D&R Headline News (Last 14 Days)

Headlines for Thursday Oct. 18, 2018

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Samsung Complements the Production of its Revolutionary 7nm EUV with Exceptional SAFE Ecosystem Solutions

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the launch of its new commercial 7LPP, the 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology for wafer production.

• TSMC Reports Third Quarter EPS of NT$3.44
• Samsung Electronics Starts Production of EUV-based 7nm LPP Process
• Communications Rise To Represent Largest Portion of Foundry Sales
• STMicroelectronics Introduces STM32L5 Ultra-Low-Power Microcontrollers for a More Secured IoT

Headlines for Wednesday Oct. 17, 2018

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eMemory's OTP IP Qualified on 22nm FD-SOI process

eMemory today announced that its one-time programmable non-volatile memory (OTP) IP, NeoFuse, has been qualified for 22nm Fully-Depleted Silicon On-Insulator (FD-SOI), also known as 22FDX, process technology.

• Arteris IP FlexNoC Interconnect Licensed by Iluvatar CoreX for Artificial Intelligence Application
• Silicon Creations Named TSMC Partner of the Year 2018 for Analog / Mixed-Signal IP
• Arm goes higher up the stack for device-to-data IoT security
• IBM, GLOBALFOUNDRIES Enhance Si2 Unified Power Model Standard
• Rambus and Riscure Team Up to Deliver Best-in-class Security Testing Platform for Side-channel Analysis
• IAR Systems leads the way for secure IoT development based on Arm TrustZone and Arm Cortex-M
• More than 100 Major IC vendors, OEMs and Broadcasters Already Adopted Allegro DVT Compliance Streams
• Inside Secure's Latest Whitebox Software Security Tool Brings Mobile Developers New Levels of Protection, Performance and Control
• Wafer Shipments Forecast to Set New Highs Through 2021
• Arasan to demonstrate its I3C Host and Device IP and participate at the I3C Interoperability Session at the 2018 MIPI Devcon in Seoul
• Synopsys Awarded DARPA Electronics Resurgence Initiative Contract for Advanced Emulation Technology
• IAR Systems supports new secure, ultra-low-power Arm Cortex-M33 MCUs from STMicroelectronics

Headlines for Tuesday Oct. 16, 2018

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Arm Neoverse: The modern cloud to edge infrastructure foundation for a world of a trillion intelligent devices

Today at Arm TechCon, Arm disclosed details on a dedicated roadmap and new brand of infrastructure-class IP for 5G networks and next-generation cloud to edge infrastructure.

• L&T Technology Services announces completion of Graphene Semiconductor Services acquisition
• Synopsys ASIP Designer Tool Speeds Development of Application-Specific Instruction-Set Processors for STMicroelectronics
• Cadence Accelerates Arm-Based Server Development by Automating Arm Pre-Silicon Bare Metal Compliance Testing
• Cadence Verification Suite Enabled on Arm-Based HPC Datacenters
• Synopsys Enables Tapeout Success for Early Adopters of Arm Neoverse IP
• UltraSoC announces integrated multi-core debug, visualization and data science / analytics suite
• SiFlower Licenses and Deploys CEVA's 802.11ac Wi-Fi IP in its Smart Home Access Point SoC
• OPENEDGES unveils world-first Memory Subsystem IP solution coupling Network-on-Chip (NoC) interconnect with DDR memory controller
• ALTEN Calsoft Labs Acquires Si2Chip, a VLSI Chip Design Company
• Eta Compute Launches Machine Learning Platform with Ultra-Low-Power Consumption for Edge Devices

Headlines for Monday Oct. 15, 2018

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Advanced Technology Key to Strong Foundry Revenue per Wafer

Analysis shows more than a 16x difference between the average revenue generated by 0.5µ 200mm wafers ($370) and ≤20nm 300mm wafers ($6,050).

• Allegro DVT Introduces High Dynamic Range and High Frame Rate System Compliance Streams for DVB UHDTV
• Moortec to show off its advances in PVT monitoring for 40nm, 28nm, 16nm, 12nm and 7nm at ARM TechCon in San Jose
• JPEG-XS standard preview by intoPIX at SMPTE ATC 2018
• Intel, Arduino and myDevices join the rapidly expanding Arm Pelion IoT Platform ecosystem
• Synopsys Delivers Platform Architect Ultra to Enable the Next Wave of AI SoCs
• Achronix to Demonstrate Speedcore eFPGA's Flexibility at Arm TechCon
• Flex Logix to Demonstrate Modular eFPGA at ARM TechCon
• Vidatronic Signs Schoenduve Corporation as Its Sales Representative for Northern California and Nevada
• Xilinx and Huawei Announce the First FPGA Cloud-based Real-time Video Streaming Solution in China
• CEVA's 2018 Technology Symposium Series Coming to Taiwan, China and Japan
• Socionext Develops World's First HDMI 2.1 Compatible Video Processing Chips

Headlines for Thursday Oct. 11, 2018

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Dialog Semiconductor and Apple enter agreement

Dialog Semiconductor plc (XETRA:DLG), today entered into an agreement with Apple Inc. to license its power management technologies, transfer certain of its assets and over 300 employees from Dialog to support chip research and development.

