Foundries News

• TSMC Reports Fourth Quarter EPS of NT$1.61 (Thursday Jan. 17, 2013)
  TSMC today announced consolidated revenue of NT$131.31 billion, net income of NT$41.57 billion, and diluted earnings per share of NT$1.61 (US$0.28 per ADR unit) for the fourth quarter ended December 31, 2012.
  
  
• UMC Introduces Thick Plated Copper Process for Monolithic PMIC Applications (Tuesday Jan. 15, 2013)
  The TPC solution, developed with Taiwan-based packaging house Chipbond Technology Corp. (6147, TWO), provides thick plated copper layers to achieve higher current flow and better thermal dissipation, reducing chip resistance by 20% or more compared with conventional Aluminum top metal, thus increasing power conversion efficiency and extending battery life.
  
  
• TSMC December 2012 Sales Report (Thursday Jan. 10, 2013)
  TSMC today announced its net sales for December 2012: On an unconsolidated basis, net sales were approximately NT$36.56 billion, a decrease of 16.2 percent from November 2012 and an increase of 19.6 percent over December 2011.
  
  
• Nitero Demonstrates High-Speed 60GHz Wi-Fi Solution on GLOBALFOUNDRIES' 65nm-LPe RF Technology (Thursday Jan. 10, 2013)
  Nitero demonstrated its innovative 60GHz Wi-Fi solution manufactured on GLOBALFOUNDRIES' 65 nanometer (nm) Low Power Enhanced (LPe) RF platform optimized for mobile SoC applications.
  
  
• GLOBALFOUNDRIES To Build R&D Facility in New York to Accelerate Advanced Manufacturing Technologies for Global Customers (Wednesday Jan. 09, 2013)
  GLOBALFOUNDRIES today announced plans to build a multi-billion dollar R&D facility at its Fab 8 campus in Saratoga County, N.Y. The new Technology Development Center (TDC) is expected to play a key role in the company's strategy to develop innovative semiconductor solutions allowing customers to compete at the leading edge of technology.
  
  
• UMC Reports Sales for December 2012 (Tuesday Jan. 08, 2013)
  UMC today reported unaudited net sales for the month of December 2012.
  
  
• SMIC Achieves Breakthrough in Backside-Illuminated Image Sensors (Thursday Dec. 20, 2012)
  SMIC today announced a breakthrough in its development of backside-illuminated (BSI) CMOS image sensor (CIS) technology, with the first test chip demonstrating good image quality even in low-light conditions.
  
  
• UMC Achieves Foundry's First 55nm SDDI Customer Product Tape-out (Tuesday Dec. 18, 2012)
  UMC today announced that it has taped out the foundry industry’s first customer product utilizing 55nm small display driver IC (SDDI) process technology.
  
  
• TSMC November 2012 Sales Report (Tuesday Dec. 11, 2012)
  TSMC today announced its net sales for November 2012: On an unconsolidated basis, net sales were approximately NT$43.64 billion, a decrease of 11.4 percent over October 2012 and an increase of 23.9 percent over November 2011.
  
  
• UMC Reports Sales for November 2012 (Friday Dec. 07, 2012)
  UMC today reported unaudited net sales for the month of November 2012.
  
  
• UMC Unveils 80nm SDDI Foundry Process Featuring the Industry's Most Competitive SRAM Bitcell (Wednesday Nov. 21, 2012)
  UMC today introduced an 80nm SDDI (Small-panel Display Driver IC) foundry process with the most competitive SDDI SRAM bitcell in the foundry industry.
  
  
• UMC Restructures Executive Team (Monday Nov. 19, 2012)
  UMC announced that its board of directors today appointed senior vice president Mr. Po-Wen Yen as the company’s new CEO, effective immediately.
  
  
• TSMC October 2012 Sales Report (Friday Nov. 09, 2012)
  TSMC today announced its net sales for October 2012: On an unconsolidated basis, net sales were approximately NT$49.28 billion, an increase of 15.1 percent over September 2012 and an increase of 32.3 percent over October 2011.
  
  
• UMC Reports Sales for October 2012 (Thursday Nov. 08, 2012)
  UMC today reported unaudited net sales for the month of October 2012.
  
  
• X-FAB and Anvo-Systems Dresden Cooperate to Provide High-Speed Non-Volatile Memory Solutions (Tuesday Nov. 06, 2012)
  X-FAB Silicon Foundries and Anvo-Systems Dresden today announced a cooperative agreement to offer high-speed non-volatile memory solutions that combine SRAM, DRAM and SONOS FLASH technologies; the compact design results in a small silicon footprint that keeps device costs low.
  
