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ST's strategy is a tale of two segments
ST tells analysts it is going to report financial results for its both digital and analog business segments for "transparency" but remains committed to exploiting manufacturing technologies it has Crolles, including its FDSOI process.
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New!!! |
Qualcomm and Samsung Pass AMD in MPU Ranking
A slowdown in notebook and desktop personal computer purchases coupled with strong growth in smartphones and tablet PCs knocked Advanced Micro Devices down to fourth place in microprocessor sales in 2012 from second, where AMD had been perched behind Intel since the 1990s, according to a new ranking of MPU suppliers by IC Insights.
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Google TV Devices with Vivante GPU Cores Ready for Android Jelly Bean Update
This week during the Google I/O developers conference, Vivante announced product readiness for the latest Android Jelly Bean 4.2.2 operating system update.
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TSMC plots system super chips
TSMC recently detailed its plans to dominate the "system super-chip" market in an exclusive EE Times interview with its chief technology officer and vice president of R&D, Jack Sun.
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New!!! |
ST to deny rivals FDSOI access
STMicroelectronics is considering plans to offer its fully depleted silicon on insulator (FDSOI) process to second-tier foundries United Microelectronics Corp. and SMIC.
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Xilinx Achieves PCI Express Compliance Across its All Programmable 28nm Devices
Xilinx, Inc. today announced that its All Programmable 7 series FPGAs and Zynq®-7000 All Programmable SoCs have achieved full PCI Express® compliance and are now listed on the PCI-SIG integrator's list.
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Cadence Introduces the Tempus Timing Signoff Solution, Delivering Unprecedented Performance and Capacity in Design Closure and Signoff
Cadence today introduced the Tempus™ Timing Signoff Solution, a new static timing analysis and closure tool designed to enable SoC developers to speed timing closure and move chip designs to fabrication quickly.
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Ultra-Low Latency H.264 Video Encoding Now Available from CAST
The H.264 video encoder IP cores available from semiconductor intellectual property provider CAST, Inc. now feature an option for ultra-low latency video encoding. This enables near-real time video transmission for streaming and wireless video applications, especially when coupled with CAST’s hardware stacks for fast, processor-less video processing.
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GUC Monthly Sales Report - April 2013
GUC today announced its net sales for April 2013 were NT$424 million, down 13.8% month-over-month and down 41.8% year-over-year. Net sales for January through April 2013 totaled NT$1,631 million, a decrease of 33.2% compared to the same period in 2012.
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What will the IP landscape look like in the future
Today the question is: When the 3rd party IP market/business was first conceived, it was a bunch of small startups plus a few more established players. Significant consolidation has happened and a lot of IP is now supplied by the EDA companies. What do you think the IP landscape will look like in the future? Who owns it?
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Calxeda and Fedora Project Deploy Servers on Path to Make ARM a Primary Architecture
Calxeda today announced the deployment of Boston Ltd. Viridis servers embedded with Calxeda EnergyCore® chips for the Fedora Project. The availability of the Calxeda-based server cluster is a critical step in helping the Fedora community enable ARM into a primary architecture.
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Synopsys DesignWare IP for PCI Express 3.0 Passes First PCI-SIG PCIe 3.0 Compliance Workshop
Synopsys today announced that its DesignWare® PHY and digital controller IP for the PCI-SIG® PCI Express® 3.0 is the first complete solution from a single vendor to pass compliance testing at the first PCI-SIG compliance workshop for PCI Express 3.0.
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Teledyne Acquires Axiom IC
Teledyne Technologies announced today that its subsidiary, Teledyne DALSA B.V., has acquired Axiom IC B.V., a fabless semiconductor company that develops high-performance CMOS mixed-signal integrated circuits.
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Cadence to Acquire IP Business of Evatronix, Further Expanding IP Portfolio
Cadence today announced its intent to acquire the IP business of Evatronix SA SKA, adding to its rapidly expanding IP offering. Based in Poland, Evatronix delivers a silicon-proven IP portfolio, which includes certified USB 2.0/3.0, Display, MIPI, and storage controllers, which are highly complementary to Cadence’s IP offering.
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Open-Silicon Celebrates Its 10th Year Anniversary With Continued Growth
Open-Silicon celebrated another milestone by reaching its 10th year in business this month. Open-Silicon, has established itself as a leader in ASIC and continues to push the boundaries on ASIC design by focusing on on-time delivery, reliability and cost-effectiveness.
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Imec and GLOBALFOUNDRIES collaborate to advance high-density memory technolog
Imec and GLOBALFOUNDRIES announced today that they have expanded joint development efforts to advance STT-MRAM (spin-transfer torque magnetoresistive random access memory) technology.
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Aizyc Technology Upgrades its SDXC3.0 Host IP to support up to 7 Devices on SD Shared Bus
Aizyc has upgraded their Silicon Proven SDXC3.0 host controller IP with “Shared Bus” functionality, allowing users to connect up to 7 SD/SDIO/MMC/eMMC devices on single “Shared Bus” slot.
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LogMeIn and ARM Announce Collaboration to Accelerate Commercial Products on the Internet of Things
LogMeIn announced today its collaboration with ARM® to simplify and accelerate commercial development on the Internet of Things (IoT). As part of the agreement, the companies are cooperating on LogMeIn's Xively Jumpstart Kit, a rapid prototyping-to-production bundle that significantly reduces the cost, complexity and learning curve required to bring IoT-based connected products and solutions to market.
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ACE's latest CoSy compiler development system optimizes for extreme architectures
ACE announces the availability of the 2013 Spring Edition of its CoSy compiler development system. Integral support for complex architecture features allows compiler developers now to build, optimize and tune compilers for compute-intensive application domains and extreme architectures.
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OneSpin Solutions Reaches for the Cloud, Driving New Technology, Business Model for Easy Adoption
OneSpin Solutions today unveiled a new business model based on Cloud Computing designed to give project teams flexibility previously unavailable for electronic design automation (EDA) tools, while eliminating barriers to adoption.
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