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• Inside Secure protects Lufthansa Technik's inflight entertainment on passenger devices (Monday Dec. 11, 2017)
  Inside Secure and Lufthansa Technik announced they are working together to protect Android and iOS applications of Lufthansa Technik’s wireless IFE (Inflight Entertainment) »nice« brand systems.
  
  
• Kilopass Anti-Fuse NVM OTP IP Designed into Montage Technology Next Generation Set-Top Box Chips Targeting Emerging Market Environments (Wednesday Dec. 06, 2017)
  Kilopass Technology today announced that its high capacity OTP NVM is designed into Montage Technology Group Limited’s next generation set-top box chips, targeting emerging market environments with challenging operating conditions.
  
  
• Inomize is selected as Supply Chain Manager and to support the development of 3D camera and XR ASIC using TSMC 12nm FFC Technology (Tuesday Dec. 05, 2017)
  Inomize announced today that Inuitive, a developer of innovative technologies for augmented and virtual reality that improve user experiences for latest-generation mobile applications, had selected Inomize to support their new ASIC design program.
  
  
• Inside Secure delivers strong customer authentication for Visma Solutions (Thursday Nov. 30, 2017)
  Inside Secureannounces today that Visma Solutions, the leading Finnish software as a service (SaaS) provider,has chosen Inside Secure’s mobile strong authentication and payment authorization service for its Netvisor ID and other online services.
  
  
• Inside Secure Selected by Neopost to Protect Online Postage Transactions (Tuesday Nov. 28, 2017)
  Inside Secure announced today that its TLS software Toolkit has been selected by Neopost, a provider of hardware and software solutions to mailers and shippers of all sizes, for its full range of postage machines supplied to postal customers worldwide.
  
  
• Intrinsix Cryptographic IP Selected by DARPA for Use in Chips Program, Featuring RISC-V Security Processor (Monday Nov. 27, 2017)
  INTRINSIX announced that it's security and cryptographic subsystem IP has been selected by DARPA for implementation into the DARPA CHIPS program. Intrinsix will create a security chiplet based on their IP. The subsystem IP is also being used as a security solution for commercial applications such as the Internet-of-Things, smart sensors and other connected appliances.
  
  
• Cybertrust Japan Selects CryptoManager IoT Security Service from Rambus (Wednesday Nov. 22, 2017)
  Rambus today announced that Cybertrust Japan Co., Ltd, a subsidiary of SoftBank Technology Corp. (JPX First Section: 4726), has selected the Rambus CryptoManager IoT Security Service for their Cybertrust Secure IoT Platform®, a comprehensive IoT platform-as-a-service.
  
  
• Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing and Analyzing Molecular Data in Real Time (Tuesday Nov. 21, 2017)
  Nano Global, an Austin-based molecular data company, today announced that it is developing a chip using intellectual property (IP) from Arm, the world's leading semiconductor IP company. The technology will help redefine how global health challenges - from superbugs to infectious diseases, and cancer are conquered.
  
  
• Inuitive Adopts Synopsys' Embedded Vision Processor IP to Accelerate Computer Vision and Deep Learning Algorithms (Wednesday Nov. 15, 2017)
  Synopsys today announced that Inuitive selected Synopsys' DesignWare® EV62 Embedded Vision Processor IP for its production NU4000 system-on-chip (SoC), Inuitive's most advanced 3D imaging and vision SoC
  
  
• Andes Technology N9 CPU Designed in Customer's SoC Shipping in Home Smart Speaker Artificial Intelligence Device (Wednesday Nov. 15, 2017)
  Andes Technology today announced its N9 CPU IP is designed into a world-class Taiwan-based IC design house customer's SoC.
  
  
• UltraSoC selected by Microsemi for growing RISC-V product range (Tuesday Nov. 14, 2017)
  UltraSoC today announced that Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, has licensed UltraSoC’s universal analytics and embedded intelligence platform for use in an expanding range of Microsemi products based on the RISC-V open source processor architecture.
  
  
• Rambus Selects Codasip Studio for SDK Development of RISC-V Processor (Tuesday Nov. 14, 2017)
  Codasip today announced that Rambus selected Codasip Studio for developing its next-generation RISC-V security products. Codasip Studio provides fully automated generation of the Software Design Kit (SDK) for RISC-V processors.
  
  
• AMD Delivers Semi-Custom Graphics Chip For New Intel Processor (Wednesday Nov. 08, 2017)
  AMD today announced that it designed a semi-custom graphics processor unit (GPU) that will be integrated into a new Intel multi-chip processor package. The new product, designed by Intel, integrates an Intel® Core™ processor, semi-custom Radeon™ graphics chip, and second generation High Bandwidth Memory (HBM2) into a single package.
  
  
• Intellifusion Licenses ArterisIP FlexNoC Interconnect IP for Machine Learning and Visual Intelligence Systems-on-Chip (Tuesday Nov. 07, 2017)
  ArterisIP today announced that Shenzhen Intellifusion Technologies Co., Ltd., has licensed FlexNoC Interconnect IP for use in machine learning visual intelligence SoCs that will target both data center and embedded applications.
  
  
• True Circuits Signs Five Year PLL License with Tsinghua University in China (Tuesday Nov. 07, 2017)
  True Circuits announced today it has signed a five year license with China’s prestigious Tsinghua University in Beijing which enables students to employ high-quality, low-jitter Phase-Locked Loop (PLL) IP in semiconductor chips used for research and development.
  
