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Friday, June 5, 2026
Meet T2M at RISC-V Summit Europe– Accelerating Next-Gen SoCs with Production-Proven IP Cores.
Thursday, June 4, 2026
Siemens and partners develop reference architecture purpose-built for NVIDIA AI data centers
InPsytech Highlights UCIe Innovation at COMPUTEX with UCIe Live Demo and Ultra-high speed ONFI 6400 Development
Soitec reports fiscal 2026 full-year results
GlobalFoundries completes acquisition of Synopsys’ Processor IP Solutions Business, delivering a holistic technology platform for Physical AI
Renesas Announces Leadership Transition in Engineering Organization
QuickLogic Set to Join Russell 2000® and Russell 3000® Indexes
Infineon launches EU flagship project Moore4Power to drive the next generation of sustainable power electronics
Keysight Expands Photonics Design Ecosystem with GlobalFoundries PDK
Innovation From Above: How Mesh Networks Help Control Drone Swarms
Siemens unveils new 3D electrical systems design workflow for electromechanical innovation
Keysight Introduces RF Signal Analyzers to Accelerate Wideband Wireless Design and Validation
Cadence extends chip design agent to Level-5 autonomy
Samsung Electronics Begins Shipment of Industry-First HBM4E Samples
Samsung Foundry Reportedly in Talks With Chinese Carmakers Like BYD for 2nm, 4nm Autonomous Driving SoCs
NVIDIA and TSMC Bring AI Into Fabs to Advance Semiconductor Design and Manufacturing
Wednesday, June 3, 2026
MicroIP and BrainChip Announce Strategic Ecosystem Partnership to Deliver Advanced Edge AI Hardware and Software
Monday, June 1, 2026
Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution
Industry Urges to Expand Push in Automotive Semiconductor Market
Faraday Ranked in Top 5% in Corporate Governance Evaluation for Second Consecutive Year
FortifyIQ Appoints Avishay Shraga as Chief Product Officer
Synopsys Posts Financial Results for Second Quarter Fiscal Year 2026
Keysight reports record revenue with orders topping $2bn
Credo Completes Acquisition of DustPhotonics
DisplayPort v1.4 Tx & Rx IP Cores with Industry-Proven up to 8K Support in 12FFC
Keysight Tackles Semiconductor Talent Gap with Executable RF Design Whiteboard
CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware
Light Speed: How Integrated Photonics Is Solving AI’s Interconnect Crisis
Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand
SemiFive Showcases 3D-IC Technology at Samsung SAFE Forum
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
Siemens and Samsung Foundry strengthen collaboration to advance silicon design enablement
Analogue Insight Appoints Dr Tanya Mangoma as Chief Product Officer to Drive Customer-Led High-Speed Interconnect and Memory Solutions
Thursday, May 28, 2026
INTERA Group Announces Next-Generation Neuromorphic Semiconductor Platform
Siemens introduces new Simcenter PhysicsAI add-on for AI-powered CFD design exploration
Keysight to Showcase Spectrum Innovations at IMS 2026
BOS Semiconductors Appoints Former Intel and Samsung Foundry Executive Hong Hao as Strategic Advisor
Three Audio Collaborations Tuning Up the Listening Experience
Quanta Computer selects Siemens Xcelerator to advance manufacturing innovation
MIPI Alliance Launches Compliance Program to Strengthen A-PHY Automotive Ecosystem
EXTOLL and Chip Interfaces introduce the Industry´s first Integrated UCIe IP Solution for GlobalFoundries FDX Technology
Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level
Samsung May Launch Physical AI Chiplet Platform Next Year
STMicroelectronics’ new GaN semiconductors improve energy efficiency for high-demand applications from AI servers to robotics
SkyeChip's World-First HBM4/HBM3E Combo PHY IP for SF4X Listed on Samsung Foundry CONNECT
Wednesday, May 27, 2026
Rambus Enables Next-Generation AI PC Memory with Complete Client Chipset for CUDIMM and CSODIMM Modules
DCD-SEMI Introduces eSPI Combo for Next-Generation Intel-Based Platforms
BOS Semiconductors Appoints Former Tenstorrent and AMD Executive David Bennett as Strategic Advisor
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