D&R Headline News (Last 14 Days)

Headlines for Friday Feb. 26, 2021

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Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market

Alphawave IP, the world leader in multi-standard connectivity IP solutions, today announced that it has negotiated a $54M multi-year exclusive subscription reseller agreement with VeriSilicon for the China market.

Headlines for Thursday Feb. 25, 2021

• BrainChip Inc. and NaNose Medical Successfully Detect COVID-19 in Exhaled Breath with Fast High-Accuracy Results
• TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
• Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering
• Rambus and AMD Extend Patent License Agreement
• MulticoreWare Inc. Becomes CEVA's Trusted Partner for Imaging & Computer Vision

Headlines for Wednesday Feb. 24, 2021

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Tianyihexin Licenses Codasip's L30 for Powering Intelligent Wearable Device Solutions

Codasip announced today that Nanjing Tianyihexin Electronics, an innovative company focused on leading-edge solutions in multi-touch and gesture recognition technologies, has selected Codasip’s L30 (originally Bk3) RISC‑V‑based core for their TWS headset and intelligent wearable devices solutions.

• Synopsys Delivers Breakthrough Performance with New ZeBu Empower Emulation System for Hardware-Software Power Verification
• CEVA's MotionEngine Smart TV Software Comes to More Smart TV brands via LG webOS
• Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications
• RISC-V International Unveils Fast Track Architecture Extension Process and Ratifies ZiHintPause Extension
• Achronix Announces 2020 Financial Results and Business Highlights
• AccelerComm Unveils Fully Integrated PUSCH Decoder to Supercharge 5G NR for Performance-Critical Channels
• Xilinx Revolutionizes the Modern Data Center with Software-Defined, Hardware Accelerated Alveo SmartNICs
• North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time
• Cadence Completes Acquisition of NUMECA

Headlines for Tuesday Feb. 23, 2021

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SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications

SiPearl, the company designing the high-performance, energy-efficient microprocessor for the European exascale supercomputer and Open-Silicon Research, the India based entity of OpenFive, a leading provider of custom silicon solutions with differentiated IP, today announced a multi-year joint collaboration to enable expansive development of innovative High Performance Computing (HPC) applications.

• Eureka Technology IP Core Supports NASA's MARS 2020 Perseverance Rover Mission
• Nations' Latest BLE 5 IC Powered By CEVA Bluetooth Low Energy IP
• Tiempo Secure is a winner of the French Government's Great Cybersecurity Challenge to make smart objects more resilient to cyberattacks

Headlines for Monday Feb. 22, 2021

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CEVA Moves to Standardize DSP-enabled Bluetooth Audio IP with New Bluebud Wireless Audio Platform for TWS Earbuds, Smartwatches and Wearables

CEVA today unveiled Bluebud™, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for the fast-growing Bluetooth audio markets, including True Wireless Stereo (TWS) earbuds, hearables, wireless speakers, gaming headsets, smartwatches and other wearable devices.

• Samsung Foundry Certifies Synopsys IC Validator for 5nm and 4nm Advanced Process Technologies
• CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces Power Consumption by 30%
• IAR Systems introduces 64-bit Arm core support in leading embedded development tools
• Imagination's GPU selected by StarFive to create high-performance, small and low-cost BeagleV RISC-V AI single board computer
• Chipus Joins FDXcelerator Program Bringing Ultra-Low-Power and Compact Power Management Solution for Hearables and Wearables
• Secure-IC and MosChip Announce Strategic Partnership to Provide Turnkey ASIC Solutions With Embedded Security for Edge Applications
• Syntiant Adopts Movellus' Clock Network for its Low-Power NDP120 Deep Learning Processor

Headlines for Friday Feb. 19, 2021

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Moschip Unveils Focused Strategy For Turn-Key ASIC Solutions

MosChip Technologies Limited, a semiconductor and system design services company, unveils today, focused strategy for turn-key ASIC solutions. MosChip has over a twenty-year track record in designing semiconductor IP, products, and SoCs for IoT, networking, industrial, and consumer applications.

