D&R Headline News (Last 14 Days)

Headlines for Tuesday Sep. 19, 2017

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CoreHW accelerates growth - Panostaja invests in CoreHW by purchasing a majority shareholding

On Friday 15th September, CoreHW has signed an agreement on selling the shares in CoreHW to Panostaja Plc. After the transaction, Panostaja will own 63 percent of the new group to be formed through the transaction.

• CommSolid is now a Member of 3GPP and ETSI
• Synopsys' New ARC Secure IP Subsystem Addresses Security Threats in Embedded SIM and Other High-Value Embedded Applications
• ArterisIP Ncore Cache Coherent Interconnect and Resilience Package Licensed by NXP
• Synopsys Strengthens Design-Technology Co-Optimization Solution with Acquisition of QuantumWise
• Intel Custom Foundry Certifies Synopsys Design Platform for Intel's 22nm FinFET Low Power Process Technology
• Intel Technology and Manufacturing Day in China Showcases 10 nm Updates, FPGA Progress and Industry's First 64-Layer 3D NAND for Data Center
• SEGGER Adds Support for SiFive's Coreplex IP to Its Industry Leading J-Link Debug Probe
• Cadence Full-Flow Digital and Signoff Tools and Custom/Analog Tools Certified and Enabled for Intel 22FFL Process Technology
• AFuzion and HDL Design House Joint Webinar: Optimizing DO-254: October 4, 2017, 4 pm CEST

Headlines for Monday Sep. 18, 2017

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SMIC, Brite Semiconductor and Synopsys Collaborate to Deliver Low Power Platform for the Internet of Things

Brite, SMIC and Synopsys today announced a collaboration resulting in an IoT platform that enables designers, system integrators and OEMs to accelerate and differentiate their next-generation IoT systems.

• Cadence Recognized with Three TSMC Partner of the Year Awards
• Synopsys' New ARC IoT Development Kit Accelerates Software Development for Sensor Fusion, Voice Recognition and Face Detection Designs
• TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event
• iPhone X chip shows problems of Imagination
• CEVA Named in Fortune's 2017 100 Fastest-Growing Companies List
• Lattice Semiconductor's iCE40 FPGA Enables Low Latency and Concurrent Sensor Processing in SteamVR Tracking
• Conversant Announces Semiconductor Memory Patent License Agreement With Toshiba

Headlines for Friday Sep. 15, 2017

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Nevion integrates TICO lightweight compression into its Virtuoso product line.

intoPIX welcomes Nevion, one of the world's leading providers of media transport solutions for broadcasters, amongst the rapidly increasing list of TICO-enabled equipment manufacturers and solution providers.

• China condemns protectionism after Lattice deal blocked
• Chip Consolidation Nearly Over, Analyst Says
• SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology

Headlines for Thursday Sep. 14, 2017

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Lattice Semiconductor and Canyon Bridge Capital Partners, LLC Announce Termination of Merger Agreement Following Decision from President Trump

Lattice Semiconductor Corporation (NASDAQ:LSCC) today announced the termination of the acquisition by Canyon Bridge Capital Partners, LLC (“Canyon Bridge”) of Lattice Semiconductor following an order from the President of the United States.

• Credo Receives Coveted TSMC 2017 Open Innovation Platform® Partner of the Year Specialty Technology IP Award
• HCC Embedded's Extensive Suite of Advanced Middleware Now Available for Xilinx Zynq-7000 SoCs
• Configurable VLIW core boosts energy efficiency for long battery life
• PathPartner Will Be at IBC 2017, Showcasing 4K HEVC Encoder and Decoder Solutions
• TSMC Updates its Silicon Menu
• Sencore adopts intoPIX JPEG2000 Ultra Low Latency technology
• PLDA Further Strengthen Partner Ecosystem, Unveils Comprehensive PCIe PHY and Controller integrated Solutions, to be Presented at IP-SoC China 2017
• EEMBC Benchmark Verifies Energy Cost of Integrated Microcontroller Peripherals
• Flex Logix Wins TSMC Open Innovation Platform Partner Of The Year Award 2017
• eMemory Receives 2017 TSMC IP Partner Award
• Cadence Introduces the Conformal Smart Logic Equivalence Checker
• Xilinx Software Defined Development Environment for Data Center Acceleration Now Available on Amazon Web Services
• Soitec launches FD-SOI pilot line in Singapore

Headlines for Wednesday Sep. 13, 2017

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UltraSoC expands to address embedded analytics market opportunity

UltraSoC today announced a significant global expansion to address the increasing demand for more sophisticated, ‘self-aware’ silicon chips in a range of electronic products, from lightweight sensors to the server farms that power the Internet.

