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eFPGA IP and FPGA Software Built on Samsung Foundry 28nm FDSOI
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Renesas to Acquire Cellular IoT Technology Leader Sequans Through Tender Offer (Monday Aug. 07, 2023)
The Acquisition of Sequans Will Allow Renesas to Extend More Comprehensive IoT Solution Offering
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Cadence to Acquire Rambus PHY IP Assets (Friday Jul. 21, 2023)
Cadence Design Systems and Rambus today announced that they have entered into a definitive agreement for Cadence to acquire the Rambus SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP.
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Arm expands open-source partnerships to reinforce commitment to open collaboration (Thursday Jul. 20, 2023)
A key tenet for Arm and our ecosystem is collaboration across the open-source community to create a strongly curated Arm architecture that is more stable for software to land on, enabling millions of developers worldwide to test and build their applications.
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Thalia Secures $2.7 Million Funding to Strengthen Position as Leading IP Reuse Partner for Semiconductor Industry (Thursday Jul. 20, 2023)
Thalia, a prominent analog IP reuse specialist, has announced the successful completion of a substantial funding round, propelling the company into its next phase of growth. The $2.7 million (£2.125 million) investment is lead by Mercia Ventures, who has backed the company since 2014, alongside continued support from Deepbridge Capital and private investor Guillaume d’Eyssautier.
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GMAC Intelligence Goes Big with BrainChip Partnership (Monday Jul. 17, 2023)
BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event- based, neuromorphic AI IP, welcomes AI/ML software company GMAC Intelligence as a partner to its Essential AI ecosystem.
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European Commission Approves Broadcom's Acquisition of VMware (Thursday Jul. 13, 2023)
Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, received conditional approval today from the European Commission to complete its acquisition of VMware, Inc. (NYSE: VMW).
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Crypto Quantique Selected for European Innovation Council (EIC) Grant Funding (Wednesday Jul. 12, 2023)
Crypto Quantique, a leading provider of quantum-based security solutions for the internet of things (IoT), today announced that it has been selected to receive European Innovation Council (EIC) funding via a growth grant for its submission on Quantum secure cryptography to secure IoT devices in deep submicron nodes.
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EUROPRACTICE starts offering access to Pragmatic's flexible integrated circuit foundry services through imec (Wednesday Jul. 05, 2023)
EUROPRACTICE Multi-Project Wafer (MPW) services will now offer flexible integrated circuit fabrication from Pragmatic Semiconductor, headquartered in Cambridge, UK. Within the EUROPRACTICE consortium, imec will be the partner that provides customers with access to Pragmatic’s technologies and technical support.
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ADTechnology Joins Synopsys IP OEM Partner Program (Monday Jul. 03, 2023)
ADTechnology today announced that they have joined the Synopsys IP OEM Partner Program to gain access to Synopsys' broad portfolio of leading IP solutions targeting Samsung Foundry advanced process technologies.
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Celestial AI, the Creator of the Photonic Fabric Optical Interconnect Technology Platform, Raises $100 Million in Series B Funding (Thursday Jun. 29, 2023)
Celestial AI, the Photonic Fabric™ company, today announced it has raised $100 million in Series B funding led by IAG Capital Partners, Koch Disruptive Technologies (KDT) and Temasek’s Xora Innovation fund.
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BrainChip Selects IPro Silicon IP to Serve Israel's high growth AI market (Monday Jun. 26, 2023)
BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, has selected IPro Silicon IP Ltd. to expand its sales presence in Israel.
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Codasip partners with SmartDV to accelerate chip design projects (Thursday Jun. 22, 2023)
Codasip, the leader in RISC-V custom compute, today announced that it has selected SmartDV Technologies as its preferred provider of peripheral design IP. Codasip’s customers can now license a selection of SmartDV peripheral IP under a single license agreement and contract.
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Secure-IC & NSITEXE extend strategic partnership to provide security solutions for Cyber-Physical Systems (CPS) (Thursday Jun. 15, 2023)
The partnership consists of several major collaborations, including a best-in class Network Secure Subsystem for CPS comprising the first worldwide cybersecurity enhanced ASIL-D grade RISC-V core and a full integrated HSM (Hardware Security Module) to answer the strong challenges regarding security in automotive and industrial MCU applications.
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Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio (Wednesday Jun. 14, 2023)
Cadence Design Systems today announced that it has signed a multi-year agreement with Samsung Foundry to expand the availability of Cadence’s design IP portfolio on Samsung Foundry’s SF5A process technology, the latest 5nm process variant to support automotive applications.
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Signature IP chooses IPro for Sales Representation in Israel (Wednesday Jun. 14, 2023)
Signature IP has partnered with IPro Silicon IP, a top sales outsourcing provider in Israel. This partnership aims to bring advanced NoC and Connectivity solutions to the SoC design community in Israel, enhancing the flexibility and configurability of chip designs.
