Foundries News

• SMIC IP R&D Center Applies EDA Solution of Beijing Empyrean (Friday Oct. 04, 2013)
  SMIC and Empyrean today jointly announced that SMIC's IP R&D center adopted Aeolus, a high-performance paralleled circuit simulation tool, along with other customized tools from Empyrean.
  
  
• SMIC Introduces Its Diversifying Embedded Non-Volatile Memory Platform (Monday Sep. 23, 2013)
  SMIC's eNVM platform includes eEEPROM (embedded Electrically Erasable Programmable Read-Only Memory), eFlash (embedded Flash memory), MTP (Multi-Time Programmable), and OTP (One-Time Programmable) at both 0.18µm and 0.13µm technology nodes, along with 55nm eFlash process with target readiness by 2Q14.
  
  
• TSMC and OIP Ecosystem Partners Deliver 16FinFET and 3D IC Reference Flows (Tuesday Sep. 17, 2013)
  TSMC today released three silicon-validated Reference Flows within the Open Innovation Platform® (OIP) that enable 16FinFET systems-on-chip (SoC) designs and 3D chip stacking packages.
  
  
• Soitec licencing to TSMC its IP portfolio related to back-side illumination technology for image sensors (Tuesday Sep. 10, 2013)
  Soitec has licensed some of its intellectual property (IP) portfolio related to back-side illumination (BSI) technology for image sensors to TSMC
  
  
• SMIC's 2013 Technology Symposiums Kicks Off in Shanghai (Wednesday Sep. 04, 2013)
  SMIC kicked off its 13th technology symposium series in Shanghai today. The theme of this year's series is "Advanced and Value-added Technology Platforms for Your Vision."
  
  
• Imagination and TSMC partner to drive industry-leading performance on GPUs (Thursday Aug. 29, 2013)
  Imagination Technologies announced today that it is working together with TSMC to drive next-generation performance to new levels on Imagination’s industry-leading PowerVR GPUs.
  
  
• AltoBeam and UMC Successfully Demonstrate DVB-T2/T/C/S2/S Demodulator (Monday Jul. 29, 2013)
  AltoBeam and UMC today announced the release of AltoBeam’s DVB-T2/T/C/S2/S demodulator to target DTV markets that have adopted these standards.
  
  
• UMC and SuVolta Announce Joint Development of 28nm Low-Power Process Technology (Tuesday Jul. 23, 2013)
  UMC and SuVolta, Inc., today announced joint technology development of a 28nm process that integrates SuVolta’s Deeply Depleted Channel™ (DDC) transistor technology into UMC's 28nm High-K Metal Gate (HKMG) high-performance mobile (HPM) process.
  
  
• Altis Semiconductor Introduces an Innovative Secure Product (Thursday Jul. 04, 2013)
  Altis is announcing a new product using state-of-the-art cryptology and technologies to address security and performances for mobile and connected devices.
  
  
• Rockchip Launches New Tablet SoCs on GLOBALFOUNDRIES' 28nm HKMG Process Technology (Tuesday Jun. 18, 2013)
  GLOBALFOUNDRIES and Fuzhou Rockchip Electronics Co., Ltd. today announced that Rockchip’s next-generation mobile processors are ramping to production on GLOBALFOUNDRIES’ 28nm High-K Metal Gate (HKMG) process technology.
  
  
• UMC joins IBM chip alliance for 10nm process development (Thursday Jun. 13, 2013)
  IBM and UMC today announced that UMC will join the IBM Technology Development Alliances as a participant in the group’s development of 10nm CMOS process technology.
  
  
• ARM and GLOBALFOUNDRIES to Optimize Next-Generation ARM Mobile Processors for 28nm-SLP Process Technology (Monday Jun. 03, 2013)
  In conjunction with the launch of the ARM® Cortex®-A12 processor, ARM and GLOBALFOUNDRIES today announced new power, performance and cost-optimized POP™ technology offerings for the ARM Cortex-A12 and Cortex-A7 processors for GLOBALFOUNDRIES 28nm-SLP High-K Metal Gate (HKMG) process technology.
  
  
• GLOBALFOUNDRIES Accelerates Adoption of 20nm-LPM and 14nm-XM FinFET Processes with Comprehensive Production-Ready Design Flows (Friday May. 31, 2013)
  
  
  
• UMC Establishes its Specialty Technology Center of Excellence in Singapore (Wednesday May. 22, 2013)
  
  
  
• Imec and GLOBALFOUNDRIES collaborate to advance high-density memory technolog (Tuesday May. 21, 2013)
  Imec and GLOBALFOUNDRIES announced today that they have expanded joint development efforts to advance STT-MRAM (spin-transfer torque magnetoresistive random access memory) technology.
  
  
• Samsung Announces Industry-First 45 nanometer Embedded Flash Logic Process Development (Tuesday May. 21, 2013)
  Samsung Electronics announced the industry's first 45nm embedded flash ("eFlash") logic process development. Samsung successfully implemented the new process into the smart card test chip, which means that this process technology fulfills the stringent quality requirements of the security solution market and can be successfully deployed on a commercial scale.
  
