HDMI 2.0 Rx PHY & Controller IP, Silicon Proven in TSMC 12FFC
Industry Expert Blogs
![]() |
Panel: Is the Cloud the Solution to IC Design Collaboration?Industry Insights Blog - Richard Goering , CadenceJan. 20, 2011 |
Semiconductor design increasingly requires collaboration by geographically-dispersed design teams, as well as partners and third-party suppliers. Private or public cloud computing may provide a rich environment for this collaboration, but some key questions and challenges remain, according to panelists at the Common Platform Technology Forum Jan. 18, 2011.
The panel, titled "Successful Collaboration in a Global Engineering Environment," wasn't specifically about cloud computing, but that was a recurring theme. The panel was moderated by Ron Wilson of EE Times, and it included the following participants:
- Jean Boufarhat, vice president of circuit technology, AMD
- Larry Drennan, group director, Cadence
- Bruce Jewett, marketing group director, cloud computing, Synopsys
- Carl Anderson, IBM fellow, processor design
- Luigi Capodieci, GLOBALFOUNDRIES fellow
- M.Y. Park, director, SSI ASIC Design Center, Samsung
Ron Wilson kicked off the panel with a provocative opening question. "In today's model of collaboration, I'll host my own tools, I'll host my own data sets, and I'll have my own support staff, but I'll give you a little data when I want some help...do we have the right model for collaboration at this point or should we be looking at some alternative?"
Related Blogs
- Intel Embraces the RISC-V Ecosystem: Implications as the Other Shoe Drops
- Experts Talk: RISC-V CEO Calista Redmond and Maven Silicon CEO Sivakumar P R on RISC-V Open Era of Computing
- Semiconductor Design Firms are Embracing the Public Cloud. Here are 5 Reasons Why.
- Decipher the Meaning of Silicon-as-a-Service
- DAC 2012 Panelists: How to Succeed at 28nm, 20nm and 14nm