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D&R Headline News (Last 14 Days)
Headlines for Tuesday Nov. 24, 2020
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Intel to Keep Its Number One Semiconductor Supplier Ranking in 2020
Seven top-15 semiconductor suppliers forecast to show ≥22% growth this year with Nvidia expected to post a huge 50% increase.Headlines for Monday Nov. 23, 2020
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CEVA's Bluetooth Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that its RivieraWaves Bluetooth® Low Energy (LE) 5.2 Platform has achieved Bluetooth SIG Qualification.- China TSMC Rival HSMC Runs Out of Cash, Ex-CEO Says
- Audio Weaver + TalkTo reference design now available on Qualcomm QCS400 series of audio System-on-Chips (SoCs)
- North American Semiconductor Equipment Industry Posts October 2020 Billings
- Mythic launches industry-first AI analog matrix processor
Headlines for Friday Nov. 20, 2020
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Wi-Fi HaLow Reference Platform Available from Palma Ceia SemiDesign
Palma Ceia SemiDesign announced today the availability of the company’s Wi-Fi HaLow Reference Platform, including all necessary hardware and software, for the design of Wi-Fi HaLow devices and systems based on the IEEE 802.11ah specification.Headlines for Thursday Nov. 19, 2020
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Ferroelectric Memory GmbH (FMC) Raises $20 Million to Accelerate Next-Generation Memory for AI, IoT, Edge Computing, and Data Center Applications
Ferroelectric Memory GmbH (FMC), the ferroelectric hafnium oxide technology leader, today announced that it has completed a $20 million Series B funding. The round of financing was led by the new investors M Ventures and imec.xpand, with participation of SK hynix, Robert Bosch Venture Capital, and TEL Venture Capital.- AI Startup Deep Vision Powers AI Innovation at the Edge
- Secure Thingz supports next-generation Secure Install technologies for IP Protection and malware prevention
- Xilinx Collaborates With Texas Instruments to Develop Energy Efficient 5G Radio Solutions
- Introducing new Arm Roadmap Guarantee and other Arm IoT initiatives for accelerating Endpoint AI
- SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform for the Embedded Edge
- Mentor joins Nano 2022 R&D program to foster innovation in semiconductor design and verification
Headlines for Wednesday Nov. 18, 2020
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Bouffalo Lab Standardizes on SiFive RISC-V Embedded CPU Core IP for New IoT Products
SiFive and Bouffalo Lab today announced the adoption of SiFive E2-Series Core IP based on RISC-V as part of Bouffalo’s new IoT Bluetooth, Zigbee, Thread and WiFi products, the BL70x and BL602.- Foundry Revenue Expected to Increase by 23.8% YoY in 2020, with Advanced Nodes and 8-Inch Capacities Being Key to Industry Competitiveness in 2021, Says TrendForce
- Wafer Capacity by Feature Size Shows Strongest Growth at <10nm
- Fugaku Tops Supercomputer Rankings Again as Arm HPC Ecosystem Expands
- First Intel Structured ASIC for 5G, AI, Cloud and Edge Announced
- BrainChip Appoints Todd Vierra Director of Technical Sales
Headlines for Tuesday Nov. 17, 2020
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Kandou Raises $92.3 Million in Series C Funding
Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, today closed its Series C round of funding, resulting in $92.3 million raised in the round.- GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC
- Ultra-low power GNSS Multi-Constellation Digital IP Core licensed to a European Semiconductor company for battery powered IOT & Wearable applications
- Marvell Announces Industry's First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure
- Arteris IP Achieves Major Milestone: 150th Licensee
Headlines for Monday Nov. 16, 2020
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Apple M1 Processor, Passing on the Chiplets
Recent angry comments to EE Times‘ interview with Intel’s Ramune Nagisetty disparaged the current heterogenous integration and chiplet discussions as more of a rehash than an innovation and furthermore simply a way for American manufacturers to obfuscate their inability to stay at the leading edge of wafer fabrication.- BrainChip Demonstrates How Its Akida Technology Is Delivering the Next-Generation of AI at the Edge at First-Ever AI Field Day
- SimpleMachines, Inc. Debuts First-of-its-Kind High Performance Chip
- Lattice Expands Radiant Software Tool Capabilities
Headlines for Thursday Nov. 12, 2020
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Synopsys Acquires In-chip Monitoring Solutions Leader Moortec
Synopsys, Inc. (NASDAQ: SNPS) today announced that it has acquired Moortec, a leading provider of in-chip monitoring technology specializing in process, voltage and temperature (PVT) sensors.- Xilinx and Samsung Deliver Industry's First Adaptable Computational Storage Drives
- Lattice Accelerates Development of Low Power FPGA-Based Custom Solutions with Lattice Design Group
- Imagination launches multi-core IMG Series4 NNA - the ultimate AI accelerator delivering industry-disruptive performance for ADAS and autonomous driving
- Faraday's 22nm Fundamental IP Adopted for Intelligent IoT Devices
- Silvaco Acquires Memory Compiler Technology of Dolphin Design SAS
- De-RISC first anniversary, a H2020 project which will create the first RISC-V, fully European platform for space
- Google Partners with SkyWater and Efabless to Enable Open Source Manufacturing of Custom ASICs
- Vidatronic Achieves up to 10X Speedup Using the Cadence Spectre X Simulator
Headlines for Wednesday Nov. 11, 2020
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CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC).Headlines for Tuesday Nov. 10, 2020
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PLDA Announces CXL 2.0 Support in their XpressLINK Family of CXL Controller IP
PLDA, the industry leader in high-speed Interconnect solutions, today announced CXL 2.0 support for its XpressLINK™ and XpressLINK-SOC™ CXL IP solutions.- CXL Consortium Releases Compute Express Link 2.0 Specification
- Silex Insight delivers state-of-the-art security features to the award-winning Secure Vault technology from Silicon Labs
- CAST Releases MIPI I3C Basic Slave Controller IP Core
- Synopsys Announces Industry's First CXL 2.0 VIP Solution for Breakthrough SoC Performance
- Graphcore leverages multiple Mentor technologies for its massive, second-generation AI platform
- Pinnacle Imaging Systems Announces Denali 3.0 ISP
- Kameleon Security and Xilinx Collaborate on New Cybersecurity Solution for Servers, Cloud Computing and Data Centers
- Avery Design Debuts QEMU Virtual Host to SystemVerilog PCIe VIP HW-SW Co-simulation Solution for Pre-silicon System-level Simulation of NVMe SSD and PCIe Designs
Headlines for Monday Nov. 09, 2020
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Cadence Achieves Industry-First ASIL B(D) Compliance Certification for Automotive Radar, Lidar and V2X DSP IP
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® Tensilica® ConnX B10 and ConnX B20 DSPs are the industry’s first DSPs optimized for automotive radar, lidar and vehicle-to-everything (V2X) to achieve Automotive Safety Integrity Level B in support of D (ASIL B(D))-compliant certification.- MosChip Technologies appoints Semiconductor Business Veteran, Swamy Irrinki As "Vice President of Marketing and Business Development" to Oversee and Drive Continued Business Growth
- European Processor Initiative: Second year of activities
- UMC Reports Sales for October 2020