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Tachyum Among Recipients of 8.1 Billion Euro IPCEI Grant (Tuesday Jun. 13, 2023)
Tachyum™ is one of 56 companies from 14 European Union countries selected to share in an up to 8.1 billion euro public grant as part of a recently announced Important Project of Common European Interest in Microelectronics and Communication Technologies (IPCEI ME/CT).
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First Generation SiMa.ai Edge AI Platform Enters Mass Production Amidst Surge in Company Momentum (Tuesday Jun. 13, 2023)
SiMa.ai today announced it is experiencing significant company-wide momentum including a rapid rise in customer demand, new innovation accolades, 30% year-over-year employee growth, the introduction of a new partner ecosystem, and new venture funding for a total of $200M raised to date.
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Arm SystemReady surpasses 100 certifications, driving standardization where it matters (Wednesday Jun. 07, 2023)
Today we are pleased to announce that the Arm SystemReady program has achieved over 100 certifications. This milestone is significant and it illustrates the fantastic momentum we’re seeing as the program continues with its vision to enable systems where software “just works”.
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Marquee Semiconductor Acquires Semikunn Technology Services, Expanding Design Services Portfolio (Tuesday Jun. 06, 2023)
Marquee Semiconductor, a leading global provider of connectivity solutions for SoC/Chiplets and FPGAs, is pleased to announce the successful acquisition of Semikunn Technology Services, a prominent design services company based in India.
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NVIDIA Collaborates With SoftBank Corp. to Power SoftBank's Next-Gen Data Centers Using Grace Hopper Superchip for Generative AI and 5G/6G (Thursday Jun. 01, 2023)
NVIDIA and SoftBank Corp. today announced they are collaborating on a pioneering platform for generative AI and 5G/6G applications that is based on the NVIDIA GH200 Grace Hopper™ Superchip and which SoftBank plans to roll out at new, distributed AI data centers across Japan.
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Vtool appoints Incusolution to be its sales-channel partner in Korea (Thursday Jun. 01, 2023)
The new Vtool-Incusolution partnership will bring Vtool’s diversified offering to leading chipmakers in Korea, offering Vtool’s advanced verification and debugging tool Cogita-PRO, its RISC-V-based SoC framework Universa, and top-notch ASIC HW/SW services.
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Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future (Wednesday May. 31, 2023)
Tenstorrent and LG Electronics Inc. (LG) are pleased to announce that they are collaborating to build a new generation of RISC-V, AI, and video codec chiplets to potentially power LG's premium TV and automotive products of the future and Tenstorrent's data center products.
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Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions (Tuesday May. 30, 2023)
Cadence today announced it has continued to expand its collaboration with Arm to advance mobile device silicon success, providing customers with a faster path to tapeout through use of Cadence® digital and verification tools and the new Arm® Total Compute Solutions 2023 (TCS23), which includes the Arm Cortex®-X4, Arm Cortex-A720 and Cortex-A520 CPUs and Immortalis™-G720, Mali™-G720 and Mali-G620 GPUs.
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Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Nodes (Monday May. 29, 2023)
Synopsys Leading EDA and IP Solutions Combined with Arm Total Compute Solutions Help Ecosystem Tackle Multi-Die System Challenges
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Apple announces multibillion-dollar deal with Broadcom for components made in the USA (Wednesday May. 24, 2023)
Today Apple announced a new multiyear, multibillion-dollar agreement with Broadcom, a leading U.S. technology and advanced manufacturing company.
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BrainChip and CVEDIA Team to Advance State-of-the-Art Edge AI and Neuromorphic Computing (Wednesday May. 24, 2023)
BrainChip, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, and CVEDIA, a leading provider of AI-based video analytics solutions, have entered into a partnership to advance the state-of-the-art in Edge AI and neuromorphic computing.
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Fabless Semiconductor Innovator Stathera Announces US $15M Series A Funding Round (Monday May. 22, 2023)
Stathera Inc., a leading provider of MEMS (Micro-electromechanical Systems) timing solutions, announced today that the company has raised $15 Million in a Series A funding round.
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CEVA and proteanTecs Announce Partnership to Optimize Reliability and Power of Complex SoCs (Monday May. 22, 2023)
proteanTecs and CEVA have announced a partnership to enhance the reliability and power/performance of advanced chips by combining CEVA’s leading IP platforms with proteanTecs’ deep data analytics.
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Axelera AI Raises $50M to Democratize Edge AI (Monday May. 22, 2023)
Axelera AI, the provider of world’s most powerful and advanced solutions for AI at the Edge, announces new investors who have joined their oversubscribed Series A round, bringing the total amount raised to $50 million.
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Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers (Wednesday May. 17, 2023)
Ansys announced today that it has entered into a definitive agreement to acquire Diakopto. A provider of differentiated EDA solutions to accelerate integrated circuit (IC) development, Diakopto focuses on helping resolve critical issues caused by layout parasitics.