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Friday, June 5, 2026

• Meet T2M at RISC-V Summit Europe– Accelerating Next-Gen SoCs with Production-Proven IP Cores. 

Thursday, June 4, 2026

• Siemens and partners develop reference architecture purpose-built for NVIDIA AI data centers
• InPsytech Highlights UCIe Innovation at COMPUTEX with UCIe Live Demo and Ultra-high speed ONFI 6400 Development
• Soitec reports fiscal 2026 full-year results
• GlobalFoundries completes acquisition of Synopsys’ Processor IP Solutions Business, delivering a holistic technology platform for Physical AI
• Renesas Announces Leadership Transition in Engineering Organization
• QuickLogic Set to Join Russell 2000® and Russell 3000® Indexes
• Infineon launches EU flagship project Moore4Power to drive the next generation of sustainable power electronics
• Keysight Expands Photonics Design Ecosystem with GlobalFoundries PDK
• Innovation From Above: How Mesh Networks Help Control Drone Swarms
• Siemens unveils new 3D electrical systems design workflow for electromechanical innovation
• Keysight Introduces RF Signal Analyzers to Accelerate Wideband Wireless Design and Validation
• Cadence extends chip design agent to Level-5 autonomy
• Samsung Electronics Begins Shipment of Industry-First HBM4E Samples
• Samsung Foundry Reportedly in Talks With Chinese Carmakers Like BYD for 2nm, 4nm Autonomous Driving SoCs
• NVIDIA and TSMC Bring AI Into Fabs to Advance Semiconductor Design and Manufacturing

Wednesday, June 3, 2026

• MicroIP and BrainChip Announce Strategic Ecosystem Partnership to Deliver Advanced Edge AI Hardware and Software

Monday, June 1, 2026

• Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution
• Industry Urges to Expand Push in Automotive Semiconductor Market
• Faraday Ranked in Top 5% in Corporate Governance Evaluation for Second Consecutive Year
• FortifyIQ Appoints Avishay Shraga as Chief Product Officer
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2026
• Keysight reports record revenue with orders topping $2bn
• Credo Completes Acquisition of DustPhotonics
• DisplayPort v1.4 Tx & Rx IP Cores with Industry-Proven up to 8K Support in 12FFC
• Keysight Tackles Semiconductor Talent Gap with Executable RF Design Whiteboard
• CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware
• Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis
• Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand
• SemiFive Showcases 3D-IC Technology at Samsung SAFE Forum
• Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
• Siemens and Samsung Foundry strengthen collaboration to advance silicon design enablement
• Analogue Insight Appoints Dr Tanya Mangoma as Chief Product Officer to Drive Customer-Led High-Speed Interconnect and Memory Solutions

Thursday, May 28, 2026

• INTERA Group Announces Next-Generation Neuromorphic Semiconductor Platform
• Siemens introduces new Simcenter PhysicsAI add-on for AI-powered CFD design exploration
• Keysight to Showcase Spectrum Innovations at IMS 2026
• BOS Semiconductors Appoints Former Intel and Samsung Foundry Executive Hong Hao as Strategic Advisor
• Three Audio Collaborations Tuning Up the Listening Experience
• Quanta Computer selects Siemens Xcelerator to advance manufacturing innovation
• MIPI Alliance Launches Compliance Program to Strengthen A-PHY Automotive Ecosystem
• EXTOLL and Chip Interfaces introduce the Industry´s first Integrated UCIe IP Solution for GlobalFoundries FDX Technology
• Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level
• Samsung May Launch Physical AI Chiplet Platform Next Year
• STMicroelectronics’ new GaN semiconductors improve energy efficiency for high-demand applications from AI servers to robotics
• SkyeChip's World-First HBM4/HBM3E Combo PHY IP for SF4X Listed on Samsung Foundry CONNECT

Wednesday, May 27, 2026

• Rambus Enables Next-Generation AI PC Memory with Complete Client Chipset for CUDIMM and CSODIMM Modules
• DCD-SEMI Introduces eSPI Combo for Next-Generation Intel-Based Platforms
• BOS Semiconductors Appoints Former Tenstorrent and AMD Executive David Bennett as Strategic Advisor