Foundries News

• UMC Reports Sales for December 2011 (Monday Jan. 09, 2012)
  UMC today reported unaudited net sales for the month of December 2011.
  
  
• UMC Pushes 8" Manufacturing Limit with A+ Technology Solution (Friday Dec. 30, 2011)
  UMC today announced its A+ technology platform, a specialized 0.11um aluminum process manufactured in UMC’s 8” fabs.
  
  
• SMIC Receives Supplier Award from Qualcomm (Wednesday Dec. 14, 2011)
  SMIC today announced its receipt of a 1 billion unit product milestone award from customer Qualcomm Incorporated in a ceremony held at SMIC's Shanghai headquarters.
  
  
• Crocus and SMIC Sign Technology Development and Wafer Manufacturing Agreements (Monday Dec. 12, 2011)
  Crocus Technology and SMIC today announced the formal signing of joint technology development and wafer manufacturing agreements. Under the agreements, the two companies will jointly develop high-temperature Magnetic Logic Unit™ (MLU) technology targeted at automotive applications.
  
  
• TSMC Expands Investment in Taiwan with New Milestone for Taichung GigaFab (Friday Dec. 09, 2011)
  TSMC today held a groundbreaking ceremony in Taichung’s Central Taiwan Science Park for Phase 3 of its Fab 15 GigaFab, setting a new milestone for the company’s commitment towards continued investment in Taiwan.
  
  
• TSMC November 2011 Sales Report (Friday Dec. 09, 2011)
  TSMC today announced its net sales for November 2011: On an unconsolidated basis, net sales were approximately NT$35.22 billion, a decrease of 5.4 percent over October 2011 and a decrease of 1.4 percent over November 2010.
  
  
• TowerJazz Signs MOU for Process Transfers and Projects in India and Brazil, Targeting India's Emerging Semiconductor Market (Thursday Nov. 17, 2011)
  TowerJazz announced today it has signed a non-exclusive MOU with a European entity to seek process transfer opportunities and projects in India and Brazil.
  
  
• TSMC October 2011 Sales Report (Thursday Nov. 10, 2011)
  TSMC today announced its net sales for October 2011: On an unconsolidated basis, net sales were approximately NT$37.25 billion, an increase of 13.3 percent over September 2011 and a decrease of 0.3 percent over October 2010.
  
  
• MagnaChip to Offer Cost Competitive Compact Standard Cell Library for Low Power Applications (Tuesday Nov. 08, 2011)
  MagnaChip Semiconductor today announced that it now offers cost competitive compact standard cell libraries targeting low power applications in 0.18um and 0.35um technologies.
  
  
• X-FAB Extends 0.18 Micrometer Technology Platform to Address Energy Efficiency Applications (Tuesday Nov. 01, 2011)
  X-FAB Silicon Foundries today announced the new technology platform XP018, its latest foundry process with the industry’s lowest mask count for the modular combination of digital, analog and high-voltage features with embedded Flash
  
  
• AppliedMicro Selects TSMC as Manufacturing Partner for ARM 64-bit SoCs On Advanced 40nm and 28nm Process Technology (Friday Oct. 28, 2011)
  AppliedMicro, today announced it has selected TSMC as its manufacturing partner to develop 64-bit ARM architecture Systems-on-Chip (SoCs) on 40nanometer (nm) and 28nm process technology.
  
  
• TSMC Reports Third Quarter EPS of NT$1.17 (Thursday Oct. 27, 2011)
  TSMC today announced consolidated revenue of NT$106.48 billion, net income of NT$30.40 billion, and diluted earnings per share of NT$1.17 (US$0.20 per ADR unit) for the third quarter ended September 30, 2011.
  
  
• TSMC 28nm Technology in Volume Production (Monday Oct. 24, 2011)
  TSMC today announced that its 28nm process is in volume production and production wafers have been shipped to customers. TSMC leads the foundry segment to achieve volume production at 28nm node.
  
  
• TSMC September 2011 Sales Report (Friday Oct. 07, 2011)
  TSMC today announced its net sales for September 2011: On an unconsolidated basis, net sales were approximately NT$32.86 billion, a decrease of 11.3 percent over August 2011 and a decrease of 10.3 percent over September 2010.
  
  
• UMC Delivers Foundry Industry's Most Compact MTP IP Solution (Tuesday Sep. 13, 2011)
  UMC today announced the successful completion of a joint development project with Yield Microelectronics Corporation (YMC) to deliver the foundry industry's most compact multiple-time programmable (MTP) non-volatile memory (NVM) intellectual property (IP) solution.
  
  
• GLOBALFOUNDRIES Offers BCDlite Technology Process for Applications in the Automotive Industry (Tuesday Sep. 13, 2011)
  GLOBALFOUNDRIES today announced it is offering its BCDlite™ foundry technology optimized for automotive applications such as power management devices, audio amplifiers, displays and LED driver integrated circuits (ICs).
  