  
• HiSilicon Selects Cadence Tensilica Vision P6 DSP for its Latest Kirin 970 Mobile Application Processor (Monday Nov. 06, 2017)
  Cadence today announced that HiSilicon, a global fabless semiconductor and IC design company, has selected the Cadence® Tensilica® Vision P6 DSP for its 10nm Kirin 970 mobile application processor, which debuted in Huawei’s new Mate 10 Series mobile phones.
  
  
• UltraSoC embedded analytics selected by ELVEES for video, security and safety applications across ARM and MIPS platforms (Thursday Nov. 02, 2017)
  UltraSoC today announced that ELVEES has licensed UltraSoC’s embedded analytics technology for use in its next-generation video processing offerings.
  
  
• Asic Land Co. Ltd Licenses Andes Technology Corp. N1337 with Single-Precision Floating-Point Unit for Voice Recognition Application (Thursday Nov. 02, 2017)
  Andes Technology today announced that Asic Land Co. Ltd, a leading Korean ASIC design services company, has designed the Andes N1337 CPU with single-precision floating-point unit (FPU) IP into a system on chip targeting voice recognition applications.
  
  
• Flex Logix to Provide Embedded FPGA IP to 'DesignShare' for SiFive Freedom Platform (Tuesday Oct. 31, 2017)
  SiFive and Flex Logix today announced they will partner to make Flex Logix EFLX® embedded FPGA available for the SiFive Freedom Platform as part of the DesignShare program.
  
  
• CEVA and LG Electronics Partner for Smart 3D Camera Solution (Tuesday Oct. 17, 2017)
  CEVA announced today a partnership with LG Electronics, a global leader in consumer electronics and appliances, to deliver a high-performance, low-cost smart 3D camera solution for consumer electronics and robotic applications.
  
  
• Montage Technology Licenses Allegro DVT's Latest Multi-Format Video Encoder IP for Next Generation Set-Top Box Chips (Tuesday Oct. 17, 2017)
  Allegro DVT, a leader in video compliance streams and video codec semiconductor IP solutions, announced today that Montage Technology, a leading fabless semiconductor provider for smart home entertainment and data center markets, has licensed Allegro DVT's AL-E100 multi-format H.264/AVC and H.265/HEVC encoder IP for integration into its next-generation set-top box (STB) products.
  
  
• Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform (Thursday Oct. 12, 2017)
  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Hiroshima University is using Cadence® technology in its development of a computer-aided diagnosis system for colorectal endoscopic images.
  
  
• Sandia National Laboratories Licenses Flex Logix's Embedded FPGA IP For Multiple Products (Tuesday Oct. 10, 2017)
  Addressing the growing industry need to use embedded FPGA technology to design chips and MCUs, Flex Logixä Technologies, Inc., announced today that Sandia National Laboratories has licensed its EFLX reconfigurable logic IP. As part of their licensing agreement, Flex Logix has delivered the Gen 2 EFLX-2.5K logic core in Sandia’s proprietary 180nm process for the development of multiple Sandia chip products for use in Sandia projects.
  
  
• DENSO Licenses NetSpeed IP for use in Advanced Automotive Platform SoCs (Wednesday Sep. 27, 2017)
  NetSpeed Systems Inc. announced today that DENSO Corporation, a leading global automotive supplier of advanced technology, systems and components, has licensed NetSpeed’s Orion on-chip network IP and Pegasus last-level cache for use in System-on-chip (SoCs) targeting Advanced Automotive Electronic Platforms including autonomous driving (ADAS, Autopilot) systems.
  
  
• Kilopass Technology Announces Design Win in Next Generation Nuvoton Embedded Controllers Targeting Desktop and Mobile computers (Wednesday Sep. 27, 2017)
  Kilopass today announced that Nuvoton Technology, a leading Embedded Controller provider, has licensed the Kilopass IP for a next generation designs targeting desktop and mobile computers.
  
  
• Pixelworks Licenses ArterisIP FlexNoC Interconnect IP Again for Advanced Video Processing SoCs (Tuesday Sep. 26, 2017)
  ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that Pixelworks has licensed Arteris FlexNoC interconnect IP for use as the backbone interconnect of its advanced video processing SoCs for projectors and other video displays.
  
  
• CCww's NB-IOT R13 Protocol-stack software is licensed by a leading IoT Chip developer (Monday Sep. 25, 2017)
  Communications Consultants Worldwide Ltd. (CCww), global innovator of 3GPP technologies has licensed its NB-IoT protocol-stack software to a leading Shanghai and Silicon Valley based developer of highly integrated and unique mixed-signal SoC solutions. This relationship, catalyzed by T2M, will enable the production of the highly integrated NB-IoT SoC chipset targeting IoT, Logistics, Smart metering, Health and Fitness markets.
  
  
• ArterisIP Ncore Cache Coherent Interconnect and Resilience Package Licensed by NXP (Tuesday Sep. 19, 2017)
  ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that NXP Semiconductors has licensed additional uses of Ncore Cache Coherent Interconnect IP and Ncore Resilience Packages.
  
  
• Nevion integrates TICO lightweight compression into its Virtuoso product line. (Friday Sep. 15, 2017)
  intoPIX welcomes Nevion, one of the world's leading providers of media transport solutions for broadcasters, amongst the rapidly increasing list of TICO-enabled equipment manufacturers and solution providers.
  
  
• Sencore adopts intoPIX JPEG2000 Ultra Low Latency technology (Thursday Sep. 14, 2017)
  intoPIX, a leading provider of innovative compression technology, today announces that Sencore has adopted intoPIX JPEG2000 Ultra Low Latency technology for their new line of SDI2X products.