• Xylon Unveils New Panoramic Multi-Sensor Camera Demo at Xilinx Developer Forum
• Spectral & NSCore Announce Strategic Relationship that Significantly Expands Access and Distribution of MTP/OTP Memory Compilers to accelerate SOC integration of NVRAM & Low Power SRAMs for IOT applications
• Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Synaptics VXR7200 IC Enabling Next Generation VR Headsets
• Arasan to demonstrate its MIPI DSI, CSI, C-PHY and D-PHY IP Cores at the 2018 MIPI Member Meeting Asia
• Silvaco to Showcase Octal SPI in Presentation at ARM TechCon
• GLOBALFOUNDRIES Expands RFwave Partner Program to Speed Time-to-Market for Wireless Connectivity, Radar and 5G
• IntelliProp to Exhibit at SC18 in Dallas, TX
• Power Regulation IPs from Dolphin Integration, now Silicon Proven on GLOBALFOUNDRIES 22FDX Technology Platform

Headlines for Wednesday Oct. 10, 2018

• NXP Secures the Edge with Two Industry-First Multi-Core Arm Cortex-M33 Solutions
• Rambus and Phison Sign Patent License
• Cadence to Demonstrate System and Automotive Solutions at Arm TechCon 2018
• Gowin Semiconductor's GW1NS Family of Products Named Arm TechCon 2018 Innovation Award Finalist For Design Innovation of the Year
• Cadence Recognized with Four 2018 TSMC Partner of the Year Awards
• Sankalp Semiconductor Opens Second Design Centre in Bangalore
• Truechip Successfully hosted TrueConnect 2018 - The 2nd Annual Technical Conference

Headlines for Tuesday Oct. 09, 2018

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Arteris FlexNoC Interconnect IP Licensed by Enflame (Suiyuan) Technology for Multiple Artificial Intelligence (AI) Chips

Arteris IP today announced that Enflame (Suiyuan) Technology has purchased multiple licenses of Arteris FlexNoC interconnect IP for use as the on-chip communications backbone of their artificial intelligence (AI) training chips for use in cloud datacenters.

• Synopsys to Showcase Optimized Solutions and Expert Services for Arm-based Designs at Arm TechCon 2018
• Inside Secure Selected by Norway's Nationwide Debit Card System to Secure Mobile Contactless Payments
• QuickLogic Announces Silicon-Proven ArcticPro eFPGA on GLOBALFOUNDRIES 22FDX Process
• Mentor releases optimized flow, new fill automation for GLOBALFOUNDRIES' 22FDX IC manufacturing process
• TSMC September 2018 Revenue Report
• UMC Reports Sales for September 2018

Headlines for Monday Oct. 08, 2018

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Andes Announces over 1.2 GHz RISC-V Cores Series at 28nm: A25/AX25 and N25F/NX25F

Andes Technology, a founding member of the RISC-V Foundation and the leading Taiwan-based supplier of 32/64-bit embedded CPU cores with solutions serving in excess of 2.5-Billion SoCs covering a wide range of applications, today announced the availability of the latest four members of the AndeStar™ V5 high efficiency processor series.

• Rambus Renews Patent License with NVIDIA
• Arasan Chip Systems Relocates it's Corporate Headquarters to accommodate future growth
• Live webinar by Dolphin Integration: how to design an energy-efficient SoC in advanced nodes for increasing battery lifetime for IoT applications

Headlines for Friday Oct. 05, 2018

• Apple, Amazon Refute China Chip Hacking Story
• GUC Monthly Sales Report - Sep 2018
• Vidatronic Selects Redtree Solutions as Its Sales Representative for European and Middle-Eastern Markets
• Arm awarded TSMC Partner of the Year award for Processor IP

Headlines for Thursday Oct. 04, 2018

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Northwest Logic and Mixel Delivering C-PHY/D-PHY Combo MIPI IP Solution

Northwest Logic and Mixel® announced today that their MIPI® CSI-2SM and DSI-2SM solutions which utilize MIPI C-PHY SM / D-PHY SM have been deployed and silicon proven in 28nm, 40nm, 55nm and 65nm process nodes. These high performance, low power, cost effective solutions contain controllers from Northwest Logic and PHYs from Mixel.

• Silicon Valley Company unveils revolutionary Artificial Intelligence (AI) driven Processor Generator
• TSMC Goes Photon to Cloud
• Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC N7+ FinFET Process
• DRAM Market Braces For Slower Growth
• Synopsys Design Platform Enabled for TSMC's Multi-die 3D-IC Advanced Packaging Technologies
• TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event
• eMemory Receives 2018 TSMC IP Partner Award
• M31 Receives TSMC's 2018 Partner of the Year Award for Specialty Process IP
• Omnitek Demonstrates Highest Performance Convolutional Neural Network on an FPGA

Headlines for Wednesday Oct. 03, 2018

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TSMC Announces OIP Ecosystem Enabled in the Cloud

TSMC today announced the initial availability of its Open Innovation Platform® Virtual Design Environment (OIP VDE), which enables semiconductor customers to securely design in the cloud, leveraging TSMC OIP design infrastructures within the flexibility of cloud infrastructures.

• Xilinx Unveils Versal: The First in a New Category of Platforms Delivering Rapid Innovation with Software Programmability and Scalable AI Inference
• Analog Bits to demonstrate Low Power SERDES at TSMC's Open Innovation Platform Ecosystem Forum
• Synopsys Announces Availability of TSMC-certified IC Design Environment in the Cloud
• Cadence Expands its Cloud Portfolio with Delivery of TSMC OIP Virtual Design Environment
• SiFive Welcomes Former Tesla Executive to Lead Global Growth Strategy
• Wi-Fi Alliance introduces Wi-Fi 6