  
• TSMC August 2011 Sales Report (Monday Sep. 12, 2011)
  TSMC today announced its net sales for August 2011: On an unconsolidated basis, net sales were approximately NT$37.04 billion, an increase of 6.1 percent over July 2011 and an increase of 1.5 percent over August 2010.
  
  
• GLOBALFOUNDRIES and Samsung Extend Fab Sync to New High-Performance 28nm Technology for Mobile Applications (Tuesday Aug. 30, 2011)
  GLOBALFOUNDRIES and Samsung Electronics, Co., Ltd. broadened their collaboration, announcing plans to synchronize global semiconductor fabrication facilities to produce chips based on a new high-performance and low-leakage 28nm High-K Metal Gate (HKMG) technology.
  
  
• UMC Delivers High Endurance, Variable Voltage Range Embedded EEPROM Solution (Tuesday Aug. 30, 2011)
  UMC has achieved breakthroughs in its development of embedded electrically erasable programmable read-only memory (eEEPROM) solutions, delivering an I/O voltage range of 1.8V-5V and endurance at 1 million program erase cycles.
  
  
• GLOBALFOUNDRIES and Amkor to Collaborate on Advanced Assembly and Test Solutions (Tuesday Aug. 30, 2011)
  GLOBALFOUNDRIES and Amkor today announced that they have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes.
  
  
• GLOBALFOUNDRIES Announces Design Enablement Support for 20nm Design Flows from Leading EDA Vendors (Tuesday Aug. 30, 2011)
  By successfully taping out a test chip using flows from leading EDA vendors Cadence Design Systems, Magma Design Automation, Mentor Graphics Corporation, and Synopsys Inc., GLOBALFOUNDRIES has demonstrated that it is ready for customers to begin evaluating their 20nm designs.
  
  
• SMIC Reports 2011 Second Quarter Results (Wednesday Aug. 10, 2011)
  SMIC today announced its consolidated results of operations for the three months ended June 30, 2011. Revenue down by 4.9% to $352.4 million in 2Q11 from $370.6 million in 1Q11 and down by 5.9% compared to 2Q10.
  
  
• TSMC July 2011 Sales Report (Wednesday Aug. 10, 2011)
  TSMC today announced its net sales for July 2011: On an unconsolidated basis, net sales were approximately NT$34.92 billion, a decrease of 2.1 percent over June 2011 and a decrease of 3.4 percent over July 2010
  
  
• TowerJazz Qualifies 0.13um SiGe Process at Its Israeli Fab; Technology Successfully Transferred from Its US Facility (Wednesday Aug. 03, 2011)
  TowerJazz today announced its 0.13um SiGe technology (SBL13) has been successfully transferred to its Migdal Haemek (MH), Israel fab from its Newport Beach, CA facility.
  
  
• TowerJazz Israel and Ramon Chips Deliver Advanced, Second Generation Radiation-Hardened Processor for Space Applications (Monday Aug. 01, 2011)
  TowerJazz and Ramon Chips announced today the successful completion of a second generation radiation-hardened (rad-hard) processor for space applications (GR712RC). The part is being fabricated exclusively in TowerJazz’s Fab2 in Migdal Haemek, Israel utilizing its internal 0.18-micron CMOS process technology.
  
  
• TSMC Reports Second Quarter EPS of NT$1.39 (Thursday Jul. 28, 2011)
  TSMC today announced consolidated revenue of NT$110.51 billion, net income of NT$35.95 billion, and diluted earnings per share of NT$1.39 (US$0.24 per ADR unit) for the second quarter ended June 30, 2011.
  
  
• Cypress and UMC Deliver ICs on New 65-Nanometer SONOS Embedded Flash Technology (Wednesday Jul. 27, 2011)
  Cypress and UMC today announced that they have produced working silicon on a new, 65-nanometer SONOS (Silicon Oxide Nitride Oxide Silicon) technology for embedded Flash memory
  
  
• SMIC: Appointment of Chairman, Redesignation of Director and Independent Non-Executive Director, Resignation of CEO, Appointment of Acting CEO, Resumption of Trading (Friday Jul. 15, 2011)
  SMIC: Appointment of Chairman, Redesignation of Director and Independent Non-Executive Director, Resignation of Chief Executive Officer, Appointment of Acting Chief Executive Officer and Authorised Representative, Clarification Announcement, Resumption of Trading
  
  
• GLOBALFOUNDRIES Fabs in New York and Dresden Achieve "Ready for Equipment" Milestone (Tuesday Jul. 12, 2011)
  Just over one year after revealing plans for a major global capacity expansion, GLOBALFOUNDRIES today announced its newly constructed cleanrooms in New York and Dresden are ready for the installation of 300mm semiconductor wafer fabrication equipment.
  
  
• Samsung, in Collaboration with Physical IP and Design Enablement Partners, Confirms 20nm Design Infrastructure with Test Chip Tape-out (Tuesday Jul. 12, 2011)
  Samsung Foundry’s 20nm early access process design kit (PDK) is currently available to those customers who are in the initial stages of designing their next-generation products.