Foundries News

• TSMC June 2011 Sales Report (Friday Jul. 08, 2011)
  TSMC today announced its net sales for June 2011: On an unconsolidated basis, net sales were approximately NT$35.65 billion, a decrease of 0.9 percent over May 2011 and an increase of 1.5 percent over June 2010.
  
  
• X-FAB Adds eFlash to High-Voltage 0.18 Micrometer Foundry Offering (Tuesday Jul. 05, 2011)
  X-FAB Silicon Foundries today enhanced its XH018 0.18 micrometer high-voltage process with a highly reliable new embedded Flash solution.
  
  
• Brite Semiconductor Achieves First-Pass Silicon Success with SMIC's 40nm Process (Tuesday Jun. 21, 2011)
  Brite Semiconductor and SMIC today announced that they have achieved first-pass silicon success with Brite's first 40nm chip, using SMIC's 40nm process technology.
  
  
• ATIC and GLOBALFOUNDRIES announce new leadership to drive continued investment through 2012 (Thursday Jun. 16, 2011)
  As part of a plan to continue significant investments in technology, talent and manufacturing capacity over the next 18 months, the board of directors of GLOBALFOUNDRIES announced today it has appointed new leadership to run the company.
  
  
• TSMC May 2011 Sales Report (Friday Jun. 10, 2011)
  TSMC today announced its net sales for May 2011: On an unconsolidated basis, net sales were approximately NT$35.96 billion, a decrease of 0.7 percent over April 2011 and an increase of 6.3 percent over May 2010.
  
  
• Samsung Qualifies 28nm LP Process Technology for High Performance Mobile Applications (Tuesday Jun. 07, 2011)
  Samsung Electronics, Co., Ltd. today announced that its foundry business, Samsung Foundry, has qualified 28nm low-power (LP) process with High-k Metal Gate (HKMG)* technology and is ready for risk production.
  
  
• Elpida, PTI, and UMC Partner on 3D IC Integration Development For Advanced Technologies Including 28nm (Tuesday May. 31, 2011)
  Elpida, PTI, and UMC, today announced that they have finalized the 3-way tie-up to deliver 3DIC integration technologies for advanced processes including 28-nm. UMC and PTI engineers have already been working with Elpida on joint development of TSV products at Elpida's Hiroshima Plant.
  
  
• TowerJazz Announces New Design Center Partnership Incentive Program (Tuesday May. 31, 2011)
  TowerJazz today announced its “Design Star Awards Program,” a new design center partnership incentive program offered to independent design centers. The program will encourage design centers that enroll in this program to refer new customers and new products to TowerJazz.
  
  
• TSMC Completes 28nm Design Infrastructure, Design Partners Show Solutions at DAC (Thursday May. 26, 2011)
  TSMC announced today that 28nm support within the Open Innovation Platform™ (OIP) design infrastructure is fully delivered, as demonstrated by 89 new 28nm designs scheduled to tapeout.
  
  
• SMIC Reports 2011 First Quarter Results (Thursday May. 19, 2011)
  SMIC today announced its consolidated results of operations for the three months ended March 31, 2011. Revenue down by 9.3% to $370.6 million in 1Q11 from $408.6 million in 4Q10 and up by 7.2% compared to 1Q10.
  
  
• Spansion and SMIC Expand Foundry Agreement (Monday May. 16, 2011)
  Spansion and SMIC today announced they will extend their current foundry arrangement to expand 65nm capacity and include the manufacture of Spansion's 45nm Flash memory.
  
  
• SMIC and Hubei Science & Technology Investment Group Sign Joint Venture Agreement in Wuhan (Thursday May. 12, 2011)
  SMIC and Hubei Science & Technology Investment Group today announced the formal signing of a joint venture agreement to invest in and manage Wuhan Xinxin Semiconductor Manufacturing Corporation's 12-inch wafer production line.
  
  
• TSMC April 2011 Sales Report (Tuesday May. 10, 2011)
  TSMC today announced its net sales for April 2011: On an unconsolidated basis, net sales were approximately NT$36.23 billion, a decrease of 0.4 percent over March 2011 and an increase of 10.9 percent over April 2010.
  
  
• TSMC Reports First Quarter EPS of NT$1.40 (Friday Apr. 29, 2011)
  TSMC today announced consolidated revenue of NT$105.38 billion, net income of NT$36.28 billion, and diluted earnings per share of NT$1.40 (US$0.24 per ADR unit) for the first quarter ended March 31, 2011.
  
  
• SMIC to Receive Investment from CIC (Tuesday Apr. 19, 2011)
  SMIC announced today a definitive investment agreement between SMIC and China Investment Corporation (CIC). Under the terms of the agreement, CIC will invest US$250 million in SMIC, acquiring 360,589,053 convertible preferred shares at HK$5.39 per convertible preferred share.
  
