D&R Headline News (Last 14 Days)

Headlines for Tuesday Jan. 19, 2021

• Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools
• Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC
• Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing

Headlines for Monday Jan. 18, 2021

Top Story

PLDA Announces XpressLINK-SOC CXL Controller IP with Support for the AMBA CXS Issue B Protocol

PLDA, the industry leader in high-speed interconnect solutions, today announced that PLDA’s industry-leading XpressLINK-SOC™ CXL IP provides full support for the AMBA® CXS Issue B (CXS-B) interface protocol.

• TSMC Boosts Capital Expenditure Budget on Strong Outlook
• DCD With EBBM in USA & Greece

Headlines for Thursday Jan. 14, 2021

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Qualcomm to Acquire NUVIA

Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has entered into a definitive agreement to acquire NUVIA for approximately $1.4 billion before working capital and other adjustments.

• Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO
• Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
• TSMC Reports Fourth Quarter EPS of NT$5.51
• BeagleBoard.org and Seeed Introduce the First Affordable RISC-V Board Designed to Run Linux
• Ginger Lee Named Chief Financial Officer for Palma Ceia SemiDesign
• TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
• Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology
• Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series
• Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices

Headlines for Wednesday Jan. 13, 2021

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Value of Semiconductor Industry M&A Agreements Sets Record in 2020

Five big acquisition announcements and more than a dozen smaller deals in 2020 pushed the total value of M&A agreements in the year to an all-time high of $118.0 billion, surpassing the previous record of $107.7 billion reached in 2015

• Netflix Now Streaming xHE-AAC Audio on Android Mobile
• Syntiant Surpasses Milestone of 10 Million Processors Shipped
• Arm's powerful compute and graphics platform at the heart of the new Samsung Exynos 2100

Headlines for Tuesday Jan. 12, 2021

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Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs

Synopsys, Inc. (Nasdaq: SNPS) and Socionext, Inc. today announced their collaboration to expand Socionext's use of Synopsys' broad DesignWare® IP to include Synopsys' HBM2E IP for maximum memory throughput in AI and high-performance computing (HPC) applications.

• CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family
• Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip
• Secure-IC And Menta Co-Develop Solution To Optimize Embedded Cybersecurity
• SEGGER introduces new Open Flashloader for direct programming of any RISC-V system

Headlines for Monday Jan. 11, 2021

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Wi-Fi Alliance Wi-Fi predictions for 2021

Wi-Fi® played a critical role in providing digital infrastructure to support increased connectivity demands during the global pandemic.

• Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras
• ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q3 2020
• Flex Logix Appoints Dana McCarty as Vice President of Sales and Marketing for AI Inference Products
• DSP Concepts and Cambridge Consultants work to accelerate audio and voice innovation
• Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core

Headlines for Friday Jan. 08, 2021

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Achronix to List on Nasdaq Through Merger with ACE Convergence

Achronix Semiconductor Corporation, a leader in high-performance field-programmable gate arrays (FPGAs) and embedded FPGA (eFPGA) IP, and ACE Convergence Acquisition Corp. (ACE) (Nasdaq: ACEV), a special-purpose acquisition company, today announced that they have entered into a definitive agreement for a business combination that would result in the combined entity continuing as a publicly listed company.

• UMC Reports Sales for December 2020
• TSMC December 2020 Revenue Report

Headlines for Thursday Jan. 07, 2021

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Andes Technology Provides RISC-V CPU Core to SK Telecom

Andes Technology Corp. today announced that its 64-bit AndesCore™ AX25 RISC-V processor has been adopted by SK Telecom (hereinafter referred to as “SKT”), Korea’s leading ICT company, for the development of artificial intelligence products.

• Kevin Steptoe Joins Palma Ceia SemiDesign as EVP Program Management
• DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor
• Jim Keller joins Tenstorrent as President and CTO.
• China Forecast to Fall Far Short of its "Made in China 2025" Goals for ICs
• IQ-Analog Antenna Processor ASIC Powers Lockheed Martin Phased Array Sensors
• Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Apps

Headlines for Wednesday Jan. 06, 2021

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Imagination, update on 2020 progress

Imagination Technologies today announces initial unaudited results for 2020, overall revenues increased by 44% to $125m (2019: $87m).

• Industry Veterans Cathal Phelan, John Kent, and Michael Reiha Join Silvaco Technical Advisory Board
• Achronix in talks to IPO
• CFX announces commercial availability of anti-fuse OTP technology on 90nm BCD process
• GUC Monthly Sales Report - Dec 2020
• More HDMI 2.1 Enabled Products Reach The Market Bringing Advanced Consumer Entertainment Features To a Wide Audience
• Sequans Introduces Calliope 2: A New Generation of LTE Cat 1 Technology for IoT Applications Requiring Higher Than LTE-M Speed
• Edgewater Announces New Funding and Organizational Changes

Headlines for Tuesday Jan. 05, 2021

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Arteris IP FlexNoC Interconnect and Resilience Package Licensed by MegaChips for Automotive Ethernet TSN Switch Chip

Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that MegaChips has licensed Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package for use as the on-chip communications backbone for an automotive Ethernet TSN switch chip.

• Global Smartphone Production Expected to Reach 1.36 Billion Units in 2021 as Huawei Drops Out of Top-Six Ranking, Says TrendForce
• CEVA and DARPA Establish Partnership for Technology Innovation
• EPS Global and Intrinsic-ID Announce Strategic Partnership

Headlines for Monday Jan. 04, 2021

Top Story

Wave Computing and MIPS Technologies Reach Agreement to Exit Bankruptcy

Company expects to exit bankruptcy in January 2021 pending creditor and court approval of Tallwood-led reorganization plan

• Global Semiconductor Sales Increase 7 Percent Year-to-Year in November
• Greek IP company Adveos bought by Shanghai-based Beken
• OmniVision Announces World's First Dedicated Driver Monitoring System ASIC With Integrated AI Neural Processing Unit, Image Signal Processor and DDR3 Memory