  
• Infineon and GLOBALFOUNDRIES Announce Joint Development and Production Collaboration for 40nm Embedded Flash Process Technology (Monday Apr. 29, 2013)
  Infineon and GLOBALFOUNDRIES today announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology. The cooperation will focus on technology development based on Infineon’s eFlash cell design and manufacturing of automotive and security microcontrollers (MCUs) with 40nm process structures.
  
  
• GLOBALFOUNDRIES Demonstrates 3D TSV Capabilities on 20nm Technology (Tuesday Apr. 02, 2013)
  At its Fab 8 campus in Saratoga County, N.Y., GLOBALFOUNDRIES has demonstrated its first functional 20nm silicon wafers with integrated Through-Silicon Vias (TSVs).
  
  
• Altis Semiconductor Introduces the Next Generation of Embedded CBRAM Technology (Tuesday Apr. 02, 2013)
  Altis announced today the next generation of embedded CBRAM (eCBRAM) technology, a new platform available for demonstration in Q2 2013. eCBRAM technology was developed through Altis’ partnership with Adesto Technologies and will enhance the Altis eNVM (embedded non-volatile memory) foundry service portfolio, today based on 130nm CMOS technologies.
  
  
• ALTIS Semiconductor Selected as Long Term Foundry Partner for IBM Microelectronics SOI Technology (Friday Mar. 15, 2013)
  ALTIS Semiconductor announced today the finalization of a foundry agreement with IBM Microelectronics. Under the terms of this agreement, ALTIS will be the foundry partner for the IBM 180nm SOI technology.
  
  
• TSMC February 2013 Sales Report (Friday Mar. 08, 2013)
  TSMC today announced its net sales for February 2013: On a consolidated basis, net sales for February 2013 were approximately NT$41.18 billion, a decrease of 13.2 percent from January 2013 and an increase of 21.5 percent over February 2012.
  
  
• UMC Reports Sales for February 2013 (Friday Mar. 08, 2013)
  UMC today reported unaudited net sales for the month of February 2013.
  
  
• Spansion and UMC Announce Joint Technology Development and Licensing Agreement (Monday Mar. 04, 2013)
  Spansion and UMC today announced the joint development of a 40nm process that integrates UMC’s 40nm LP logic process with Spansion® proprietary embedded Charge Trap (eCT) Flash memory technology.
  
  
• GLOBALFOUNDRIES Offers Enhanced 55nm CMOS Logic Process with ARM Next-Generation Memory and Logic IP Support for Low Voltage (Wednesday Feb. 20, 2013)
  GLOBALFOUNDRIES today announced additional enhancements to the foundry’s 55-nanometer (nm) Low-Power Enhanced (LPe) process technology platform – 55nm LPe 1V – with qualified, next-generation memory and logic IP solutions from ARM.
  
  
• TSMC January 2013 Sales Report (Friday Feb. 08, 2013)
  TSMC today announced its net sales for January 2013: On a consolidated basis, net sales for January 2013 were approximately NT$47.44 billion, an increase of 27.7 percent from December 2012 and an increase of 37.1 percent over January 2012.
  
  
• UMC Reports Sales for January 2013 (Friday Feb. 08, 2013)
  UMC today reported unaudited net sales for the month of January 2013.
  
  
• GLOBALFOUNDRIES and Cyclos Semiconductor Partner to Develop High-Performance, Low-Power ARM Cortex-A15 Processors Using Resonant Clock Mesh Technology (Tuesday Feb. 05, 2013)
  GLOBALFOUNDRIES and Cyclos Semiconductor announced plans to implement Cyclos’ low-power semiconductor intellectual property in ARM® CortexTM-A15 processors using 28nm High-K Metal Gate (HKMG) process technology from GLOBALFOUNDRIES.
  
  
• GLOBALFOUNDRIES To Offer Adapteva's Processor IP For 28nm SoC Designs (Tuesday Feb. 05, 2013)
  At today’s Common Platform Technology Forum, GLOBALFOUNDRIES announced a partnership with Adapteva to offer the company’s Epiphany IV microarchitecture to customers using GLOBALFOUNDRIES’ leading-edge 28nm-SLP process technology.
  
  
• STATS ChipPAC and UMC Unveil World's First 3D IC Developed under an Open Ecosystem Model (Tuesday Jan. 29, 2013)
  STATS ChipPAC and UMC today announced the world’s first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.
  
  
• Faraday and UMC Deliver 300 Million Gate 40nm Customer SoC (Tuesday Jan. 22, 2013)
  Faraday and UMC today announced that they have produced customer SoC ICs with a density of over 300 million gates. The successful fabrication of the communication infrastructure ICs demonstrates the two companies’ ability to deliver highly complex SoCs for third-party customers with lower development risk, design effort, and overall time-to-market.