D&R Headline News (Last 14 Days)

Headlines for Friday Sep. 24, 2021

• Daejin semiconductor, takes over the distribution of Dolphin Design in Korea

Headlines for Thursday Sep. 23, 2021

Top Story

Allegro DVT and Beamr Announce the World's First Content-Adaptive Silicon IP Video Encoder

Allegro DVT, the leading provider of video processing silicon IPs, and Beamr, the leading developer of content-adaptive video encoding technologies, today announced an integrated solution that combines Beamr’s CABR silicon IP with Allegro’s video encoding IP to create the world’s first content-adaptive silicon IP encoder.

• Foundry Market Tracking Toward Record-tying 23% Growth in 2021
• Strategic Investment in proteanTecs from Industry Leaders MediaTek and Advantest Joined by Porsche Automobil Holding SE to Advance Electronics Health Monitoring
• Xiphera expands its Advanced Encryption Standard portfolio
• Rambus and Kioxia Renew Patent License Agreement
• Movellus launches global distribution partners to accelerate adoption of its Intelligent Clock Network IP
• Cadence Accelerates Development of Mobile, Automotive and Hyperscale Systems with the Helium Virtual and Hybrid Studio
• Lattice mVision Solution Stack Enables 4K Video Processing at Low Power for Embedded Vision Applications
• Xilinx and NEC Accelerate Next-Generation 5G Radio Units for Global Deployment
• Syntiant Unveils NDP200 Neural Decision Processor for Always-On Vision Edge AI Applications

Headlines for Wednesday Sep. 22, 2021

Top Story

Alphawave IP: Interim results for the 6 months to 30 June 2021

Alphawave IP Group plc (LSE: AWE, “Alphawave IP”, the “Company”), a global leader in high-speed connectivity for the world’s leading technology infrastructure, has published its interim results for the 6 months to 30 June 2021

• Samsung Foundry Certifies Synopsys PrimeLib Unified Library Characterization and Validation Solution at 5nm, 4nm and 3nm Process Nodes
• EPI EPAC1.0 RISC-V Test Chip Samples Delivered
• NEWRACOM Introduces First Wi-Fi HaLow Sensor Solution

Headlines for Tuesday Sep. 21, 2021

Top Story

DCD-SEMI introduces octa SPI IP Core for smart wear, audio and mobile

Drive for richer graphics, higher data throughput and wider range of multimedia forces engineers to enable more sophisticated features in embedded applications. But the higher data throughputs require extra demands on the often-limited MCU on-chip memory. That’s why DCD-SEMI mastered DOSPI – octa SPI, to enhance the line of dual and quad SPI IP Cores.

• Update to Royalty-Free MIPI I3C Basic Utility and Control Bus Specification Boosts Speed and Flexibility
• 100G MAC and 100G PCS IP Cores for high performance applications are now available
• Codasip Opens UK Design Center led by Simon Bewick

Headlines for Monday Sep. 20, 2021

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Synopsys Advances Processor IP Leadership with New ARC DSP IP Solutions for Low-Power Embedded SoCs

To address the broader range of power, performance and area (PPA) demands of embedded applications, Synopsys, Inc.today announced it has expanded its DesignWare® ARC® Processor IP portfolio with new 128-bit ARC VPX2 and 256-bit ARC VPX3 DSP Processors.

• SkyWater Technology Joins CHIPS Alliance to Further Efforts to Make Chip Design and Production More Accessible
• Revenue of Top 10 IC Design (Fabless) Companies Reaches US$29.8 Billion for 2Q21, Though Growth May Potentially Slow in 2H21, Says TrendForce
• AI Processor Chipmaker Deep Vision Raises $35 Million in Series B Funding
• Global Fab Equipment Spending Projected to Reach New High of Nearly $100 Billion in 2022, SEMI Reports

Headlines for Friday Sep. 17, 2021

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Xiphera launches solutions for encrypted data storage

To address the needs to secure data at rest, Xiphera has expanded its product portfolio by adding two Intellectual Property (IP) cores to its offering. The freshly added IP cores are based on the AES-XTS, which is the most popular standard for encrypting data on block-oriented storage devices and formally defined in IEEE Standard 1619-2018.