• Credo Demonstrates Single-Lane 112G and 56G PAM4 SerDes IP Solutions at TSMC 2017 OIP Ecosystem Forum
• Synopsys and Alango Technologies Introduce Voice Enhancement Package Optimized for DesignWare ARC Data Fusion IP Subsystem
• eSilicon tapes out deep learning ASIC
• Packet Partners with Arm to Accelerate Adoption of Armv8-A for Datacenter Workloads
• Fab Equipment Spending Breaking Industry Records
• Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 Design & Reuse IP SoC Event in Shanghai

Headlines for Tuesday Sep. 12, 2017

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Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution

Open-Silicon, a system-optimized ASIC solution provider, today announced it has successfully completed silicon validation of its High Bandwidth Memory (HBM2) IP subsystem in TSMC’s 16nm FinFET technology in combination with TSMC’s CoWoS® 2.5D silicon interposer technology and HBM2 memory.

• Sidense and Intellitech collaborate on Electronic Chip IDs, anti-counterfeiting and semiconductor security for Secure Supply Chain Enablement
• Mobiveil Inc. and Crossbar Inc. Announce Partnership to Apply Mobiveil's NVMe Solid State Drive IP to Crossbar's ReRAM IP blocks
• Synopsys and TSMC Collaborate to Develop DesignWare Foundation IP for Low-Power TSMC 40-nm eFlash Processes
• ArterisIP FlexNoC Interconnect Licensed by Renesas
• Nextchip License CEVA Imaging and Vision Platform for ADAS Vision System
• QuickLogic First to Offer eFPGA Technology on SMIC 40nm Low Leakage Process
• Creonic Joins Consortium to Develop FEC Codes for Beyond-5G Tb/s Use Cases
• SEMI Reports Second Quarter 2017 Worldwide Semiconductor Equipment Figures; Record Quarterly Billings of $14.1 Billion
• Samsung Strengthens Advanced Foundry Portfolio With New 11nm LPP and 7nm LPP With EUV Technology
• BrainChip Introduces World's First Commercial Hardware Acceleration of Neuromorphic Computing
• NGCodec and Tiledmedia to Show Cloud Hardware-Accelerated Low-Latency HEVC VR360 Streaming Solution at IBC 2017
• Analog Bits to Demonstrate New High Performance and Ultra-Low Power SERDES IP at TSMC Open Innovation Platform Ecosystem Forum

Headlines for Monday Sep. 11, 2017

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Image Matters Delivers Disruptive Innovation with PathPartner

Image Matters is proud to announce that video machine learning specialists PathPartner and member of the origami™ Ecosystem, will be integrating their high performance universal H.265/HEVC Decoder with facial detection into the origami™ B20 Module.

• Silicon Creations Celebrates 100th Tape-Out of Its PLL in TSMC 28nm Process Technology
• Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box
• PathPartner Technology and Accelize Announce Availability of HEVC / H.265 FPGA Decoder for QuickPlay Development Platform
• Synopsys Successfully Tapes Out Broad IP Portfolio for TSMC 7-nm FinFET Process
• PLDA Announces Industry's First Controller for FPGA supporting PCIe 4.0 v0.9, Allowing immediate PCIe 4.0 implementation into FPGAs
• Inside Secure Announces Successful Fundraising of 16M Euros
• Semiconductor Industry Records Best Second Quarter in Three Years, IHS Markit Says
• Xilinx, Arm, Cadence, and TSMC Announce World's First CCIX Silicon Demonstration Vehicle in 7nm Process Technology
• True Circuits Attends the TSMC 2017 NA OIP Ecosystem Forum
• Synopsys IC Compiler II Certified for TSMC's Advanced 7-nm FinFET Plus Node
• Cadence Collaborates with TSMC to Advance 7nm FinFET Plus Design Innovation
• UPMEM Announces the First Processing In-Memory Chip Accelerating Big Data Applications
• Cadence Tools and Flows Achieve Production-Ready Certification for TSMC's 12FFC Process
• Synopsys' IC Compiler II Completes Certification for TSMC's 12-nm Process Technology

Headlines for Friday Sep. 08, 2017

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Arastu Systems releases R-DIMM and LR-DIMM support for its DDR4 Controller

Arastu Systems’ DDR professionals, who carry the necessary wisdom required to traverse the DDR trajectory, have improvised DDR4 DRAM Memory Controller by adding support for Register Clock Driver (RCD) and Data Buffer (DB).