  
• SMIC Reports 2012 Third Quarter Results (Monday Nov. 05, 2012)
  SMIC today announced its consolidated results of operations for the three months ended September 30, 2012. Quarterly revenue hit a record high of $461.2 million in 3Q12, which was up by 9.3% from $421.8 million in 2Q12 and grew by 50.3% year over year.
  
  
• TSMC Reports Third Quarter EPS of NT$1.90 (Thursday Oct. 25, 2012)
  TSMC today announced consolidated revenue of NT$141.38 billion, net income of NT$49.30 billion, and diluted earnings per share of NT$1.90 (US$0.32 per ADR unit) for the third quarter ended September 30, 2012.
  
  
• UMC Qualifies Foundry's First True 12V eFlash Solution (Friday Oct. 19, 2012)
  UMC today announced that it has qualified the foundry industry's first high voltage (HV) embedded flash (eFlash) process that incorporates a true 12-volt solution.
  
  
• TSMC Tapes Out Foundry's First CoWoS Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface (Friday Oct. 12, 2012)
  TSMC today announced that it has taped out the foundry segment’s first CoWoS™ (Chip on Wafer on Substrate) test vehicle using JEDEC Solid State Technology Association’s Wide I/O mobile DRAM interface.
  
  
• Silterra Released 180nm Embedded Flash Technology for Mass Production (Friday Oct. 12, 2012)
  SilTerra officially announced the production release of 0.18-micron embedded Flash technology, dubbed C18E. SilTerra has licensed SuperFlash © technology from Silicon Storage Technology Inc (SST)
  
  
• TSMC 20nm and CoWoS Design Infrastructure Ready (Tuesday Oct. 09, 2012)
  TSMC announced today that the readiness of 20nm and CoWoS™ design support within the Open Innovation Platform® (OIP) is demonstrated by the delivery of two foundry-first reference flows supporting 20nm and CoWoS™ (Chip on Wafer on Subsrate) technologies.
  
  
• TSMC September 2012 Sales Report (Tuesday Oct. 09, 2012)
  TSMC today announced its net sales for September 2012: On an unconsolidated basis, net sales were approximately NT$42.82 billion, a decrease of 12.4 percent over August 2012 and an increase of 30.3 percent over September 2011.
  
  
• UMC Reports Sales for September 2012 (Tuesday Oct. 09, 2012)
  UMC today reported unaudited net sales for the month of September 2012
  
  
• Sand 9 Partners with GLOBALFOUNDRIES as High-Volume Foundry for MEMS Timing Products (Wednesday Oct. 03, 2012)
  Sand 9, Inc., a pioneer in precision MEMS timing products for wireless and wired applications, today announced that it has partnered with GLOBALFOUNDRIES to support high-volume manufacturing for Sand 9 products.
  
  
• Samsung and STMicroelectronics Enter Strategic Relationship for Advanced Foundry Services at 32/28nm Technology (Friday Sep. 28, 2012)
  STMicroelectronics has selected Samsung's foundry business unit for the production of ICs using a 32/28-nm high-K metal gate manufacturing process.
  
  
• X-FAB to Invest More than $50M in MEMS Operations (Wednesday Sep. 26, 2012)
  -FAB Silicon Foundries today announced it will invest more than $50M during the next three years in cleanroom space, new equipment, R&D and staff for its MEMS operations. These investments reflect X-FAB’s significant focus on MEMS to support the expected growth in MEMS services.
  
  
• GLOBALFOUNDRIES Unveils FinFET Transistor Architecture Optimized for Next-Generation Mobile Devices (Thursday Sep. 20, 2012)
  GLOBALFOUNDRIES today accelerated its leading-edge roadmap with the launch of a new technology designed for the expanding mobile market. The company’s 14nm-XM offering will give customers the performance and power benefits of three-dimensional “FinFET” transistors with less risk and a faster time-to-market.
  
  
• SMIC Unveils 0.13um-1.2V Low-Power Embedded EEPROM Platform (Wednesday Sep. 19, 2012)
  SMIC today announced the availability of its 1.2-volt Low-Power Embedded EEPROM Platform, which is fully compatible with its 0.13-micron (um) low-leakage (LL) process.
  
  
• LFoundry launches several technology enhancement projects in R&D and innovations (Monday Sep. 17, 2012)
  Thanks to the materialization of several large-scale projects, LFoundry plans to invest a total EUR 25 million in R&D and innovation projects over the next three years.
  
  
• X-FAB Goes 3D (Wednesday Sep. 12, 2012)
  X-FAB Silicon Foundries today announced the industry’s first open-platform MEMS 3D inertial sensor process available directly from a high-volume pure-play foundry.