  
• TSMC March 2011 Sales Report (Monday Apr. 11, 2011)
  TSMC today announced its net sales for March 2011: On an unconsolidated basis, net sales were approximately NT$36.37 billion, an increase of 14.5 percent over February 2011 and an increase of 18 percent over March 2010.
  
  
• TSMC rolls smartphone/tablet process (Wednesday Apr. 06, 2011)
  During the TSMC 2011 Technology Symposium, TSMC rolled out what could be the industry’s first manufacturing process optimized for chips used in smartphones and tablets.
  
  
• TowerJazz Expected to Nearly Double Production Capacity with Proposed Acquisition of Micron Technology Wafer Manufacturing Plant in Japan (Monday Apr. 04, 2011)
  TowerJazz announced today it has signed a non-binding term sheet contemplating its purchase of Micron Technology’s fabrication facility in Nishiwaki City, Hyogo, Japan.
  
  
• GLOBALFOUNDRIES enters a broad strategic partnership with imec (Monday Apr. 04, 2011)
  GLOBALFOUNDRIES has signed a strategic long-term partnership on sub-22nm CMOS scaling and GaN-on-Si technology with the nanoelectronics R&D center imec.
  
  
• SMIC Announces 2010 Annual Results (Thursday Mar. 31, 2011)
  SMIC announces the audited consolidated results of the Company and its subsidiaries for the year ended December 31, 2010. Sales increased by 45.3% from US$1,070.4 million for 2009 to US$1,554.8 million for 2010, primarily due to an increase in overall wafer shipment.
  
  
• SMIC Clarification Announcement (Wednesday Mar. 16, 2011)
  Semiconductor Manufacturing International Corporation today released the following statement:
  
  
• TSMC February 2011 Sales Report (Thursday Mar. 10, 2011)
  TSMC today announced its net sales for February 2011: On an unconsolidated basis, net sales were approximately NT$31.75 billion, a decrease of 7.8 percent over January 2011 and an increase of 8.8 percent over February 2010.
  
  
• UMC to Provide Foundry Services for Sanken Electric (Thursday Mar. 10, 2011)
  UMC today announced that it has agreed to offer manufacturing services to Sanken, a power semiconductor provider headquartered in Japan.
  
  
• RDA and SMIC Reach 55nm Joint Production Milestone (Wednesday Mar. 09, 2011)
  SMIC and RDA Microelectronics today announced that RDA5802N, an FM receiver chip using SMIC's 55nm Low Leakage (LL) logic process and adopting Innopower's IP solution, is now in risk-production.
  
  
• UMC Reports Sales for February 2011 (Tuesday Mar. 08, 2011)
  UMC today reported unaudited net sales for the month of February 2011
  
  
• TowerJazz Announces Availability of 0.18um Power Management EPI Platform Design Kit (Friday Mar. 04, 2011)
  TowerJazz today announced the release of its 0.18um power management EPI Platform Design Kit. The kit is an extension of its successful TS18PM platform which includes the industry’s only scalable Rdson versus breakdown voltage LDMOS which enables 10-40% smaller die sizes and faster design cycle times.
  
  
• Fingerprint Cards and SMIC Work in Collaboration to Bring the World’s Smallest and Most Power-Efficient Fingerprint Sensor to China (Thursday Feb. 17, 2011)
  Fingerprint Cards and SMIC today jointly announced that the companies will work in collaboration to bring FPC1080A, the world’s smallest and most power-efficient fingerprint swipe sensor optimized for mobile phones and tablets, to the China market.
  
  
• TSMC Board of Directors Proposes NT$3.0 Cash Dividend Per Share (Wednesday Feb. 16, 2011)
  The TSMC Board of Directors today adopted a proposal recommending distribution of a NT$3.0 cash dividend per common share. The proposal will be discussed and decided at the Company’s annual shareholders' meeting scheduled for June 9, 2011.
  
  
• TSMC January 2011 Sales Report (Thursday Feb. 10, 2011)
  TSMC today announced its net sales for January 2011: On an unconsolidated basis, net sales were approximately NT$34.42 billion, an increase of 2 percent over December 2010 and an increase of 18.1 percent over January 2010.
  
  
• CSR and TSMC Extend Collaboration to 90-nm Embedded Flash Process Technology and IP (Thursday Feb. 10, 2011)
  CSR and TSMC today announced they are collaborating on the adoption of TSMC’s leading edge 90-nm embedded flash process technology, IP and RF CMOS processes for CSR’s next-generation wireless products.