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Foundries News

  • TSMC September 2008 Sales Report (Oct. 09, 2008)
    TSMCtoday announced its net sales for September 2008: on an unconsolidated basis, sales were NT$28,252 million, a decrease of 8.9 percent from August 2008 and a decrease of 0.9 percent from September 2007
  • Panasonic and Renesas Technology to Collaborate on Development of SoCs at 32-nm Process Node (Oct. 09, 2008)
    Building on the successful partnership on their joint process technology development since 1998, Panasonic Corporation and Renesas Technology Corp. are now collaborating on the development of elemental process technologies for systems-on-a-chip (SoCs) of the next-generation 32-nm node.
  • Fujitsu Microelectronics, e-Shuttle and D2S to Develop Maskless ICs (Oct. 09, 2008)
    Fujitsu, e-Shuttle and D2S, today announced an agreement under which FML and e-Shuttle will adopt D2S' advanced design for e-beam (DFEB) technology-starting with a 65-nm Low Power (LP) library-to result in the creation of test silicon to refine and validate DFEB technology for the 65-nm, 40-nm and below nodes.
  • UMC Reports Sales for September 2008 (Oct. 08, 2008)
    United Microelectronics Corporation (UMC) today reported unaudited net sales for the month of September 2008.
  • AMD and Advanced Technology Investment Company of Abu Dhabi to Create Leading-Edge Semiconductor Manufacturing Company (Oct. 07, 2008)
    AMD and ATIC today announced the intention to create a new global enterprise, The Foundry Company, to address the growing global demand for independent, leading-edge semiconductor manufacturing.
  • SMIC tips 40-nm, enters 32-nm talks with IBM (Oct. 03, 2008)
    Chinese foundry vendor Semiconductor Manufacturing International Corp. (SMIC) here outlined its process roadmap, tipping its 45- and 40-nm technology for delivery in 2009.
  • Yitran Communications and Tower Semiconductor Announce Production Launch of Yitran's IT700 PLC Module (Oct. 02, 2008)
    IT700 will be manufactured using Tower Semiconductor's advanced 0.18u NVM technology at Tower's 200-mm Fab 2
  • TSMC's 28nm To Be a Full Node Process (Sep. 29, 2008)
    Next generation 28nm process provides first comprehensive manufacturing platform featuring both high-k metal gate and silicon oxynitride
  • SMIC Reiterates 2008 Third Quarter Revenue Guidance (Sep. 29, 2008)
    SMIC reiterated today its revenue guidance for third quarter for the three months ended September 30, 2008
  • Chartered tips 40-, 32- and 28-nm processes (Sep. 25, 2008)
    Seeking to take the lead in the foundry market, Singapore's Chartered Semiconductor Manufacturing Pte. Ltd. has revealed its new roadmap, including plans to develop and offer a 28-nm process possibly by next year.
  • Tower Semiconductor Announces Signing and Closing of Definitive Agreements with its Lenders to Restructure Its Balance Sheet and Reduce $250 Million of Debt (Sep. 25, 2008)
    Agreements Will Increase Shareholders' Equity by $250 Million, Improve Future Cash Flow and Financial Results; Agreement Will Result-In a Gain of Approximately $130 Million, to be Recorded in the Third Quarter 2008
  • Renesas Plans to Sell German Fab to Silicon Foundry Holding (Sep. 24, 2008)
    Renesas Technology is planning a sale of its production facility in Germany to Silicon Foundry Holding (SFH), a newly established Germany-based company specializing in semiconductor foundry services.
  • Tower Semiconductor Completes Merger with Jazz Technologies (Sep. 19, 2008)
    Merger Creates Leading specialty foundry with increased capacity and scale offering a comprehensive process portfolio.
  • IBM and NEC Electronics Sign Agreement for Joint Development of Next-Generation Semiconductor Process Technology (Sep. 11, 2008)
    Under the agreement, NEC Electronics will participate in a joint development project for the next-generation core CMOS process, at the 32-nm node, and in advanced fundamental research for leading-edge semiconductor technologies of the future.
  • TSMC August 2008 Sales Report (Sep. 10, 2008)
    TSMC today announced its net sales for August 2008: on an unconsolidated basis, sales were NT$30,995 million, an increase of 0.4 percent over July 2008 and an increase of 6.2 percent over August 2007.
