Synopsys DesignWare CXL IP Supports AMBA CXS Protocol Targeting High-Performance Computing SoCs
- proteanTecs Announces Market and Regional Expansions
- Instrumentation Technology Systems adds intoPIX TICO-XS to their upcoming NetVIDxs
- UMC Reports Sales for September 2020
- TSMC September 2020 Revenue Report
- Pushing the boundaries of performance and security to unleash the power of 64-bit computing
- Think Silicon to introduce a new Inference Micro GPU Architecture based on RISC-V at Linley Fall Virtual Processor Conference
- Intento Design Expands Analog Automation with IDX-PVT, Eliminating the Need for Design-by-Verification
- Cadence Announces Complete DDR5/LPDDR5 IP Solution for TSMC N5 Process Technology
- Attopsemi's I-fuse Memory Solution Now Qualified and Available on X-FAB's 130nm RF-SOI Technology
Headlines for Wednesday Oct. 07, 2020
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CAST Introduces Ultra-Low Latency TSN Ethernet Switch IP Core
Today at the virtual TSN/A Technology and Applications Conference, silicon intellectual property provider CAST, Inc. announced a new IP core that implements a switch for Time-Sensitive Networking (TSN) Ethernet networks as increasingly used in automotive, industrial, medical, and other systems.- VSORA Introduces Small Footprint, Low-Power PetaFLOPS Platform Enabling L4/L5 Autonomous Driving
- Everactive Adopts Movellus Sub-Microwatt Clocking Solution for its Batteryless IIoT System
- SmartDV Unveils SmartConf Testbench Generator