• V-Nova & NGCodec Deliver real-time UHDp60 Perseus Plus HEVC encoding on a single FPGA
• UMC Reports Sales for August 2017
• OmniPHY to Demonstrate Automotive Design Solutions at TSMC 2017 OIP Ecosystem Forum
• TSMC August 2017 Revenue Report

Headlines for Thursday Sep. 07, 2017

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Cadence Delivers Comprehensive IP Portfolio for TSMC 16FFC Automotive Design Enablement Platform

Cadence Design Systems today announced it is delivering a comprehensive automotive IP portfolio for the TSMC 16nm FinFET Compact (16FFC) automotive process technology.

• Barco Silex integrates new video coding technique from the latest VC-2 HQ standard.
• TSMC responds to antitrust investigation reports
• EU Regulators Again Halt Qualcomm-NXP Investigation
• Apple vs Qualcomm: Who Extorted Whom?
• SiFive and UltraSoC partner to accelerate RISC-V development through DesignShare
• Sital Technology and Logicircuit to Provide DO-254 Certified IP Cores for Avionic Data Buses
• Cadence Announces Legato Memory Solution, Industry's First Integrated Memory Design and Verification Solution
• Menta Embeds sureCore Low Power SRAM IP on TSMC's 28nm Process
• Ambiq Micro and TSMC Deliver World's Lowest Energy Consumption for Huawei's Fitness Wearables
• Solido launches PVTMC Verifier from its Machine Learning Labs

Headlines for Wednesday Sep. 06, 2017

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Imec Reports World-Class Low-Power IP Blocks for 5G

Today, at its Imec Technology Forum Southeast Asia in Singapore, imec, the world-leading research and innovation hub in nano-electronics and digital technology, will present two key building blocks for future 5G applications featuring record low power consumption.

• Innosilicon Announces the World most efficient LTC Miner A4+, 550Mh, 750W
• eASIC Engages Si-Edge to Provide Additional Advanced Design Center Support in China for eASIC's Custom IC Platform
• Xilinx Powers Huawei FPGA Accelerated Cloud Server
• With Acquisition in Doubt, Lattice Appeals to Trump
• Global Semiconductor Sales Increase 24 Percent Year-to-Year in July
• Kilopass Ultra-Low Power OTP NVM Provides Storage for Northrop Grumman Advanced Silicon Processor That Prevents Counterfeit Electronic Parts Entering DoD Supply Chains
• SILTERRA Unveils 180nm Ultra Low Leakage Technology To Position in IoT Sensor Hub IC Market
• Conversant Announces Semiconductor Patent License Agreement With SK hynix
• Sankalp Semiconductor to Present & Exhibit at Design & Reuse IPSoC China 2017
• eSilicon at TSMC OIP 2017

Headlines for Tuesday Sep. 05, 2017

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Flex Logix Joins TSMC IP Alliance Program

Flex Logix Technologies, Inc., the leading supplier of embedded FPGA IP and software, today announced that it has joined the TSMC IP Alliance Program included in TSMC’s Open Innovation Platform®.

• GlobalSign and Intrinsic ID Plan Joint Demos at Two Upcoming STMicroelectronics Events
• Samsung SARC Selects Synopsys as Primary Verification Solution for Advanced Mobile Processor Designs
• Stratix 10 FPGA: REFLEX CES Introduces the Widest Range of Boards Based on Stratix 10 GX and SoC technology from Intel PSG
• Ty Garibay Joins ArterisIP as Chief Technology Officer
• Electronics and Telecommunications Research Institute (ETRI) joins HEVC Advance
• President Trump to rule on Lattice's China deal
• GUC Monthly Sales Report - Aug 2017
• Achronix to Speak at D&R IP-SOC Conference in Shanghai
• SecureRF Joins STMicroelectronics Partner Program to Bring Security to the Smallest Devices in the IoT
• Sidense Exhibiting and Presenting a Paper at the TSMC Open Innovation Platform (OIP) Ecosystem Forum

Headlines for Monday Sep. 04, 2017

• NFC Semicon sets a new standard for NFC Sensor Chip Solutions