  • Chartered Updates Guidance for Third Quarter (Sep. 10, 2008)
    Today Chartered updated its third quarter 2008 guidance, which was originally provided on July 25, 2008.
  • Spansion Extends SMIC Agreement to Include 43nm MirrorBit(R) ORNAND2(TM) Technology (Aug. 21, 2008)
    Spansion today announced it has extended its current agreement with SMIC for the production of 65-nanometer MirrorBit NOR to include the manufacture of 43-nanometer Spansion(R) MirrorBit(R) ORNAND2(TM) Flash memory on 300mm wafers.
  • Tower Semiconductor Signs Memorandum of Understanding to Significantly Improve Its Balance Sheet and Financial Position (Aug. 20, 2008)
    Will Reduce Debt by $250 Million, Increase Shareholders’ Equity by $250 Million and Improve Future Cash Flow and Financial Results
  • Philips Completes Exit of TSMC Shareholding (Aug. 14, 2008)
    TSMC today announced that the multi-phased plan for Philips’ exit from its TSMC shareholding, as announced in March 2007, has come to an orderly and successful conclusion.
  • Tower Semiconductor & Jazz Technologies Announce Merger on Track for Closing in September 2008 (Aug. 13, 2008)
    Jazz Technologies Stockholders to Vote September 17, 2008; Registration Statement Declared Effective by the SEC
  • TSMC July 2008 Sales Report (Aug. 08, 2008)
    Revenues for January through July 2008 totaled NT$201,694 million, an increase of 22.3 percent compared to the same period in 2007.
  • Tower Semiconductor in Advanced Negotiations for Restructuring Agreement to Significantly Improve Its Balance Sheet and Reduce Its Level of Debt (Aug. 08, 2008)
    Jazz Technologies Merger Is On Track for Closing
  • TSMC Reports Second Quarter EPS of NT$1.12 (Jul. 31, 2008)
    Year-over-year, second quarter revenue increased 17.6% while net income and diluted EPS increased 12.9% and 16.3%, respectively.
  • Commentary: Losing patience with SMIC (Jul. 30, 2008)
    Based on the tone of this week's conference call with industry analysts, the analyst community is simply running out of patience with China's Semiconductor Manufacturing International Corp. (SMIC).
  • Chartered Reports Results for Second Quarter 2008 (Jul. 25, 2008)
    Chartered revenues of $457.6 million in 2Q 2008, up 41.1 percent from 2Q 2007 and up 17.9 percent sequentially. Revenues including Chartered’s share of SMP of $482.5 million, up 36.7 percent from 2Q 2007 and up 16.5 percent sequentially.
  • UMC Announces Restructuring of Executive Team (Jul. 16, 2008)
    UMC Board of Directors elects Mr. Stan Hung as Chairman and Dr. Shih-Wei Sun as CEO following resignation of Dr. Jackson Hu
  • austriamicrosystems releases High-Voltage IO library offering 4KV ESD protection (Jul. 10, 2008)
    The new silicon proven H35 periphery library guarantees a 4kV HBM (Human Body Model) ESD protection compliant to the MIL-883E, Method 3015.7 and JEDEC JESD22-A114B ESD standards.
  • TSMC June 2008 Sales Report (Jul. 10, 2008)
    TSMC today announced its net sales for June 2008: on an unconsolidated basis, sales were NT$28,510 million, a decrease of 1.7 percent from May 2008 and an increase of 12.9 percent over June 2007
  • Panavision Imaging And Tower Semiconductor Announce New Family Of Re-Configurable Linear Image Sensors (Jul. 09, 2008)
    The sensors were developed by Panavision using Tower’s Advanced Photo Diode (APD) pixel process and pixel IP, and are to be manufactured in Tower’s 200mm Fab2 in Migdal Ha’emek, Israel.
  • Cypress and Tower Semiconductor Announce Completion of Cypress'’s First 0.18-Micron Stitched Custom CMOS Image Sensor Device (Jul. 07, 2008)
    Tower’s Patented Small-Pixel Stitching Technology to Manufacture High End Application



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