Semiconductor design increasingly requires collaboration by geographically-dispersed design teams, as well as partners and third-party suppliers. Private or public cloud computing may provide a rich environment for this collaboration, but some key questions and challenges remain, according to panelists at the Common Platform Technology Forum Jan. 18, 2011.
The panel, titled "Successful Collaboration in a Global Engineering Environment," wasn't specifically about cloud computing, but that was a recurring theme. The panel was moderated by Ron Wilson of EE Times, and it included the following participants:
- Jean Boufarhat, vice president of circuit technology, AMD
- Larry Drennan, group director, Cadence
- Bruce Jewett, marketing group director, cloud computing, Synopsys
- Carl Anderson, IBM fellow, processor design
- Luigi Capodieci, GLOBALFOUNDRIES fellow
- M.Y. Park, director, SSI ASIC Design Center, Samsung
Ron Wilson kicked off the panel with a provocative opening question. "In today's model of collaboration, I'll host my own tools, I'll host my own data sets, and I'll have my own support staff, but I'll give you a little data when I want some help...do we have the right model for collaboration at this point or should we be looking at some alternative?"
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