Headlines for Thursday Sep. 16, 2021

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New Arm technologies to transform the software-defined future for the automotive industry

Arm, in collaboration with leaders across the automotive supply chain, today announced it is delivering a new software architecture and reference implementation, Scalable Open Architecture for Embedded Edge (SOAFEE), and two new reference hardware platforms to accelerate the software-defined future of automotive.

• Ken Potts joins the Alphacore team as Chief Operating Officer
• intoPIX Releases a New Range of Compact Encoders and Decoders for JPEG XS
• GlobalFoundries Unveils Innovative Solutions that Deliver a New Era of More in Semiconductor Manufacturing
• GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products
• GF and Synopsys Deliver New Reference Flows for GF 22FDX Process: Cloud-Qualified and First Automotive Flow for ASIL-D Designs
• MoSys and Peraso Technologies Announce Definitive Agreement for Business Combination
• Elissa Murphy Joins GlobalFoundries Board

Headlines for Wednesday Sep. 15, 2021

Top Story

Dutch AI Semiconductor Startup Axelera AI Launches With $12 Million Seed Round

AI semiconductor startup Axelera AI announced today that it has successfully closed a seed investment round of $12 million. The round was led by emerging technologies leader Bitfury and joined by global nanoelectronics R&D center imec and deep-tech venture capital funds Innovation Industries and imec.xpand.

• Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions
• Movellus Hires Semiconductor Industry Veteran Matthew Raggett as VP of Growth
• Siemens' Aprisa place-and-route solution now certified for GlobalFoundries' 22FDX platform
• Visit Alphacore Interactive Virtual booth at the 2021 GlobalFoundries Technology Summit (GTS) Virtual Conference beginning Sept. 15, 2021

Headlines for Tuesday Sep. 14, 2021

Top Story

Mixel Announces Immediate Availability of MIPI C-PHY/D-PHY Combo IP on TSMC N5 Process

Mixel®, a leading provider of mixed-signal intellectual property (IP), announced today that its MIPI® C-PHYSM/D-PHYSM Combo IP is now available on TSMC’s industry-leading N5 process. The MIPI C-PHY IP supports the v2.0 specification, and the MIPI D-PHY IP supports the MIPI D-PHY v2.5 specification.

• SmartDV Provides Broad Portfolio of Memory Modeling, Design and Verification Solutions
• Synopsys Accelerates Most Stringent Functional Safety Certification of NSITEXE RISC-V Parallel Processor IP
• Synopsys Appoints Sassine Ghazi as President and Chief Operating Officer; Chi-Foon Chan to Transition from co-CEO Role
• Analog Circuit Works Adopts Diakopto's ParagonX Platform for High-Performance Analog Circuit IP

Headlines for Monday Sep. 13, 2021

Top Story

Imagination looking at IPO or sale

Imagination Technologies has engaged investment bank Lazard to look at options for selling or IPO-ing the company, reports Bloomberg.

• Synopsys PrimeSim Reliability Analysis Solution Accelerates Design of Hyper-Convergent ICs for Mission-Critical Applications
• MIPI UFS v3.1 Ctrl., MIPI UniPro v1.8 Ctrl. & MIPI M-PHY v4.1 IP Cores in 12nm & 28nm available for immediate licensing for high performance serial interface applications
• 3Q21 Earnings Outlooks Bode Well for Most Leading Semi Suppliers
• Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform

Headlines for Friday Sep. 10, 2021

• TSMC August 2021 Revenue Report

Headlines for Thursday Sep. 09, 2021

Top Story

Intel to invest $95bn in Europe over 10 years, says CEO

Intel will invest $95 billion in European fabs over the next ten years and will open up its Irish fab for foundry business from car companies, said CEO Pat Gelsinger at Munich’ s IAA car show.

• eMemory's Security-Enhanced OTP IP Qualified on TSMC N6 Process
• System Level Solutions's eUSB 3.1 Gen2 Device Controller (eUSB31SF) IP core now available with Isochronous transfer support
• Weebit and SkyWater Announce Agreement to take ReRAM Technology to Volume Production
• Attopsemi's I-fuse OTP IP Embedded into NJR's Products
• Codasip Strengthens Senior Leadership Team
• Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon
• Aviva Technology Holding Raises $26.5M Series A Financing to Accelerate Automotive Connectivity
• Efinix Announces AEC-Q100 Qualification and Automotive Product Line Initiative