• Sales of Logic ICs Account for Largest Share of China's IC Market in 2020
• aicas and SiFive Bridge Flexibility and Performance with RISC-V, JamaicaVM Integration
• Achronix and Logic Fruit Introduce IP Solutions for Test and Measurement Applications

Headlines for Thursday Feb. 18, 2021

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PLDA Announces a Unique CXL Verification IP Ecosystem, Delivering Robust Verification That Reduces Time-to-Design for CXL 2.0 Applications

PLDA, the industry leader in high-speed interconnect solutions, today announced their CXL™ Verification IP Ecosystem which includes IP from partners Truechip and Avery Design Systems, who are pioneering CXL design verification.

• Synopsys Posts Financial Results for First Quarter Fiscal Year 2021
• Proposed Arm Buyout: Huang on So Many Levels
• Micro Magic, Inc. Delivers Ultra Low Power 64-Bit RISC-V Core
• Mark Redford Named Vice President, Operations & Supply Chain for Palma Ceia SemiDesign - Former Arm Executive
• JEDEC Publishes DDR4 NVDIMM-P Bus Protocol Standard
• SPARK Microsystems Announces CDN$17.5 Million Financing

Headlines for Wednesday Feb. 17, 2021

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Arteris IP Adds a Record 28 New Licensees in 2020

Arteris IP today announced that the company added 28 new licensees for its Arteris® IP Ncore®, FlexNoC®, CodaCache®, AI Package, Resilience Package, and PIANO® Interconnect IP products in 2020.

• CEVA Appoints Jaclyn Liu to its Board of Directors; Bruce A. Mann Retires
• Veriest Solutions and CEVA develop functional safety verification methodology for automotive devices
• Renesas Develops Automotive SoC Functional Safety Technologies for CNN Accelerator Cores and ASIL D Control Combining World-Class Performance and Power Efficiency
• New Website Dedicated to Advancing PUF Security Technology

Headlines for Tuesday Feb. 16, 2021

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Objections grow to Nvidia-ARM deal

Qualcomm, Google and Microsoft have all raised objections in the US to the acquisition of ARM by Nvidia

• Imec Showcases World's First Sub-5mW, IEEE 802.15.4z Ultra-Wideband Transmitter Chip
• ISSCC Plenary: A Bright Foundry Future
• CEVA, Inc. Announces Fourth Quarter and Year End 2020 Financial Results
• Flex Logix EFLX eFPGA in design for GLOBALFOUNDRIES 22FDX
• CHIPS Alliance Welcomes Antmicro and VeriSilicon to the Platinum Membership Level

Headlines for Monday Feb. 15, 2021

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videantis passes milestone of enabling 10 million production vehicles

videantis, a leading supplier of processor IP for the automotive and other embedded markets, announces that cumulative shipments of production vehicles equipped with videantis processors have surpassed the 10 million unit mark.

• U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York
• 5GNR L1/L2/L3 Phy+SW Stack IP available for SoC & FPGA Ue & gNodeB development
• Silex Insight partners with Crypto Quantique to deliver end-to-end IoT security
• High Performance Computing Demand Puts Premium on Backend Engineering Expertise

Headlines for Friday Feb. 12, 2021

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Comcores sells wireless assets to Analog Devices

Comcores, a leading supplier of digital IP-cores and sub-systems for communication technology and interface solutions for ASICs and FPGAs, announces the sale of its wireless assets to Analog Devices, Inc. (ADI) a US-based company.

• The Arm ecosystem ships a record 6.7 billion Arm-based chips in a single quarter

Headlines for Thursday Feb. 11, 2021

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TSMC to Raise $9 Billion for Expansion Amid Shortages

Taiwan Semiconductor Manufacturing Co. (TSMC) said that it plans two sales of bonds that would raise about $9 billion to expand production, possibly helping to ease a critical shortage of silicon.

• Israeli AI Chip Startup Raises Seed Funding
• Fraunhofer IIS and intoPIX announce joint licensing program for JPEG XS
• Lattice FPGAs with High I/O Density Bring Low Power Signal Bridging and Interface Management to Edge Devices